CN107357399B - Computer intelligent temperature control cooling system - Google Patents

Computer intelligent temperature control cooling system Download PDF

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Publication number
CN107357399B
CN107357399B CN201710839860.8A CN201710839860A CN107357399B CN 107357399 B CN107357399 B CN 107357399B CN 201710839860 A CN201710839860 A CN 201710839860A CN 107357399 B CN107357399 B CN 107357399B
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heat
turbine
pipe
communicated
bevel gear
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CN107357399A (en
Inventor
李海珍
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Hefei Guanshuo Information Technology Co ltd
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Hefei Guanshuo Information Technology Co ltd
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

Abstract

The invention discloses an intelligent temperature control and heat dissipation system for a computer, which comprises: the heat absorbing sheets are arranged on the mainboard in parallel, and the five heat absorbing sheets are respectively arranged in a CPU area, a display card area, a memory area, a south bridge area and a north bridge area; the cold pipe is communicated with one end of the heat absorption pipe; the heat pipe is communicated with the other end of the heat absorption pipe; and the radiating fins are communicated with the cold pipe and the heat pipe and are arranged on the outer side surface of the case. The method adopts a turbine control device, the heat-conducting medium expands after being heated, the volume is increased, so that the heat pipe turbine rotates in an accelerated way, the heat pipe turbine rotates in an accelerated way to drive the cold pipe turbine to rotate in an accelerated way, and therefore the circulation of the heat-conducting medium in the pipeline is accelerated, and more heat is taken away. The circulation speed is accelerated by the temperature rise of the heat-conducting medium, so that energy is saved.

Description

Computer intelligent temperature control cooling system
Technical Field
The invention relates to computer intelligent temperature control and heat dissipation, in particular to a computer intelligent temperature control and heat dissipation system.
Background
With the rapid development of science and technology, various new technologies and new technical inventions are developed. The intelligent temperature control and heat dissipation system of the computer plays an important role in ensuring the efficient use of the computer. The core technology of the computer intelligent temperature control and heat dissipation system described in the invention patent CN 106055048A is as follows: the liquid alloy is used as a heat-conducting medium, so that heat transfer is effectively guaranteed when the computer dissipates heat. The electromagnetic pump is used as the motion power of the conductive medium, so that the motion of the conductive medium in the pipeline is ensured, and the heat dissipation efficiency of the computer is effectively ensured.
Although the technology well realizes the intelligent temperature control and heat dissipation system of the computer, the heat absorbed by the metal liquid is only simply discharged to the outside of the case and is not well utilized, and the energy is wasted.
Disclosure of Invention
The invention aims to provide an intelligent temperature control and heat dissipation system for a computer, which aims to solve the problem of energy waste and environmental pollution in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme:
a computer intelligent temperature control and heat dissipation system comprises:
the heat absorbing sheets are arranged on the mainboard in parallel, and the five heat absorbing sheets are respectively arranged in a CPU area, a display card area, a memory area, a south bridge area and a north bridge area;
the cold pipe is communicated with one end of the heat absorption pipe;
the heat pipe is communicated with the other end of the heat absorption pipe;
the cooling fin is communicated with the cold pipe and the heat pipe and is arranged on the outer side surface of the case;
the turbine supercharging device comprises a turbine servo motor, a turbine bag, a first bevel gear, a second bevel gear, a turbine bag, a turbine fan, a turbine booster and a turbine fan, wherein the turbine servo motor is arranged on the turbine servo motor;
the main control device comprises a main control module, an information processing module and a communication transceiving module, wherein the main control module is electrically connected with the processor, the turbine control device, the temperature detection device and the power supply device;
the turbine control device comprises an information receiving and transmitting module and a turbine servo motor, the turbine control device is electrically connected with the power supply device, and the turbine control device transmits the power of the heat pipe turbine to the cold pipe turbine through a central shaft;
and the temperature detection device comprises an information transceiving device and a temperature detection probe, and the temperature detection device is electrically connected with the power supply device.
Preferably, the radiating surface of the radiating fin exhausts air towards the outside of the computer mainboard.
Preferably, the heat conducting liquid in the heat pipe is sodium-potassium alloy.
Compared with the prior art, the invention has the beneficial effects that:
the method adopts a turbine control device, the heat-conducting medium expands after being heated, the volume is increased, so that the heat pipe turbine rotates in an accelerated way, the heat pipe turbine rotates in an accelerated way to drive the cold pipe turbine to rotate in an accelerated way, and therefore the circulation of the heat-conducting medium in the pipeline is accelerated, and more heat is taken away. The circulation speed is accelerated by the temperature rise of the heat-conducting medium, so that energy is saved.
Drawings
FIG. 1 is a block diagram of an embodiment of the present invention;
FIG. 2 is a schematic diagram of the mechanism of the embodiment of the present invention;
FIG. 3 is a schematic view of a turbine structure according to an embodiment of the present invention.
In the figure: the heat pump comprises a main plate 1, a heat absorbing sheet 2, a cold pipe 3, a heat pipe 4, a heat radiating sheet 5, a turbine servo motor 61, a heat pipe turbine 62, a cold pipe turbine 63, a central shaft 64, a turbine blade 71, a first bevel gear 72 and a second bevel gear 73.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
With reference to FIGS. 1-3
A computer intelligent temperature control and heat dissipation system comprises:
the heat absorbing sheets 2 are arranged on the mainboard 1 in parallel, and five heat absorbing sheets 2 are respectively arranged in a CPU area, a display card area, a memory area, a south bridge area and a north bridge area;
a cold pipe 3 which is communicated with one end of the heat absorption pipe 2;
the heat pipe 4 is communicated with the other end of the heat absorption pipe 2;
the cooling fin 5 is communicated with the cold pipe 3 and the heat pipe 4, and the cooling surface of the cooling fin exhausts air towards the outside of the computer mainboard;
the turbo-charging device comprises a heat pipe turbine 62 communicated with a heat pipe and a cold pipe turbine 63 communicated with a cold pipe, wherein the heat pipe turbine 62 and the cold pipe turbine 63 are connected to a central shaft 64 of a turbine servo motor 61, the structure of the heat pipe turbine 62 is the same as that of the cold pipe turbine 63, a turbine packet 74 wraps outside a turbine blade 71, a first bevel gear 72 and a second bevel gear 73, the first bevel gear 72 and the second bevel gear 73 are in matched connection, the first bevel gear 72 and the turbine blade 71 are connected, the second bevel gear 73 is connected with the central shaft 64, the central axes of the first bevel gear 72, the turbine blade 71 and the turbine packet 74 are coincident, the central shaft 64 and the central axis of the second bevel gear 73;
the main control device comprises a main control module, an information processing module and a communication transceiving module, wherein the main control module is electrically connected with the processor, the turbine control device, the temperature detection device and the power supply device;
the turbine control device comprises an information receiving and transmitting module and a turbine servo motor, the turbine control device is electrically connected with the power supply device, and the turbine control device transmits the power of the heat pipe turbine 62 to the cold pipe turbine 63 through a central shaft 64;
and the temperature detection device comprises an information transceiving device and a temperature detection probe, and the temperature detection device is electrically connected with the power supply device.
The method adopts a turbine control device, the heat-conducting medium expands after being heated, the volume is increased, so that the heat pipe turbine rotates in an accelerated way, the heat pipe turbine rotates in an accelerated way to drive the cold pipe turbine to rotate in an accelerated way, and therefore the circulation of the heat-conducting medium in the pipeline is accelerated, and more heat is taken away. The circulation speed is accelerated by the temperature rise of the heat-conducting medium, so that energy is saved.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (3)

1. The utility model provides a computer intelligence accuse temperature cooling system which characterized in that includes:
the heat absorbing sheets (2) are arranged on the mainboard (1) in parallel, and the five heat absorbing sheets (2) are respectively arranged in a CPU area, a display card area, a memory area, a south bridge area and a north bridge area;
the cold pipe (3) is communicated with one end of the heat absorption pipe (2);
a heat pipe (4) which is communicated with the other end of the heat absorption pipe (2);
the cooling fins (5) are communicated with the cold pipe (3) and the heat pipe (4), and the cooling fins (5) are arranged on the outer side surface of the case;
the turbocharging device is characterized in that a heat pipe turbine (62) communicated with a heat pipe and a cold pipe turbine (63) communicated with a cold pipe are connected to a central shaft (64) of a turbine servo motor (61), the heat pipe turbine (62) and the cold pipe turbine (63) are of the same structure, a turbine packet (74) wraps outside a turbine blade (71), a first bevel gear (72) and a second bevel gear (73), the first bevel gear (72) and the second bevel gear (73) are in fit connection, the first bevel gear (72) is connected with the turbine blade (71), the second bevel gear (73) is connected with the central shaft (64), the central axes of the first bevel gear (72), the turbine blade (71) and the turbine packet (74) are coincident, and the central axes of the central shaft (64) and the second bevel gear (73) are coincident;
the heat radiating fins (5) are communicated with one ends of the heat absorbing fins (2) through the cold pipes (3), and the other ends of the heat absorbing fins are communicated through the heat pipes (4);
the main control device comprises a main control module, an information processing module and a communication transceiving module, wherein the main control module is electrically connected with the processor, the turbine control device, the temperature detection device and the power supply device;
the turbine control device comprises an information receiving and transmitting module and a turbine servo motor, the turbine control device is electrically connected with the power supply device, and the turbine control device transmits the power of the heat pipe turbine (62) to the cold pipe turbine (63) through a central shaft (64);
and the temperature detection device comprises an information transceiving device and a temperature detection probe, and the temperature detection device is electrically connected with the power supply device.
2. The system according to claim 1, wherein the heat dissipation surface of the heat dissipation plate exhausts air to the outside of the computer motherboard.
3. The computer intelligent temperature control and heat dissipation system of claim 1, wherein: and the heat-conducting liquid in the heat pipe (4) is sodium-potassium alloy.
CN201710839860.8A 2017-09-18 2017-09-18 Computer intelligent temperature control cooling system Active CN107357399B (en)

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Application Number Priority Date Filing Date Title
CN201710839860.8A CN107357399B (en) 2017-09-18 2017-09-18 Computer intelligent temperature control cooling system

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Application Number Priority Date Filing Date Title
CN201710839860.8A CN107357399B (en) 2017-09-18 2017-09-18 Computer intelligent temperature control cooling system

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CN107357399A CN107357399A (en) 2017-11-17
CN107357399B true CN107357399B (en) 2020-05-26

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108445998B (en) * 2018-02-28 2020-03-06 重庆补贴猫电子商务有限公司 Cooling device for computer

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2907193Y (en) * 2006-03-06 2007-05-30 张炜 Heat radiator
CN101325863A (en) * 2008-08-06 2008-12-17 王志勇 Radiator for cooling automatic cycle liquid
CN104216492A (en) * 2014-09-29 2014-12-17 上海交通大学 Liquid-state cooling immersion type structure heat dissipation system for computer chip
US9032742B2 (en) * 2010-12-30 2015-05-19 Munters Corporation Methods for removing heat from enclosed spaces with high internal heat generation
CN105224054A (en) * 2015-11-13 2016-01-06 屠雪祥 Heat radiation module
CN205540531U (en) * 2016-03-29 2016-08-31 吕迅 Computer temperature control system
CN205692118U (en) * 2016-05-26 2016-11-16 阿坝师范学院 A kind of computer with high-cooling property
CN205788069U (en) * 2016-05-05 2016-12-07 天津瑞鑫科技咨询有限公司 The water-cooling fan that the heat radiation of a kind of computer is special
CN206301260U (en) * 2016-08-30 2017-07-04 天津万达鼎睿网络科技有限公司 Computer radiating sorting device
CN107092321A (en) * 2017-06-02 2017-08-25 山东建筑大学 A kind of phase-change heat cabinet of computer

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2907193Y (en) * 2006-03-06 2007-05-30 张炜 Heat radiator
CN101325863A (en) * 2008-08-06 2008-12-17 王志勇 Radiator for cooling automatic cycle liquid
US9032742B2 (en) * 2010-12-30 2015-05-19 Munters Corporation Methods for removing heat from enclosed spaces with high internal heat generation
CN104216492A (en) * 2014-09-29 2014-12-17 上海交通大学 Liquid-state cooling immersion type structure heat dissipation system for computer chip
CN105224054A (en) * 2015-11-13 2016-01-06 屠雪祥 Heat radiation module
CN205540531U (en) * 2016-03-29 2016-08-31 吕迅 Computer temperature control system
CN205788069U (en) * 2016-05-05 2016-12-07 天津瑞鑫科技咨询有限公司 The water-cooling fan that the heat radiation of a kind of computer is special
CN205692118U (en) * 2016-05-26 2016-11-16 阿坝师范学院 A kind of computer with high-cooling property
CN206301260U (en) * 2016-08-30 2017-07-04 天津万达鼎睿网络科技有限公司 Computer radiating sorting device
CN107092321A (en) * 2017-06-02 2017-08-25 山东建筑大学 A kind of phase-change heat cabinet of computer

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