CN2397504Y - Coupler of semiconductor laser device and optical fiber - Google Patents
Coupler of semiconductor laser device and optical fiber Download PDFInfo
- Publication number
- CN2397504Y CN2397504Y CN 99240338 CN99240338U CN2397504Y CN 2397504 Y CN2397504 Y CN 2397504Y CN 99240338 CN99240338 CN 99240338 CN 99240338 U CN99240338 U CN 99240338U CN 2397504 Y CN2397504 Y CN 2397504Y
- Authority
- CN
- China
- Prior art keywords
- optical fiber
- coupling
- shell
- heat sink
- copper billet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000013307 optical fiber Substances 0.000 title claims abstract description 97
- 239000004065 semiconductor Substances 0.000 title claims abstract description 34
- 230000008878 coupling Effects 0.000 claims abstract description 77
- 238000010168 coupling process Methods 0.000 claims abstract description 77
- 238000005859 coupling reaction Methods 0.000 claims abstract description 77
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 41
- 229910052802 copper Inorganic materials 0.000 claims abstract description 41
- 239000010949 copper Substances 0.000 claims abstract description 41
- 239000000835 fiber Substances 0.000 claims description 17
- 230000005855 radiation Effects 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000000565 sealant Substances 0.000 claims description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 238000005057 refrigeration Methods 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 238000012544 monitoring process Methods 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010891 electric arc Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000001808 coupling effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229920006335 epoxy glue Polymers 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000003032 molecular docking Methods 0.000 description 1
- 229920001206 natural gum Polymers 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 210000005239 tubule Anatomy 0.000 description 1
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- Optical Couplings Of Light Guides (AREA)
Abstract
A coupler for semiconductor laser device and optical fibre is composed of a tube shell with a tube shell seat, a semiconductor refrigerator in the tube shell, and a heat sink copper block and a heat radiating copper block connected together. The heat sink copper block is provided with a coupling fixing head fixed by a fixing clip, and the coupling fixing head fixes an optical fiber coupling head with a hemispherical micro lens at the front end on the heat sink copper block. The heat sink copper block is also provided with a thermistor. The photoelectric detector is arranged on the heat dissipation copper block. The outer of the tube shell is provided with a connector with a tail end provided with a connector core and a plurality of lead electrodes. The LED lamp has the characteristics of compact and reasonable structure, small size, portability, internal temperature control and light control functions and output coupling rate of 80-90%.
Description
The utility model is the coupling mechanism about semiconductor laser device and optical fiber, be specially adapted to the efficient coupling of high-power laser diode and special optical fiber, it is a kind ofly to have efficient coupling and contain semiconductor microactuator refrigeration, temperature sensing temperature controlling function and to the semiconductor laser device of laser diode light monitoring function and the coupling mechanism of optical fiber.
Watt level high-power semiconductor laser spare (or claim laser diode, abbreviate LD as) is paid attention in many Military Application such as medical treatment and space laser communication, laser fuze, infrared illumination, search tracking deeply.For it can be used, people are seeking a kind ofly have little refrigeration, temperature sensing temperature controlling function and to the small and light compact device of optical fiber coupling of the light monitoring function of laser diode.The manufacturer that this several years U.S. SDL INC are representative competitively releases this device products (prior art [1] U.S. SDL INC ' .96/ ' 97PRODUCT CATALOG, A.2, A.3, A.4, A.5) this device is except costing an arm and a leg, and the tail optical fiber output couple efficiency of product is not high, mostly be 50～60% (prior art [2] U.S. SDL INC. ' 93-" 98PRODUCT CATALOG), and have only 1～2 watt semiconductor laser device coupled apparatus to have little refrigeration temperature control light control functionality.Semiconductor laser device coupling mechanism for laser power P 〉=3,4 watt does not possess refrigeration temperature control light control functionality, and the yet difficult coupling of seeking of driving power.So use inconvenience is arranged, do not satisfy application requirements.
The purpose of this utility model is for overcoming existing deficiency in the above-mentioned prior art, a kind of coupling mechanism that makes high power (1～6 watt) semiconductor laser device and optical fiber is provided, it will have built-in semiconductor microactuator refrigeration temperature control light control functionality, can make coupling efficiency bring up to 70～85%, and it is easy to use, satisfy various (comprising military affairs) and use, compact conformation is reasonable.
The coupling mechanism of semiconductor laser device of the present utility model and optical fiber contains the shell 26 that has stationary housing screw 7 on the shell seat 17.Be equipped with semiconductor cooler 18 on the shell seat 7 in the shell 26, the heat sink copper billet 4 and the heat radiation copper billet 21 that on semiconductor cooler 18, have both to fuse.The groove 27 that moves towards to have on the centrosymmetric position smaller part circle at the upper surface upper edge of heat sink copper billet 4 optical fiber (14).On the heat sink copper billet 4 of groove 27 both sides, vest fixing threaded hole 3 is arranged, on heat sink copper billet, put the circular hole (10) of thermistor in addition.Front end has the lenticular optical fiber coupling head of hemisphere (13) and is fixed on the heat sink copper billet 4 by the coupling fixed head 1 in the groove 27 that places on the heat sink copper billet 4.Be stamped fixedly vest 2 above the coupling fixed head 1.Fixedly vest 2 is vest fixing threaded hole 3 interior the fixing that are threaded onto groove 27 both sides by fixed screw 19.In order to fix better, between the groove 27 on fixing vest 2, coupling fixed head 1 and the heat sink copper billet 4, fill up the packed layer 12 of inserts formation.Place on the heat sink copper billet 4 of heat radiation copper billet 21 1 sides with the center of heat sink 20 semiconductor laser device 5 and the central axis OO of optical fiber coupling head 13 and coincide.Place that there is photodetector 6 in the space on the heat radiation copper billet 21 in the shell 26.Just a shell 26 seals, and is filled with dried nitrogen in the shell 26.As shown in Figure 1.
The other end of the optical fiber 14 front end band optical fiber coupling heads 13 at coupling fixed head 1 center in the shell 26 reaches outside the shell 26, and an end of close shell 26 is with copper pipe 16 on optical fiber 14 cylindricals, between optical fiber 14 cylindricals and copper pipe 16 heat-shrink tube 15 is arranged.The connector 9 that band connector core 8 is arranged on the tail end of the optical fiber 14 that reaches shell 26 lateral surfaces.As shown in Figure 1 and Figure 2.
There is being optical fiber 14 to stretch out that (leading flank) has and shell 26 insulation on the other side of shell 26 sides, and many lead-in wire electrodes 11 of mutually insulated.As shown in Figure 1.Stationary housing screw 7 on the shell seat 7 outside shell 26 has four to be used for shell 26 is fixed on heating radiator usually.The mutually insulated of shell 26 leading flanks also has 1～10 usually with many lead-in wire electrodes 11 of shell 26 insulation, and wherein second vacancy is standby.Stretch out shell 26 infrared optical fibers 14 at a end, on copper pipe 16 and optical fiber 14 cylindricals, be with heat-shrink tube 15 in order that buffer protection optical fiber 14 near shell 26.Stretching out shell 26 outer optical fiber 14 tail ends also is optical fiber 14 output terminals, therefore has connector 9, and the connection core print 8 of its connector 9 (also being called for short tail optical fiber) the utility model has multiple coupling connector core 8 by the special design of different core diameters.
Said coupling fixed head 1 is optical fiber 14 on the center.On optical fiber 14 cylindricals, be with thin sleeve pipe 24.On the cylindrical of thin sleeve pipe 24, be with metal sleeve 23.Between the cylindrical and thin sleeve pipe 24 of optical fiber 14, and between thin sleeve pipe 24 cylindricals and metal sleeve 23, fixing seal layer 22 is arranged all.Between fibre core that exposes in the optical fiber coupling head 13 on optical fiber 14 front ends and the thin sleeve pipe 24 sealant layer 25 is arranged.In order to obtain high coupling efficiency, require the refractive index n of sealant layer 25
25Equal or be approximately equal to the refractive index n of optical fiber 14 coverings
14, i.e. n
25≌ n
14
Said fixing seal layer 22 between optical fiber 14 cylindricals and thin sleeve pipe 24 and between thin sleeve pipe 24 cylindricals and metal sleeve 23 is made of scolding tin and epoxide-resin glue.
Said fixedly vest 2 is that kovar is made, or other metal materials are made.
Said fixedly vest 2, packed layer 12 is scolding tin and epoxy glue layer between the groove 27 on coupling fixed head 1 and the heat sink copper billet 4.
Said thin sleeve pipe 24 is glass capillaries, or quartzy tubule etc.
Heat radiation copper billet 21 usefulness screws are fixed on the right side of heat sink copper billet 4.Like this, the heat sink copper billet 4 of fixed fiber coupling head 13 and the fixing heat radiation copper billet 21 of semiconductor laser device 5 are fused, do not produce any relative displacement.And the surface of emission that optical fiber coupling head 13 is aimed at semiconductor laser device 5 by the multidimensional micropositioning stage is aimed at coupling, and promptly the central axis OO of optical fiber coupling head 13 overlaps with the center of semiconductor laser device 5 is strict.When obtaining high coupling efficiency, by fixedly filling tin solder (metallization is fixing) and the fixing encapsulation of epoxide-resin glue between vest 2, optical fiber coupling head 13 and the fixing heat sink copper billet 4.The photodetector 6 that is used for the light monitoring places semiconductor laser device 5 exiting surface front upper sides, in the upper space of heat radiation copper billet 4, gets the monitor optical electric current in the light leak mode.
Optical fiber coupling head 13 forms integrated hemisphere lenticule at the fibre core head, and its diameter is the best to be slightly larger than (20%～30%) core diameter, and coupling efficiency is the highest.
Coupling fixed head 1 of the present utility model, fixing in order to be coupled, coupling fixed head 1 is made structure as shown in Figure 3, almost with unguyed the same during coupling before fixed, promptly the fixed sturcture of optical fiber 14 is not introduced coupling loss for coupling loss minimum, tail optical fiber output light function.
The utility model coupled apparatus when semiconductor laser device 5 emitted light beams, is placed in the hemisphere lenticule that is total to optical fiber coupling head 13 front ends of central axis OO with it and receives.Because the lenticular diameter of hemisphere greater than the diameter of optical fiber 14 fibre cores, so the light beam that lenticule the receives overwhelming majority is exported by optical fiber 14 to tail end, has high coupling efficiency, generalized case is issued to η 〉=70%, and coupling efficiency reaches η under the optimum coupling state
Max〉=85～90%, and tail optical fiber luminous power output is stable fine, Δ p/p＞0.5%.
Coupling of the present utility model is fixing to adopt which floor metal (kovar) sleeve pipe of big or small a chain of rings to replace the glass capillary of prior art, and its effect is identical, but is good with structure of the present utility model, convenient, simple.Epoxy natural gum glue-line should approach between sleeve pipe, so that make the core centre degree good.
Advantage of the present utility model: under high power (1～6 watt) semiconductor laser device and optical fiber coupling situation, inside has semiconductor microactuator refrigerator 18 and places the thermistor of 10 li of circular holes on the heat sink copper billet 4 is the temperature sensor temperature control, photodetector monitoring optical power function, compact conformation is reasonable, small portable, easy to operate during coupling.The tail optical fiber end has added connector 9 standard FC of extraordinary core diameter of the present utility model again, is convenient to docking of device and application system.This has enlarged the range of application of this coupled apparatus greatly.
The utility model has and adopts high strength in the coupling mechanism, and bending resistance is good, for adaptable special optical fiber 14 under the various severe environmental conditions, adopts the 3M Co TECS of the U.S.
TMTECS wherein
TMThe high digital aperture N of optical fiber
A=0.39 ± 0.02 single core silica fibre more can be applicable to the application that requires high output couple efficiency and the output of high tail optical fiber luminous power.In addition, at the ask for something high coupling efficiency and than small value aperture (N
A=0.22 ± 0.02), tail optical fiber is exported in the application with high brightness and is then selected TECS for use
TMThe optical fiber 14 of the quartzy covering of quartzy core, this a kind of optical fiber in back because quartzy covering outside also has one deck TECS high strength fluorinated polymer covering (low-refraction), has just more improved coupling efficiency.
The fibre core head of optical fiber coupling head 13 of the present utility model has the hemisphere lenticule of slightly larger in diameter in core diameter, the manufacture craft of this structure is simple, comprise the fiber stripping core, corrosion conical head and arc process and fibre core head form integral lens, and original standard can both be arranged.
Success ratio is very high, does according to this configuration, and coupling efficiency generally can both reach 60～70%, even reaches 80～90%.Prior art all only is suitable for the standard quartz cladded-fiber, with optical fiber coupling head structure of the present utility model very big-difference is arranged, and manufacture craft is difficult to standard.
