CN2395385Y - Hinged heat conductive structure - Google Patents
Hinged heat conductive structure Download PDFInfo
- Publication number
- CN2395385Y CN2395385Y CN 99238948 CN99238948U CN2395385Y CN 2395385 Y CN2395385 Y CN 2395385Y CN 99238948 CN99238948 CN 99238948 CN 99238948 U CN99238948 U CN 99238948U CN 2395385 Y CN2395385 Y CN 2395385Y
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- CN
- China
- Prior art keywords
- heat
- cylindrical hole
- conducting block
- conductive structure
- block
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a pivotal-rotating heat conducting structure which can be used for making the heat produced by heating elements conduct to the heat radiation position of a displayer. The utility model comprises a heat conducting block with good heat-conducting property, a first column hole and a second column hole which are arranged in parallel from top to bottom and are provided with opposite openings, a first heat conducting pipe which is fixedly inserted in the first column hole of the heat conducting block, a second heat conducting pipe which can be inserted in the second column hole of the heat conducting block in pivotal-rotating way, and a sealing device. The heat produced by the heating elements can be absorbed by the first heat conducting pipe and can be conducted to the heat conducting block. Then, the heat can be absorbed from the heat conducting block by the second heat conducting pipe and can be conducted to the displayer so as to spread to the external world.
Description
The utility model is about a kind of conductive structure that pivots, and is meant a kind ofly by heat pipe and heat-conducting block with good heat conductive effect especially, and the heat that heater element produces is conducted to the pivoted conductive structure of display place heat radiation.
Along with the raising of electronic installation internal wafer arithmetic speed and the increase of consumed power, the heat of corresponding generation also increases severely thereupon, for wafer can be moved, normally directly set up a heat abstractor so that discharge the heat that wafer produces in wafer surface under normal working temperature.As United States Patent (USP) the 5th, 615,735,5,537,343 and 5,541, the radiator structure that is disclosed for No. 811, these radiator structures are to be inserted in the radiator that directly is sticked on the wafer of motherboard,, by the radiating fin on the radiator heat are distributed behind the wafer draw heat by radiator again.But the radiating efficiency of these radiator structures is difficult to satisfy the radiating requirements of the wafer that arithmetic speed improves day by day in actual use.
The structure of another kind of existing heat abstractor can be with reference to United States Patent (USP) the 5th, 690, No. 468, this heat abstractor is to be made of radiating part, heat pipe and fan etc., and wherein this radiating part has a pedestal that slightly is square and several are from the upwardly extending radiating fin of base top surface one.This pedestal is to recline with bottom surface and wafer, and is provided with fan in base top surface central authorities, and heat pipe then is fixed between the radiating fin of radiating part one side.Though the radiating effect of this structure is better than the former, but for notebook computer, because it requires the height of motherboard integral body more and more low, and this class is placed a heat abstractor of forming by fan and radiator on motherboard, get rid of the heat that heater element produces, obviously infeasible.
In addition, above-mentioned prior art is except that the needs that can not satisfy existing computer development because of radiating effect or volume height problem, and because of it is by the motherboard place heat that heater element produces to be discharged, and this radiating mode is for notebook (pocket) computer user, if when computer is placed on above-knee operation, the heat that the motherboard place gives out will cause user's discomfort, also can influence the integral heat sink effect of computer simultaneously.
The purpose of this utility model is to provide a kind of notebook (pocket) computer that is used in, and excellent in heat dissipation effect, overall dimensions is little and by outside the pivoted conductive structure of heat radiation in display place.
Another purpose of the present utility model is to provide a kind of can conduct to a heat-conducting block with the heat that heater element produces by first heat pipe, conduct to display through sealing device and second heat pipe from this heat-conducting block draw heat again and dispel the heat, and the pivoted conductive structure that covers of (pocket) computer monitor that do not influence notebook.
Technical characterictic of the present utility model is: the conductive structure that pivots of the present utility model, be to be used for that the heat that heater element produces is conducted to the display place outwards to dispel the heat, it comprises the heat-conducting block with good heat conductive performance, be provided with and be arranged in parallel up and down and first, second cylindrical hole that opening is opposite, fixedly be plugged on first heat pipe in this heat-conducting block first cylindrical hole, be plugged on second heat pipe and sealing device in this heat-conducting block second cylindrical hole pivotly.Wherein, the sealing device is made up of sealing ring and plug screw; One end of this first heat pipe is can be fixed on heat conduction in first cylindrical hole, and the other end is to be connected heater element with heat conduction, with heat extraction that heater element was produced and reach heat-conducting block; One end of this second heat pipe is to be arranged on pivotly in second cylindrical hole, and fill heat-conducting cream in the gap between the two with heat conduction and lubrication, by sealing device this heat-conducting cream is encapsulated simultaneously, this second heat pipe can be contacted also do heat conduction with the inwall of second cylindrical hole can make pivoting action, the other end at this second heat pipe is to be connected the display place with heat conduction, so that with the heat of second heat pipe from the heat-conducting block absorption, conduct to the display place and outwards distribute, to satisfy the inconvenience that is brought in the heat radiation of main frame place in the prior art.
The utility model compared with the prior art, its advantage is: the utility model excellent in heat dissipation effect, overall dimensions are little, be fit to the more and more requirement at the end of height of notebook host slab integral, an end of this second heat pipe is to be arranged on pivotly in second cylindrical hole simultaneously, but the other end is heat conduction is connected the display place, thereby with the heat that second heat pipe is drawn from heat-conducting block, outwards dispel the heat in the place by display, satisfies the inconvenience that is brought from the main frame heat radiation in the prior art.
In conjunction with the embodiments the utility model is further described with reference to the accompanying drawings.
Fig. 1 is can the pivot assembled sectional view of conductive structure of the utility model.
Fig. 2 is can the pivot three-dimensional combination figure of conductive structure of the utility model.
See also Fig. 1, Fig. 2, the utility model conductive structure that can pivot includes heat-conducting block 10, first, second heat pipe 20,30 and sealing device 40.
This heat-conducting block 10 is to be stacked up and down by first, second block 16,18, and is bonding and form the integrative-structure with good heat-conducting through heat-conducting glue 50.On this first, second block 16,18, corresponding being provided with is arranged in parallel up and down and first, second cylindrical hole 12,14 that opening is opposite, wherein the inwall of this second cylindrical hole 14 is provided with step 142 at the end near opening, then is provided with the end of thread 144 at the close opening part of the inwall of second cylindrical hole 14.In addition, this first block 16 also is provided with base 162, and is respectively equipped with a screw 164 at four corners of this base 162, and by screw 60 heat-conducting block 10 is fixed on the host computer.
One end A of this first heat pipe 20 can be fixed in first cylindrical hole 12 of this heat-conducting block 10 with heat conduction, other end B then can be connected with heater element with heat conduction (as CPU etc., figure does not show), with the heat extraction that heater element was produced, and reach heat-conducting block 10; One end C of this second heat pipe 30 is arranged in second cylindrical hole 14 of this heat-conducting block 10 pivotly, and the material that is filled with tool heat conduction and lubrication in the gap between the two is (as heat-conducting cream 70, or oily substance), and by sealing device 40 this heat-conducting cream 70 is encapsulated.Sealing device 40 is by sealing ring 42 and plug screw 44 (or single rubber stopper, figure does not show) form, wherein sealing circle 42 is arranged on step 142 places in second cylindrical hole 14, and this plug screw 44 is the ends of thread 144 that screw at second cylindrical hole 14, in order to heat-conducting cream 70 is blockaded, make this second heat pipe 30 do thermo-contact and to make pivoting action with the inwall of second cylindrical hole 14, this plug screw 44 also offers through hole 442 simultaneously, passes for an end of second heat pipe 30.In addition, the other end D of this second heat pipe 30 is but that hot link is at the display place (figure does not show), with the heat that second heat pipe 30 is drawn from heat-conducting block 10, the place outwards distributes by display, to satisfy the inconvenience that is brought from the main frame heat radiation in the prior art.In second cylindrical hole 14, can make pivoting action because of this second heat pipe 30 again,, not cover and can not influence computer monitor so this second heat pipe 30 also can be made pivoting action with display.
Claims (12)
1. the conductive structure that can pivot comprises heat-conducting block, and first and second heat pipe and sealing device is characterized in that: this heat-conducting block has the good heat conductive performance, which is provided with first, second cylindrical hole; This first heat pipe is fixedly to be plugged in first cylindrical hole of heat-conducting block; This second heat pipe is to be plugged on pivotly in second cylindrical hole of heat-conducting block; And the sealing device is arranged on the heat-conducting block second cylindrical hole appropriate position.
2. the conductive structure that pivots as claimed in claim 1 is characterized in that: this heat-conducting block is stacked up and down by first, second block to be formed, and by the bonding integrative-structure that forms of heat-conducting glue.
3. the conductive structure that pivots as claimed in claim 2 is characterized in that: this first, second cylindrical hole is to be located at respectively on first, second block.
4. as claim 1, the 2 or 3 described conductive structures that pivot, it is characterized in that: this second cylindrical hole inwall is provided with step at the end near opening, is provided with the end of thread at opening part.
5. the conductive structure that pivots as claimed in claim 4 is characterized in that: the sealing device is made up of sealing ring and plug screw, and this plug screw is provided with through hole.
6. the conductive structure that pivots as claimed in claim 5 is characterized in that: the sealing circle is to be placed on the step of the second cylindrical hole inwall, and this plug screw is the end of thread of cock at the second cylindrical hole inwall.
7. as claim 1, the 2 or 3 described conductive structures that pivot, it is characterized in that: the heat-conducting cream that is filled with tool heat conduction and lubrication in the gap between this second heat pipe and the second cylindrical hole inwall.
8. as claim 1, the 2 or 3 described conductive structures that pivot, it is characterized in that: the oily substance that is filled with tool heat conduction and lubrication in the gap between this second heat pipe and the second cylindrical hole inwall.
9. the conductive structure that pivots as claimed in claim 2 is characterized in that: this second block further is provided with the base of strengthening fixing this heat-conducting block.
10. the conductive structure that pivots as claimed in claim 9 is characterized in that: the base of this second block is provided with screw.
11. the conductive structure that pivots as claimed in claim 10 is characterized in that: this conductive structure that can pivot also includes the screw that can pass on this second block base and the screw that heat-conducting block is fixing.
12. as claim 1, the 2 or 3 described conductive structures that pivot, it is characterized in that: this first, second conduit is to be connected with heat-conducting block by an end, the other end then links to each other with heater element and display respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 99238948 CN2395385Y (en) | 1999-10-08 | 1999-10-08 | Hinged heat conductive structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 99238948 CN2395385Y (en) | 1999-10-08 | 1999-10-08 | Hinged heat conductive structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2395385Y true CN2395385Y (en) | 2000-09-06 |
Family
ID=34026288
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 99238948 Expired - Lifetime CN2395385Y (en) | 1999-10-08 | 1999-10-08 | Hinged heat conductive structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2395385Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102065666A (en) * | 2009-11-12 | 2011-05-18 | 富准精密工业(深圳)有限公司 | Heat dissipating device |
-
1999
- 1999-10-08 CN CN 99238948 patent/CN2395385Y/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102065666A (en) * | 2009-11-12 | 2011-05-18 | 富准精密工业(深圳)有限公司 | Heat dissipating device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |