CN2555454Y

CN2555454Y - Hybrid integrated LED all color lamp with high efficiency

Info

Publication number: CN2555454Y
Application number: CN 02237676
Authority: CN
Inventors: 卢景贵; 卢健
Original assignee: Individual
Current assignee: Individual
Priority date: 2002-06-24
Filing date: 2002-06-24
Publication date: 2003-06-11
Anticipated expiration: 2012-06-24

Abstract

The hybrid integration LED high efficiency full-color light related in the utility model comprises a hybrid integration LED, a porcelain base, a multi-edge sphericity package cap, a glass casing and a metal foundation. The porcelain base comprises upper and down layer porcelain plaque conduction band, which are X-Y crossed two-dimensional routing layer. The equipment is characterized in even lighting mixing color, high brightness, high qualification rate of finished products and production efficiency, fitting for industrialization production, long service life and reliable performance.

Description

Mixed integrated efficient full-colour LED lamp

Technical field

It is the lighting device of light emitting source with LED that the utility model relates to a kind of.

Background technology

In recent years, owing to realize breakthrough large-scale production development such as superbright degree indigo plant, green, red and orange light in LED epitaxial material MOCVD technology, single led chip encapsulation φ 3, φ 5 have reached candle light level light intensity levels under the 20mA electric current.With red, blue, green three-primary color LED chip and the compound white light source lamp of making of YAG fluorescent material, reached above 10 times of ordinary incandescent lamp luminous efficiencies.At present, also occurred the goods of many LED lamps both at home and abroad, but because prior art and condition restriction are almost seldom seen high-performance, high-quality LED lamp moulded products.Traditional mode with LED lamp making ornament lamp, curb lamp, Lawn lamp etc. is as follows: adopt the LED discrete device lamp of φ 3, φ 5 to tie up in the circuit board, its shortcoming is that output intensity IQ directive property is strong, the mixed light poor effect, and separate piece Assembled lamp core body is too big, difficult approximate wick light source, and the light intensity IQ that distributes again is difficult for the design levelling.Adopt resin circuit board combination led chip in addition, its wiring board does not dispel the heat, easily heat-age discolo(u)ration, and the LED light decay quickens, and LED lamp poor reliability is fragile.The LED lamp of general combination is inserted in the globe lamp, because each discrete LED points relationship cause the lamp housing surface or the monochromatic light spot occurs, or the lamp housing surface scattering is serious, uniformity of luminance increases, but luminous efficiency obviously decays, and the luminance loss is serious.

Summary of the invention

Mixed integrated efficient full-colour LED lamp described in the utility model can solve under the situation that does not influence light efficiency, and the lamp housing surface monochromatic piebald point do not occur and has the problem of rational light distribution.

A kind of mixed integrated efficient full-colour LED lamp described in the utility model, it comprises mixes integrated LED chip, lamp seat and lampshade; It is characterized in that: described mixing integrated LED chip is the super brightness large size chip, solidify respectively on the lamp seat that a porcelain substrate is formed by conducting resinl, described porcelain substrate divides upper and lower two-layer, stack constitutes X-Y and intersects two-dimentional wiring layer, be that the upper strata is the directions X electrode wiring, the Y of lower floor direction electrode wiring; The coating that silver lustre or gold are arranged at the porcelain substrate surface; Between the wiring of porcelain substrate, be fixing hole of mixing integrated LED chip; Described X-Y intersect two-dimentional wiring layer each to the lead-in wire become biserial can cut down sheet limit pin configuration in the side weld of porcelain substrate, its surface is a Gold plated Layer; The orbicule of rib more than an encapsulation caps is arranged and mix integrated LED chip and porcelain substrate Butt sealing, constitute modulated structure in the LED jointly; Modulated structure is fixed on the metal lamp holder with the glass shell that covers in its outside jointly in the described LED; Described glass shell through the corase grind sand, and in be coated with 25-35 μ microparticle glass dust.

The panchromatic luminous colour mixture of the finished product lamp that the utility model is produced is even, and the brightness height is made the product qualified rate height, and the production efficiency height is suitable for producing in batches, and serviceability is reliable, and the life-span is long.

Description of drawings

Fig. 1 is the interior modulated structure schematic diagram of the full-color colored lights of mixing integrated LED high efficiency described in the utility model.

Fig. 2 is the structural representation of the full-color colored lights of mixing integrated LED high efficiency described in the utility model.

Fig. 3 is the porcelain substrate X-Y cross wire principle schematic of the full-color colored lights of mixing integrated LED high efficiency described in the utility model.

Fig. 4 is the bottom electrode schematic diagram that the Y direction conductive strips in the porcelain substrate lower floor front of the full-color colored lights of mixing integrated LED high efficiency described in the utility model constitute.

Fig. 5 is the side view of Y direction conductive strips of the porcelain substrate lower floor of the full-color colored lights of mixing integrated LED high efficiency described in the utility model.

Fig. 6 is the top electrode schematic diagram that front, the upper strata directions X conductive strips of the full-color colored lights of mixing integrated LED high efficiency described in the utility model constitute.

Fig. 7 is the porcelain substrate longitudinal sectional view of the full-color colored lights of mixing integrated LED high efficiency described in the utility model.

Fig. 8 is the porcelain substrate transverse sectional view of the full-color colored lights of mixing integrated LED high efficiency described in the utility model.

Fig. 9 is the porcelain substrate front view of the full-color colored lights of mixing integrated LED high efficiency described in the utility model.

Figure 10 is the porcelain substrate side surfaces directions X outer lead solder joint figure of the full-color colored lights of mixing integrated LED high efficiency described in the utility model.

Figure 11 is the porcelain substrate side surfaces Y direction outer lead solder joint figure of the full-color colored lights of mixing integrated LED high efficiency described in the utility model.

Accompanying drawing number

1. porcelain substrate 2. mixes integrated LED chip

3. the pre-seal of protectiveness rib more than 4. orbicule encapsulation caps

5. control modulated structure Butt sealing layer in the lamp outer lead 6.LED

7. glass shell 8. metal lamp holders

9. twin-core series LED chip carrier 10. single-chip LED chip carriers

11.Y direction conductive strips 12.LED chip installing hole

13.Y direction face down bonding point 14.Y direction can be cut down the band outer lead

15.X direction top electrode conductive strips 16.LED chip

17.LED lead 18.X direction can be cut down the band outer lead

19. porcelain substrate 20.X direction face down bonding point

The specific embodiment

Led chip in this device is selected the super brightness large size chip, selects of all kinds emitting led as follows: ruddiness: GaTIAs (DH) λ p650-680nm

Green glow: InGaN (sw) λ p520,540nm

Blue light: GaN λ p470nm, 430nm

Orange light: InGaAIP λ p620,590nm

The integrated three primary colours of described mixing (red, blue, green) led chip is fixed in the two dimension lead-in wire porcelain pedestal of an X-Y cross wire.The wiring of this porcelain pedestal and structure can be referring to Fig. 3, Fig. 4, Fig. 5, Fig. 6: the X-Y cross wire divides upper and lower two-layer formation conductive strips at the porcelain pedestal, and the upper strata is an X line direction battery lead plate, and lower floor is a Y column-wise electrodes plate.Levels porcelain pedestal is fixed into one by low-melting glass sintering (about 400 ℃).Described porcelain pedestal thickness of slab 1.0mm, conductive strips 0.3mm, the gap 0.5mm of the led chip installing hole between the conductive strips, the diameter in hole are 1mm.Described conductive strips burn till gold-plated or silver-colored the making in back for the MO-Mn conductive paste.What provide in the accompanying drawing is 6 * 6LED wiring plate, and upper and lower bilayer draws the X-Y outlet, bilaterally by Ag-Cu the MoMn tape welding is connect in that upper strata X is capable can cut down band, respectively draws 6 outer leads, draws 6 outer leads in that the Y of lower floor row are bilateral equally.X-Y each to the lead-in wire, can control any single LED or all luminous.This integrated LED chip assembly can be realized panchromatic middle white light and any colored monochromatic light.

Manufacture the many ribs orbicule encapsulation caps that covers in outside LED, the porcelain substrate and can use the transparent optical plastics, prefabricated by the injection moulding of die sinking tool.LED and the porcelain board unit that to pack in many ribs orbicule encapsulation caps with optical resin carry out Butt sealing, under 60 ℃ of temperature, keep being cured in 4 hours.

After glass shell is roughly ground sand, housing is coated with 30 μ microparticle glass dust.Metal lamp holder is docked fixing with interior modulated structure, glass shell docks with metal lamp holder to be fixed.Described glass shell size, shape visual appearance are examined and will be selected.

Claims

1. mixed integrated efficient full-colour LED lamp, it comprises mixes integrated LED chip, lamp seat and lampshade; It is characterized in that: described mixing integrated LED chip is the super brightness large size chip, solidify respectively on the lamp seat that a porcelain substrate is formed by conducting resinl, described porcelain substrate divides upper and lower two-layer, stack constitutes X-Y and intersects two-dimentional wiring layer, be that the upper strata is the directions X electrode wiring, the Y of lower floor direction electrode wiring; The coating that silver lustre or gold are arranged at the porcelain substrate surface; Between the wiring of porcelain substrate, be fixing hole of mixing integrated LED chip; Described X-Y intersect two-dimentional wiring layer each to the lead-in wire become biserial can cut down sheet limit pin configuration in the side weld of porcelain substrate, its surface is a Gold plated Layer; The orbicule of rib more than an encapsulation caps is arranged and mix integrated LED chip and porcelain substrate Butt sealing, constitute modulated structure in the LED jointly; Modulated structure is fixed on the metal lamp holder with the glass shell that covers in its outside jointly in the described LED; Described glass shell through the corase grind sand, and in be coated with 25-35 μ microparticle glass dust.