CN219437244U - Double-layer circuit board - Google Patents

Abstract

The utility model relates to the technical field of circuit boards, in particular to a double-layer circuit board which comprises a main board and an auxiliary board, wherein an auxiliary board power supply socket arranged on one surface of the main board is connected with one surface of the auxiliary board in an up-down staggered manner, low components are arranged on one surface of the main board and one surface of the auxiliary board opposite to the main board, fixed components are arranged on the other surface of the main board, and detachable and replaceable components are arranged on the other surface of the auxiliary board. According to the embodiment of the utility model, the length and the width of the whole circuit board can be reduced through the combination of the main board and the auxiliary board, the design of the shell is facilitated through the special arrangement mode of the components on the main board, the space of the board is saved, and the user can flexibly change the external configuration through the arrangement of the components on the auxiliary board.

Description

Double-layer circuit board

Technical Field

The utility model relates to the technical field of circuit boards, in particular to a double-layer circuit board with an up-down staggered arrangement structure.

Background

The double-layer circuit boards are applied to miniature electronic products with extremely high space requirements, the common double-layer circuit boards are two main boards, the two main boards are directly combined for use, components on the upper and lower double-layer circuit boards are not staggered in height, so that the upper and lower double-layer circuit boards cannot be mutually and highly cooperated, the space for installing the circuit boards is wasted, and the use of users is inconvenient.

Disclosure of Invention

The utility model aims to provide a double-layer circuit board, which is capable of reasonably utilizing the heights of components on the main board and the auxiliary board to perform high-low staggered layers and saving space.

In order to achieve the above purpose, the present utility model provides the following technical solutions:

the utility model provides a double-deck circuit board, includes mainboard and subplate, the mainboard is through the subplate power supply socket that is equipped with on its one side and the one side of subplate stagger from top to bottom and place to be connected, all places low components and parts on the one side of this mainboard and the one side of the opposite mainboard of subplate, places fixed components and parts on the another side of this mainboard, place detachable replacement's components and parts on the another side of subplate.

Preferably, a CPU is arranged at the center of one surface of the main board;

the left side of the CPU is provided with a network port, a USB3.0 interface, a Type-C interface and a power management module;

a MICRO HDMI interface, a USB2.0 interface and a USB3.0 interface are arranged on the upper side of the CPU;

and a WiFi chip and memory particles are placed on the lower side of the CPU.

Preferably, the network port comprises a first network port, a second network port and a third network port;

the connecting ports of the first network port, the second network port and the third network port are arranged back to the CPU, and are sequentially and tightly arranged and connected to the edge of the main board;

the connection port of the USB3.0 interface is consistent with the network port in orientation, and is connected to the edge of the main board near the third network port;

the connection port of the Type-C interface is consistent with the network port in orientation, and is connected to the edge of the main board close to the USB3.0 interface;

the power management module is connected to the edge of the main board near the rear end of the Type-C interface.

Preferably, the connection port of the MICRO HDMI interface is arranged back to the CPU, and is close to the edge of the main board, where the power management module is installed;

the connection port of the USB2.0 interface is oriented to be consistent with the MICRO HDMI interface, and is installed near the edge of the main board;

the connection port of the other USB3.0 interface is oriented to be consistent with the MICRO HDMI interface, and is installed at the edge of the main board near the USB2.0 interface.

Preferably, the WiFi chip is installed near the edge of the main board near the first network port;

and the four memory particles are sequentially arranged and placed close to the edge of the main board, where the WiFi chip is arranged.

Preferably, a network card chip module is arranged on the other surface of the main board at a position corresponding to the position between the CPU and the network port, wherein the network card chip module comprises a first network card chip, a second network card chip and a third network card chip which are arranged in a' figure;

a secondary board power supply socket is arranged on the other surface of the main board at a position corresponding to the position between the Type-C interface and the power supply management module;

a TF card slot is arranged on the other surface of the main board and corresponds to the position of the USB2.0 interface, and the opening of the TF card slot is consistent with the connection port of the USB2.0 interface in orientation;

a screen wire slot and a data wire slot are sequentially arranged close to the TF card slot, and the directions of connection ports of the screen wire slot and the data wire slot are consistent with the directions of USB3.0 interfaces;

a change-over switch, two fan power supply sockets, an eMMC chip and an RTC battery socket are sequentially arranged on the edge of the other surface of the main board, which is close to the right side of the CPU, corresponding to the data line slot;

the connection ports of the fan power supply socket and the RTC battery socket are opposite to the network port.

Preferably, a 5G module, a solid state disk, a WiFi module, a SIM card slot, a function indicator lamp and a built-in battery socket are arranged on one surface of the auxiliary board, and the other surface main board of the auxiliary board is connected with one surface on which the auxiliary board power supply socket is arranged;

the 5G module is arranged on the auxiliary board at a position corresponding to the screen wire slot on the main board;

the SIM card slot is positioned below the 5G module and is arranged on the auxiliary board;

the solid state disk is arranged on the auxiliary board close to the 5G module at a position corresponding to the data line slot on the main board;

the WiFi module corresponds to the position of the RTC battery socket on the main board, and is arranged at the included angle position close to the adjacent two sides of the auxiliary board;

the function indicator lamp is arranged at the edge of the auxiliary board corresponding to the position of the net opening on the main board;

the built-in battery socket is arranged at the edge of the auxiliary board corresponding to the position of the MICRO HDMI interface on the main board.

Preferably, the function indicator lamp comprises a battery function indicator lamp, a WiFi function indicator lamp, a 4G function indicator lamp and a 5G function indicator lamp;

the battery function indicator lamp, the WiFi function indicator lamp, the 4G function indicator lamp and the 5G function indicator lamp correspond to the positions of the first net opening, the second net opening and the third net opening on the main board, and are sequentially arranged and installed at the edge of the auxiliary board.

Preferably, the auxiliary plate is provided with a fixing frame, and the fixing frame is installed at a position adjacent to the 5G module and the WiFi module.

Preferably, the adjacent fixing frames on the auxiliary plate are provided with 5G module cooling fan sockets.

Compared with the prior art, the utility model has the beneficial effects that:

the length and the width of the whole circuit board can be reduced through the combination of the main board and the auxiliary board; the special arrangement mode of the components on the main board, which is high at the left and low at the right, facilitates the design of the shell and saves the space of the board surface; through the arrangement of components and parts on the auxiliary board, the user can flexibly change the external configuration.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Wherein:

FIG. 1 is a schematic perspective view of a dual-layer circuit board according to an embodiment;

fig. 2 is a schematic diagram of a structure of a double-layer circuit board with a main board and a sub-board separated from each other in the embodiment;

FIG. 3 is a schematic top view of a dual-layer circuit board according to an embodiment;

FIG. 4 is a schematic bottom view of a dual-layer circuit board according to an embodiment;

FIG. 5 is a schematic diagram of a front view of a dual-layer circuit board according to an embodiment;

FIG. 6 is a schematic diagram of a rear view of a dual-layer circuit board according to an embodiment;

FIG. 7 is a schematic diagram of a left-hand structure of a dual-layer circuit board according to an embodiment;

FIG. 8 is a right side view of a dual-layer circuit board according to an embodiment;

fig. 9 is a schematic diagram of a system frame of a dual-layer circuit board according to an embodiment.

In the figure:

10. a main board; 101. a net opening; 1011. a first portal; 1012. a second portal; 1013. a third portal; 102. a network card chip module; 1021. a first network card chip; 1022. a second network card chip; 1023. a third network card chip; 103. a USB3.0 interface; 104. Type-C interface; 105. a USB2.0 interface; 106. a MICRO HDMI interface; 107. a power management module; 108. a fan power supply socket; 109. a change-over switch; 110. a data line slot; 111. a screen wire slot; 112. a TF card slot; 113. a secondary board power supply socket; 114. an eMMC chip; 115. RTC battery socket; 116. a WiFi chip; 117. memory particles; 118. and a CPU.

20. A sub-plate; 21. a 5G module; 22. a solid state disk; 23. a WiFi module; 24. a fixing frame; 25. 5G module radiator fan socket; 26. a SIM card slot; 261. a SIM card; 27. a function indicator light; 271. a battery function indicator light; 272. WiFi function indicator light; 273. 4G function indicator light; 274. 5G function indicator lights; 28. a battery socket is arranged in the battery box.

Detailed Description

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used in the description of the applications herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having" and any variations thereof in the description and claims of the present application and in the description of the figures above are intended to cover non-exclusive inclusions.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the present application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.

In order to better understand the technical solutions of the present application, the following description will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings.

As shown in fig. 1-9, embodiments provided for by the present utility model.

The embodiment of the utility model provides a double-layer circuit board, which comprises a main board 10 and an auxiliary board 20, wherein the main board 10 is connected with one surface of the auxiliary board 20 in a vertically staggered manner through an auxiliary board power supply socket 113 arranged on one surface of the main board 10, low components are arranged on one surface of the main board 10 and one surface of the auxiliary board 20 opposite to the main board 10, fixed components are arranged on the other surface of the main board 10, and detachable and replaceable components are arranged on the other surface of the auxiliary board 20.

In this embodiment, referring to fig. 1 and 2, the auxiliary board 20 and the main board 10 are arranged in a vertically staggered and opposite manner, one side of the panel of the main board 10 is provided with an auxiliary board power supply socket 113, and the main board 10 is detachably connected with one side of the auxiliary board 20 opposite to the panel of the main board 10 through the auxiliary board power supply socket 113. Thus, the main board 10 and the auxiliary board 20 are combined to form a double-layer circuit board, which is more compact in size than a monolithic circuit board design, and is convenient for some products with high space utilization requirements. Components with lower heights are placed on one surface of the panel of the main board 10 and one surface of the auxiliary board 20 opposite to the panel of the main board 10, and fixed components, i.e. components which do not need to be disassembled, such as chips, interfaces and the like, are placed on the other surface of the panel of the main board 10; the other side of the panel of the auxiliary board 20 is provided with detachable components, namely components commonly used for replacement, such as components of a 5G module 21, a solid state disk 22 and the like; so two panels of mainboard 10 and subplate 20 stagger and arrange, cooperate each other, further improve space utilization, core components and the components that need not change are placed on mainboard 10, and is relative, places the components that the user can change by oneself, like solid state disk 22, wiFi module 23 on subplate 20, makes things convenient for the replacement in the daily.

In one embodiment, the CPU118 is centrally located on one side of the motherboard 10.

The left side of the CPU118 houses the Internet port 101, USB3.0 interface 103, type-C interface 104 and power management module 107.

The upper side of the CPU118 places the MICRO HDMI interface 106, the USB2.0 interface 105, and the USB3.0 interface 103.

The underside of CPU118 houses WiFi chip 116 and memory granule 117.

In the present embodiment, referring to fig. 4, a CPU118 is placed in a central position under the panel of the main board 10, and other components are placed around the CPU118. The network port 101, the USB3.0 interface 103, the Type-C interface 104 and the power management module 107 are arranged on the left side of the CPU118, the MICRO HDMI interface 106, the USB2.0 interface 105 and the USB3.0 interface 103 are arranged on the upper side of the CPU118, and the WiFi chip 116 and the memory particles 117 are arranged on the lower side of the CPU 118; therefore, the arrangement of the components from left to right is arranged in a trend of high left and low right, and the circuit board is convenient to be arranged in a combined connection or placed shell design, so that the design is easier because the components have the arrangement characteristics of high left and low right, the space utilization rate is optimized by fully utilizing different heights of the components, and the attractiveness is improved.

In one embodiment, portal 101 includes a first portal 1011, a second portal 1012, and a third portal 1013.

The connection ports of the first port 1011, the second port 1012 and the third port 1013 are all disposed opposite to the CPU118, and the three ports are sequentially and closely arranged and connected to the edge of the motherboard 10.

The connection port of one USB3.0 interface 103 is oriented in line with the port 101, and is disposed near the edge of the motherboard 10 near the third port 1013.

The connection port of the Type-C interface 104 is oriented in accordance with the network port 101, and is connected to the edge of the motherboard 10 near the USB3.0 interface 103.

The power management module 107 is disposed near the rear end of the Type-C interface 104 and is connected to the edge of the motherboard 10.

