CN2478249Y - Radiator - Google Patents
Radiator Download PDFInfo
- Publication number
- CN2478249Y CN2478249Y CN 01215679 CN01215679U CN2478249Y CN 2478249 Y CN2478249 Y CN 2478249Y CN 01215679 CN01215679 CN 01215679 CN 01215679 U CN01215679 U CN 01215679U CN 2478249 Y CN2478249 Y CN 2478249Y
- Authority
- CN
- China
- Prior art keywords
- alcove
- heat abstractor
- metallic plate
- heat
- radiating fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a radiating device, is in electronic element upper, electronic element heat, the mainly which comprises a base and a plurality of is the base upper protruding radiating fin stock. the base is a as when concave in concave upper square wall upper is provided with a plurality of hole, the etc. hole is and the a plurality of radiating fin stock corresponding fin stock in the fin stock top end. the concave in has plurality hole and easy work body, meanwhile and a or etc. metal board or is arranged in sealing.
Description
The utility model is meant a kind of heat abstractor, is meant a kind of in light weight and heat abstractor that radiating effect is good especially.
Many electronic components the time can produce a large amount of heats in operation, if untimely heat is discharged, and the stability when influence electronic building brick and move.Therefore, industry is installed a heat abstractor at electronical elements surface usually, is used for discharging as quickly as possible heat.
Known heat abstractor is a lot, heat abstractor 2 as shown in Figure 1, it has a pedestal 4 and some radiating fins 6, and this pedestal 4 and some radiating fins 6 are one extrusion formings, and the bottom surface 8 of this pedestal 4 is to fit on the electronic component (figure does not show), is used for discharging the heat that electronic building brick produces.Yet, this heat abstractor is to adopt tradition to extrude mode and get, weight is difficult for fixing more greatly, and when heat radiation, also be difficult to the top of temperature homogenisation to this radiating fin 6, in addition, under the restriction of manufacturing technology and mould strength etc., the density of these radiating fins 6 or integral heat sink surface area also will be restricted, thereby be difficult to meet more and more high radiating requirements.
The purpose of this utility model be to provide a kind of in light weight, can be with temperature homogenisation to the radiating fin top and the good heat abstractor of radiating effect.
The purpose of this utility model is achieved through the following technical solutions: the utility model heat abstractor is to be fitted on the electronic component, be used for distributing the heat that electronic component produces, it mainly comprises a pedestal and some radiating fins that is upwards protruded out by this base top surface.The bottom of this pedestal is that hollow out forms an alcove with appropriate depth, and also offers some through holes on the roof above the alcove, and these through holes are corresponding with these some radiating fins and extend in the radiating fin until the top end near this radiating fin.Be filled with porous medium in this alcove and be easy to generate the hydraulic fluid of phase change, simultaneously and the metallic plate that utilizes aluminium or copper etc. to make inlay or be welded on bottom and realize sealing, wherein, this hydraulic fluid is to be adsorbed in this porous medium.
Owing to adopt the advantage of technique scheme the utility model the utility model heat abstractor to be: this heat abstractor is in light weight, can be with temperature homogenisation to the radiating fin top and the good heat abstractor of radiating effect.
In conjunction with the embodiments the utility model is further described with reference to the accompanying drawings:
Fig. 1 is the stereogram of known heat abstractor.
Fig. 2 is the three-dimensional exploded view of the utility model heat abstractor.
Fig. 3 is the three-dimensional combination figure of the utility model heat abstractor.
Fig. 4 is the cutaway view of the utility model heat abstractor.
Please in the lump referring to figs. 2 to Fig. 4, the utility model heat abstractor 10 mainly comprises a pedestal 12 and some radiating fins 14 that is upwards protruded out by these pedestal 12 end faces.The bottom of this pedestal 12 is that hollow out forms an alcove 16 with appropriate depth, and also offer some through holes 22 on the roof above the alcove 16 18, these through holes 22 are corresponding with this some radiating fin 14 and extend in the radiating fin 14 until the top end (please refer to Fig. 4) near this radiating fin 14.Be filled with porous medium 40 (please refer to Fig. 4) in this alcove 16 and be easy to generate the hydraulic fluid (figure do not show) of phase change, simultaneously and the metallic plate 30 that utilizes aluminium or copper etc. to make inlay or be welded on bottom and realize sealing (please refer to Fig. 3), wherein, this hydraulic fluid is to be adsorbed in this porous medium 40.
When dispelling the heat when the surface that the utility model heat abstractor 10 is fitted in electronic component (figure does not show), the heat that this electronic component produces will be delivered on this metallic plate 30, make hydraulic fluids in this pedestal 12 alcoves 16 be converted into the high temperature gas and rise along through hole 22, when the low temperature inwall of this high temperature gas and this radiating fin 14 touches to a certain degree, will by gas be converted into liquid and utilize the capillarity of this porous medium 40 and fast return in the alcove 16 of this pedestal 12, so continuous circulation can be distributed the heat that this electronic component produces apace.
Because the utility model heat abstractor 10 is to adopt the mode of phase change to conduct heat and heat radiation, so heat transfer is respond well with heat radiation, and the base that utilizes this pedestal 12 is that the inside of hollow out formation alcove 16, this radiating fin 14 is that hollow out forms the mode that through hole 22 flows for hydraulic fluid, except that reducing significantly the weight of heat abstractor 10 integral body, also can be with temperature homogenisation to these radiating fin 14 tops.
Claims (6)
1. heat abstractor, be to be fitted on the electronic component, be used for distributing the heat that electronic component produces, it mainly comprises a pedestal and some radiating fins, these some radiating fins are upwards to be protruded out by this base top surface, it is characterized in that: this base bottom is that hollow out forms an alcove with appropriate depth, on the roof above the alcove, also offer some through holes, these through holes are corresponding with these some radiating fins and extend in the radiating fin until the top end near this radiating fin, and in this alcove, be filled with porous medium and be easy to generate the hydraulic fluid of phase change, this hydraulic fluid is to be adsorbed in this porous medium, in addition, utilize a metallic plate to be located at the bottom of alcove and make this alcove realize sealing.
2. heat abstractor as claimed in claim 1, it is characterized in that: the hydraulic fluid in this alcove will be converted into the high temperature gas and rise along through hole after being heated, and when the low temperature inwall of this high temperature gas and this radiating fin touches to a certain degree, will by gas be converted into liquid and utilize the capillarity of this porous medium and fast return to the alcove of this pedestal, circulation can be distributed the heat that this electronic component produces apace so continuously.
3. heat abstractor as claimed in claim 1 or 2 is characterized in that: this metallic plate is to be made of copper.
4. heat abstractor as claimed in claim 1 or 2 is characterized in that: this metallic plate is made of aluminum.
5. heat abstractor as claimed in claim 1 or 2 is characterized in that: this metallic plate is the bottom that is installed in this alcove with mosaic mode.
6. heat abstractor as claimed in claim 1 or 2 is characterized in that: this metallic plate system is welded on the bottom of this alcove.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 01215679 CN2478249Y (en) | 2001-03-14 | 2001-03-14 | Radiator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 01215679 CN2478249Y (en) | 2001-03-14 | 2001-03-14 | Radiator |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2478249Y true CN2478249Y (en) | 2002-02-20 |
Family
ID=33634216
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 01215679 Expired - Lifetime CN2478249Y (en) | 2001-03-14 | 2001-03-14 | Radiator |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN2478249Y (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100338766C (en) * | 2004-03-25 | 2007-09-19 | 鸿富锦精密工业(深圳)有限公司 | Method for producing radiating device |
CN100345287C (en) * | 2004-04-15 | 2007-10-24 | 台达电子工业股份有限公司 | Heat radiation module |
CN100356555C (en) * | 2004-03-29 | 2007-12-19 | 台达电子工业股份有限公司 | Radiator |
CN103135711A (en) * | 2011-11-23 | 2013-06-05 | 昆山广兴电子有限公司 | Cooling device |
WO2013139058A1 (en) * | 2012-03-22 | 2013-09-26 | 深圳市华星光电技术有限公司 | Thermal dissipation substrate and manufacturing method therefor |
CN104009671A (en) * | 2013-02-27 | 2014-08-27 | 陈树山 | Overwater thermoelectric power generation device utilizing solar energy |
US9205515B2 (en) | 2012-03-22 | 2015-12-08 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Heat dissipation substrate and method for manufacturing the same |
CN106992739A (en) * | 2017-02-27 | 2017-07-28 | 东莞产权交易中心 | A kind of solar energy storage device |
CN107017214A (en) * | 2015-11-30 | 2017-08-04 | Abb技术有限公司 | Cooled power electronics component |
WO2020229728A1 (en) * | 2019-05-10 | 2020-11-19 | Teknologian Tutkimuskeskus Vtt Oy | Heat transfer system and electric or optical component |
WO2021204031A1 (en) * | 2020-04-08 | 2021-10-14 | 深圳光峰科技股份有限公司 | Optical assembly |
-
2001
- 2001-03-14 CN CN 01215679 patent/CN2478249Y/en not_active Expired - Lifetime
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100338766C (en) * | 2004-03-25 | 2007-09-19 | 鸿富锦精密工业(深圳)有限公司 | Method for producing radiating device |
CN100356555C (en) * | 2004-03-29 | 2007-12-19 | 台达电子工业股份有限公司 | Radiator |
CN100345287C (en) * | 2004-04-15 | 2007-10-24 | 台达电子工业股份有限公司 | Heat radiation module |
CN103135711A (en) * | 2011-11-23 | 2013-06-05 | 昆山广兴电子有限公司 | Cooling device |
US9205515B2 (en) | 2012-03-22 | 2015-12-08 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Heat dissipation substrate and method for manufacturing the same |
WO2013139058A1 (en) * | 2012-03-22 | 2013-09-26 | 深圳市华星光电技术有限公司 | Thermal dissipation substrate and manufacturing method therefor |
CN104009671A (en) * | 2013-02-27 | 2014-08-27 | 陈树山 | Overwater thermoelectric power generation device utilizing solar energy |
CN107017214A (en) * | 2015-11-30 | 2017-08-04 | Abb技术有限公司 | Cooled power electronics component |
CN106992739A (en) * | 2017-02-27 | 2017-07-28 | 东莞产权交易中心 | A kind of solar energy storage device |
CN106992739B (en) * | 2017-02-27 | 2019-05-07 | 东莞产权交易中心 | A kind of solar energy storage device |
WO2020229728A1 (en) * | 2019-05-10 | 2020-11-19 | Teknologian Tutkimuskeskus Vtt Oy | Heat transfer system and electric or optical component |
CN114096795A (en) * | 2019-05-10 | 2022-02-25 | 芬兰国家技术研究中心股份公司 | Heat transfer system and electrical or optical component |
WO2021204031A1 (en) * | 2020-04-08 | 2021-10-14 | 深圳光峰科技股份有限公司 | Optical assembly |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CX01 | Expiry of patent term |
Expiration termination date: 20110314 Granted publication date: 20020220 |