CN2588441Y - Pipe type heat sink - Google Patents
Pipe type heat sink Download PDFInfo
- Publication number
- CN2588441Y CN2588441Y CN 02236412 CN02236412U CN2588441Y CN 2588441 Y CN2588441 Y CN 2588441Y CN 02236412 CN02236412 CN 02236412 CN 02236412 U CN02236412 U CN 02236412U CN 2588441 Y CN2588441 Y CN 2588441Y
- Authority
- CN
- China
- Prior art keywords
- heat
- radiator
- utility
- pipe radiator
- container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a heat pipe radiator, which is used for a heat pipe radiator of the heat radiation of electronic elements, particularly used for the heat pipe radiator of the heat radiation of a computer central processor, or a hard disk, etc. The utility model is characterized in that an outer wall which is communicated with a container is sheathed with at least two pipes of a radiator leaf blade. The characteristic of the utility model solves the disadvantages that the heat of a heat releasing end is centralized, and the heat of a heat absorbing end is not easy to absorb, which is generated by a 'one-to-one 'structure that one end of the existing heat pipe radiator absorbs heat, and the other end releases heat. The heat pipe radiator of the utility model adopts a 'one-to-many ' or 'many-to-many' structure in which heat is absorbed by one end or multiple ends and heat is released by multiple ends, which causes heat release to achieve the goal of quick heat absorption and quick heat release.
Description
A kind of particularly heat-pipe radiator of the heat transmission of robot calculator central processing unit (CPU) or hard disk etc. of thermal objects such as electronic devices and components that is used for.
Existing heat pipe adopts " one to one " structure of end heat absorption, other end heat release with hot device, though adopting heat pipes for heat transfer is rapid, the release end of heat heat is concentrated, and heat radiation is difficult.
The utility model proposes a kind of new heat pipe structure,, heat is distributed fast to overcome the disadvantage that the release end of heat heat is concentrated.
Heat-pipe radiator of the present utility model adopts " one-to-many " or " multi-to-multi " structure of the heat absorption of an end or multiterminal, multiterminal heat release, makes spread heat and reaches quick heat absorption, quick heat radiating purpose.
Heat-pipe radiator (see figure 1) of the present utility model by container 1. and the outer wall that is communicated with this container be with radiator shutter pipe 3. and 2. form a confined space, be filled with in this confined space be less than this spatial volume amount liquid 4., as water or organic solvent, be with radiator shutter pipe 3. with outer wall that 1. container is communicated with and 2. have two at least, radiator shutter be connected with on 3. cooling fan 7. the accelerated heat heat radiation send out, container 1. with thermal objects 5. the reverse side of the chamber wall of contact site post the imbibition lining 6., to guarantee 4. abundant 1. heated part of contacting container of liquid, 1. container is to constitute (see figure 2) by a chamber (see figure 1) or the connection of the chamber more than.
Diffuse to pipe 2. when 4. heat that 5. thermal objects produces evaporates the liquid of container in 1., the steam that 4. liquid evaporate generation is cooled in 2. at pipe, be back to container 1. for liquid with fixed attention, its heat by pipe 2. the outside radiator shutter 3. be dispersed in the air, so periodic duty reaches the heat radiation purpose.
And the manufacturing of heat-pipe radiator of the present utility model when assembling, 1. container adopts the glue adhesive seal to replace welded seal with pipe connecting portion 2., reach save time, saving of labor, the purpose that reduces cost.
Claims (2)
1, a kind of heat-pipe radiator, by container 1. and the outer wall that is communicated with this container be with radiator shutter pipe 3. and 2. form confined space, be filled with in this confined space be less than this spatial volume amount liquid 4., as water or organic solvent, radiator shutter be connected with on 3. cooling fan 7. accelerated heat distribute, it is characterized in that being with radiator shutter pipe 3. with outer wall that 1. container is communicated with 2. has two at least.
2, heating radiator according to claim 1 is characterized in that 1. described container is to be communicated with by a chamber or the chamber more than to constitute.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 02236412 CN2588441Y (en) | 2002-05-21 | 2002-05-21 | Pipe type heat sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 02236412 CN2588441Y (en) | 2002-05-21 | 2002-05-21 | Pipe type heat sink |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2588441Y true CN2588441Y (en) | 2003-11-26 |
Family
ID=33710681
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 02236412 Expired - Fee Related CN2588441Y (en) | 2002-05-21 | 2002-05-21 | Pipe type heat sink |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN2588441Y (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1314112C (en) * | 2004-01-08 | 2007-05-02 | 杨洪武 | Heat-tube radiator for heating electronic element |
CN100346263C (en) * | 2004-10-29 | 2007-10-31 | 国际商业机器公司 | Method for high-density packaging and cooling of high-powered compute and storage server blades |
-
2002
- 2002-05-21 CN CN 02236412 patent/CN2588441Y/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1314112C (en) * | 2004-01-08 | 2007-05-02 | 杨洪武 | Heat-tube radiator for heating electronic element |
CN100346263C (en) * | 2004-10-29 | 2007-10-31 | 国际商业机器公司 | Method for high-density packaging and cooling of high-powered compute and storage server blades |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |