CN2484644Y - Radiating apparatus - Google Patents

Radiating apparatus Download PDF

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Publication number
CN2484644Y
CN2484644Y CN 01225167 CN01225167U CN2484644Y CN 2484644 Y CN2484644 Y CN 2484644Y CN 01225167 CN01225167 CN 01225167 CN 01225167 U CN01225167 U CN 01225167U CN 2484644 Y CN2484644 Y CN 2484644Y
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CN
China
Prior art keywords
heat
thermal diffusion
heat transfer
radiator
transfer medium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 01225167
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Chinese (zh)
Inventor
郭大祺
陶谦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec Chaun Choung Technology Corp
Original Assignee
Chaun Choung Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Chaun Choung Technology Corp filed Critical Chaun Choung Technology Corp
Priority to CN 01225167 priority Critical patent/CN2484644Y/en
Application granted granted Critical
Publication of CN2484644Y publication Critical patent/CN2484644Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A radiating apparatus has a thermal diffusion equipment which has a cavity inside, while the cavity is filled with heat-conducting medium, such as wax, olefin, water, methanol, mercury and so on. When the thermal diffusion equipment contacts to the heat resource, heat will be transferred to the heat-conducting medium, which makes the heat-conducting medium hotter and generates a heat convection with which the heat will be absorbed into the other position of the thermal diffusion equipment so as to generate an effect of thermal diffusion.

Description

A kind of radiator
The utility model relates to a kind of radiator, is meant that especially a kind of cost is low and has the radiator structure that thermal convection is conducted heat.
Known have many kinds of radiator structures, these radiator structures are mainly used in the heat radiation of electronic building brick, certain structures requires and will very fast the hot type that is produced on the electronic building brick be removed, so as shown in Figure 1, thermal source at electronic building brick, with a thermal conductance piece 1 heat is drained, certain structures is the radiator that directly is formed with the fin shape on the thermal conductance piece, another kind of mode shown in the figure, for be equipped with a heat pipe 2 in thermal conductance piece 1, via the radiating fin 11 that is located at heat pipe 2 other ends such as sheet, dispel the heat, wherein make the media of heat pipe 2 for conducting heat and passing, heat is passed to fin 11 places of radiator 10 by thermal source, the structure of heat pipe 2 is for being filled with liquid 22 partly in the body 20 of closed, utilization liquid 22 is evaporated to radiator 10 places heat release in the heat absorption of thermal source 1 place and condenses, wherein flow for quicker generation is circulative, be provided with capillary structure 21, apace the liquid 22 of condensation is sucked back with capillary structure 21, because heat pipe 2 has goodish heating power conductibility, but the process of its making need be through the program of multiple tracks, and therefore cost improves.Constantly enlarge in market scale, but under the situation that production unit cost constantly reduces, for the product that has more the market competitiveness is provided, the designer researches and develops, to solve the problem on the known cost.
The purpose of this utility model is to provide a kind of radiator, the theory of utilization integrated radiating, make via behind the thermal source, can be in the mode of convection current with thermal conductance to the radiator place, the heat conduction velocity of this convective heat transfer is slow than heat pipe, but can reduce the cost in the manufacture process, and reach the satisfactory heat transfer effect.
For reaching above-mentioned purpose, the radiator that the utility model provides is: have a thermal diffusion device, a chamber is arranged in the thermal diffusion device, be covered with heat transfer medium in chamber; Heat transfer medium is for to present solid matter at normal temperature, as: wax; Or normal temperature presents liquid material, as: paraffin oil (paraffinoil), water, methyl alcohol, mercury etc.; When the thermal diffusion device contacts with pyrotoxin, conduct heat to heat transfer medium, heat transfer medium is heated gradually and produces thermal convection, and heat is brought to other position of thermal diffusion device, and produce the thermal diffusion effect.
For further understanding the utility model is to reach technology, means and the effect that predetermined purpose is taked, now be described in detail as follows for a preferable feasible embodiment and conjunction with figs., believe the purpose of this utility model, feature and advantage, can obtain thus deeply and concrete understanding.Wherein:
Fig. 1 is the cutaway view of known technology;
Fig. 2 is a board-like stereogram of the present utility model;
Fig. 3 is the cutaway view of Fig. 2;
Fig. 4 is Fig. 3 of the present utility model cross-sectional schematic of conducting heat;
Fig. 5 is a tubular type stereogram of the present utility model;
Fig. 6 is the cutaway view of Fig. 5;
Fig. 7 is a combination type stereogram of the present utility model;
Fig. 8 is Fig. 7 cutaway view of the present utility model.
As shown in Figure 2 to Figure 3, be the board-like embodiment of a kind of radiator of the utility model, Fig. 5 is tubular type embodiment to shown in Figure 6, Fig. 7 is to Figure 8 shows that combination type, these three kinds of patterns all have same structure, profile difference only, and it has a thermal diffusion device 3, one chamber 31 is arranged in the thermal diffusion device 3, be covered with heat transfer medium 4 in chamber 31, wherein thermal diffusion device 3 is with the good material of conductibility, makes as metals such as aluminium, copper; Heat transfer medium 4 is for to present solid-state material at normal temperature (refer to below 30 ℃, be preferably 20-30 ℃), as: wax; Or normal temperature presents liquid material; As: paraffin oil, water, methyl alcohol, mercury etc.; When thermal diffusion device 3 contacts with pyrotoxin 6, the heat transfer of pyrotoxin 6 is directed at heat transfer medium 4, heat transfer medium 4 is heated gradually and produces thermal convection, and heat is brought to other position of thermal diffusion device 3, produce the effect of thermal diffusion.Wherein be equipped with radiating subassembly 5 at thermal diffusion device 3, be the radiating fin 51 of radiating subassembly 5 being arranged to sheet board-like with tubular type, and combination type is directly formed in the one mode by thermal diffusion device 3 for making radiating fin 52, make and form the structure with array shape or row's shape, the effect that allows radiating fin dispel the heat with its surface area.
The most important structure of the utility model is, be provided with heat transfer medium in the thermal diffusion device, heat transfer medium is the quick transmission of carrying out heat energy usually, is heat pipe in known configurations, and the utility model is a heat transfer medium, its article with low cost are good, below with wax as an illustration, wax just can be by the solid-state liquid state that converts to more than 40 degrees Centigrade, so at normal temperature, wax is solid, and represents with the kenel of block shape, so wax can be present in 25 degree Celsius of normal temperature for various solid shapes.
When in the thermal diffusion device, chamber being set, can be drilled with this chamber, with inserting this chamber after the heat transfer medium dissolving, wherein be rendered as the form of filling up chamber fully again, usually heat transfer medium is for being independent of in addition in the thermal diffusion device, and different with the material of thermal diffusion device.
See also shown in Figure 4, heat transfer medium wax near pyrotoxin is heated and can dissolves gradually, because of wax just can dissolve more than 40 degrees Centigrade, but the part that wax is not heated then can be cooled off rapidly, because the temperature that the pyrotoxin initial condition produces is low, just there is the state of Fig. 4 to occur, the energy of pyrotoxin constantly imports heat transfer medium into, will make heat transfer medium be transformed into wax liquid fully, produces the heat transfer convection action, just make heat constantly reach the radiating subassembly of cold junction by the thermal source that is subjected in hot junction, in the time of may just beginning to operate, it be relatively poor to dissolve effect, but can change with the variation that the pyrotoxin temperature raises, owing to wherein there is no the space of gasification, so maintain the heat transfer limitation of motion of liquid.
If the normal temperature state is aqueous water, methyl alcohol, mercury, its chamber need be established the filling mouth, and chamber pre-set space and need to match with the filling mouth, carries out suitable sealing, to guarantee in the chamber for being covered with liquid heat transfer medium, by the effect of liquid heat transfer medium expansion thermal convection.
Structure in sum, the thermal convection of the utility model utilization heat transfer medium is better than the thermal diffusion device, and can be combined into one with the thermal diffusion device, and the cost of saving manufacturing process, improve the marketability of product, thereby can in the thermal diffusion device, produce thermal convection, reach the function of quick conductive with heat transfer medium, so good usability can be provided, be a complete structure different with known technology.
The above is the detailed description and the accompanying drawing of preferred embodiment of the present utility model, be not to be used for limiting the utility model, all scopes of the present utility model should be as the criterion with following claim scope, the embodiment and the approximate construction of the spirit variation similar with it of all claims all should be contained in the scope of the present utility model.

Claims (5)

1. radiator is characterized in that comprising:
One thermal diffusion device has a chamber in the thermal diffusion device; And
One heat transfer medium, it is covered with in chamber; Described thermal diffusion device is provided with radiating subassembly.
2. radiator as claimed in claim 1 is characterized in that heat transfer medium is to present solid-state material at normal temperature, and this material is a wax.
3. radiator as claimed in claim 1 is characterized in that heat transfer medium is to present liquid material at normal temperature, and this material is paraffin oil, water, methyl alcohol or mercury.
4. radiator as claimed in claim 1 is characterized in that described radiating subassembly is the board-like radiating fin or the radiating fin of tubular type.
5. radiator as claimed in claim 1 is characterized in that described radiating subassembly is the combination type radiating fin, and itself and thermal diffusion device are integrally formed.
CN 01225167 2001-06-04 2001-06-04 Radiating apparatus Expired - Fee Related CN2484644Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 01225167 CN2484644Y (en) 2001-06-04 2001-06-04 Radiating apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 01225167 CN2484644Y (en) 2001-06-04 2001-06-04 Radiating apparatus

Publications (1)

Publication Number Publication Date
CN2484644Y true CN2484644Y (en) 2002-04-03

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN 01225167 Expired - Fee Related CN2484644Y (en) 2001-06-04 2001-06-04 Radiating apparatus

Country Status (1)

Country Link
CN (1) CN2484644Y (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100568492C (en) * 2006-12-06 2009-12-09 中国科学院电工研究所 Heat radiator of computer CPU

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100568492C (en) * 2006-12-06 2009-12-09 中国科学院电工研究所 Heat radiator of computer CPU

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C19 Lapse of patent right due to non-payment of the annual fee
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