CN210804306U - CPCI mainboard radiator - Google Patents
CPCI mainboard radiator Download PDFInfo
- Publication number
- CN210804306U CN210804306U CN201922487895.7U CN201922487895U CN210804306U CN 210804306 U CN210804306 U CN 210804306U CN 201922487895 U CN201922487895 U CN 201922487895U CN 210804306 U CN210804306 U CN 210804306U
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- Prior art keywords
- heat dissipation
- guide plate
- heat
- back plate
- cpci
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- 102100029368 Cytochrome P450 2C18 Human genes 0.000 title claims abstract 11
- 101000919360 Homo sapiens Cytochrome P450 2C18 Proteins 0.000 title claims abstract 11
- 230000017525 heat dissipation Effects 0.000 claims abstract description 140
- 239000002184 metal Substances 0.000 claims abstract description 16
- 229910052751 metal Inorganic materials 0.000 claims abstract description 16
- 238000012546 transfer Methods 0.000 abstract description 2
- 238000007599 discharging Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 6
- 238000009530 blood pressure measurement Methods 0.000 description 5
- 238000004891 communication Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 210000000056 organ Anatomy 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a CPCI mainboard radiator, which comprises a radiating guide plate, a radiating back plate, a buckle structure and a movable bracket, wherein the radiating guide plate is used for guiding heat of each working chip 11; the heat dissipation back plate is used for discharging the heat of the heat dissipation guide plate to the outside; the buckle structure is used for realizing the fixed connection between the heat dissipation guide plate and the heat dissipation back plate; the movable support is used for enabling the heat dissipation back plate to be in a movable state, and the heat dissipation guide plate is separated from the heat dissipation back plate. The utility model discloses utilize the heat dissipation baffle and the heat dissipation backplate of disconnect-type to carry out the heat dissipation of CPCI mainboard, accomplished and to have artificially monitored the position relation of metal guide block for work chip 11, improved work chip 11's heat dissipation full scale degree in the CPCI mainboard to the heat dissipation baffle and the heat dissipation backplate of disconnect-type adopt buckle formula structure to carry out the joint fixed, make heat dissipation baffle and heat dissipation backplate in close contact with, do not influence the heat transfer between heat dissipation baffle and the heat dissipation backplate.
Description
Technical Field
The utility model relates to a CPCI communications facilities field, concretely relates to CPCI mainboard radiator.
Background
CPCI (compact Peripheral Component internet) is a bus standard, is mostly used in the military industry or the communication field, and generally, when solving the technical problem in the military industry or the communication field, a CPCI motherboard is mostly needed to perform system debugging or simple data reception. Because the CPCI mainboard needs to meet the compact and space-saving characteristics of the CPCI platform, the working chip sets all adopt embedded movable chip sets, but the heat dissipation problem is accompanied, and the working efficiency of the chips is reduced due to the excessive heat generated by the working chips such as the CPU and the memory chip, so that the service life of the CPCI mainboard is reduced. It is necessary to add a heat sink to the motherboard.
In the conventional heat sink, the heat sink is roughly divided into two parts: the heat dissipation guide block and the heat dissipation back plate are of an integrated structure, and the radiator is large in size and suitable for heat dissipation of a single chip. Because the CPCI mainboard is high in integration, the volume of the mainboard is larger than that of a common chip, so that when the radiator is installed, whether the alignment is achieved can not be confirmed manually like when the radiator of a single chip is installed, namely, the position relation between each working chip on the mainboard and the heat conduction cold plate can not be seen, the position relation can not be confirmed manually, and the heat dissipation fullness can not be ensured.
How to ensure sufficient heat dissipation of the motherboard operating chip is an urgent problem to be solved in the field.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to provide a but CPCI mainboard radiator of artifical confirmation chip thermal diffusivity.
In order to solve the problem of CPCI mainboard location heat dissipation difficulty, the utility model provides a scheme is:
a CPCI mainboard radiator comprises a metal guide block (10), a radiating guide plate (2), a radiating back plate (1), a detachable fixed structure, a movable support (5) and a pressure sensor (7);
the metal guide block (10) is arranged on the heat dissipation guide plate (2), and the heat dissipation back plate (1) is arranged on the surface of the heat dissipation guide plate (2) opposite to the metal guide block (10); the metal guide block (10) is used for connecting a heat dissipation device of a mainboard
The end parts of the heat dissipation back plate (1) and the heat dissipation guide plate (2) are connected through a detachable fixing structure; the heat dissipation back plate (1) is connected with the heat dissipation guide plate (2) through a movable support (5); the pressure sensor (7) is arranged between the heat dissipation back plate (1) and the heat dissipation guide plate (2) and is used for detecting and generating a connection pressure signal between the heat dissipation back plate (1) and the heat dissipation guide plate (2); the pressure sensor (7) is also connected with an alarm unit, and the alarm unit sends out a prompt signal after receiving the pressure signal.
Further, the method comprises the following steps: the movable support (5) comprises a first movable arm and a second movable arm, one end of the first movable arm is hinged to the heat dissipation guide plate (2), and the other end of the first movable arm is hinged to one end of the second movable arm; the other end of the second movable arm is hinged on the heat dissipation back plate (1).
Further, the method comprises the following steps: the detachable fixing structure comprises a first clamping structure and a second clamping structure, the first clamping structure is connected to the heat dissipation guide plate (2), and the heat dissipation back plate (1) opposite to the first clamping structure is movably connected with the second clamping structure; the second clamping structure and the first clamping structure are clamped with each other and used for fixing the heat dissipation back plate (1) and the heat dissipation guide plate (2).
Further, the method comprises the following steps: the first clamping structure comprises a hook head (15), a fixed block (12), a slotted hole (14), a threaded hole and a pull ring (13), wherein the hook head (15) is arranged on one surface of the fixed block (12), and the pull ring (13) is arranged on the surface of the fixed block (12) opposite to the hook head (15); the middle of the fixing block (12) is provided with the slotted hole (14), the threaded hole is formed in the heat dissipation guide plate (2), and the slotted hole (14) and the threaded hole are penetrated through a nut to realize fixed connection.
Further, the method comprises the following steps: the second clamping structure is a fixed hook (16), and the fixed hook (16) is fixed on the heat dissipation back plate (1).
Further, the method comprises the following steps: the heat dissipation backboard comprises a heat dissipation backboard body (1) and is characterized by further comprising a heat conduction rubber layer (8), wherein the heat conduction rubber layer (8) is arranged on one surface, contacted with the heat dissipation guide plate (2), of the heat dissipation backboard body (1).
Further, the method comprises the following steps: the thickness of the heat-conducting rubber layer (8) is larger than the distance between the contact point of the pressure sensor (7) and the heat-radiating back plate (1) by 1-3 mm.
The utility model has the advantages that:
1. the utility model utilizes the separated heat dissipation guide plate and the heat dissipation back plate to dissipate heat of the CPCI mainboard, thereby realizing the purpose of manually monitoring the position relation of the metal guide block relative to the working chip and improving the heat dissipation fullness of the working chip in the CPCI mainboard;
2. the utility model fixes the separated heat dissipation guide plate and the heat dissipation back plate by the detachable fixing structure, thereby realizing the manual adjustment of the tightness of the heat dissipation guide plate and the heat dissipation back plate;
3. the utility model discloses utilize the inseparable degree of pressure measurement unit measurement heat dissipation baffle and heat dissipation backplate, when the inseparable degree reaches pressure measurement unit's default, carry out the buzzer sound production, remind the inseparable degree of installer heat dissipation baffle and heat dissipation backplate to have reached the expectation.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic structural view of the utility model after being unfolded;
FIG. 3 is a detachable fixed structure diagram of the present invention;
fig. 4 is a partial enlarged view of the pressure sensor of the present invention;
fig. 5 is a structural view of the pressure sensor in the present embodiment;
FIG. 6 is a block diagram of a pressure measurement unit;
the reference numbers are as follows: the heat dissipation device comprises a heat dissipation back plate 1, a heat dissipation guide plate 2, a clamping structure 3 of the heat dissipation back plate, a clamping structure 4 of the heat dissipation guide plate, a movable support 5, a CPCI main board 6, a pressure sensor 7, a heat conduction rubber layer 8, a buzzer 9, a metal guide block 10, a working chip 11, a fixed block 12, a pull ring 13, a groove hole 14, a hook head 15 and a fixed hook 16.
Detailed Description
The present invention is further described below in conjunction with the following figures and specific embodiments so that those skilled in the art may better understand the present invention and practice it.
The following discloses many different embodiments or examples for implementing the subject technology described. In order to simplify the disclosure, a specific example of one or more permutations of the features is described below, but the present disclosure is not limited to the specific example, and the first feature described later in the specification may be connected to the second feature in a direct connection, or may include an embodiment forming an additional feature, and further, may include the use of one or more other intervening features to connect or combine the first feature and the second feature indirectly with each other so that the first feature and the second feature may not be directly connected.
As shown in fig. 1:
the utility model comprises a metal guide block 10, a heat radiation guide plate 2, a heat radiation backboard 1, a detachable fixed structure, a movable bracket 5 and a pressure measuring unit; one surface of the heat dissipation guide plate 2 is provided with the metal guide block 10, and the other surface of the heat dissipation guide plate 2 is provided with the heat dissipation back plate 1; the heat dissipation guide plate 2 and the heat dissipation back plate 1 are respectively connected with the movable support 5 on the same side face, one end of the movable support 5 is fixed on the heat dissipation guide plate 2, and the other end of the movable support is fixed on the heat dissipation back plate 1; the heat dissipation guide plate 2 and the heat dissipation back plate 1 are connected in a matched mode through the detachable fixing structure; the pressure measuring unit is arranged on the contact surface of the heat dissipation back plate 1 and the heat dissipation guide plate 2 and is used for measuring the current pressure value between the heat dissipation guide plate 2 and the heat dissipation back plate 1.
Specifically, the movable support 5 comprises a first movable arm and a second movable arm, one end of the first movable arm is hinged to the heat dissipation guide plate 2, and the other end of the first movable arm is hinged to one end of the second movable arm; the other end of the second movable arm is hinged on the heat dissipation back plate 1.
Specifically, can dismantle fixed knot construct including first joint structure and second joint structure, first joint structure is located on the heat dissipation baffle 2, second joint structure is located on the heat dissipation backplate 1, the joint is realized between first joint structure and the second joint structure fixed connection between heat dissipation baffle 2 and the heat dissipation backplate 1.
Specifically, the first clamping structure comprises a hook head 15, a fixed block 12, a slot 14, a threaded hole and a pull ring 13, wherein the hook head 15 is arranged on one surface of the fixed block 12, and the pull ring 13 is arranged on the opposite surface of the fixed block 12 to the hook head 15; the middle part of the fixed block 12 is provided with the slotted hole 14, the threaded hole is arranged on the heat dissipation guide plate 2, and the slotted hole 14 and the threaded hole are penetrated through by a nut to realize fixed connection, and the specific structure is shown in fig. 3.
Preferably, the second clamping structure is a fixed hook 16, and the fixed hook 16 is connected to the heat dissipation back plate 1.
Specifically, as shown in fig. 4: the pressure measuring unit comprises a microprocessor, a miniature pressure sensor 7, an AD converter and a buzzer 9, the miniature pressure sensor 7 is connected with the AD converter, the AD converter and the buzzer 9 are respectively connected with the microprocessor, and a partial enlarged view of the pressure sensor is shown in figure 5.
Specifically, the miniature pressure sensor 7 is disposed at a contact surface of the heat dissipation back plate 1 and the heat dissipation guide plate 2.
Preferably, the heat dissipation backboard 1 further comprises a heat conduction rubber layer 8, and the heat conduction rubber layer 8 is arranged on one surface of the heat dissipation backboard 1, which is in contact with the heat dissipation guide plate 2. The heat conducting rubber layer 8 is 1-3 mm thicker than the pressure sensor 7.
Preferably, the central position of the heat dissipation guide plate 2 close to the CPCI motherboard 6 is a hollow structure, and the heat conduction blocks are uniformly arranged in the region except the position of the working chip 11, so that the heat dissipation guide plate 2 can be horizontally arranged, and the heat of the CPCI motherboard 6 is transferred out.
The structure of the separation between the heat dissipation guide plate 2 and the heat dissipation back plate 1 is shown in fig. 2.
The utility model discloses an embodiment does:
after the metal guide block 10 is installed on each working chip 11 of the CPCI mainboard 6 and manually coated with heat-conducting silicone grease, the heat-radiating guide plate 2 is covered on the CPCI mainboard 6, and the copper columns and the screws are screwed into the threaded holes around the CPCI mainboard 6 for fixed connection, so that the metal guide block 10 does not move relative to the working chips 11, at the moment, small pieces of heat-conducting rubber can be filled in the gap part of the CPCI mainboard 6, the heat transfer between the CPCI mainboard 6 and the heat-radiating guide plate 2 is more sufficient, the heat-radiating back plate 1 is covered above the heat-radiating guide plate 2, the movable support 5 is installed on the same side surface of the heat-radiating guide plate 2 and the heat-radiating back plate 1, the separation movement of the heat-radiating guide plate 2 and the heat-radiating back plate 1 within a certain range can be realized through the hinging of the first movable arm and the second movable arm of the movable support 5, at the, no gap exists between the heat dissipation guide plate 2 and the heat dissipation back plate 1 after the fixing, and heat is better transferred.
When heat dissipation backplate 1 is close to heat dissipation baffle 2, middle heat conduction rubber plays the cushioning effect, protection heat dissipation backplate 1 and heat dissipation baffle 2 can not damage, when carrying out first joint structure and second joint structure joint, the gib head 15 of first joint structure can realize the joint with the fixed couple 16 of second joint structure, as shown in fig. 3, at this moment, installer holds pull ring 13 and makes heat dissipation backplate 1 and heat dissipation baffle 2 closely paste tightly, heat conduction rubber deformation this moment, miniature pressure sensor 7 monitors the tight degree of pasting wherein, if the pressure value reaches microprocessor predetermined pressure value, then buzzer 9 sound production, remind installer pressure value to reach the expectation, can fix, installer can use the nut to pass slotted hole 14 and screw hole realization fixed connection this moment.
When the heat dissipation guide plate 2 is detached from the heat dissipation back plate 1, the hook head 15 and the fixing hook 16 are detached by loosening the nut.
As shown in fig. 6: the pressure sensor 7 in this embodiment is a micro pressure sensor 7 of PLD204D-6.5 type, and the pressure sensor 7 includes a contact section with a height of 6mm, a width of 6.5mm, and a height of 0.8 mm.
To sum up, the utility model discloses utilize the heat dissipation baffle 2 of disconnect-type and heat dissipation backplate 1 to carry out the heat dissipation of CPCICPCI mainboard 6, accomplished and to have artificially monitored metal guide block 10 for the position relation of working chip 11, the heat dissipation degree of filling of working chip 11 among the CPCICPCI mainboard 6 has been improved, and utilize the heat dissipation baffle 2 and the heat dissipation backplate 1 of the fixed disconnect-type of removable fixed knot structure, realize the inseparable degree of artificial regulation heat dissipation baffle 2 and heat dissipation backplate 1, wherein, utilize the inseparable degree of pressure measurement unit measurement heat dissipation baffle 2 and heat dissipation backplate 1, when the inseparable degree reaches the default of pressure measurement unit, carry out bee calling organ 9 sound production, remind installer heat dissipation baffle 2 and heat dissipation backplate 1's inseparable degree to have reached expectation.
In addition, the heat conducting rubber layer 8 between the heat dissipation guide plate 2 and the heat dissipation back plate 1 enables the heat dissipation back plate 1 to play a role in buffering the heat dissipation back plate 1 when approaching the heat dissipation guide plate 2.
Finally, although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the present invention can be modified or replaced by other means without departing from the spirit and scope of the present invention, which should be construed as limited only by the appended claims.
Claims (7)
1. A CPCI mainboard radiator is characterized by comprising a metal guide block (10), a radiating guide plate (2), a radiating back plate (1), a detachable fixed structure, a movable support (5) and a pressure sensor (7);
the metal guide block (10) is arranged on the heat dissipation guide plate (2), and the heat dissipation back plate (1) is arranged on the surface of the heat dissipation guide plate (2) opposite to the metal guide block (10); the metal guide block (10) is used for connecting a heat dissipation device of the mainboard;
the end parts of the heat dissipation back plate (1) and the heat dissipation guide plate (2) are connected through a detachable fixing structure; the heat dissipation back plate (1) is connected with the heat dissipation guide plate (2) through a movable support (5); the pressure sensor (7) is arranged between the heat dissipation back plate (1) and the heat dissipation guide plate (2) and is used for detecting and generating a connection pressure signal between the heat dissipation back plate (1) and the heat dissipation guide plate (2); the pressure sensor (7) is also connected with an alarm unit, and the alarm unit sends out a prompt signal after receiving the pressure signal.
2. A CPCI motherboard heat sink according to claim 1, characterised in that said mobile bracket (5) comprises a first mobile arm and a second mobile arm, one end of said first mobile arm being hinged to said heat sink guide (2), the other end of said first mobile arm being hinged to one end of said second mobile arm; the other end of the second movable arm is hinged on the heat dissipation back plate (1).
3. A CPCI motherboard heat sink as claimed in claim 1, wherein the detachable fixing structure comprises a first clamping structure and a second clamping structure, the first clamping structure is connected to the heat dissipation guide plate (2), and the heat dissipation back plate (1) opposite to the first clamping structure is movably connected to the second clamping structure; the second clamping structure and the first clamping structure are clamped with each other and used for fixing the heat dissipation back plate (1) and the heat dissipation guide plate (2).
4. A CPCI main board radiator according to claim 3, wherein the first clamping structure comprises a hook head (15), a fixed block (12), a slot hole (14), a threaded hole and a pull ring (13), the hook head (15) is arranged on one surface of the fixed block (12), and the pull ring (13) is arranged on the surface of the fixed block (12) opposite to the hook head (15); the middle of the fixing block (12) is provided with the slotted hole (14), the threaded hole is formed in the heat dissipation guide plate (2), and the slotted hole (14) and the threaded hole are penetrated through a nut to realize fixed connection.
5. A CPCI motherboard heat sink as claimed in claim 4, wherein said second snap-fit structure is a fixing hook (16), and said fixing hook (16) is fixed on said heat sink back plate (1).
6. A CPCI motherboard heat sink as claimed in claim 1, further comprising a heat conducting rubber layer (8), wherein said heat conducting rubber layer (8) is disposed on the surface of said heat dissipating backplate (1) contacting said heat dissipating guide plate (2).
7. A CPCI motherboard heat sink as claimed in claim 6, wherein the thickness of the heat conducting rubber layer (8) is larger than the distance from the contact point of the pressure sensor (7) to the heat dissipation backboard (1) by 1-3 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922487895.7U CN210804306U (en) | 2019-12-31 | 2019-12-31 | CPCI mainboard radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922487895.7U CN210804306U (en) | 2019-12-31 | 2019-12-31 | CPCI mainboard radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210804306U true CN210804306U (en) | 2020-06-19 |
Family
ID=71226865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922487895.7U Expired - Fee Related CN210804306U (en) | 2019-12-31 | 2019-12-31 | CPCI mainboard radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210804306U (en) |
-
2019
- 2019-12-31 CN CN201922487895.7U patent/CN210804306U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200619 |