CN2643487Y

CN2643487Y - Improvement of radiating support structure for light emitting diode

Info

Publication number: CN2643487Y
Application number: CNU032642881U
Authority: CN
Inventors: 陈聪欣
Original assignee: Individual
Current assignee: Individual
Priority date: 2003-06-24
Filing date: 2003-06-24
Publication date: 2004-09-22
Anticipated expiration: 2013-06-24

Abstract

The utility model relates to an improved LED radiation stand structure. The improved LED radiation stand has a stand unit comprising a cathode main area and an anode main area; and at least one lighting wafer is fixed in a cup base in the cathode main area and connected to the anode main area through a wire and each main area has at least one stretched long prong. The utility model is characterized in that the stand unit divides the cathode and anode main areas in a non-direct cutting way and makes the stand unit generate longitudinal cutting end faces opposite to each other to improve radiation effect. Furthermore, according to the cutting area, the cup base of the cathode main area comparatively has more distribution area to carry larger or more lighting wafers.

Description

The improvement of LED heat radiating supporting structure

Technical field

The utility model relates to a kind of heating diode, relates in particular to a kind of improvement of the diode radiating supporting structure that generates heat.

Background of invention

At present relevant LED support mainly includes: by the negative electrode pin that a sheet metal forms, its upper end comprises a groove with the set wafer, and is made up of the parts such as an anode pin that another sheet metal forms; Known techniques, for example, TaiWan, China patent announcement No. 488616 " LED support ", No. 477468 novel patents such as " light-emitting diode improvement structures " of bulletin No. 477466 " improvement of light-emitting diode " and bulletin all disclose in succession and have above-mentioned typical traditional structure.

Promptly in above-mentioned patent case, all demonstrate the improvement of relevant LED support aspect structural design, or promote problems such as its function, come the value on the increase industry, for example, announce No. 488616 " LED support ", it is to go out the equidistant carrier unit that links to each other of plural number on the sheet metal of conduction continuously, each carrier unit includes the junction surface and the central portion of opposition, wherein the junction surface is for the usefulness that connects lead, central portion is to extend a bearing towards the junction surface for the set wafer, this junction surface and central portion two ends further stretch out, and form first, second pin and the 3rd, the 4th pin is for the usefulness of connecting circuit, the heat that produces when making wafer work can distribute rapidly by above-mentioned pin, to improve the radiating efficiency of light-emitting diode; Or as, announce No. 477466 " improvement of light-emitting diode ", it includes: a support body, parts such as one wafer and a bonding wire, wherein support body is that conductive metal sheet is one-body molded, and two groups respectively is two foot rests that separate, the perpendicular direction of one group frame pin links a support body, organize the frame pin separately and then link a sheet with its vertical direction, the nearly frame of frame medium film section connects the place and is arranged with cup, wherein a wafer, be to put and be positioned in aforesaid the cup, wherein bonding wire is conductive metal wire, and an end is linked to crystal grain, end then is linked to frame even in addition, sealing is to be coated on aforementioned wafer, bonding wire, the part that frame sheet and frame connect, and it is prominent to form a lamp of giving prominence in the wafer top, it is characterized in that the width of frame sheet is wide than the frame pin, and sealant covers even exposes the frame sheet of hypomere and frame, thinks preferable heat radiation; Or as No. the 477468th, bulletin " light-emitting diode improvement structure ", it mainly includes wafer, holds the support and the lead-in wire of wafer.It is in the bottom of support or near the place, bottom the support radiating block to be set, and it is characterized in that: it is that the thickness of thickening support holds the bowl cup degree of depth of wafer to more than the 0.6mm with increase.

Yet allly before quoted as proof in the case by above-mentioned, can find, be applied in the relevant many Prior Arts of all known traditional LED LAMP supports though provide, major part is with extruding or impact style production, especially be easy to generate the situation of break (as the design of bowl cup) with impact style production, and support is that the structure of sheet can only be as lower powered heat radiation, but then can't reach desirable to high-power heat radiation.

For considering of the problem of above-mentioned high power heat radiation, if make with casting or powder metallurgy mode, and make the cathode anchor hollow out of the increasing solid that structural design can be easy form the convection current that cylinder increases air, or how significantly increase the structural design of area of dissipation in the cathode anchor upper end, or make the degree of depth of bowl cup, volume, the layout overline improvement of area, to adapt to multiple use, or be provided with the heat conduction ditch and cooperate the design cut apart carrier unit in rack outer surface, to increase radiating efficiency, or the body region that makes carrier unit is because of the design of the heat conduction ditch that is provided with convex-concave surface, can reduce A, the use amount of B glue (sealing), can reduce cost, increase overall package (deadlocked) intensity of encapsulation again, in above-mentioned patent case, all be not prompted or disclose.

