CN2435733Y - Open-type electronic temp.-control flatform - Google Patents
Open-type electronic temp.-control flatform Download PDFInfo
- Publication number
- CN2435733Y CN2435733Y CN 00250957 CN00250957U CN2435733Y CN 2435733 Y CN2435733 Y CN 2435733Y CN 00250957 CN00250957 CN 00250957 CN 00250957 U CN00250957 U CN 00250957U CN 2435733 Y CN2435733 Y CN 2435733Y
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- heat
- thermoelectric
- plate
- conducting plate
- heat conducting
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Abstract
The utility model relates to an open-type electronic temperature-control platform, comprising a heat conducting platform, a thermoelectric cooler and a heat conducting plate. The thermoelectric cooler is fixedly arranged on the heat conducting platform and comprises an upper plate, a lower plate and a plurality of thermoelectric semiconductors, and the thermoelectric semiconductors are mutually connected in series and arranged between an upper and a lower ceramic plates of an electrical insulation heat good conductor. When an electronic component to be measured is arranged above the heat conducting plate and the thermoelectric semiconductors of the thermoelectric cooler is energized, the heat conducting plate can quickly reduce heat and be cooled, or the thermoelectric semiconductor is energized in a reverse mode to heat the heat conducting plate. The utility model can carry out rapidly increasing and reducing thermal compensation for the heat conducting plate so to accurately control the environment temperature needed by the electronic component to be measured in measuring.
Description
The utility model is about a kind of open electron temperature-control platform, refers to a kind of in order to test electronics spare part finished product, half-finished temperature controllable test platform especially.
General electronics spare part is the semi-manufacture in early development stage no matter, or the finished product of exploitation after finishing, even test of the QC after the volume production or various authentication operation all need its operational function of test under the different operating temperature.Tradition is to regulate the varying environment temperature to test in the closed environment of a temperature controllable.Yet, knownly cooling off, or heat closed environment with heating wire with compressor, required time is long and temperature control is inaccurate, very perplexs the user.And known can only being adjusted under the particular preset temperature tested, and does dynamic temperature variation test as desire, all needs for a long time because of its compressor, heating wire add reduction of heat, can't change by the required dynamic temperature of immediate response, is difficult to simulate the actual work temperature environmental change.
The creator whence originally in the spirit of positive creation, is urgently thought a kind of " open electron temperature-control platform " that can address the above problem because of in this, and several times research experiment is eventually to the creation of finishing this Jiahui common people.
Fundamental purpose of the present utility model is that a kind of open electron temperature-control platform is being provided, so that can accurately control probe temperature fast.
Another purpose of the present utility model is that a kind of open electron temperature-control platform is being provided, and changes test so that can carry out dynamic temperature.
In order to reach above-mentioned purpose, the utility model mainly includes: a heat conduction platform, and the top is formed with a upper surface; One thermoelectric cooling module, be fixedly arranged on this heat conduction platform upper surface, this thermoelectric cooling module comprises a upper plate, a lower plate and a plurality of thermoelectric semiconductor, and this upper plate, lower plate are to be made by electrical isolation and hot good conductor material, and these thermoelectric semiconductors are one another in series and are located between this upper plate, the lower plate; And a heat-conducting plate, be to be a tabular, and be fixedly arranged on this upper plate top.
Wherein this heat conduction platform still includes a heat abstractor.
Wherein this heat abstractor includes a plurality of radiating fins.
Wherein this heat abstractor includes at least one fan.
Wherein this heat conduction platform, heat-conducting plate are to be made by hot good conductor.
Wherein this hot good conductor is meant aluminium.
Wherein this upper plate, lower plate are to be made by ceramic wafer.
It still includes at least one fixture, in order to this heat-conducting plate and thermoelectric cooling module are fixed in the upper surface of heat conduction platform.
By this, when measured electronic elements being put in the heat-conducting plate top, and to these thermoelectric semiconductors energising of this thermoelectric cooling module, then can be rapidly to the refrigeration of heat-conducting plate reduction of heat, or oppositely switch on to the heat-conducting plate heating, test required environment temperature so can do plus-minus thermal compensation fast with accurate control measured electronic elements to heat-conducting plate.If input dynamic electric voltage value then can produce dynamic temperature and change to carry out the dynamic temperature test.
Because the utility model structure is novel, can provide on the industry and utilize, and truly have the enhancement effect, so apply for novel patent in accordance with the law.
For further specifying structure of the present utility model and feature thereof, below in conjunction with accompanying drawing the utility model is described in further detail, wherein:
Fig. 1 is the constitutional diagram of the utility model embodiment.
Fig. 2 is the exploded view of the utility model embodiment.
Fig. 3 is the phantom view of the utility model embodiment.
Your, be described as follows especially exemplified by a preferred embodiment for allowing juror can more understand technology contents of the present utility model.
Please consult the constitutional diagram of Fig. 1 the utility model one preferred embodiment earlier, it is in an aluminum heat conduction platform 1 upper surface 11 thermoelectric cooling module 2 to be set, thermoelectric cooling module 2 tops are provided with an aluminum heat-conducting plate 3 again, and heat-conducting plate 3 and thermoelectric cooling module 2 are fixed on the heat conduction platform 1 by screw with two fixtures 4, also can change between heat-conducting plate 3, thermoelectric cooling module 2, the heat conduction platform 1 with stickup, welding, chimeric, engaging ... wait other equivalent way in conjunction with fixing.Wherein, heat conduction platform 1 and heat-conducting plate 3 also can be made by other the equivalent hot good conductor materials beyond the aluminium.
Please consult Fig. 2 again, the heat conduction platform 1 of present embodiment is provided with heat abstractor, and such as be formed with a plurality of radiating fins 12 in the below, the side also adds three fans 13, in order to disperse heat.Certainly also can effectively drive away heat by air cooling, water-cooled or other equivalent radiator structures.
Fig. 3 illustrates the thin portion structure of present embodiment thermoelectric cooling module 2, it is in last ceramic wafer 21 and is folded with a plurality of thermoelectric semiconductors 23 between the ceramic wafer 22 down, each thermoelectric semiconductor 23 is welded in the conducting strip 210,220 that is interspersed up and down and uses and be one another in series, and these conducting strips 210,220 can plate work in advance in upper and lower ceramic wafer 21,22.Upper and lower ceramic wafer 21,22 can be used other instead and have electrical isolation and make for the equivalent material of hot good conductor, and conducting strip 210,220 also can cooperate uses other equivalences that are easy to attached work conduction materials instead.
Look back Fig. 1, prior to (being different from known confined space) under the open space measured electronic elements 5 is put in heat-conducting plate 3 tops during use, and to thermoelectric cooling module 2 energisings, ceramic wafer 21 temperature are reduced, and then the heat-conducting plate 3 of cooling top, again via the accurate control of voltage, but then quick control obtains an accurate low-temperature test environment.Simultaneously dispersing heat by the radiating fin 12 of 13 pairs of heat conduction platform 1 belows of three fans can increase work efficiency.Otherwise,, accurately control voltage and just can accurately heat heat-conducting plate 3 fast, and then an accurate high temperature test environment is provided if oppositely energising then can make ceramic wafer 21 temperature raise.
But utilize the forward and reverse electric current of above-mentioned thermoelectric cooling module 2 mats to heat or the characteristic of reduction of heat, to become magnitude of voltage by the temperature transition that heat-conducting plate 3 detects earlier, compare with standard voltage value again corresponding to preset temperature, foundation as input thermoelectric cooling module 2 forward and reverse electric currents, just can do the plus-minus thermal compensation to this measured electronic elements 5, and then accurately required low temperature or high temperature are tested in control.Because temperature transition potential circuit, voltage ratio are very known to circuit and control system thereof, need not give unnecessary details.
In like manner, if preset temperature is set as a dynamic temperature change curve, also can utilize the utility model arrange in pairs or groups above-mentioned known all circuit and control system, according to adjust control one accurate dynamic temperature variation test condition corresponding to the dynamic electric voltage value curve of dynamic temperature.
To sum up institute is old, and no matter the utility model is all showing it totally different in the feature of known techniques with regard to purpose, means and effect, for a quantum jump of " open electron temperature-control platform ", earnestly ask your juror and perceive, early order is grant quasi patent, so that Jiahui society, the true feeling moral just.Only it should be noted that above-mentioned many embodiment give an example for convenience of explanation, the interest field that the utility model is advocated should be as the criterion so that claim is described certainly, but not only limits to the foregoing description.
Claims (8)
1. an open electron temperature-control platform is characterized in that, mainly includes:
One heat conduction platform, the top is formed with a upper surface;
One thermoelectric cooling module, be fixedly arranged on this heat conduction platform upper surface, this thermoelectric cooling module comprises a upper plate, a lower plate and a plurality of thermoelectric semiconductor, and this upper plate, lower plate are to be made by electrical isolation and hot good conductor material, and these thermoelectric semiconductors are one another in series and are located between this upper plate, the lower plate; And
One heat-conducting plate is to be a tabular, and is fixedly arranged on this upper plate top.
2. open electron temperature-control platform according to claim 1 is characterized in that wherein this heat conduction platform still includes a heat abstractor.
3. open electron temperature-control platform according to claim 2 is characterized in that wherein this heat abstractor includes a plurality of radiating fins.
4. open electron temperature-control platform according to claim 2 is characterized in that wherein this heat abstractor includes at least one fan.
5. open electron temperature-control platform according to claim 1 is characterized in that wherein this heat conduction platform, heat-conducting plate are to be made by hot good conductor.
6. open electron temperature-control platform according to claim 5 is characterized in that wherein this hot good conductor is meant aluminium.
7. open electron temperature-control platform according to claim 1 is characterized in that wherein this upper plate, lower plate are to be made by ceramic wafer.
8. open electron temperature-control platform according to claim 1 is characterized in that it still includes at least one fixture, in order to this heat-conducting plate and thermoelectric cooling module are fixed in the upper surface of heat conduction platform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 00250957 CN2435733Y (en) | 2000-08-24 | 2000-08-24 | Open-type electronic temp.-control flatform |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 00250957 CN2435733Y (en) | 2000-08-24 | 2000-08-24 | Open-type electronic temp.-control flatform |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2435733Y true CN2435733Y (en) | 2001-06-20 |
Family
ID=33609007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 00250957 Expired - Fee Related CN2435733Y (en) | 2000-08-24 | 2000-08-24 | Open-type electronic temp.-control flatform |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2435733Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100492037C (en) * | 2001-07-12 | 2009-05-27 | 株式会社爱德万测试 | Apparatus for handling electronic components and method for controlling temperature of electronic components |
| CN104281177A (en) * | 2013-07-03 | 2015-01-14 | 致茂电子股份有限公司 | Wide-area temperature control device |
| US9494353B2 (en) | 2013-07-03 | 2016-11-15 | Chroma Ate Inc. | Temperature control equipment |
-
2000
- 2000-08-24 CN CN 00250957 patent/CN2435733Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100492037C (en) * | 2001-07-12 | 2009-05-27 | 株式会社爱德万测试 | Apparatus for handling electronic components and method for controlling temperature of electronic components |
| CN104281177A (en) * | 2013-07-03 | 2015-01-14 | 致茂电子股份有限公司 | Wide-area temperature control device |
| US9494353B2 (en) | 2013-07-03 | 2016-11-15 | Chroma Ate Inc. | Temperature control equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |