CN2585405Y - Means for supporting semiconductor wafer - Google Patents

Abstract

The utility model discloses a loading device for loading semiconductor chips, namely a chip vessel, which is suitable for placing at least one piece of chip. The loading device for loading semiconductor chips comprises a first side wall, a second side wall which is arranged on the relative position of the first side wall, a front side wall and a back side wall. The loading device for loading semiconductor chips also comprises a main body part which is limited to an inner space area for vertically placing a plurality of chips; a support lithographic plate is arranged between each compartment of the inner space area. In addition, the main body part of the chip vessel also comprises two parallel foot racks which can support the whole loading device for loading semiconductor chips and chips of the inner part of the loading device for loading semiconductor chips, and a handle for holding the loading device for loading semiconductor chips.

Description

The semiconductor wafer bogey

Technical field

The utility model relates to a kind of semiconductor wafer bogey, particularly a kind of chip bearing apparatus of the wafer standing groove that has support plate and widen.

Background technology

Semiconductor wafer bogey, that is the brilliant boat that is commonly called as are typically to be used for storing, transport and the device of processed wafer.Usually, the semiconductor wafer bogey is designed to can take up at least the structure of a wafer; More particularly, the semiconductor wafer bogey mainly contains a plurality of wafer standing grooves (slot), and each wafer standing groove can be for placing a wafer.

Fig. 1 is the stereogram of existing brilliant boat structure.This crystalline substance boat 10 mainly comprises a front side wall 16, a rear wall 17, a left side wall 14 and a right side wall 15, and this four sidewall defines one jointly can be with the wafer space with compartment that is seated in wherein parallel to each other; This crystalline substance boat also further comprises a pair of foot rest parallel to each other 22,23, and a handle 13 that is positioned on the front side wall.

Fig. 2 is the vertical view of brilliant boat structure as shown in Figure 1; Wherein, respectively have dentalation on the relative position of left side wall 14 and right side wall 15, by this dentalation, it is 6.35 millimeters wafer placement groove that left side wall 14 and right side wall 15 define 25 width jointly, and each wafer placement groove can be for placing a wafer.

Fig. 3 is the interior local enlarged diagram of putting wafer of brilliant boat as shown in Figure 1.At first, we can observe the wafer that is seated in the brilliant boat at an easy rate and present the sagging phenomenon of core.This phenomenon is that core then is unsettled state because the wafer that level is put only is subjected to the support of dentalation on the sidewall at two ends; Under gravitational influence, the center wafer position is naturally just toward sagging, and this sagging situation can strengthen along with the size of wafer, thickness attenuation and serious further.In addition, because the middle cardioptosia of wafer causes entire wafer to produce deformation; Even so wafer still can present the up U-shaped of warpage of a both sides of wafers limit by being removed in the brilliant boat when lying against on the workbench.The relation of the warp value of wafer is as shown in Table 1 on sagging value and the workbench in brilliant boat for wafer.The deformation of this kind wafer, not only cause the difficulty of subsequent technique, for example influence the accuracy that grinder reaches board load wafer such as sticking transputer automatically and takes out wafer, than under the serious situation, even the wafer full wafer is scrapped, the negative results that causes production cost raising, qualification rate and productive rate to descend.Table one

The sagging value of wafer in the brilliant boat	4mm	6mm	7mm	10mm	11mm
						The warp value of wafer on the platform	1mm	2mm	3mm	4mm	5mm

In addition, because the width (pitch) of existing its wafer placement groove of brilliant boat has only 6.35 millimeters, the too for a short time wafer that causes of spacing is when carrying, the wafer that deformation is slightly especially arranged, be impacted easily and cause fragmentation, this situation equally also can cause the increase of production cost, sometimes even cause the fault of board, so also be a problem demanding prompt solution.

The utility model content

First purpose of the present utility model provides one can prevent LED reverse mounting type sagging semiconductor wafer bogey in brilliant boat.

Second purpose of the present utility model provides a semiconductor wafer bogey that can significantly improve the LED reverse mounting type warpage.

The 3rd purpose of the present utility model provides one can reduce that wafer is impacted and the semiconductor wafer bogey that causes problems such as fragmentation and mechanical disorder when the manipulator interbay transport.

For achieving the above object, the utility model provides a kind of semiconductor wafer bogey, be applicable to and place a slice wafer at least, it comprises: a first side wall, one be positioned at the first side wall relative position and with the first side wall parallel to each other second sidewall, one front side wall, and one and front side wall rear wall parallel to each other; This bogey also comprises a body part that is defined out by aforementioned four sidewalls, this body part is an internal interval zone, this internal interval zone then further defines a plurality of compartments by the support plate between the dentalation of the dentalation of the first side wall and the second inside sidewalls face and two relative positions, each compartment can be for the vertical wafer of putting, and this support lithographic plate is placed on wafer in the wafer placement groove in order to support; In addition, the body part of brilliant boat also comprise support whole bogey with its in two parallel foot rests of wafer, an and handle for this device of gripping.

Via above-mentioned formation, the semiconductor wafer bogey that the utility model disclosed offers a kind of brilliant boat structure that can support entire wafer comprehensively and have the wafer placement groove of broad of semiconductor wafer, it not only can reduce wafer sagging distortion during horizontal storage in brilliant boat, and the wafer standing groove of widening can make wafer when loading and carry bigger space be arranged and reduces the probability of collision fragmentation.

Description of drawings

The utility model will be illustrated according to preferred embodiment shown in the drawings, wherein:

Fig. 1 is the stereogram of existing brilliant boat structure;

Fig. 2 is the vertical view of brilliant boat structure as shown in Figure 1;

Fig. 3 is the interior local enlarged diagram of putting wafer of brilliant boat as shown in Figure 1;

Fig. 4 is the stereogram of chip bearing apparatus of the present utility model;

Fig. 5 is the vertical view of chip bearing apparatus as shown in Figure 4; And

The profile that Fig. 6 is got along the 6-6 hatching of Fig. 4 for chip bearing apparatus of the present utility model.

Embodiment

Fig. 4 is the stereogram of chip bearing apparatus of the present invention; Wherein, brilliant boat 40 comprise a first side wall 44, one and the first side wall be positioned at relative position second sidewall, 45, one front side walls 46 and one and front side wall be positioned at the rear wall 47 of relative position.This four sidewall interlinks and defines a brilliant boat body 41.Brilliant boat body 41 comprises an internal interval district 50, this internal interval district 50 is made up of the dentalation that is positioned at relative position of the first side wall 44 and second sidewall, 45 medial surfaces and 48 a plurality of compartments that define jointly of support plate therebetween by 12, so wafer can singlely vertically be placed in the compartment district 50.The design of this support plate 48 can provide a kind of comprehensive support of wafer that is seated in the brilliant boat, significantly to improve wafer sagging situation in brilliant boat.In addition, this crystalline substance boat body 41 also comprises a pair of foot rest parallel to each other 42,43, with support whole brilliant boat 40 and in the wafer deposited, an and handle 49 that is positioned at front side wall 46 lateral surfaces grips for the operator and to move whole brilliant boat 40.

Fig. 5 is the vertical view of chip bearing apparatus as shown in Figure 4; Wherein, in the chip bearing apparatus of the present utility model, each wafer placement groove all possesses a support plate 48, and not like existing brilliant boat shown in Figure 2, presents hollow in the middle of the dentalation of two ends opposite position; So be erectility (as Fig. 5) when whole brilliant boat 40, that is the wafer of depositing in the brilliant boat 40 is when being the level of state, the centre of wafer can the sagging distortion because of gravitational effect yet.In addition, the width (pitch) of the wafer placement groove of chip bearing apparatus of the present utility model is greater than 7 millimeters, the preferably is 12.7 millimeters, 6.35 millimeters than existing brilliant boat is wide, even so wafer in the whole operation process because of other factors produces micro-deformation, can't not put into brilliant boat or cause fragmentation can be too for a short time yet with brilliant boat collision because of the width of wafer placement groove.

The profile that Fig. 6 is got along the 6-6 hatching of Fig. 4 for chip bearing apparatus of the present utility model.By icon as can be known, present embodiment be positioned at the single compartment unit (unit) the 51st that the dentalation of opposite position and therebetween 48 of support plate constitute jointly by the first side wall 44 and second sidewall 45, integrally formed and constitute, so can simplify the complexity that brilliant boat is made.In addition, because the shape of compartment unit 51 can be propped up two ends and the middle part that is placed in the wafer 52 in the wafer placement groove just, offer the good and complete supporting surface of wafer, so wafer can sagging deformation.

Table two is for placing the comparison sheet that has the wafer deformation quantity in the brilliant boat now and place the wafer deformation quantity in the brilliant boat of the utility model.Because device of the present utility model can effectively lower the degree of wafer deformation, so can solve wafer at grinder, load and carry the problem of going out on glutinous transputer (wafer mounter) and other board automatically, also can reduce the fragmentation of wafer and then prevent that machine from producing fault because of fragmentation, thereby make whole technical process more smooth and easy.Table two

The sagging value of wafer in the existing brilliant boat	4mm	?6mm	?7mm	?10mm	?11mm
						The sagging value of wafer in the brilliant boat of the utility model	＜1mm	＜1mm	＜1mm	＜1mm	＜1mm

Technology contents of the present utility model and technical characterstic disclose as above, yet those skilled in the art still may be based on teaching of the present utility model and announcements and done all replacement and modifications that does not deviate from the utility model spirit.Therefore, protection range of the present utility model should be not limited to those disclosed embodiments, and should comprise various do not deviate from replacement of the present utility model and modifications, and is contained by claim of the present utility model.

Claims (10)

1. a semiconductor wafer bogey is applicable to and places a slice wafer at least, it is characterized in that it comprises:

One the first side wall;

One second sidewall is positioned at the relative position of the first side wall and parallel to each other with the first side wall;

One front side wall is linked between first and second sidewall;

One rear wall is linked between first and second sidewall, and parallel relative with front side wall; And

One body part, contain:

One internal interval zone, have a plurality of dentalation and compartments of defining of the support plate between the dentalation of two relative positions by the first side wall and the second inside sidewalls face, wherein this support plate extends between the first side wall and second sidewall, and each compartment can be for putting a wafer;

Two foot rests parallel to each other; And

The leader is located at front side wall, can be for mentioning this semiconductor wafer bogey.

2. device as claimed in claim 1 is characterized in that: this dentalation and this support plate are integrally formed structures.

3. device as claimed in claim 1 is characterized in that: the width of this compartment is greater than 7 millimeters.

4. device as claimed in claim 3 is characterized in that: the width preferably of this compartment is 12.7 millimeters.

5. a semiconductor wafer bogey is applicable to and places a slice wafer at least, it is characterized in that it comprises:

One the first side wall;

One second sidewall is positioned at the relative position of the first side wall and parallel to each other with the first side wall;

One front side wall is linked between first and second sidewall;

One rear wall is linked between first and second sidewall, and parallel relative with front side wall;

A plurality of compartments are contained in one internal interval zone, and the width of each compartment is greater than 7 millimeters;

Two foot rests parallel to each other; And

The leader is located at front side wall, can be for mentioning this semiconductor wafer bogey.

6. device as claimed in claim 5 is characterized in that: these a plurality of compartments are defined by the support plate between the dentalation of the dentalation of the first side wall and the second inside sidewalls face and two relative positions, and each compartment can be for putting a wafer.

7. device as claimed in claim 6 is characterized in that: this dentalation and this support plate are integrally formed structures.

8. device as claimed in claim 5 is characterized in that: the width preferably of this compartment is 12.7 millimeters.

9. a semiconductor wafer bogey is applicable to and places a slice wafer at least, it is characterized in that it comprises:

One the first side wall;

One second sidewall is positioned at the relative position of the first side wall and parallel to each other with the first side wall;

One front side wall is linked between first and second sidewall;

One rear wall is linked between first and second sidewall, and parallel relative with front side wall; And

One body part, contain:

One internal interval zone, have a plurality of dentalation and compartments of defining of the support plate between the dentalation of two relative positions by the first side wall and the second inside sidewalls face, wherein this support plate extends between the first side wall and second sidewall, and the width of each compartment is greater than 7 millimeters;

Two foot rests parallel to each other; And

The leader is located at front side wall, can be for mentioning this semiconductor wafer bogey.

10. device as claimed in claim 9 is characterized in that: the width preferably of this compartment is 12.7 millimeters.

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