CN2606456Y - Water circulating CPU radiator - Google Patents
Water circulating CPU radiator Download PDFInfo
- Publication number
- CN2606456Y CN2606456Y CN 03223094 CN03223094U CN2606456Y CN 2606456 Y CN2606456 Y CN 2606456Y CN 03223094 CN03223094 CN 03223094 CN 03223094 U CN03223094 U CN 03223094U CN 2606456 Y CN2606456 Y CN 2606456Y
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- China
- Prior art keywords
- radiator
- inlet pipe
- outlet pipe
- water
- water inlet
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates the radiating device technical field, in particular to a water circulating CPU radiator. The utility model is realized by the technical proposal that: an empty liquid storage cavity is arranged inside the radiator; one end of the water inlet pipe and one end of the water outlet pipe are respectively communicated with the empty cavity arranged inside the radiator, while the other end of the water inlet pipe and the other end of the water outlet pipe are respectively communicated with a container with liquid inside; and a water pump is arranged on the water inlet pipe or the water outlet pipe. With the structure, the utility model can rapidly radiate the heat absorbed by the radiator by constant recirculation of the inside liquid, thereby enormously improving the radiating performance of the radiator, with no increase of the volume of the radiator.
Description
Technical field:
The utility model relates to radiating device technical field, refers in particular to a kind of cpu heat that improves radiating efficiency.
Background technology:
See accompanying drawing 1, this is a radiator 01 that is used on the computer CPU, and it adopts the higher metal material of heat conductivility to make usually.Be provided with the cylinder 02 of many projectioies on radiator 01, the setting of these cylinders 02 can increase the surface area of entire radiator 01 greatly to improve its radiating efficiency.Because along with computer equipment development at full speed, as the also positive high speed development of the central processing unit of computer equipment core, can become a major issue of present CPU development but CPU in time dispel the heat, if a large amount of heats of the generation in the time of CPU can not being worked in time exhale, be easy to cause CPU to be burnt.So in order to improve the arithmetic speed of CPU, just need to guarantee its working temperature, improve the heat transference efficiency of radiator.Usually the way that adopts is a kind of is to add a fan on radiator, quickens its radiating rate by external device; Another kind is exactly the area of dissipation that strengthens radiator.But all there is a drawback in these two kinds of methods, have strengthened the volume of radiator exactly, and this deviates to littler, faster development target mutually with computer.
Summary of the invention:
The purpose of this utility model is to provide a kind of mode that adopts the boiler water circulation heat radiation, under the precondition that does not increase the radiator volume, can effectively improve the cpu heat of its radiating efficiency.
The utility model is achieved by the following technical solution: but radiator inside is provided with the cavity of carrying liquid, one end of water inlet pipe and outlet pipe is communicated with cavity in the radiator respectively, and water inlet pipe is communicated with the container that fills liquid with the other end of outlet pipe, and water inlet pipe or outlet pipe are provided with water pump.
After adopting this structure, make the utility model can utilize in its cavity constantly circulation liquid, the heat that radiator is absorbed is dispersed fast, thereby improves the radiating efficiency of radiator greatly, and does not increase the volume of radiator.
Description of drawings:
Below in conjunction with accompanying drawing the utility model is further described:
Fig. 1 is the three-dimensional structure diagram of existing cpu heat;
Fig. 2 is a structural representation of the present utility model;
Fig. 3 is the another kind of execution mode of the utility model radiator.
Embodiment:
See accompanying drawing 2, the utility model comprises: comprising: radiator 1, but radiator 1 inside is provided with the cavity 11 of carrying liquid, one end of water inlet pipe 2 and outlet pipe 3 is communicated with cavity 11 in the radiator 1 respectively, and water inlet pipe 2 is communicated with the container 4 that fills liquid 6 with the other end of outlet pipe 3, and water inlet pipe 2 or outlet pipe 3 are provided with water pump 5.The above-mentioned liquid 6 general water that adopt.
See accompanying drawing 3, this is another execution mode of the utility model radiator 1, and wherein the cavity 11 that is communicated with for duct type in the radiator 1 adopts the cavity 11 of this structure will help the circulation of current more, quickens the efficient of heat radiation.In order to improve radiating rate, the internal communication cavity of the water inlet pipe 2 that can make cavity 11 and be communicated with cavity, outlet pipe 3, container 4 is for straight empty.
When using the utility model, radiator 1 is placed on the CPU, be coated with at contact-making surface and spread heat conductive silica gel and in time pass to radiator 1, then water inlet pipe 2 and outlet pipe 3 are passed the casing of host computer to guarantee heat, and 4 connections of the container in the casing that is placed on host computer outside.When CPU starts working, start water pump 5, make the water in the container 4 begin to circulate along water inlet pipe 2, radiator 1, outlet pipe 3, like this since ringing by current timely the heat transferred of radiator 1 absorption is gone out.Because being used for the current of thermolysis mainly is contained in the container 4, and container 4 can be provided with its size as required, can change what of Total Body Water as required, even even current dispel the heat through long-time circulation like this, its bulk temperature does not have tangible rising yet.On the other hand, because the volume of radiator also need not increase in the utility model, and its equipment that mainly takes up room---container 4, can be placed on the outside of computer housing by water inlet pipe 2 and outlet pipe 3, so, just need not improve radiating efficiency by the volume that strengthens radiator 1.
Claims (3)
1, a kind of boiler water circulation cpu heat, comprise: radiator (1), it is characterized in that: radiator (1) but inside is provided with the cavity (11) of carrying liquid, one end of water inlet pipe (2) and outlet pipe (3) is communicated with cavity (11) in the radiator (1) respectively, and water inlet pipe (2) is communicated with the container that fills liquid (6) (4) with the other end of outlet pipe (3), and water inlet pipe (2) or outlet pipe (3) are provided with water pump (5).
2, a kind of boiler water circulation cpu heat according to claim 1 is characterized in that: the cavity (11) that is communicated with for duct type in the radiator (1).
3, a kind of boiler water circulation cpu heat according to claim 1 is characterized in that: described liquid (6) is water.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 03223094 CN2606456Y (en) | 2003-01-21 | 2003-01-21 | Water circulating CPU radiator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 03223094 CN2606456Y (en) | 2003-01-21 | 2003-01-21 | Water circulating CPU radiator |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2606456Y true CN2606456Y (en) | 2004-03-10 |
Family
ID=34162563
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 03223094 Expired - Fee Related CN2606456Y (en) | 2003-01-21 | 2003-01-21 | Water circulating CPU radiator |
Country Status (1)
Country | Link |
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CN (1) | CN2606456Y (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1893802B (en) * | 2005-06-30 | 2010-05-12 | 英特尔公司 | Liquid cooling system comprising component capable of heat exchanging |
CN103605414A (en) * | 2013-11-23 | 2014-02-26 | 韩兴 | Radiating device for case |
-
2003
- 2003-01-21 CN CN 03223094 patent/CN2606456Y/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1893802B (en) * | 2005-06-30 | 2010-05-12 | 英特尔公司 | Liquid cooling system comprising component capable of heat exchanging |
CN103605414A (en) * | 2013-11-23 | 2014-02-26 | 韩兴 | Radiating device for case |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |