CN2634525Y - Improved heat radiator bottom plate structure - Google Patents

Improved heat radiator bottom plate structure Download PDF

Info

Publication number
CN2634525Y
CN2634525Y CN 03266737 CN03266737U CN2634525Y CN 2634525 Y CN2634525 Y CN 2634525Y CN 03266737 CN03266737 CN 03266737 CN 03266737 U CN03266737 U CN 03266737U CN 2634525 Y CN2634525 Y CN 2634525Y
Authority
CN
China
Prior art keywords
base plate
radiator
soleplate
hole
heat pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 03266737
Other languages
Chinese (zh)
Inventor
姜财良
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CpuMate Inc
Original Assignee
CpuMate Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CpuMate Inc filed Critical CpuMate Inc
Priority to CN 03266737 priority Critical patent/CN2634525Y/en
Application granted granted Critical
Publication of CN2634525Y publication Critical patent/CN2634525Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Abstract

The utility model relates to an improved heat radiator bottom plate structure, which at least comprises a soleplate of which the bottom can be contacted with the top surface of a microprocessor, a heat conducting pipe penetrating in the center of the soleplate, and a plurality of radiation fins arranged on the top surface of the soleplate, wherein the soleplate of the heat radiator and the radiation fins on the soleplate are provided with through holes, and the spaces of the through holes of the soleplate and the radiation fins can be inserted with the heat conducting pipe. A long groove communicated with the through hole of the soleplate is arranged from the upper part of the through hole of the soleplate to the top surface of the soleplate. The structure of the long groove can make the welding and bonding work of the heat conducting pipe and the soleplate of the heat radiator quick and convenient.

Description

Improved base plate of radiator structure
Technical field
The utility model relates to a kind of base plate of radiator structure, be meant a kind of job sequence of being convenient to engage heat pipe and base plate of radiator especially, but so that minimizing manufacturing is gone up time and the improved base plate of radiator structure of nickel material uniformly dispersing on the composition surface between base plate of radiator and heat pipe because of nickel plating spent.
Background technology
General known base plate of radiator structure as shown in Figure 1, this heating radiator includes: base plate of radiator 2, Contraband type heat pipe 1 and be arranged at radiating fin 5 on the base plate of radiator 2 etc., at present general base plate of radiator 2 is when carrying out the solder bond operation with Contraband type heat pipe 1, for example shown in Figure 1, be at base plate of radiator 2 and radiating fin 5, offer one or more than one through hole 3 earlier, end with Contraband type heat pipe 1 inserts in the through hole 3 default on the base plate of radiator 2 again, because of trickle slit and unfixing is arranged between Contraband type heat pipe 1 and the through hole 3, so fill with nickel material 4 (being commonly called as thermal grease) inside, so that fix its inner structure and uniformly thermal source conducted to Contraband type heat pipe 1, last radiating fin 5 is punctured into the top (and being fixed on base plate of radiator 2 tops) of Contraband type heat pipe 1 more one by one, is beneficial to thermal source and conducts to radiating fin from Contraband type heat pipe 1 and dispel the heat.But because the slit, composition surface between through hole is very narrow and small on this heat pipe 1 and the base plate of radiator 2, so when carrying out filling nickel material 4, in operation, be difficult for construction, and whether uniformly dispersing is to the slit can't to learn the nickel material, operation is very slow, therefore squeeze packing nickel material has caused great puzzlement to the dealer, really the problem that should solve for the task of top priority.
Summary of the invention
The technical problems to be solved in the utility model is: a kind of improved base plate of radiator structure is provided, makes heat pipe and base plate of radiator when carrying out the solder bond operation, rapid and convenient more improves the qualification rate and the production capacity of product according to this.
Technical solution of the present utility model is: a kind of improved base plate of radiator structure, the base arrangement of this heating radiator include at least a bottom can with the contacted base plate of microprocessor end face, and through the heat pipe and a plurality of radiating fins of being located at this plate top surface of described base plate central authorities, wherein: the through hole top in the base plate of radiator, offer an open slot, this open slot upwards can penetrate into the end face of base plate of radiator, and connects setting with described through hole; Contraband type heat pipe is capable of being combined to be arranged in the described through hole, can be filled in this through hole by the thermal grease of this open slot top filling, and described heat pipe closely contacts setting with base plate.
Characteristics of the present utility model and advantage are: the utility model utilizes the former through-hole structure that is arranged on the base plate of radiator, locate to offer a long strip type groove above it, and this groove is for running through between this through hole and an outer open slot structure of base plate of radiator end face, by this open slot structure, form the runner that a place can make things convenient for filling nickel material, thereby overcome the defective of prior art, after the nickel material is overheated, can be dissolved between the slit of base plate of radiator and heat pipe automatically, when can making the operation of filling nickel material, this open slot do not have again the space narrow and small, hinder the situation of construction to take place, make heat pipe and base plate of radiator when carrying out the solder bond operation, rapid and convenient more, improve the qualification rate and the production capacity of product according to this, and it is simple in structure, is convenient to implement.
Description of drawings
Fig. 1 is known base plate of radiator dependency structure figure;
Fig. 2 is a base plate of radiator dependency structure exploded view of the present utility model;
Fig. 3 is a base plate of radiator dependency structure constitutional diagram of the present utility model;
Fig. 4 is a base plate of radiator dependency structure section plan of the present utility model;
Fig. 5 is that base plate of radiator dependency structure plan cross-section of the present utility model is implemented figure;
Fig. 6 is the three-dimensional figure of enforcement of base plate of radiator dependency structure of the present utility model.
The drawing reference numeral explanation:
1, heat pipe 2, base plate of radiator 3, through hole 31, open slot
4, nickel material 5, radiator fins
Embodiment
In order to make the technical solution of the utility model, feature and effect further specifically be understood, conjunction with figs. now is described as follows in detail:
See also Fig. 2,3, shown in 6, the utility model offers one or more than one through hole 3 on base plate of radiator 2, above through hole 3, offer an open slot 31 that can connect 3 of base plate of radiator 2 end faces and through holes, utilize this open slot 31 can penetrate into the characteristic of outer and base plate of radiator 2 interior bone 3 of the end face of base plate of radiator 2, make its open channels place as filling nickel material 4, again because the opening part of this open slot 31 can reach the rear from the front end of base plate of radiator 2 end faces, area is very broad, so when filling nickel material 4, the space very very much not has not easy working situation and takes place, enforcement situation about filling nickel material 4, as shown in Figure 4, situation when not filling out as yet as nickel material 4, after in the through hole 3 of heat pipe 1 insertion base plate of radiator 2 inside, as shown in Figure 5, nickel material 4 can be filled into from the open slot 31 of base plate of radiator 2 end faces, when nickel material 4 after open slot 31 places are filled into, after in case heat pipe 1 is overheated, just can make nickel material 4 dissolve directly flowing downstream into 3 of the through holes of heat pipe 1 and base plate of radiator 2 inside, fully heat pipe 1 outer fringe surface is coated ten minutes rapid and convenient in the operation.
Though the utility model discloses with specific embodiment; but it is not in order to limit the utility model; any those skilled in the art; the displacement of the equivalent assemblies of under the prerequisite that does not break away from design of the present utility model and scope, having done; or, all should still belong to the category that this patent is contained according to equivalent variations and modification that the utility model scope of patent protection is done.

Claims (1)

1, a kind of improved base plate of radiator structure, the base arrangement of this heating radiator include at least a bottom can with the contacted base plate of microprocessor end face, and through the heat pipe and a plurality of radiating fins of being located at this plate top surface of described base plate central authorities, it is characterized in that: the through hole top in the base plate of radiator, offer an open slot, this open slot upwards can penetrate into the end face of base plate of radiator, and connects setting with described through hole; Contraband type heat pipe is capable of being combined to be arranged in the described through hole, can be filled in this through hole by the thermal grease of this open slot top filling, and described heat pipe closely contacts setting with base plate.
CN 03266737 2003-07-07 2003-07-07 Improved heat radiator bottom plate structure Expired - Fee Related CN2634525Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 03266737 CN2634525Y (en) 2003-07-07 2003-07-07 Improved heat radiator bottom plate structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 03266737 CN2634525Y (en) 2003-07-07 2003-07-07 Improved heat radiator bottom plate structure

Publications (1)

Publication Number Publication Date
CN2634525Y true CN2634525Y (en) 2004-08-18

Family

ID=34298437

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 03266737 Expired - Fee Related CN2634525Y (en) 2003-07-07 2003-07-07 Improved heat radiator bottom plate structure

Country Status (1)

Country Link
CN (1) CN2634525Y (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100447521C (en) * 2005-04-28 2008-12-31 日立电线株式会社 Heat pipe radiator and method for manufacturing same
CN100462159C (en) * 2006-07-04 2009-02-18 陈世明 Vertical combined type heat transfer radiating device manufacturing method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100447521C (en) * 2005-04-28 2008-12-31 日立电线株式会社 Heat pipe radiator and method for manufacturing same
CN100462159C (en) * 2006-07-04 2009-02-18 陈世明 Vertical combined type heat transfer radiating device manufacturing method

Similar Documents

Publication Publication Date Title
DE102009016576B4 (en) battery
CN100458343C (en) Heat collector with mounting plate
CN2634525Y (en) Improved heat radiator bottom plate structure
DE202015009510U1 (en) Carrier, support frame and light emitting device
CN106658938A (en) Printed circuit board and manufacturing method thereof
CN101630716B (en) Platy LED metal substrate, platy LED light emitting device and manufacturing method thereof
CN203242617U (en) A packaging structure of a Schottky diode
CN202938264U (en) Double-layer circuit structure with good radiating effect
CN203659924U (en) LED packaging substrate
CN104949080B (en) Honeycomb radiator and its processing technology
CN110493954A (en) PCB construction and preparation method thereof is buried in a kind of QFN device
CN209588799U (en) There is the box-like stacking heat exchanger of support fin in periphery of angled hole plane space
CN208352292U (en) A kind of LED charactrons
CN206921812U (en) A kind of high intensity lead frame
CN212461675U (en) Surface mount diode lead frame
CN101777502A (en) Packaging method of inverted chip
CN218362982U (en) Installation frock of on-vehicle machine switch tube that charges
CN216818382U (en) Base plate and thermoelectric module with hinder and weld structure
CN108901183A (en) A kind of water-cooled plate and preparation method thereof
CN214767899U (en) Aluminum radiator extrusion die
CN100447954C (en) Method for manufacturing metal balls of sphere grid array in semiconductor module
CN212934567U (en) Closely arranged LED lamp bead material box carrier band
CN217334075U (en) Semiconductor device with a plurality of transistors
CN218505312U (en) Refrigerator door frame extrusion mechanism
CN216087344U (en) WiFi6 router that contains full coverage fin

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20040818

Termination date: 20120707