CN218336961U

CN218336961U - Board card brass heat dissipation external member

Info

Publication number: CN218336961U
Application number: CN202222487227.6U
Authority: CN
Inventors: 王宗豪; 孙金立; 吴泽宇
Original assignee: Nanjing Ruida Electronic Technology Co ltd
Current assignee: Nanjing Ruida Electronic Technology Co ltd
Priority date: 2022-09-20
Filing date: 2022-09-20
Publication date: 2023-01-17
Anticipated expiration: 2032-09-20

Abstract

The utility model discloses a board brass heat dissipation external member, relate to wave control subassembly technical field, including the board card module, brass heat dissipation external member includes brass radiating block apron, go up the brass radiating block, lower brass radiating block, go up the heat conduction silica gel pad, heat conduction silica gel pad and installation fastener down, upward be equipped with the screw hole on the brass radiating block, brass radiating block down, go up the heat conduction silica gel pad, all open the through-hole on heat conduction silica gel pad and the board card module down, the through-hole on the heat conduction silica gel pad down supreme passing in proper order is followed to the installation fastener, through-hole on the heat conduction silica gel pad down, through-hole on the board card module, stretch into the threaded hole on the brass radiating block after going up the through-hole on the heat conduction silica gel pad, brass radiating block apron closes with last brass radiating block lid. The beneficial effects of the utility model are that, both alleviateed its weight and the assembly is simple and can see clearly whether wrap up the radiating components and parts on the integrated circuit board completely of heat conduction silicone grease.

Description

Board card brass heat dissipation external member

Technical Field

The utility model relates to a phased array radar antenna's basic unit wave accuse subassembly technical field especially relates to a plate strap brass heat dissipation external member.

Background

The board card module is one of key parts of the phased array radar. The wave control component is generally used for supplying power to a T/R in a wireless transceiving system, and the T/R is a part between a video and an antenna. One end of the wave control component is connected with the T/R, and the other end of the wave control component is connected with external power supply to form a power supply system, and the function of the power supply system is to supply power and control the T/R component.

The wave control component is the basic component and key technology of the active phased array radar antenna. Depending on the application, an active phased array may consist of hundreds or thousands of T/R modules. The T/R modules play an important role in the performance of the array and account for 50% of the cost of the source phased array antenna. Therefore, when the T/R is used, power is supplied to the T/R.

In order to effectively dispel the heat to its corresponding chip when wave accuse subassembly uses, work such as loaded down with trivial details investigation and the reinstallation that appears causing because of the not good problem of heat dissipation after avoiding later stage to use the host computer, present heat dissipation mainly adopts the brass radiating block to carry out radiating mode, and is fixed through brass radiating block and integrated circuit board module promptly, then irritates the mode of heat conduction silicone grease on the brass radiating block. This approach has the following drawbacks: 1. the brass radiating block has heavier overall weight; 2. when the heat-conducting silicone grease is poured, whether the components needing heat dissipation on the board card module are completely wrapped or not cannot be distinguished.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the shortcoming that exists among the prior art, and the radiating block of a kind of cardboard brass heat dissipation external member that proposes, this brass radiating block is a simple, the radiating module of convenient easy assembly. Through the separate processing of the heat dissipation block, the weight of the heat dissipation block is reduced, the assembly is simple, and whether the heat conduction silicone grease completely wraps the board card or not can be seen.

In order to realize the purpose, the utility model adopts the following technical scheme: the utility model provides a strap clamp brass heat dissipation external member, including the strap clamp module, still include brass heat dissipation external member, brass heat dissipation external member includes brass radiating block apron, go up the brass radiating block, brass radiating block down, go up the heat conduction silica gel pad, heat conduction silica gel pad and installation fastener down, upward be equipped with the screw hole on the brass radiating block, brass radiating block down, go up the heat conduction silica gel pad, all open the through-hole down on heat conduction silica gel pad and the strap clamp module, the installation fastener is from supreme through-hole down passing in proper order down on the brass radiating block down, through-hole on the heat conduction silica gel pad down, through-hole on the strap clamp module, go up and stretch into in the screw hole on the brass radiating block behind the through-hole on the heat conduction silica gel pad, brass radiating block apron and last brass radiating block lid close.

As a further description of the above technical solution: the mounting fastener penetrates through the flat pad and then penetrates through the lower brass radiating block.

As a further description of the above technical solution: still including bullet pad, the installation fastener is from supreme down stretched into in the threaded hole on the brass radiating block after passing flat pad, bullet pad, the through-hole on the brass radiating block down in proper order, the through-hole on the heat conduction silica gel pad down, the through-hole on the integrated circuit board module, go up the through-hole on the heat conduction silica gel pad.

As a further description of the above technical solution: the upper brass radiating block is internally provided with a cavity.

As a further description of the above technical solution: the heat dissipation structure further comprises heat dissipation silicone grease, and the heat dissipation silicone grease is filled in a cavity arranged in the upper brass heat dissipation block.

As a further description of the above technical solution: the mounting fasteners include pan head screws and countersunk head screws.

As a further description of the above technical solution: the brass radiating block cover plate and the upper brass radiating block are fastened through countersunk screws.

The utility model discloses following beneficial effect has:

1. through designing into brass heat dissipation apron and last brass radiating block (inside being the cavity) two parts with the brass radiating block of integrated circuit board module top, solved the loaded down with trivial details problem of step when pouring heat conduction silicone grease on the brass radiating block that makes progress, simultaneously through adopting the mode of hollowing out the inside of going up the brass radiating block, solved the whole overweight problem of integrated circuit board radiating module.

2. Through adopting the mode of separately processing the brass radiating block, the problem of overweight of wave control assembly is solved, and the problem of whether the heat conduction silicone grease is filled and whether all wrapping up the chip that needs the heat dissipation can also be seen accurately.

Drawings

FIG. 1 is a view of the components of the present invention;

fig. 2 is a schematic structural diagram of the present invention.

Illustration of the drawings:

101. the integrated circuit board comprises a board card module, 102, countersunk screws, 103, a brass radiating block cover plate, 104, an upper brass radiating block, 105, an upper heat-conducting silica gel pad, 106, a lower heat-conducting silica gel pad, 107, a lower brass radiating block, 108, a flat pad, 109, an elastic pad, 110 and pan head screws.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1-2, the utility model provides a cardboard brass heat dissipation external member, including integrated circuit board module 101, still include brass heat dissipation external member, brass heat dissipation external member includes brass radiating block apron 103, go up brass radiating block 104, brass radiating block 107 down, go up heat conduction silica gel pad 105, heat conduction silica gel pad 106 and installation fastener down, upward be equipped with the screw hole on the brass radiating block 104, brass radiating block 107 down, go up heat conduction silica gel pad 105, the through-hole has all been opened on heat conduction silica gel pad 106 and the integrated circuit board module 101 down, the through-hole on the brass radiating block 107 is passed down in proper order to the installation fastener down, the through-hole on heat conduction silica gel pad 106 down, the through-hole on the integrated circuit board module 101, go up and stretch into the threaded hole on the brass radiating block 104 behind the through-hole on the heat conduction silica gel pad 105, brass radiating block apron 103 closes with last brass radiating block 104 lid.

For convenient connection, the utility model discloses the installation fastener adopts pan head screw 110 or countersunk head screw 102.

The utility model discloses in, for making coiled head screw 110 steady with lower brass radiating block 107 block, coiled head screw 110 directly is equipped with flat pad 108 and bullet pad 109 with lower brass radiating block 107 in proper order.

In order to irritate heat conduction silicone grease and alleviate the whole weight of integrated circuit board heat dissipation module for convenient, the utility model discloses go up and set up to the cavity in the brass radiating block 104.

In order to facilitate the connection of brass radiating block cover plate 103 and upper brass radiating block 104, the utility model discloses a countersunk head screw 102 fastens brass radiating block cover plate 103 and upper brass radiating block 104.

The working principle is as follows: the heat dissipation kit for the chip of the board module part specifically penetrates through the lower brass radiating block 107, the lower heat-conducting silicone pad 106, the board module 101, the upper heat-conducting silicone pad 105, the upper brass radiating block 104 through the threaded hole in the upper brass radiating block 104, the inner cavity of the upper brass radiating block 104 is filled with heat-dissipating silicone grease, and the brass radiating block cover plate 103 is fixed on the upper brass radiating block 104 through the countersunk head screw 102, wherein the pan head screw 110, the flat pad 108 and the elastic pad 109 penetrate through the lower brass radiating block 107. And then the heat of the chip on the board card module 101 is conducted to the shell through the heat dissipation brass block by contacting the heat dissipation brass block with the external shell, and the shell dissipates the heat through the external heat dissipation system.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.

Claims

1. The utility model provides a board brass heat dissipation external member, includes board card module (101), its characterized in that: still include brass heat dissipation external member, brass heat dissipation external member includes brass radiating block apron (103), go up brass radiating block (104), brass radiating block (107) down, go up heat conduction silica gel pad (105), heat conduction silica gel pad (106) and installation fastener down, upward be equipped with the screw hole on brass radiating block (104), brass radiating block (107) down, go up heat conduction silica gel pad (105), all open the through-hole on heat conduction silica gel pad (106) and integrated circuit board module (101) down, the installation fastener is from supreme through-hole of passing down on brass radiating block (107) down in proper order, through-hole on heat conduction silica gel pad (106) down, through-hole on integrated circuit board module (101), stretch into the screw hole on brass radiating block (104) after going up the through-hole on heat conduction silica gel pad (105), brass radiating block apron (103) and last brass radiating block (104) lid close.

2. The brass heat dissipation kit for a board according to claim 1, wherein: the heat dissipation device also comprises a flat pad (108), and the mounting fastener penetrates through the flat pad (108) and then penetrates through the lower brass radiating block (107).

3. The card brass heat dissipation kit of claim 2, wherein: still include bullet pad (109), installation fastener is from supreme down stretched into behind the through-hole on brass radiating block (104) after passing flat pad (108), bullet pad (109), the through-hole on brass radiating block (107) down, the through-hole on heat conduction silica gel pad (106) down, the through-hole on integrated circuit board module (101), the through-hole on going up heat conduction silica gel pad (105) in proper order in the screw hole on brass radiating block (104).

4. The card brass heat dissipation kit of claim 1, wherein: the upper brass radiating block (104) is internally provided with a cavity.

5. The card brass heat dissipation kit of claim 4, wherein: the heat dissipation structure further comprises heat dissipation silicone grease, and the heat dissipation silicone grease is filled in a cavity arranged in the upper brass heat dissipation block (104).

6. The card brass heat dissipation kit of claim 5, wherein: the mounting fasteners include pan head screws (110) and countersunk head screws (102).

7. The brass heat dissipation kit for a board according to claim 6, wherein: the brass radiating block cover plate (103) is fastened with the upper brass radiating block (104) through a countersunk head screw (102).