CN219163384U - Novel integrated circuit chip - Google Patents

Abstract

The utility model discloses a novel integrated circuit chip, which comprises a circuit chip body, a protection device is interspersed and movably connected to the lower part of the outer surface of the circuit chip body, an upper cover is movably connected to the upper end of the circuit chip body, and the upper end of the upper cover is fixed. Several cooling fins are connected; the protective device includes No. 1 support frame and No. 2 support frame, both of which are "L"-shaped structures, and the lower end of the No. Two No. 1 grooves. There are two No. 2 grooves at the lower end of the No. 1 support frame. The right end of the No. 2 support frame is fixedly connected with a No. 1 connecting plate, and the front end of the No. 2 support frame is fixedly connected with a No. 4 connection plate. No. 3 connecting plate is fixedly connected to the left end of the No. 1 supporting frame, and No. 2 connecting plate is fixedly connected to the rear end of the No. 1 supporting frame. The novel integrated circuit chip described in the utility model has high installation efficiency, good heat dissipation effect and high stability, and is suitable for the use of the circuit chip.

Description

A new type of integrated circuit chip

technical field

The utility model relates to the technical field of integrated circuit chips, in particular to a novel integrated circuit chip.

Background technique

The integrated circuit chip is an electronic component including a silicon substrate, at least one circuit, a fixed sealing ring, a grounding ring and at least one guard ring. The circuit is formed on the silicon substrate, and the circuit has at least one output/input pad. A fixed sealing ring is formed on the silicon substrate and surrounds the circuit and the I/O pads. A ground ring is formed between the silicon substrate and the output/input pads, and is electrically connected to the fixed seal ring. The protective ring is set on the silicon substrate and surrounds the output/input pads to be electrically connected to the fixed sealing ring. There are at least the following disadvantages in the use of the existing integrated circuit chips: 1. The existing integrated circuit chips are often smeared Paste the heat sink on the chip after the silicone grease for heat dissipation, but after the silicone grease is squeezed by the heat sink and the chip, it is easy to overflow through the gap and flow to the pins or the substrate, and it is not easy to clean; 2. Now After the installation of some integrated circuit chips, the pins lack protection. After being bumped by external force, the pins are prone to deformation and breakage, which affects the service life. Therefore, we have introduced a new type of integrated circuit chip.

Utility model content

The main purpose of the utility model is to provide a new integrated circuit chip, which can effectively solve the problems in the background technology.

In order to achieve the above object, the technical scheme that the utility model takes is:

A new type of integrated circuit chip, comprising a circuit chip body, the lower part of the outer surface of the circuit chip body is movably connected with a protective device, the upper end of the circuit chip body is movably connected with an upper cover, and the upper end of the upper cover is fixedly connected with several heat sinks. piece;

The protective device includes a No. 1 support frame and a No. 2 support frame. The No. 2 support frame and the No. 1 support frame are both "L"-shaped structures. There are two No. 1 grooves at the lower end of the No. 2 support frame. The lower end of the No. 1 support frame has two No. 2 grooves, the right end of the No. 2 support frame is fixedly connected with a No. 1 connecting plate, and the front end of the No. 2 support frame is fixedly connected with a No. 4 connecting plate. The No. 3 connecting plate is fixedly connected to the left end of the frame, and the No. 2 connecting plate is fixedly connected to the rear end of the No. 1 support frame. The end of the No. 2 connecting plate close to the No. 1 connecting plate and the end of the No. 4 connecting plate close to the No. 3 connecting plate Both are fixedly connected with a connecting screw, and the end of the No. 1 connecting plate close to the No. 2 connecting plate and the end of the No. 3 connecting plate close to the connecting screw are both provided with connecting circular holes.

Preferably, the No. 1 supporting frame and the No. 2 supporting frame are movably connected to the outer surface of the circuit chip body, and the two connecting screws are respectively inserted and movably connected to two connecting circular holes.

Preferably, three through-slots are opened on the upper ends of the several heat sinks, and the several through-slots are equidistantly distributed.

Preferably, a card slot is formed at the lower end of the upper cover, and a cavity is opened outside the upper wall of the card slot.