Summary of the invention

Therefore, main purpose of the present utility model provides a kind of improvement of LED heat radiating supporting structure, it mainly is at injection, die casting, casting or the integrated carrier unit of powder metallurgy mode, this unit portion is provided with negative pole part and anode portion body region, partitioning scheme with non-vertical cut can produce different cutting areas, especially do to cut apart along a peripheral intended path, to form at least two opposite end faces in the vertical, make described unit portion obtain a bigger cup area and arrange and bigger heat dissipation region, to adapt to various heat radiation purposes.Above-mentioned inboard in negative pole part or anode portion body region is corresponding perpendicular end surface, and form one at interval order do not contact, make to have described large-area space between described the two poles of the earth, and more improve heat sinking function; Or make negative pole part define a hollow body again, and described hollow body prolongs axis direction, and extend a geometrical configuration downwards or form the tissue design of cylinder, be the convection current that can increase air, promptly be in order to increase surface area or volume, and have the effect of the heat radiation of promoting.

Another purpose of the present utility model is the body region outer surface that makes carrier unit, includes the heat conduction ditch of a plurality of convex-concave surfaces; Or the column body spatial placement that makes hollow body and cold and hot convection current has the tissue of convex-concave surface, increases cooling surface area, and the surperficial free electron of reinforced metal element enliven energy; Being organized in when encapsulating of a plurality of convex-concave surfaces of aforementioned body district outer surface can increase the intensity of overall package (deadlocked) and the blackness emissivity of metallic object again.

A kind of improvement of LED heat radiating supporting structure, has a carrier unit, this unit pack contains negative pole part body region and anode portion body region, and at least one luminescent wafer is to anchor in the cup of negative pole part body region, be connected to the anode portion body region through a lead, be extended with a long pin at least in each body region; Wherein:

Cut apart anode and cathode portion body region at carrier unit with the form of non-vertical cut, make to produce a vertical cutting area betwixt, to promote its radiating effect; And, according to described cutting area, the bowl seat that makes this negative pole part body region have bigger arrangement areas relatively, the bigger or luminescent wafer of volume more for bearing.

Described negative pole part body region is a solid.

Described negative pole part body region is a hollow body.

The hollow body lower end of described negative pole part body region is extended the hollow cylinder of a cold and hot convection current downwards.

The inside position of described hollow body is made as cylindric.

The inside position of described hollow body is the flaring open column shape that is made as outwardly.

Described negative pole part is provided with the hot-fluid ditch with the non-corresponding vertical plane that is parallel to each other of the lateral surface of anode portion, to increase area of dissipation.

The inner surface of the inside position of described hollow body is provided with a plurality of recessed float gage faces, to increase area of dissipation.

Described hollow body is provided with a plurality of recessed float gage faces to increase area of dissipation down to the inner surface of the inside position of cold and hot convection current hollow cylinder.

The sealing of described unit is to 1/3rd places, upper end of each body region height.

Described carrier unit is a column type.

Described carrier unit is oval column type.

Described carrier unit is the square body.

Described carrier unit is the rectangle body.

The utility model is the improvement of relevant a kind of LED heat radiating supporting structure, its be at carrier unit with the partitioning scheme of non-vertical cut to produce bigger cutting area, make the space kenel design of this carrier unit can have the heat radiation function that significantly increases, with height heat radiation purposes, and then can promote the effective utilization and the life-span of light-emitting diode in response to demand day by day.

Description of drawings

Figure 1A is the schematic perspective view of the carrier unit of the utility model two divisional planes;

Figure 1B is the solid generalized section of the carrier unit of the utility model Figure 1A;

Fig. 1 C is the hollow body generalized section of the carrier unit of the utility model Figure 1A;

Fig. 1 D is another generalized section of hollow body of the carrier unit of the utility model Figure 1A;

Fig. 2 A is the solid and the generalized section of the cold and hot shunting cylinder of carrier unit tool of the utility model two divisional planes;

Fig. 2 B is the generalized section of the cold and hot shunting cylinder of carrier unit tool of the utility model Fig. 2 A;

Fig. 3 A is the schematic perspective view of the carrier unit of the utility model four divisional planes;

Fig. 3 B is the solid generalized section of the utility model Fig. 3 A carrier unit;

Fig. 3 C is the hollow body generalized section of the utility model Fig. 3 A carrier unit;

Fig. 4 A is the schematic perspective view of the cold and hot shunting cylinder of carrier unit tool of the utility model four divisional planes;

Fig. 4 B is the generalized section of the utility model Fig. 4 A carrier unit;

Fig. 5 A is the schematic perspective view of the cold and hot shunting cylinder of the utility model square two segmentation masks;

Fig. 5 B is the generalized section of the utility model Fig. 5 A carrier unit;

Fig. 5 C is the schematic perspective view of the carrier unit of the utility model square two divisional planes;

Fig. 5 D is the generalized section of the utility model Fig. 5 C solid carrier unit;

Fig. 5 E is the generalized section of the utility model Fig. 5 C hollow body carrier unit;

Fig. 6 A is the schematic perspective view of the carrier unit of the cold and hot shunting cylinder of the utility model four segmentation masks;

Fig. 6 B is the generalized section of the utility model Fig. 6 A;

Fig. 6 C is the schematic perspective view of the utility model four divisional plane carrier units;

Fig. 6 D is the generalized section of the utility model Fig. 6 C solid carrier unit;

Fig. 6 E is the generalized section of the utility model Fig. 6 C hollow body carrier unit;

Fig. 7 A is the embodiment schematic perspective view of the carrier unit of the round two segmentation mask heat conduction ditches of the utility model;

Fig. 7 B is the embodiment schematic perspective view of the carrier unit of round two segmentation mask heat conduction ditches of the utility model and the cold and hot shunting cylinder of tool;

Fig. 7 C is the embodiment schematic perspective view of the carrier unit of the round four segmentation mask heat conduction ditches of the utility model;

Fig. 7 D is the embodiment schematic perspective view of the carrier unit of the utility model round tool heat conduction ditch and the cold and hot shunting cylinder of tool;

Fig. 8 A is the embodiment schematic perspective view of the carrier unit of the utility model square two segmentation mask heat conduction ditches;

Fig. 8 B is the carrier unit of the utility model square two segmentation mask heat conduction ditches and the cold and hot shunting cylinder of tool

The embodiment schematic perspective view;

Fig. 8 C is the embodiment schematic perspective view of the carrier unit of the utility model square four segmentation mask heat conduction ditches;

Fig. 8 D is the carrier unit of the utility model square four segmentation mask heat conduction ditches and the cold and hot shunting cylinder of tool

The embodiment schematic perspective view;

Fig. 8 E is the embodiment schematic perspective view of the utility model square two segmentation mask heat conduction ditches and the initial cut-point carrier unit nearest with stopping cut-point;

Fig. 9 A is the embodiment floor map of the round top of the utility model two divisional plane carrier units divisional plane;

Fig. 9 B is an embodiment floor map again of the round top of the utility model two divisional plane carrier units divisional plane;

Fig. 9 C is the another embodiment floor map of the round top of the utility model two divisional plane carrier units divisional plane;

Fig. 9 D is the embodiment floor map of the round top of the utility model four divisional plane carrier units divisional plane;

Fig. 9 E is an embodiment floor map again of the round top of the utility model four divisional plane carrier units divisional plane;

Fig. 9 F is the another embodiment floor map of the round top of the utility model four divisional plane carrier units divisional plane;

Fig. 9 G figure is that the round top of the utility model two divisional plane carrier units divisional plane is cut apart initial point and the immediate embodiment floor map of terminal point;

Figure 10 A is the floor map of the utility model two divisional plane carrier unit square top divisional planes;

Figure 10 B is an embodiment floor map again of the utility model two divisional plane carrier unit square top divisional planes;

Figure 10 C is the another embodiment floor map of the utility model two divisional plane carrier unit square top divisional planes;

Figure 10 D is the floor map of the utility model four divisional plane carrier unit square top divisional planes;

Figure 10 E is the flat amount schematic diagram of the utility model four divisional plane carrier unit square top divisional planes;

Figure 10 F figure is the floor map of the utility model four divisional plane carrier unit square top divisional planes;

Figure 11 A is the floor map of the round top of the utility model carrier unit transparent enclosure;

Figure 11 B is another floor map of the round top of the utility model carrier unit transparent enclosure;

Figure 11 C is the floor map of the round top of the utility model carrier unit tool heat conduction ditch transparent enclosure;

Figure 11 D is another floor map of the round top of the utility model carrier unit tool heat conduction ditch transparent enclosure;

Figure 11 E is the floor map of the utility model carrier unit square top transparent enclosure;

Figure 11 F is another floor map of the utility model carrier unit square top transparent enclosure.

Element number and title contrast among the figure

10 carrier units

11 negative pole part body region

111 cups

112 luminescent wafers

113 solids

114 hollow bodies

115 cylinders

116 convex-concave surfaces

12 anode portion body region

13 pins

14 heat conduction ditches

15 sealings

Embodiment

As for detailed construction of the present utility model, application principle, effect and effect then please refer to the explanation that diagram is done, and can be understood completely.

Please join Figure 1A to Fig. 1 D, and Fig. 5 A to Fig. 5 E is by shown in these accompanying drawings, can obviously find out, light-emitting diode of the present utility model is imitated the improvement of cooling stand structure, be with injection, die casting, casting or the integrated carrier unit 10 of powder metallurgy mode, this unit 10 includes a negative pole part body region 11 and at least one anode portion body region 12, each body region 11 wherein, 12 lower end is provided with a long pin 13 at least, be formed with a cup 111 in negative pole part body region 11 upper ends, for at least one luminescent wafer 112 of bearing, and this luminescent wafer 112 is to be connected to anode portion body region 12 above-mentioned carrier units 10 with a lead at least can be set as column type, oval column type, forms such as square body and rectangle body (Fig. 2 A for example, Fig. 3 A, Fig. 4 A Fig. 6 A and Fig. 6 C), each body region 11,12 lateral surface can be set as smooth surface, or the plane, or the design that is provided with the heat conduction ditch 14 of convex-concave surface (please be joined Fig. 7 A to Fig. 7 D, Fig. 8 A to Fig. 8 E) and each body region 11,12 medial surface is the corresponding big vertical plane and not contacting of being parallel to each other.

The utility model also can form the negative pole part body region of above-mentioned carrier unit 10 solid 113 (Figure 1B, Fig. 3 B, Fig. 5 D and Fig. 6 D) or hollow body (Figure 10, Fig. 1 D, Fig. 2 B, Fig. 3 C, Fig. 4 B, Fig. 5 B and Fig. 6 B), the inside position 114 of this hollow body can form cylindric or coniform (as Fig. 1 D flue) or other geometric cross section open tubular columns or flaring open tubular column again, in order to air enter the generation convection current, also can extend the cylinder 115 (Fig. 2 B, Fig. 4 B, Fig. 5 B and Fig. 6 B) of a vacant state downwards; Relative carrier unit 10 hollow bodies at square body and rectangle body also form similar kenel, also form cylindric in this hollow body inside position 114 or the male shape of circle or other geometric cross section open tubular columns or flaring open tubular column, or extend the cylinder 115 of a vacant state downwards, the inner surface of its inside position 114 and cylinder 115 can be provided with a plurality of convex-concave surfaces 116 (as Fig. 5 B, Fig. 5 E, Fig. 6 B and Fig. 6 E) again to increase area of dissipation and blackness emissivity.

Design by said structure, mainly be with non-directional partitioning scheme, can produce bigger cutting area, to promote its radiating effect, among the embodiment for example of the present utility model, two divisional planes are arranged, or four divisional plane (please join Fig. 9 A to Fig. 9 G, Figure 10 A to Figure 10 F), especially when a peripheral intended path is cut apart, to form at least two opposite end faces in the vertical, make described negative pole part body region 11 can obtain more large-area cup 111 or area of dissipation, especially when cut apart starting point and terminal point more near the time will obtain more large tracts of land (as Fig. 9 G), this carrier unit 10 is provided with a negative pole part body region 11 and at least one anode portion body region 12, makes 10 liang of interpolars of carrier unit have large-area space, can effectively improve heat sinking function; Or negative pole part body region 11 is set as the inside position 114 of hollow body, or outer surface is provided with heat conduction ditch 14, more can increases radiating efficiency; Work as the body region 11,12 of carrier unit 10 again because of being provided with the heat conduction ditch 14 of convex-concave surface, when encapsulation, can reduce the use amount of A, B glue (sealing), can reduce cost, can increase the intensity of overall package (deadlocked) again, with blackness emissivity (please join Figure 11 A to Figure 11 F); Sealing area, volume because of encapsulation can reduce again, and relative just reducing intercepts heat conducting sealing use amount, can improve heat radiation and lighting power so certainly; Moreover, the utility model is with injection, die casting, casting or the integrated carrier unit of powder metallurgy mode, easier than punching press in the kenel design, can significantly increase the degree of depth, the volume area of bowl cup in negative pole part body region upper end, also can strengthen anode portion body region topside area, can increase welding gold thread (lead) area, make convenient many leads and the operation function of sharing thermal conductance of increasing.

Comprehensive the above as can be known, the improvement of light-emitting diode substance high efficiency and heat radiation support of the present utility model, not only do not see the situation of public use before this, and really can produce the function that is better than traditional support of the same type, close in the regulation of the relevant important document of the novel patent of Patent Law, patent is filed an application in the whence in accordance with the law, sincerely please grants standard early, is that institute is to expecting.

Need Chen Mingzhe, the above is the utility model one preferred embodiment, if comply with the change that conception of the present utility model is done, the function of its generation, when not exceeding specification yet and illustrating contained spiritual, all should be in scope of the present utility model, zygote Chen Ming.

Claims

1, a kind of improvement of LED heat radiating supporting structure, has a carrier unit, this unit pack contains negative pole part body region and anode portion body region, and at least one luminescent wafer is to anchor in the cup of negative pole part body region, be connected to the anode portion body region through a lead, be extended with a long pin at least in each body region; It is characterized by:

2,, it is characterized in that the negative pole part body region is a solid according to the improvement of the described LED heat radiating supporting structure of claim 1.

3,, it is characterized in that the negative pole part body region is a hollow body according to the improvement of the described LED heat radiating supporting structure of claim 1.

4,, it is characterized in that the hollow body lower end of negative pole part body region extends the hollow cylinder of a cold and hot convection current downwards according to the improvement of the described LED heat radiating supporting structure of claim 3.

5, according to the improvement of claim 3 or 4 described LED heat radiating supporting structures, it is characterized in that the inside position of this hollow body, be made as cylindric.

6, according to the improvement of claim 3 or 4 described LED heat radiating supporting structures, it is characterized in that the inside position of this hollow body, be the flaring open column shape that is made as outwardly.

7,, it is characterized in that the non-corresponding vertical plane that is parallel to each other of the negative pole part and the lateral surface of anode portion is provided with the hot-fluid ditch, to increase area of dissipation according to the improvement of the described LED heat radiating supporting structure of claim 1.

8,, it is characterized in that the inner surface of the inside position of hollow body is provided with a plurality of recessed float gage faces, to increase area of dissipation according to the improvement of the described LED heat radiating supporting structure of claim 3.

9,, it is characterized in that hollow body is provided with a plurality of recessed float gage faces to increase area of dissipation down to the inner surface of the inside position of cold and hot convection current hollow cylinder according to the improvement of the described LED heat radiating supporting structure of claim 4.

10,, it is characterized in that upper end 1/3rd places of this unit sealing to each body region height according to the improvement of the described LED heat radiating supporting structure of claim 1.

11, according to claim 1 or 2 or 3 or the improvement of 4 or 10 described LED heat radiating supporting structures, it is characterized in that carrier unit is a column type.

12,, it is characterized in that carrier unit is a column type according to the improvement of the described LED heat radiating supporting structure of claim 5.

13,, it is characterized in that carrier unit is a column type according to the improvement of the described LED heat radiating supporting structure of claim 6.

14, according to claim 1 or 2 or 3 or the improvement of 4 or 10 described LED heat radiating supporting structures, it is characterized in that carrier unit is oval column type.

15,, it is characterized in that carrier unit is oval column type according to the improvement of the described LED heat radiating supporting structure of claim 5.

16,, it is characterized in that carrier unit is oval column type according to the improvement of the described LED heat radiating supporting structure of claim 6.

17, according to claim 1 or 2 or 3 or 7 or 8 or the improvement of 9 or 10 described LED heat radiating supporting structures, it is characterized in that carrier unit is the square body.

18,, it is characterized in that carrier unit is the square body according to the improvement of the described LED heat radiating supporting structure of claim 5.

19,, it is characterized in that carrier unit is the square body according to the improvement of the described LED heat radiating supporting structure of claim 6.

20, according to claim 1 or 2 or 3 or 7 or 8 or the improvement of 9 or 10 described LED heat radiating supporting structures, it is characterized in that carrier unit is the rectangle body.

21,, it is characterized in that carrier unit is the rectangle body according to the improvement of the described LED heat radiating supporting structure of claim 5.

22,, it is characterized in that carrier unit is the rectangle body according to the improvement of the described LED heat radiating supporting structure of claim 6.