In the present embodiment, referring to fig. 4 and fig. 7, in order to increase the network functionality of the circuit board, the network port 101 is provided with three network connection ports of the first network port 1011, the second network port 1012 and the third network port 1013, and of course, four, five or more ports may be provided according to actual situations. The connection ports of the first network port 1011, the second network port 1012 and the third network port 1013 are all arranged back to the CPU118, face to the outer side of the circuit board, so that external connection is convenient, and in order to save space, the first network port 1011, the second network port 1012 and the third network port 1013 are sequentially and tightly arranged, the ports of the first network port 1011, the second network port 1012 and the third network port 1013 slightly protrude out of the edge of the panel of the main board 10, so that the thickness adaptation of the design shell is convenient; a USB3.0 interface 103 is arranged close to the third network port 1013, the port of the USB3.0 interface 103 faces the outer side of the circuit board, and the port of the USB3.0 interface 103 protrudes slightly beyond the edge of the panel of the main board 10, so that the shell is convenient to adapt; adjacent, the Type-C interface 104 is arranged close to the USB3.0 interface 103, and the interface faces the outer side of the circuit board and slightly protrudes the edge of the panel of the motherboard 10, so as to be convenient for adapting to the housing; the power management module 107 is close to the Type-C interface 104, and adjacent USB3.0 interfaces 103 are arranged at the edge of the panel, so that the Type-C interface 104 and the power management module 107 are just similar to the USB3.0 interfaces 103 in length, and the space of the panel is saved.

In one embodiment, the connection port of the MICRO HDMI interface 106 is disposed away from the CPU118, near the edge of the motherboard 10 where the power management module 107 is mounted.

The connection port of the USB2.0 interface 105 is oriented in conformity with the MICRO HDMI interface 106, and is mounted near the edge of the motherboard 10 near the MICRO HDMI interface 106.

The connection port of the other USB3.0 interface 103 is oriented in line with the MICRO HDMI interface 106, mounted near the edge of the motherboard 10 near the USB2.0 interface 105.

In this embodiment, referring to fig. 2 and fig. 4, the connection port of the micro HDMI interface 106 faces the outside of the circuit board, and is installed near the edge of the motherboard 10 by the power management module 107, and the port of the micro HDMI interface slightly protrudes from the edge of the panel of the motherboard 10, so as to facilitate the adaptation of the housing; the connection port of the USB2.0 interface 105 faces the outer side of the circuit board, is close to the MICRO HDMI interface 106 and is arranged at the edge of the main board 10, and the port of the connection port slightly protrudes out of the edge of the panel of the main board 10, so that the connection port is convenient to adapt to the shell; in order to increase the demand of the user on the USB3.0, the connection port of the other USB3.0 interface 103 faces the outside of the circuit board, and is installed near the edge of the motherboard 10 near the USB2.0 interface 105, and the port of the port slightly protrudes out of the edge of the panel of the motherboard 10, so as to be convenient for adapting to the housing.

In one embodiment, the WiFi chip 116 is mounted on an edge of the motherboard 10 near the first portal 1011.

Four memory particles 117 are placed in sequence, mounted near the edge of the motherboard 10 near the WiFi chip 116.

In this embodiment, referring to fig. 4, a WiFi chip 116 is disposed near the first port 1011 at the edge of the motherboard 10, and the height of the WiFi chip is far lower than the first port 1011, which is beneficial to arrangement and space saving; four memory particles 117 are arranged on the adjacent WiFi chips 116 and are sequentially arranged at the edge of the main board 10; the WiFi chip 116 and the memory particles 117 are not required to be externally connected and are slightly away from the edge of the panel, so that the shell is prevented from being knocked.

In one embodiment, the network card chip module 102 is disposed on the other surface of the motherboard 10 at a position corresponding to a position between the CPU118 and the network port 101, where the network card chip module 102 includes a first network card chip 1021, a second network card chip 1022, and a third network card chip 1023, and the three are arranged in a "pin" shape.

A secondary board power supply socket 113 is disposed on the other surface of the main board 10 corresponding to a position between the Type-C interface 104 and the power management module 107.

The TF card slot 112 is disposed on the other surface of the main board 10 at a position corresponding to the USB2.0 interface 105, and the opening of the TF card slot is oriented in accordance with the connection port of the USB2.0 interface 105.

A screen slot 111 and a data slot 110 are sequentially disposed near the TF card slot 112, and the connection ports of the screen slot 111 and the data slot 110 are oriented to be consistent with the USB3.0 interface 103.

On the other side edge of the motherboard 10 near the right side of the data line slot 110 corresponding to the CPU118, a change-over switch 109, two fan power supply sockets 108, an eMMC chip 114, and an RTC battery socket 115 are placed in sequence.

The connection ports of both the fan power supply socket 108 and the RTC battery socket 115 are oriented opposite the network port 101.