Preferably, the upper and lower walls of the card slot are in contact with the upper end of the circuit chip body.

Compared with the prior art, the utility model has the following beneficial effects:

1. In the utility model, the circuit chip body is wrapped by the No. 1 support frame and the No. 2 support frame, and then the two connecting screws and the two connection round holes are interspersed and connected together and fixed by nuts, so that the No. 1 support frame The No. 1 support frame and the No. 2 support frame are fixed on the outer surface of the circuit chip body, so that the pins on the circuit chip body can be protected by the No. 1 support frame and the No. 2 support frame to avoid deformation and damage caused by bumping;

2. In the utility model, by opening a card slot on the upper cover, the upper cover can be directly covered on the circuit chip body, which is convenient for installation. By opening a cavity in the upper cover, the overflowing silicone grease can enter the cavity , to avoid overflow.

Description of drawings

Fig. 1 is the overall structure schematic diagram of a kind of novel integrated circuit chip of the utility model;

Fig. 2 is a schematic diagram of the overall structure of a protection device for a novel integrated circuit chip of the present invention;

3 is a schematic diagram of the overall structure of a heat sink of a novel integrated circuit chip of the present invention;

Fig. 4 is a schematic diagram of the overall structure of the upper cover of a new integrated circuit chip of the present invention.

In the figure: 1. Circuit chip body; 2. Protective device; 3. Upper cover; 4. Heat sink; 21. No. 1 support frame; 22. No. 2 support frame; 23. No. 1 groove; 24. No. 1 connection Plate; 25, No. 2 connecting plate; 26, No. 2 groove; 27, connecting round hole; 28, No. 3 connecting plate; 29, No. 4 connecting plate; 210, connecting screw; 31, cavity; 32, card slot ; 41, through slot.

Detailed ways

In order to make the technical means, creative features, goals and effects achieved by the utility model easy to understand, the utility model will be further elaborated below in conjunction with specific embodiments.

In the description of the present utility model, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "another end" The orientation or positional relationship indicated by ", etc. is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, so as to Specific orientation configurations and operations, therefore, should not be construed as limitations on the invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and should not be understood as indicating or implying relative importance.

In the description of the present utility model, it should be noted that, unless otherwise specified and limited, the terms "installed", "set with", "connected", etc. should be understood in a broad sense, such as "connected", which can be a fixed The connection can also be a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediary, and it can be the internal communication of two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present utility model in specific situations.

Example

Please refer to Figure 1-4, the utility model provides a technical solution:

A new type of integrated circuit chip, comprising a circuit chip body 1, a protective device 2 is interspersed and movably connected to the lower part of the outer surface of the circuit chip body 1, an upper cover 3 is movably connected to the upper end of the circuit chip body 1, and a plurality of heat dissipation devices are fixedly connected to the upper end of the upper cover 3 piece 4;

The protective device 2 includes a No. 1 support frame 21 and a No. 2 support frame 22. Both the No. 2 support frame 22 and the No. 1 support frame 21 have an "L" shape structure, and two No. 1 grooves 23 are opened on the lower end of the No. 2 support frame 22. , the lower end of No. 1 support frame 21 has two No. 2 grooves 26, the right end of No. 2 support frame 22 is fixedly connected with No. 1 connecting plate 24, the front end of No. 2 support frame 22 is fixedly connected with No. No. 2 connecting plate 28 is fixedly connected to the left end of 21, No. 2 connecting plate 25 is fixedly connected to No. 1 support frame 21 rear end, No. 2 connecting plate 25 is close to one end of No. 1 connecting plate 24 and No. 4 connecting plate 29 is close to No. 3 connecting plate One end of 28 is all fixedly connected with connecting screw rod 210, and one end of No. 1 connecting plate 24 close to No. After the No. 2 support frame 22 is connected with the circuit chip body 1, it will limit and protect the pins on the circuit chip body 1 to avoid bumping.

In this embodiment, No. 1 support frame 21 and No. 2 support frame 22 are movably connected with the outer surface of the circuit chip body 1, and two connecting screws 210 are respectively interspersed and movably connected with two connecting round holes 27; several cooling fins 4 Three through grooves 41 are opened on the upper end, and several through grooves 41 are equidistantly distributed.

In this embodiment, a slot 32 is formed at the lower end of the upper cover 3 , and a cavity 31 is opened outside the upper wall of the slot 32 ;

It should be noted that the utility model is a new type of integrated circuit chip. During use, first, the No. 1 support frame 21 and the No. 2 support frame 22 are placed on the outer surface of the circuit chip body 1, and the The pins are clamped together with the No. 1 groove 23 and the No. 2 groove 26, and then the connecting screw rod 210 on the No. 4 connecting plate 29 and the No. 2 connecting plate 25 passes through the two connecting round holes 27, and then through the nuts. Fix, limit the No. 1 support frame 21 and the No. 2 support frame 22, so that the No. 1 support frame 21 and the No. 2 support frame 22 clamp the circuit chip body 1, and protect the pins on the circuit chip body 1 , to avoid deformation of the pins due to extrusion. When the upper cover 3 and the heat sink 4 need to be installed, apply silicon grease on the upper end of the circuit chip body 1, and place the upper cover 3 on the circuit chip body 1, so that the upper cover 3 Squeeze and fit the silicone grease. As the pressing continues, the overflowing silicone grease will enter the cavity 31, so that the cavity 31 can accommodate the silicone grease, thereby preventing the silicone grease from contacting the pins and the substrate. The circuit chip has high installation efficiency, good heat dissipation effect and high stability, and is suitable for the use of the circuit chip.

The basic principles and main features of the present utility model and the advantages of the present utility model have been shown and described above. Those skilled in the industry should understand that the utility model is not limited by the above-mentioned embodiments. The above-mentioned embodiments and descriptions only illustrate the principles of the utility model. Without departing from the spirit and scope of the utility model, the utility model The new model also has various changes and improvements, and these changes and improvements all fall within the scope of the claimed utility model. The scope of protection required by the utility model is defined by the appended claims and their equivalents.

Claims (5)

1. A novel integrated circuit chip, comprising a circuit chip body (1), characterized in that: the lower part of the outer surface of the circuit chip body (1) is movably connected with a protective device (2), and the circuit chip body (1) The upper end is movably connected with an upper cover (3), and the upper end of the upper cover (3) is fixedly connected with several cooling fins (4); The protective device (2) comprises a No. 1 support frame (21) and a No. 2 support frame (22), and the No. 2 support frame (22) and the No. 1 support frame (21) are both "L" shaped structures, so The No. 2 support frame (22) lower end has two No. 1 grooves (23), the No. 1 support frame (21) lower end has two No. 2 grooves (26), and the No. 2 support frame ( 22) The right end is fixedly connected with No. 1 connecting plate (24), the front end of the No. 2 support frame (22) is fixedly connected with No. 4 connecting plate (29), and the left end of the No. 1 support frame (21) is fixedly connected with No. 3 connecting plate (28), the No. 1 support frame (21) rear end is fixedly connected with the No. 2 connecting plate (25), and the No. 2 connecting plate (25) is close to an end of the No. 1 connecting plate (24) and the No. 4 connecting plate (29) One end close to the No. 3 connecting plate (28) is fixedly connected with a connecting screw (210), and the No. 1 connecting plate (24) is close to the end of the No. 2 connecting plate (25) and the No. 3 connecting plate (28) One end close to the connecting screw rod (210) is provided with a connecting circular hole (27). 2. A novel integrated circuit chip according to claim 1, characterized in that: said No. 1 support frame (21) and No. 2 support frame (22) are movably connected with the outer surface of the circuit chip body (1) , the two connecting screws (210) are respectively inserted and movably connected with the two connecting round holes (27). 3. A novel integrated circuit chip according to claim 1, characterized in that: several said heat sinks (4) are provided with three through-slots (41) on the upper ends, and several said through-slots (41) etc. distance distribution. 4. A new type of integrated circuit chip according to claim 1, characterized in that: the lower end of the upper cover (3) is provided with a card slot (32), and the outside of the upper wall of the card slot (32) is provided with an empty space. Cavity (31). 5. A new integrated circuit chip according to claim 4, characterized in that: the upper and lower walls of the card slot (32) are in contact with the upper end of the circuit chip body (1).

Images