The coupling fixed head that the utility model adopts is to the fixedly (see figure 3) of optical fiber coupling head, generally held standard optical fiber is that fibre core and covering all are quartzy, it is the refractive index difference, when electric arc burns till integral micro-lens, (～7mm) quartzy covering is by scorification, the effect of intact maintenance covering at lens contiguous position.Therefore, can be when added metal sleeve pipe or glass bushing optical fiber appearance metallization, also can make inserts and not influence the luminous power coupling efficiency and the light transmission of optical fiber 14 with scolding tin with refractive index height such as epoxy resin (n～1.55).And now at the light-emitting area of hundreds of μ m * 1 μ m of several watts of level high power LD, the special optical fiber that must adopt core diameter to be complementary with it.The utility model is selected single silica fibre TECS for use
TM, when forming integral micro-lens with arc process, head has long optical fiber (TECS) covering of 8mm～10mm must shell clearly approximately, not so also can be burnt by electric arc and destroy.Fixing (stable for tail optical fiber output, as must to avoid the fibre core head to rock) of the exposed fibre core that such 8～10mm is long is exactly a difficult problem, the metal packing absorbing light, and scolding tin etc. can not be used.Common cementation glue such as epoxy resin, its refractive index is higher than 1.48, all is higher than fibre core n
14=1.457, the laser of semiconductor laser device just can't be coupled in the optical fiber 14 and go like this.As shown in Figure 3, only find the viscose glue of a kind of refractive index, just can not influence the efficient of coupling and transmission light near the refractive index (n=1.404) of optical fiber (TECS) covering.So refractive index n of the utility model sealant layer 25
25Equal or closely equal the refractive index n of optical fiber 14 coverings
14, i.e. n
25≌ n
14Refractive index n as corresponding optical fiber (TECS) covering of the utility model
14The refractive index n of=1.404 usefulness sealant layers
25=1.406 organic silica gel, this be optimal almost be perfect solution, this head ruggedized construction does not influence the transmission of coupling efficiency and light, success ratio reaches 100%.
Description of drawings:
Fig. 1 is the top view structural drawing of the utility model coupling mechanism
Fig. 2 is the A-A cross-sectional schematic of Fig. 1
Fig. 3 is the synoptic diagram of coupling fixed head 1 structure during B-B analyses and observe among Fig. 2.
Embodiment: as the structure of Fig. 1, Fig. 2, Fig. 3.Listed in the optical fiber 14 of formation the utility model embodiment and the parameter of semiconductor laser device (LD) such as the following table.
| Example 1 | Example 2 | |
| The optical fiber feature | 46 ° of (N of Hard Roll layer | 46 ° of (N of Hard Roll layer |
| The LD characteristic | 4 watts of semiconductor laser device surface of emission W * H:300 μ m * 1 μ m beam divergence angle: θ that export continuously ⊥～45°，θ ∥～10° | 1 watt of semiconductor laser device surface of emission W * H:200 μ m * 1 μ m beam divergence angle: θ that exports continuously ⊥～45°，θ ∥～10° |
| The coupled apparatus performance | Be provided with in the shell 26 that little refrigeration is light-operated, function of temperature control tail optical fiber optical output power P～3.4 watts of coupling efficiency η=46 ° of tail optical fiber Output optical power of 85% tail optical fiber beam divergence angle degree of stability＜0.5% | Interior shell 26 contains that little refrigeration is light-operated, function of temperature control optical output power P～0.75 watt of coupling efficiency η=46 ° of tail optical fiber Output optical power of 75% tail optical fiber beam divergence angle degree of stability＜0.5% |
Said tail optical fiber is exactly the connector core 8 of the connector 9 of optical fiber 14 tail ends that stretch out shell 26 lateral surfaces of the optical fiber 14 described in Fig. 1, Fig. 2 in the last table.
Claims (3)
1. the coupling mechanism of semiconductor laser device and optical fiber, contain:
＜1〉has the shell (26) of stationary housing screw (7) on the shell seat (17), be equipped with semiconductor cooler (18) on the shell seat (17) in the shell (26), place the semiconductor laser device (5) that also has optical fiber coupling head (13) in the shell (26) and have heat sink (20);
＜2〉reach the optical fiber (14) of the connector (9) that tail end band connector core (8) is arranged of shell (26) lateral surface, be with copper pipe (16) near on end optical fiber (14) cylindrical of shell (26) lateral surface, between copper pipe (16) and optical fiber (14) cylindrical heat-shrink tube (15) is arranged, reach shell (26) lateral surface and also have many lead-in wire electrodes (11);
It is characterized in that:
＜3〉heat sink copper billet (4) and the heat radiation copper billet (21) that has both to fuse above the semiconductor cooler (18) in shell (26);
＜4〉move towards to have on the centrosymmetric position groove (27) of smaller part circle at the upper surface upper edge of heat sink copper billet (4) optical fiber (14), on the heat sink copper billet (4) of groove (27) both sides vest fixing threaded hole (3) is arranged, put the circular hole (10) of thermistor on the heat sink copper billet (4) in addition;
＜5〉front end has the lenticular optical fiber coupling head of hemisphere (13) by placing the interior coupling fixed head (1) of groove (27) on the heat sink copper billet (4) to be fixed on the heat sink copper billet (4), be stamped fixedly vest (2) above the coupling fixed head (1), fixedly vest (2) is threaded onto interior the fixing of vest fixing threaded hole (3) of groove (27) both sides by fixed screw (19), fixedly vest (2) has packed layer (12) between the groove (27) on coupling fixed head (1) and the heat sink copper billet (4);
＜6〉place on the heat sink copper billet (4) of heat radiation copper billet (21) one sides with the center of the semiconductor laser device (5) of heat sink (20) and the central axis (OO) of optical fiber coupling head (13) and coincide;
＜7〉place the heat radiation copper billet (21) in the shell (26) upward photodetector (6) to be arranged the space, shell (26) seals, and shell is filled with dried nitrogen in (26).
2. the coupling mechanism of semiconductor laser device according to claim 1 and optical fiber, it is characterized in that being with thin sleeve pipe (24) on optical fiber (14) cylindrical on coupling fixed head (1) center of said fixed fiber coupling head (13), the outer metal sleeve (23) that is with of thin sleeve pipe (24), between optical fiber (14) and the thin sleeve pipe (24) and between thin sleeve pipe (24) and the metal sleeve (23) fixedly sealed layer (22) is being arranged, at fibre core that optical fiber coupling head (13) exposes and carefully between the sleeve pipe (24) sealant layer (25) is arranged.
3. the coupling mechanism of semiconductor laser device according to claim 1 and 2 and optical fiber is characterized in that the refractive index n of said sealant layer (25)
25Equal or be approximately equal to the refractive index n of optical fiber (14) covering
14, i.e. n
25≌ n
14
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 99240338 CN2397504Y (en) | 1999-11-16 | 1999-11-16 | Coupler of semiconductor laser device and optical fiber |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 99240338 CN2397504Y (en) | 1999-11-16 | 1999-11-16 | Coupler of semiconductor laser device and optical fiber |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2397504Y true CN2397504Y (en) | 2000-09-20 |
Family
ID=34027399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 99240338 Expired - Fee Related CN2397504Y (en) | 1999-11-16 | 1999-11-16 | Coupler of semiconductor laser device and optical fiber |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2397504Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101464545B (en) * | 2007-12-17 | 2012-09-05 | Jds尤尼弗思公司 | Method and device for monitoring light |
| CN109564136A (en) * | 2016-06-03 | 2019-04-02 | 恩耐公司 | For monitoring the multifunctional circuit of Connectorized fiber optic cabling health status |
| CN110888208A (en) * | 2019-12-09 | 2020-03-17 | 亨通洛克利科技有限公司 | Optical module with fiber winding mechanism |
-
1999
- 1999-11-16 CN CN 99240338 patent/CN2397504Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101464545B (en) * | 2007-12-17 | 2012-09-05 | Jds尤尼弗思公司 | Method and device for monitoring light |
| CN109564136A (en) * | 2016-06-03 | 2019-04-02 | 恩耐公司 | For monitoring the multifunctional circuit of Connectorized fiber optic cabling health status |
| CN110888208A (en) * | 2019-12-09 | 2020-03-17 | 亨通洛克利科技有限公司 | Optical module with fiber winding mechanism |
| CN110888208B (en) * | 2019-12-09 | 2024-01-02 | 亨通洛克利科技有限公司 | Optical module with fiber winding mechanism |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |