CN2506175Y - Heat conductive water tank for radiator - Google Patents
Heat conductive water tank for radiator Download PDFInfo
- Publication number
- CN2506175Y CN2506175Y CN 01255508 CN01255508U CN2506175Y CN 2506175 Y CN2506175 Y CN 2506175Y CN 01255508 CN01255508 CN 01255508 CN 01255508 U CN01255508 U CN 01255508U CN 2506175 Y CN2506175 Y CN 2506175Y
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- China
- Prior art keywords
- heat
- water tank
- water
- conducting
- abstractor according
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- Expired - Fee Related
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- Heat-Pump Type And Storage Water Heaters (AREA)
Abstract
The utility model discloses a thermal transfer water tank which comprises a tank body, a water inlet 8 and a water outlet 1; the thermal transfer surface 6 where the tank body clings to thermal end face is made from good thermal transfer performance material. The utility model is characterized in that a plurality of water channels 4 are arranged in the water tank; the water channels 4 are separated by a plurality of flow distribution plates 5 and a plurality of arc baffle plates 2 which are fixed at the ends of the tank outlet and inlet; the thermal transfer surface 6 where the tank contacts a semiconductor thermal end is made from thermal transfer material; the inner angle 3 of the tank body can be an arc end surface. The thermal transfer tank by adopting the structure has the advantages of good thermal transfer effect, etc.
Description
The utility model relates to a kind of heat abstractor by water circulation heat radiation, specifically relates to a kind of heat-conducting water box of heat abstractor.
The heat abstractor of the heat abstractor of known technology such as refrigerating drinker semiconductor chilling plate radiating surface has the heat radiation of the aluminium section bar of employing, as application (patent) number be 97208782.6, the applying date is that 1997.03.06, name are called the disclosed technology of patent of " a kind of improvement of semiconductor refrigerating water dispenser heat-exchanger rig ", its aluminium section bar fin connects the semiconductor heat end face, the heat dissipation wind channel that constitutes with fan board, adopting the shortcoming of said structure is that radiating effect is bad, thereby has influenced semi-conductive refrigeration performance; Favourable water dispels the heat, and as the water-cooling of engine, the water in its water tank is immobilising water, and the temperature of water is very high; Also have and dispel the heat by the circulation of water, promptly be close to a heat exchange water tank at the thermal source end face, connect heat exchanger, radiator fan and water pump and constitute the loop, conduct heat, dispel the heat by circulating of water, compare with scheme noted earlier, this scheme has significant advantage, but general water tank heat exchange effect is bad; Therefore adopt the heat exchange water tank of which kind of structure to conduct heat better and be a considerable problem.
The purpose of this utility model just is to provide the heat-conducting water box of the good heat abstractor of a kind of heat-transfer effect.
For achieving the above object, the utility model adopts following scheme to realize: this heat-conducting water box comprises the casing that has water inlet and delivery port, the part that water tank is close to thermal source such as refrigeration semiconductor hot junction face be thermal conductive surface be heat conductivility preferably material make, be provided with water stream channel in the water tank.
Water stream channel in the water tank is to separate by some arc deflectors of fixing in the inlet end of water tank with at some split-flow baffles at water tank middle part to constitute, and this split-flow baffles can also can be waveform or other shape for vertical.
The thermal conductive surface of water tank can whole be made by Heat Conduction Material, also can only be made by Heat Conduction Material with thermal source such as semiconductor heat end face contact position, and by water tank this contact-making surface be snapped together; Described split-flow baffles can be that an integral manufacturing is shaped with thermal conductive surface, be heat conductivility preferably material make.
The opposite end interior angle of water tank intake-outlet is a curved end.
After adopting said structure, owing in water tank, separated some water channels, make current more even, when the split-flow baffles of water stream channel also adopts heat conductivility material is made thermal conductive surface with water tank and is one preferably, more increased heat-conducting area, heat-transfer effect is better, can reduce the radiating surface temperature of thermal source such as semiconductor refrigerating preferably, effectively improves refrigeration performance.Be described further below in conjunction with drawings and Examples.
Fig. 1 is of the present utility model one routine structural representation;
Structural representation when Fig. 2 is an integral body for of the present utility model one routine thermal conductive surface and split-flow baffles.
Fig. 3 is another routine structural profile schematic diagram of the present utility model.
As shown in Figure 1, the utility model heat-conducting water box comprises six casings and water inlet 8, delivery port 1 and installing hole 7, five of water tank are the integral molded plastic shaping, five of other of the thermal conductive surface of water tank and water tank pass through bolting together, certainly they can also adopt heat seal, form such as bonding connects, have square hole on the thermal conductive surface of water tank near thermal source hot junction face, the heat carrier that one Heat Conduction Material such as aluminium are made is made of heat conduction end face 6 and split-flow baffles 5, it is fastened in the square hole of thermal conductive surface of water tank, its heat conduction end face 6 also is close together with the hot junction face of thermal source, as Fig. 2, heat conduction end face 6 and split-flow baffles 5 integral manufacturings are shaped, and this split-flow baffles 5 is vertical, and its appearance is rough, cross section is the broach shape, has increased heat exchange area like this; Delivery port 1 end at water tank is fixed with some arc deflectors 2, split-flow baffles 5 and deflector 2 are separated out some water stream channels 4 in water tank, this split-flow baffles 5 and deflector 2 substantially with the discharge mean allocation in each water channel, it is more even to conduct heat, and the opposite end interior angle of water tank intake-outlet is a curved end 3.
The thermal conductive surface of water tank can one whole be made by Heat Conduction Material, and split-flow baffles 5 can not be an integral body with thermal conductive surface yet, and its split-flow baffles 5 also can have multiple shape, as is waveform etc.; Constitute the different embodiment of the utility model thus.
As shown in Figure 3, dividing plate 5 can also make water stream channel become a bending channel for horizontal, and the sidewall of water tank can be cambered surface, plays guide functions, and it also is another embodiment of the present utility model.
Claims (9)
1. the heat-conducting water box of a heat abstractor comprises the casing that is provided with water inlet, delivery port, it is characterized in that, is provided with water stream channel in the water tank, the part that this water tank is close to heat or low-temperature receiver end face be thermal conductive surface be heat conductivility preferably material make.
2. the heat-conducting water box of heat abstractor according to claim 1 is characterized in that, the water stream channel in the described water tank is to be made of the some arc deflectors fixed at the water inlet or the water outlet end of water tank and the some split-flow baffles in water tank.
3. the heat-conducting water box of heat abstractor according to claim 2 is characterized in that, described split-flow baffles can also can be waveform for vertical.
4. the heat-conducting water box of heat abstractor according to claim 2 is characterized in that, described split-flow baffles can be that an integral manufacturing is shaped with thermal conductive surface.
5. the heat-conducting water box of heat abstractor according to claim 1 is characterized in that, the heat conduction of described water tank or conduction cooling face can one whole be made by Heat Conduction Material.
6. the heat-conducting water box of heat abstractor according to claim 1, it is characterized in that, five of described water tank are the integral molded plastic shaping, the thermal conductive surface of water tank and heat source near has the hole, thermal conductive surface is connected by securing member with its lap, one heat conduction or the conduction cooling face of being made by Heat Conduction Material is fastened in the hole of water tank heat conduction or conduction cooling face, and this heat conduction or conduction cooling face are close to thermal source or low-temperature receiver end face.
7. the heat-conducting water box of heat abstractor according to claim 1 is characterized in that, the opposite end interior angle of described water tank intake-outlet is a curved end.
8. the heat-conducting water box of heat abstractor according to claim 2 is characterized in that, the appearance of described split-flow baffles is a tungued-and-grooved face.
9. the heat-conducting water box of heat abstractor according to claim 1 is characterized in that, described water stream channel is the bending channel that is made of some lateral partitions of being fixed in water tank, and the sidewall of water tank can be arc.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 01255508 CN2506175Y (en) | 2001-09-05 | 2001-09-05 | Heat conductive water tank for radiator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 01255508 CN2506175Y (en) | 2001-09-05 | 2001-09-05 | Heat conductive water tank for radiator |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2506175Y true CN2506175Y (en) | 2002-08-21 |
Family
ID=33664630
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 01255508 Expired - Fee Related CN2506175Y (en) | 2001-09-05 | 2001-09-05 | Heat conductive water tank for radiator |
Country Status (1)
Country | Link |
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CN (1) | CN2506175Y (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109612782A (en) * | 2018-12-25 | 2019-04-12 | 水利部交通运输部国家能源局南京水利科学研究院 | A kind of road rain water runoff automatic acquisition device and method |
CN111381638A (en) * | 2020-03-03 | 2020-07-07 | 戴森信息科技(杭州)有限公司 | Dustproof case for computer |
CN114189174A (en) * | 2022-02-15 | 2022-03-15 | 四川大学 | Thermoelectric conversion device and system |
-
2001
- 2001-09-05 CN CN 01255508 patent/CN2506175Y/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109612782A (en) * | 2018-12-25 | 2019-04-12 | 水利部交通运输部国家能源局南京水利科学研究院 | A kind of road rain water runoff automatic acquisition device and method |
CN111381638A (en) * | 2020-03-03 | 2020-07-07 | 戴森信息科技(杭州)有限公司 | Dustproof case for computer |
CN114189174A (en) * | 2022-02-15 | 2022-03-15 | 四川大学 | Thermoelectric conversion device and system |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |