CN2511097Y - Electronic device radiator - Google Patents
Electronic device radiator Download PDFInfo
- Publication number
- CN2511097Y CN2511097Y CN 01251475 CN01251475U CN2511097Y CN 2511097 Y CN2511097 Y CN 2511097Y CN 01251475 CN01251475 CN 01251475 CN 01251475 U CN01251475 U CN 01251475U CN 2511097 Y CN2511097 Y CN 2511097Y
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- CN
- China
- Prior art keywords
- radiator
- utility
- model
- heat pipe
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides an electronic device radiator. A phase exchanging heat conduction tube is arranged on a substrate; the phase exchanging heat conduction tube is filled with liquid and is vacuumized. The radiating effect of the radiator is good and can effectively guarantee the heat produced by electronic devices to be dissipated in time. The utility model also has the advantages of convenient installation, low production cost, etc.
Description
(1) technical field
The utility model relates to a kind of radiator.Specifically a kind of radiator that is used for electronic device.
(2) background technology
The components and parts heating is a kind of universal phenomenon in the electronic product, also is the key factor of its efficient operation of restriction.What generally use at present is Aluminium Radiator.It is to utilize the thermal conductivity of aluminium to dispel the heat, and must be subjected to the restriction of metal heat-conducting ability, and thermal conductivity is low, and effect is not very good.Some other radiator such as water-filled radiator, exist that volume is big, heaviness, complex structure, easily leak, shortcoming such as difficult installation.So its use is restricted.
(3) summary of the invention
The purpose of this utility model is to provide a kind of good heat dissipation effect, electronic-device radiator simple in structure.The purpose of this utility model is achieved in that covert heat pipe is set on substrate, is filled with liquid in the covert heat pipe and is evacuated.Advantage of the present utility model is: according to the liquid physical characteristic that boiling point reduces under the situation that pressure reduces, the covert heat pipe that liquid is housed is evacuated, make the boiling point of liquid become very low, approach normal temperature, when ambient temperature slightly raises, the liquid endothermic gasification expands, and rapidly heat is taken away, and passes to a cold end.At a cold end, the condensation of gas of expansion refluxes.Like this gas that expands of gasification again condensing reflux formed circulation, reciprocation cycle under the situation that the temperature difference exists reaches the purpose of rapid heat-obtaining heat radiation.Device of the present utility model is installed on the electric elements that need heat radiation, for example is installed on the CPU, its heat-sinking capability is tens times even hundreds of times of common Aluminium Radiator.Experiment showed, Aluminium Radiator and product of the present utility model with the cross section, put into 80 ℃ of water simultaneously less than 1 minute, the other end of the utility model product surpasses 70 ℃, and the other end of Aluminium Radiator just reached about 40 ℃ after 5 minutes.Therefore device of the present utility model can guarantee effectively that the heat that electronic device produces can in time shed.Device of the present utility model in addition also has advantages such as easy for installation, with low cost.
(4) description of drawings
Accompanying drawing is a structural representation of the present utility model.
(5) specific embodiments
For example the utility model is done more detailed description below in conjunction with accompanying drawing:
Embodiment 1.The composition of electronic-device radiator comprises substrate 1, and covert heat pipe 2 is set on substrate, and covert heat pipe is arranged on the substrate equably, is filled with liquid in the covert heat pipe and is evacuated.
Embodiment 2.On the basis of embodiment 1, between the covert heat pipe of a row, be provided with heating panel 3.
Embodiment 3.On the basis of above-mentioned two embodiment, the angle between covert heat pipe and the substrate can be 90 °, or less than 90 °.
Claims (5)
1, a kind of electronic-device radiator is characterized in that: covert heat pipe is set on substrate, is filled with liquid in the covert heat pipe and is evacuated.
2, electronic-device radiator according to claim 1 is characterized in that: be provided with heating panel between the covert heat pipe of a row.
3, according to claim 1,2 described electronic-device radiators, it is characterized in that: the angle between covert heat pipe and the substrate is 90 °.
4, according to claim 1,2 described electronic-device radiators, it is characterized in that: the angle between covert heat pipe and the substrate is less than 90 °.
5, electronic-device radiator according to claim 3 is characterized in that: the angle between covert heat pipe and the substrate is less than 90 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01251475 CN2511097Y (en) | 2001-11-15 | 2001-11-15 | Electronic device radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01251475 CN2511097Y (en) | 2001-11-15 | 2001-11-15 | Electronic device radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2511097Y true CN2511097Y (en) | 2002-09-11 |
Family
ID=33661396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01251475 Expired - Fee Related CN2511097Y (en) | 2001-11-15 | 2001-11-15 | Electronic device radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2511097Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106440900A (en) * | 2016-12-19 | 2017-02-22 | 宁海县浙工大海洋研究院 | Novel quick heat conduction heat dissipation device |
-
2001
- 2001-11-15 CN CN 01251475 patent/CN2511097Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106440900A (en) * | 2016-12-19 | 2017-02-22 | 宁海县浙工大海洋研究院 | Novel quick heat conduction heat dissipation device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |