CN204616191U - Substrate installation constitution - Google Patents
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- CN204616191U CN204616191U CN201520347848.1U CN201520347848U CN204616191U CN 204616191 U CN204616191 U CN 204616191U CN 201520347848 U CN201520347848 U CN 201520347848U CN 204616191 U CN204616191 U CN 204616191U
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Abstract
The utility model provides a kind of substrate installation constitution, has: holding member, and its lower end is provided with multiple tabular fixed foot portion, electric substrate, be provided with multiple plated-through holes that above-mentioned multiple fixed foot portion is inserted, after above-mentioned multiple fixed foot portion inserts above-mentioned multiple plated-through hole respectively, above-mentioned holding member is mounted on above-mentioned electric substrate, the thickness of above-mentioned fixed foot portion is set to little compared with the size on the Width of above-mentioned plated-through hole, the 1st side on the thickness direction of the fixed foot portion of above-mentioned holding member is provided with outstanding fastener, reciprocal 2nd side of the 1st side towards above-mentioned fixed foot portion arranges outstanding protuberance, when above-mentioned fixed foot portion inserts above-mentioned plated-through hole, while above-mentioned fastener is abutted with the lower ora terminalis of the 1st hole wall that the length direction of above-mentioned plated-through hole extends, above-mentioned protuberance blocks the above-mentioned plated-through hole of part in contact with the upper edge with relative the 2nd hole wall of above-mentioned 1st hole wall.
Description
Technical field
The utility model relates to a kind of substrate installation constitution, particularly a kind of substrate installation constitution by welding, holding member being installed on electric substrate.
Background technology
At existing navigation device for vehicle, in the e-machine of audio devices etc., when the holding member etc. maintaining the electronic components such as power integrated circuit (POWER IC) is installed on electric substrate, usually substrate installation constitution described in patent documentation 1 can be adopted, namely, the bottom of holding member is provided with foot, each foot inserts the through hole be arranged on electric substrate, the edge of through hole is locked on again according to the be distorted top ends of the means Shi Ge foots such as distortion (recording in reference patent documentation 1 background technology) of the restoring force produced after making each pin leading section install or the top ends of Shi Ge foot, this holding member is made to be pre-fixed on electric substrate thus, the top ends of each foot is welded in the back side of electric substrate by the method for being welded by plug-in unit (DIP) afterwards.Holding member is just fixed on electric substrate well accordingly.
Prior art document
Patent documentation 1 Japanese Unexamined Patent Publication 2011-176230 publication
Utility model problem to be solved
Although above-mentioned existing substrate installation constitution can realize holding member to be mounted on electric substrate, but, if because the bending deformation quantity of foot is too small after installing, the elastic-restoring force of foot diminishes, or the top ends of the foot of the substrate installation constitution in background technology makes the reduction of its intensity even damage due to reason repeated disassembled and assembled such as repairings, holding member just can not be fixed on electric substrate effectively, the sound sending snapping snapping will be loosened between holding member and electric substrate under the environment of vibration, holding member even also may be caused to come off from electric substrate.And in the above prior art, in order to holding member being mounted on electric substrate effectively, be inserted into after the through hole on electric substrate pre-fixes, the operation of plug-in unit welding must be carried out, the top ends of the foot of holding member is welded on the back side of electric substrate from side, the electric substrate back side.So, just cause operation loaded down with trivial details, add installation cost.
Utility model content
The utility model is created in view of above-mentioned prior art Problems existing, object is to provide a kind of substrate installation constitution, plug-in unit welding sequence can also be saved while effectively holding member can being fixed on electric substrate, thus reduce installation cost.
In order to reach above-mentioned purpose, substrate installation constitution of the present utility model, has: holding member, and its leading section is provided with multiple tabular fixed foot portion, electric substrate, be provided with the multiple roughly rectangular plated-through hole that above-mentioned multiple fixed foot portion is inserted, after above-mentioned multiple fixed foot portion inserts above-mentioned multiple plated-through hole respectively, utilize backflow weldment operation that above-mentioned holding member is installed on above-mentioned electric substrate, the thickness of the fixed foot portion of above-mentioned holding member is set to little compared with the size on the Width of above-mentioned plated-through hole, the 1st side on the thickness direction of the fixed foot portion of above-mentioned holding member is provided with outstanding fastener, reciprocal 2nd side of the 1st side towards above-mentioned fixed foot portion arranges outstanding protuberance, when above-mentioned fixed foot portion inserts above-mentioned plated-through hole, while above-mentioned fastener is abutted with the lower ora terminalis of the 1st hole wall that the length direction of above-mentioned plated-through hole extends, above-mentioned protuberance blocks the above-mentioned plated-through hole of part in contact with the upper edge with relative the 2nd hole wall of above-mentioned 1st hole wall, thus there is slot at interval between the 2nd side of above-mentioned fixed foot portion and the 2nd hole wall of above-mentioned plated-through hole, by above-mentioned reflow soldering operation, under the state that above-mentioned holding member is installed in above-mentioned electric substrate, while the lower ora terminalis of the above-mentioned fastener of above-mentioned fixed foot portion and the 1st hole wall of above-mentioned plated-through hole abuts against, above-mentioned fixed foot portion is closely clamped in above-mentioned 1st hole wall and plug gets lodged between the scolding tin of above-mentioned slot.
In above-mentioned substrate installation constitution of the present utility model, multiple fixed foot portion of above-mentioned holding member are formed obliquely respectively to the projected direction of the fastener in each fixed foot portion, when this holding member is installed on electric substrate, multiple fixed foot portion inserts while strain occurs the plated-through hole on electric substrate corresponding separately respectively to the direction that respective incline direction is contrary.
In above-mentioned substrate installation constitution of the present utility model, fastener is formed as " く " shape elastic protrusion by bending machining.
In above-mentioned substrate installation constitution of the present utility model, protuberance is the bulbous protrusion outstanding from above-mentioned 2nd side be integrally formed with above-mentioned fixed foot portion, and under state, the upper edge of this protuberance and above-mentioned 2nd hole wall is point cantact after mounting.
Utility model effect
According to above-mentioned substrate installation constitution of the present utility model, while effectively the holding member of maintenance electronic component can being fixed on electric substrate, saving plug-in unit welding sequence, reduce installation cost.
Accompanying drawing explanation
Fig. 1 be the holding member of substrate installation constitution of the present utility model be installed in electric substrate state under stereogram.
Fig. 2 is the exploded perspective view of the holding member of substrate installation constitution of the present utility model, electronic component, electric substrate.
Fig. 3 is the stereogram of holding member of the present utility model.
Fig. 4 is the enlarged drawing of the variation of the fixed foot portion of holding member of the present utility model.
Fig. 5 is the enlarged drawing of the plated-through hole of the installation holding member that electric substrate is arranged.
Fig. 6 is the profile that the fixed foot portion of holding member of the present utility model is inserted into the state in the process of electric substrate.
Fig. 7 is the profile that the fixed foot portion of holding member of the present utility model is inserted into the state in the process of electric substrate.
Fig. 8 is the profile that the fixed foot portion of holding member of the present utility model is inserted into the state after electric substrate.
The profile of state when Fig. 9 is reflow soldering after the fixed foot portion insertion electric substrate of holding member of the present utility model.
Figure 10 be the fixed foot portion of holding member of the present utility model insert reflow soldering after electric substrate be over after the profile of state.
Embodiment
Below, substrate installation constitution of the present utility model is described in detail with reference to accompanying drawing.First, illustrate that each several part of substrate installation constitution of the present utility model is formed according to Fig. 1 ~ Fig. 5.
As shown in Figure 1, substrate installation constitution of the present utility model be substantially by be integrated with various circuit and be provided with various electronic devices and components 101 electric substrate 100, be installed on electric substrate 100 and remain the holding member 200 of electronic component 300 (being connector in the present embodiment) and form.Fig. 2 shows electric substrate 100 in substrate installation constitution of the present utility model, electronic component 300, keeps the exploded perspective view of the holding member 200 of this electronic component 300.Electronic component 300 is fixed on electric substrate 100 with the state being maintained at holding member 200.As shown in the figure, electric substrate 100 is provided with plated-through hole 102a, 102a, 102b, 102b, its metallized area is all hole walls and the electric substrate front of this plated-through hole, the peripheral region 103 of the through hole on the back side (not shown), in the present embodiment, the metallization process of this above-mentioned plated-through hole 102 completes by carrying out copper-plating technique.Except being provided with above-mentioned plated-through hole 102a on electric substrate 100,102a, 102b, outside 102b, be also provided with and the terminal D of electronic component 300 can be made to insert thus realize other plated-through holes (not shown) of the electrical connection between itself and electric substrate 100.Although in execution mode of the present utility model, the connector that electronic component 300 is connected with external power source etc. for the e-machine possessing this electric substrate also can be other electronic component, the organ such as fan, rotary encoder.
Fig. 3 is the stereogram of the holding member 200 embodying substrate installation constitution of the present utility model.As shown in Figure 3, holding member 200 is stamped to form by sheet metal material, have: the pair of sidewalls 210a arranged vis-a-vis, 210b, connect this two side 210a, 210b and the roof 220 be substantially vertical setting with this two side, and from above-mentioned pair of sidewalls 210a, 210b, extend the fixed foot portion 220a connecting and arrange respectively downwards, 220a, 220b, 220b.And, two side 210a, distance Z between 210b is arranged to roughly the same with the lateral dimension H of electronic component 300 (with reference to Fig. 2), and in the mounted state, electronic component 300 keeps and is accommodated in (with reference to Fig. 1) between this pair of sidewalls 210,210.In addition, the fixed foot portion 220a of two side 210a, 210b and upper setting thereof, after 220a, 220b, 220b are stressed can to the inside or outside carry out flexural deformation.And two side 210a, 210b can be arranged to relatively slightly toward tilted (not shown), so that in the mounted state, fixed foot portion 220a, 220a, 220b, 220b can be stuck in the hole wall of plated-through hole better.
, the fixed foot portion 220a of the important composition as execution mode of the present utility model, 220a are described below, fixed foot portion 220b, 220b.As shown in Figure 3, because the formation of formed multiple (being formed with 4 in the present embodiment) fixed foot portion is all identical, be therefore only described for fixed foot portion 220a, 220a that wherein sidewall 210a is arranged.As shown in the figure, fixed foot portion 220a, 220a are arranged from the lower end of sidewall 210a to downward-extension, its bottom is formed as " く " shape outstanding inside holding member 200 by punch process, thus side 221a, 221a (the 1st side) is in a thickness direction formed with outstanding " く " shape fastener 222a, 222a.Towards with the 1st side 221a, 221a towards the top of side the 2nd side 223a, 223a be in the opposite direction provided with hemispheric jut 224a, 224a.Fastener 222a, 222a of fixed foot portion 220a, 220a and jut 224a, 224a also can be arranged not according to the method for present embodiment, as long as this fastener 222a, 222a and jut 224a, 224a to be separately positioned on 221a or 223a of side and round about outstanding (such as fastener is arranged on the 2nd side, jut is arranged on the 1st side).Jut 224a, 224a of present embodiment are formed as outstanding hemispherical of 223a from the side, but also can be formed as column, vertebra shape or round table-like projection.Certainly, jut also can be as shown in Figure 4, by the method for punching press, the part on fixed foot portion 220a top is torn off after part cutting in advance, its root is still connected with fixed foot portion 220a, 220a, and top is outstanding thus form jut 224a, 224a of the variation of the utility model jut to the inner side of holding member 200.Fastener 222a, 222a in present embodiment form " く " shape projection by punch process, also can be formed as hemispherical as jut 224a, 224a, the projection of the shape such as taper.Though unspecified, 1st side 221b, the 2nd side 223b of the upper set fixed foot portion 220b of sidewall 210b, 210b, 220b is also respectively arranged with fastener 222b, 222b and jut 224b, 224b (not shown) in the same way, here just repeats no more.
As shown in Figure 1, electric substrate 100 is provided with four for installing the plated-through hole 102a of holding member 200,102a, 102b, 102b.As shown in Figure 2 and Figure 3, according to the distance Z between two side 210a, 210b of holding member 200, two couples of plated-through hole 102a, 102a, plated-through hole 102b, 102b setting transversely separated by a distance, this distance Y arranges be a bit larger tham above-mentioned fixed foot portion 220a, 220a respectively relative projecting aftermentioned fastener 222a, 222a upper with fixed foot portion 220b, 220b, distance X between 222b, 222b.As shown in Fig. 3, Fig. 5, these two pairs of plated-through holes respectively distance K are in the vertical according to the above-mentioned two fixed foot portion 220a be separately positioned on two side 210a, 210b, 220a, fixed foot portion 220b, distance M between 220b and arranging, as long as can make each fixed foot portion insert each self-corresponding plated-through hole during installation.Plated-through hole 102a, the formation of 102a, 102b, 102b is all identical, is therefore only described for pair of metal through hole 102a, 102a of being arranged on sidewall with reference to Fig. 5.Plated-through hole 102a, 102a are all formed as roughly rectangular elongated hole, in the present embodiment in order to the broad ways by plated-through hole 102a, 102a easy to process is (horizontal, representing with N in Fig. 5) hole wall that extends is arranged to cambered surface, but also can be formed as plane under prerequisite no problem in processing, thus be formed as corner apertures.In addition, this plated-through hole 102a, 102a are along its length (longitudinally, represent with R in Fig. 5) on be formed respectively relatively near another to the 1st hole wall 104 of plated-through hole and 2nd hole wall 105 relative with the 1st hole wall 104, edge on the upper surface being positioned at electric substrate 100 of then the 1st hole wall 104 is the upper edge 104a of the 1st hole wall 104, and the edge on the lower surface being positioned at electric substrate 100 of the 1st hole wall 104 is the lower ora terminalis 104b (not shown) of the 1st hole wall 104.In the same manner, edge on the upper surface being positioned at electric substrate 100 of above-mentioned 2nd hole wall 105 is the upper edge 105a (not shown) of the 2nd hole wall 105, and the edge on the lower surface being positioned at electric substrate 100 of the 2nd hole wall 105 is the lower ora terminalis 105b of the 2nd hole wall 105.All hole walls of above-mentioned plated-through hole 102,102 and be positioned at the peripheral region 103 (peripheral region 103 of lower surface is not shown, and its region formed in upper surface is identical) in the hole on the upper surface of electric substrate 100, lower surface.The region closer to plated-through hole 102,102 edge on the peripheral region 103 that electric substrate 100 upper surface is formed is formed as Reflow Soldering solder(ing) paste application area (not shown), scribbles solder(ing) paste used in aftermentioned Reflow Soldering operation on the area.
Secondly, the assembly process of the execution mode of substrate installation constitution of the present utility model is described.First, illustrate that holding member 200 is installed on the installation procedure of electric substrate 100 with reference to Fig. 6 ~ Fig. 8.
First, by plated-through hole 102a, 102a, 102b, the Reflow Soldering solder(ing) paste of 102b smears region and is arranged on electric substrate 100 and not shown in order to install other electronic units thus the solder(ing) paste realizing the surrounding of the plated-through hole be electrically connected between this electronic unit and electric substrate smears on region and coats solder(ing) paste P equally.
Then, after the through hole (not shown) of the electrical connection that the terminal of the lower faced downwards setting of electronic component 300 and electric substrate 100 are arranged is carried out aligned in position, by the plated-through hole on substrate corresponding separately for the terminal insertion arranged below electronic component 300, electronic component 300 is temporarily fixed on electric substrate 100 thus.Afterwards, as shown in Figure 2,2 couples of fixed foot portion 220a of 210a, 210b lower end, holding member 200 two side will be arranged at, 2 couples of plated-through hole 102a of 220a, 220b, 220b and electric substrate 100,102a, 102b, 102b carry out aligned in position, make electronic unit 300 from top close to electric substrate 100 and the above-mentioned electronic component 300 be temporarily fixed on electric substrate 100 under the state of this aligned in position.Then, make holding member 200 cover on the top of this electronic component 300, its two side 210a, 210b lay respectively at the both sides transversely of electronic component 300, and namely electronic component 300 is held in holding member 200.Two of holding member 200 couples of fixed foot portion 220a, 220a, 220b, 220b are made to insert the plated-through hole 102a of the correspondence with it on electric substrate 100 respectively, in 102a, 102b, 102b in this condition.
The insert action that the fixed foot portion further describing holding member 200 is below inserted to plated-through hole.As shown in Fig. 2, Fig. 6, with under the state of each plated-through hole aligned in position corresponding with it on electric substrate 100, it is pressed above electric substrate 100 in each fixed foot portion of holding member 200, first the fastener of each fixed foot portion is pressed in plated-through hole corresponding separately.Due to the distance between the hole wall close to each other that the distance between fastener 222a, 222b is less than transversely two plated-through holes, so the raised face of the fastener of each fixed foot portion is all crimped on the upper edge 104a of the 1st hole wall 104 of each plated-through hole, the counter-force fixed foot portion 220a, the 220a that produce according to it and fixed foot portion 220b, 220b produce elastic springing in the direction that fastener 222a, 222b are separated from each other respectively, and sidewall 210a, 210b of being respectively arranged with these two pairs of fixed foot portion thus are also strutted by both sides.By the fixed foot portion 220a of holding member 200, 220a, 220b, 220b inserts further, fastener 222a, 222a, 222b, the 1st hole wall 104 that the top of the ledge of 222b crimps respective corresponding plated-through hole respectively overcomes the force of sliding friction between the top of above-mentioned ledge and hole wall while slide to the depth direction in hole, until the top of the ledge of each fastener is by the lower ora terminalis 104a of the 1st hole wall 104 of each plated-through hole, according to fixed foot portion 220a, 220a, 220b, the elastic-restoring force (see Fig. 7) of 220b, fastener 222a, 222a and fastener 222b, 222b has the trend of movement in a direction close to each other.Meanwhile, along with above-mentioned fixed foot portion 220a, 220a, 220b, the insertion of 220b, be arranged on the jut 224a in each fixed foot portion, 224a, 224b, 224b little by little partly enters each self-corresponding plated-through hole respectively from the bottom to top, when owing to making the top of the ledge of above-mentioned each fastener by the lower ora terminalis 104a of the 1st hole wall 104 of each plated-through hole from the pressure of top, its elastic-restoring force produced makes the top of above-mentioned each jut or top be crimped on the upper edge 105a of the 2nd hole wall 105 of each plated-through hole with lower part, also make the root of each fastener (ideal state is root simultaneously, also can be the part between more than the top of the arc surface of fastener to root) be locked to the lower ora terminalis 104a of the 1st hole wall 104 of each plated-through hole.Thus, as shown in Figure 8, the fixed foot portion 220a of holding member 200,220a, 220b, 220b is to the plated-through hole 102a corresponding to it, 102a, 102b, the insert action of 102b terminates, and holding member 200 and the electronic component 300 by its storage maintenance are together temporarily fixed on electric substrate 100.In this condition, jut 224a, 224a, 224b, 224b partly enters plated-through hole 102a, 102a, 102b, 102b, and this each jut partly blocks each plated-through hole while contacting with the upper edge 105a of the 2nd hole wall 105 of each plated-through hole respectively.In the present embodiment because jut is formed as spherical shape projection, therefore the contact of the upper edge of itself and hole wall is point cantact, and when the variation of the above-mentioned jut as Fig. 4, contact is linear contact lay.And, now side 221a, 221b of each fixed foot portion roughly with the 1st hole wall 104,104 of plated-through hole 102a, 102b abreast infinite approach be even mutually close to, thickness due to holding member 200 arranges be less than size on the Width of each plated-through hole, therefore leaves gap F between side 223a, 223b of each fixed foot portion and the 2nd hole wall 105,105 of plated-through hole 102a, 102b.
Afterwards, electronic component 300 and keep the holding member 200 of this electronic component 300 by be temporarily fixed on electric substrate 100 together state under, carry out reflow soldering, the electric substrate 100 being about to scribble in advance solder(ing) paste P heats, make the solder(ing) paste P being coated in electric substrate 100 surface be in molten condition, the liquid solder cream P being in molten condition afterwards flows in each plated-through hole and completes the welding of electric substrate 100 integral back-flow.In concrete execution mode of the present utility model, as shown in Figure 9, the solder(ing) paste P of institute's precoating around plated-through hole becomes liquid solder cream P after heating, the 2nd hole wall of plated-through hole upper end edge due to liquid surface tension formed expand drops, because the upper edge of the protuberance of fixed foot portion with the 2nd hole wall of plated-through hole contacts, the surface tension balance of liquid solder cream P is destroyed, and is imported in the F of gap, thus completes Reflow Soldering operation along contact position.After reflow soldering, the substrate installation constitution of execution mode of the present utility model as shown in Figure 10, solder(ing) paste P is filled with between the hole wall of each fixed foot portion and each plated-through hole, then this fixed foot portion is closely clamped between the hole wall of plated-through hole and solder(ing) paste P, thus is welded on electric substrate 100 by reflow soldering by the holding member 200 being temporarily fixed at electric substrate 100.
Accordingly, because solder(ing) paste fills up gap, fixed foot portion is made to be clamped in the 1st of plated-through hole the effectively between hole wall and solder(ing) paste, solder(ing) paste is clipped between the 2nd hole wall of fixed foot portion and plated-through hole again effectively, so when holding member is subject to the pull-out force from top, the fastener of fixed foot portion be subject to power upwards and and produce squeezing action power between the lower ora terminalis of the 1st hole wall, this active force makes fixed foot portion oriented both sides that the trend of strain (softened) occur, but the extruding due to solder(ing) paste prevents the strain of fixed foot portion, thus the phenomenon preventing fixed foot portion to deviate from from plated-through hole effectively occurs, ensure that installation strength, thus achieve can effectively by while keeping the holding member of electronic component be fixed on electric substrate, save plug-in unit welding sequence, reduce installation cost.
Claims (4)
1. a substrate installation constitution, has: holding member, and its lower end is provided with multiple tabular fixed foot portion; Electric substrate, be provided with the multiple roughly rectangular plated-through hole that above-mentioned multiple fixed foot portion is inserted, after above-mentioned multiple fixed foot portion inserts above-mentioned multiple plated-through hole respectively, utilize backflow weldment operation that above-mentioned holding member is mounted on above-mentioned electric substrate, it is characterized in that:
The thickness of the fixed foot portion of above-mentioned holding member is set to little compared with the size on the Width of above-mentioned plated-through hole, the 1st side on the thickness direction of the fixed foot portion of above-mentioned holding member is provided with outstanding fastener, reciprocal 2nd side of the 1st side towards above-mentioned fixed foot portion arranges outstanding protuberance
When above-mentioned fixed foot portion inserts above-mentioned plated-through hole, while above-mentioned fastener is abutted with the lower ora terminalis of the 1st hole wall that the length direction of above-mentioned plated-through hole extends, above-mentioned protuberance blocks the above-mentioned plated-through hole of part in contact with the upper edge with relative the 2nd hole wall of above-mentioned 1st hole wall, thus there is slot at interval between the 2nd side of above-mentioned fixed foot portion and the 2nd hole wall of above-mentioned plated-through hole, by above-mentioned reflow soldering operation, under the state that above-mentioned holding member is installed in above-mentioned electric substrate, the lower ora terminalis of the above-mentioned fastener of above-mentioned fixed foot portion and the 1st hole wall of above-mentioned plated-through hole abuts against and above-mentioned fixed foot portion is closely clamped in above-mentioned 1st hole wall and plug gets lodged between the scolding tin of above-mentioned slot.
2. substrate installation constitution according to claim 1, is characterized in that:
Multiple fixed foot portion of above-mentioned installing component are formed obliquely respectively to the projected direction of the fastener in each fixed foot portion, when this installing component is installed on electric substrate, multiple fixed foot portion inserts while strain occurs the plated-through hole on electric substrate corresponding separately respectively to the direction that respective incline direction is contrary.
3. substrate installation constitution according to claim 1, is characterized in that;
Above-mentioned fastener is formed as " く " shape elastic protrusion by bending machining.
4. substrate installation constitution according to claim 1, is characterized in that:
Above-mentioned protuberance is the bulbous protrusion outstanding from above-mentioned 2nd side be integrally formed with above-mentioned fixed foot portion, and under state, the upper edge of this protuberance and above-mentioned 2nd hole wall is point cantact after mounting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520347848.1U CN204616191U (en) | 2015-05-26 | 2015-05-26 | Substrate installation constitution |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201520347848.1U CN204616191U (en) | 2015-05-26 | 2015-05-26 | Substrate installation constitution |
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| CN204616191U true CN204616191U (en) | 2015-09-02 |
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| CN201520347848.1U Expired - Fee Related CN204616191U (en) | 2015-05-26 | 2015-05-26 | Substrate installation constitution |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113815779A (en) * | 2021-10-22 | 2021-12-21 | 上海外高桥造船有限公司 | Opening structure |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113815779A (en) * | 2021-10-22 | 2021-12-21 | 上海外高桥造船有限公司 | Opening structure |
| CN113815779B (en) * | 2021-10-22 | 2022-12-13 | 上海外高桥造船有限公司 | Opening structure |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150902 |
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| CF01 | Termination of patent right due to non-payment of annual fee |