CN2613049Y - 简化型影像感测器模组 - Google Patents

简化型影像感测器模组 Download PDF

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CN2613049Y
CN2613049Y CNU032368631U CN03236863U CN2613049Y CN 2613049 Y CN2613049 Y CN 2613049Y CN U032368631 U CNU032368631 U CN U032368631U CN 03236863 U CN03236863 U CN 03236863U CN 2613049 Y CN2613049 Y CN 2613049Y
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image sensing
image sensor
sensing wafer
transparent colloid
sensor module
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谢志鸿
吴志成
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Kingpak Technology Inc
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Kingpak Technology Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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Abstract

一种简化型影像感测器模组。为提供一种结构简单、便于制造、降低生产成本、缩小整体尺寸的影像感测器模组，提出本实用新型，它包括设有上、下表面的基板、设有设于基板上表面并与基板形成凹槽的第一表面及第二表面的凸缘层、设有复数焊垫的影像感测晶片、电连接于影像感测晶片的焊垫与基板上表面的复数条导线及填充于基板与凸缘层形成的凹槽内并包覆住影像感测晶片的透明胶体；透明胶体相对于影像感测晶片的位置形成具有聚焦的作用的凸透部；影像感测晶片固定于基板上表面上，并位于凹槽内。

Description

简化型影像感测器模组
技术领域
本实用新型属于影像感测器模组，特别是一种简化型影像感测器模组。
背景技术
如图1所示，习知的影像感测器模组包括镜座10、镜筒20及影像感测器30。
镜座10设有上端面12、下端面14及由上端面12贯通至下端面14并形成内螺纹18的容置室16。
镜筒20设有与镜座10容置室16内螺纹18相对应并螺接的外螺纹22，其内由上而下设有透光区24、非球面镜片26及红外线滤光镜片28。镜筒20由镜座10的上端面12容置于容置室16内，并与镜座10的内螺纹18螺锁。
影像感测器30设有第一面32及第二面34，第一面32设置有透光层36。
影像感测器30系藉由透光层36黏着固定于镜座10的下端面14，并藉由调整镜筒20与镜座10螺合的深度，以控制镜筒20的非球面镜片26与影像感测器30透光层36间的焦距。
习知的影像感测器模组存在如下缺点：
1、制造上较为复杂，必须将影像感测器30先行封装完成后，再将其与镜座10及镜筒20搭配而形成影像感测器模组，以使影像感测器30接收非球面镜片26聚光后的光讯号，故其结构较复杂，且整体尺寸较高，无法达到轻薄短小的要求。
2、透光层36系以黏胶黏着于镜座10的下端面14上，制程中，黏胶易污染透光层36表面，从而造成光讯号接收不良。
3、进行模组的组装时，透光层36必须精准地与非球面镜片26进行对位，而以黏胶黏着方式固定，一旦对位精准度有所偏差时，整个模组便无法再行重新组装，而必须予以报废。
发明内容
本实用新型的目的是提供一种结构简单、便于制造、降低生产成本、缩小整体尺寸的简化型影像感测器模组。
本实用新型包括设有上、下表面的基板、设有设于基板上表面并与基板形成凹槽的第一表面及第二表面的凸缘层、设有复数焊垫的影像感测晶片、电连接于影像感测晶片的焊垫与基板上表面的复数条导线及填充于基板与凸缘层形成的凹槽内并包覆住影像感测晶片的透明胶体；透明胶体相对于影像感测晶片的位置形成具有聚焦的作用的凸透部；影像感测晶片固定于基板上表面上，并位于凹槽内。
其中：
基板上表面形成复数个藉复数条导线电连接至影像感测晶片焊垫上的第一接点。
基板下表面形成复数个用以电连接至印刷电路板上第二接点。
透光层上凸透部系呈弧形状。
由于本实用新型包括设有上、下表面的基板、设有设于基板上表面并与基板形成凹槽的第一表面及第二表面的凸缘层、设有复数焊垫的影像感测晶片、电连接于影像感测晶片的焊垫与基板上表面的复数条导线及填充于基板与凸缘层形成的凹槽内并包覆住影像感测晶片的透明胶体；透明胶体相对于影像感测晶片的位置形成具有聚焦的作用的凸透部；影像感测晶片固定于基板上表面上，并位于凹槽内。将影像感测晶片封装完成后，藉由透明胶体的凸透部，即可接收聚焦的光讯号，使影像感测器无须另行搭配模组使用，故不但产品尺寸得以有效缩小，且制造上较为便利，可有效降低生产成本；不仅结构简单、便于制造、降低生产成本，而且缩小整体尺寸，从而达到本实用新型的目的。
附图说明
图1、为习知的影像感测器模组结构示意剖视图。
图2、为本实用新型结构示意剖视图。
图3、为本实用新型结构示意剖视图(未形成透光层)。
具体实施方式
如图2、图3所示，本实用新型包括基板40、凸缘层42、设有复数个焊垫64的影像感测晶片44、复数条导线46及透明胶体48。
基板40设有形成复数个第一接点54的上表面50及形成复数个用以电连接至印刷电路板53上第二接点56下表面52。
凸缘层42设有设置于基板40上表面50上并与基板40形成凹槽62的第一表面58及第二表面60。
影像感测晶片44固定于基板40的上表面50上，并位于凹槽62内。
复数条导线46系电连接于影像感测晶片44的焊垫64与基板40上表面50上的第一接点54之间，以将影像感测晶片44的讯号传递至基板40上。
透明胶体48系填充于基板40与凸缘层42形成的凹槽62内，藉以包覆住影像感测晶片44，其相对于影像感测晶片44位置处形成有呈弧形状具有聚焦的作用的凸透部66，以使影像感测晶片44可透过凸透部66接收光讯号。
将影像感测晶片44封装完成后，藉由透明胶体48的凸透部，即可接收聚焦的光讯号，使影像感测器无须另行搭配模组使用，故不但产品尺寸得以有效缩小，且制造上较为便利，可有效降低生产成本。

Claims (4)

1、一种简化型影像感测器模组，它包括设有上、下表面的基板、设有设于基板上表面并与基板形成凹槽的第一表面及第二表面的凸缘层、设有复数焊垫的影像感测晶片及电连接于影像感测晶片的焊垫与基板上表面的复数条导线；影像感测晶片固定于基板上表面上，并位于凹槽内；其特征在于所述的基板与凸缘层形成的凹槽内填充包覆住影像感测晶片的透明胶体；透明胶体相对于影像感测晶片的位置形成具有聚焦的作用的凸透部。
2、根据权利要求1所述的简化型影像感测器模组，其特征在于所述的基板上表面形成复数个藉复数条导线电连接至影像感测晶片焊垫上的第一接点。
3、根据权利要求1所述的简化型影像感测器模组，其特征在于所述的基板下表面形成复数个用以电连接至印刷电路板上第二接点。
4、根据权利要求1所述的简化型影像感测器模组，其特征在于所述的透明胶体上的凸透部系呈弧形状。
CNU032368631U 2003-01-27 2003-01-27 简化型影像感测器模组 Expired - Fee Related CN2613049Y (zh)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104743508A (zh) * 2015-04-16 2015-07-01 歌尔声学股份有限公司 含有传感器单元的模组的封装方法和封装结构
CN105448939A (zh) * 2014-08-06 2016-03-30 原相科技(槟城)有限公司 图像模块封装及其制作方法
WO2018219358A1 (zh) * 2017-06-02 2018-12-06 宁波舜宇光电信息有限公司 光学镜头、光学组件和光学模组以及制造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105448939A (zh) * 2014-08-06 2016-03-30 原相科技(槟城)有限公司 图像模块封装及其制作方法
CN104743508A (zh) * 2015-04-16 2015-07-01 歌尔声学股份有限公司 含有传感器单元的模组的封装方法和封装结构
WO2018219358A1 (zh) * 2017-06-02 2018-12-06 宁波舜宇光电信息有限公司 光学镜头、光学组件和光学模组以及制造方法

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