In this embodiment, referring to fig. 2, fig. 5 and fig. 6, a network card chip module 102 is disposed on the other surface of the motherboard 10 at a position corresponding to the position between the CPU118 and the network port 101, and in order to match the first network port 1011, the second network port 1012 and the third network port 1013, the network card chip module 102 is provided with three chips of a first network card chip 1021, a second network card chip 1022 and a third network card chip 1023, and is arranged on the motherboard 10 in a "product" shape; corresponding to the position between the Type-C interface 104 and the power management module 107, a secondary board power supply socket 113 is disposed on the other surface of the main board 10, and is used for connecting with the secondary board 20; corresponding to the position of the USB2.0 interface 105, a TF card slot 112 is arranged on the other surface of the main board 10, and the opening of the TF card slot faces the outer side of the circuit board, so that a user can conveniently insert the TF card; next to the TF card slot 112, a screen slot 111 and a data slot 110 are sequentially disposed on the other surface of the motherboard 10, and connection ports of the screen slot 111 and the data slot 110 face the outer side of the circuit board, so that related devices can be conveniently connected externally; on the other side of the main board 10 corresponding to the right side of the CPU118, the adjacent data line slots 110 are sequentially provided with a switch 109, two fan power supply sockets 108, an eMMC chip 114 and an RTC battery socket 115, where the switch 109 is a switch for powering on automatic power-on and button power-on, and connection ports of the fan power supply sockets 108 and the RTC battery socket 115 face the outer side of the circuit board, so that external connection is facilitated.

In one embodiment, the 5G module 21, the solid state disk 22, the WiFi module 23, the SIM card slot 26, the function indicator light 27 and the built-in battery socket 28 are disposed on one surface of the auxiliary board 20, and the other surface main board 10 of the auxiliary board 20 is connected to the surface on which the auxiliary board power supply socket 113 is disposed.

The 5G module 21 is mounted on the sub-board 20 corresponding to the position of the screen slot 111 on the main board 10.

The SIM card slot 26 is located below the 5G module 21 and is mounted on the sub-board 20.

The solid state disk 22 is installed on the auxiliary board 20 near the 5G module 21 corresponding to the position of the data line slot 110 on the main board 10.

The WiFi module 23 corresponds to the RTC battery socket 115 on the main board 10, and is installed near the solid state disk 22 at an included angle between two adjacent sides of the auxiliary board 20.

The function indicator lamp 27 is arranged at the edge of the auxiliary board 20 corresponding to the position of the net opening 101 on the main board 10.

The built-in battery receptacle 28 is mounted at the edge of the sub-board 20 corresponding to the position of the MICRO HDMI interface 106 on the main board 10.

In this embodiment, referring to fig. 2 and fig. 3, a 5G module 21, a solid state disk 22, a WiFi module 23, a SIM card slot 26, a function indicator lamp 27 and a built-in battery socket 28 are disposed on the panel of the auxiliary board 20, and the lower surface of the auxiliary board 20 is connected with one surface of the main board 10 where the auxiliary board power supply socket 113 is disposed, so that only larger and replaceable components are disposed on the panel of the auxiliary board 20, only pins of the components above are disposed on the lower surface of the panel of the auxiliary board 20, and only the upper surface of the panel connected with the main board 10 is disposed below, thereby optimizing space utilization and saving space for arranging the components; a 5G module 21 is mounted on the sub board 20 corresponding to the position of the screen slot 111 on the main board 10; the flatter SIM card slot 26 can be just arranged below the 5G module 21 and is arranged on the auxiliary board 20, the setting position of the data line slot 110 on the corresponding main board 10 is close to the 5G module 21, the solid state disk 22 is arranged on the auxiliary board 20, the setting position of the RTC battery socket 115 on the corresponding main board 10 is close to the solid state disk 22, the WiFi module 23 is arranged on two adjacent sides of the right upper corner of the auxiliary board 20, and therefore, the 5G module 21, the solid state disk 22, the WiFi module 23 and the SIM card slot 26 are closely arranged on the right side of the upper surface of the panel of the auxiliary board 20, and the space is greatly saved and the space utilization rate is improved by utilizing the size specification of components; the function indicator lamp 27 is arranged at the edge of the auxiliary board 20 corresponding to the setting position of the internet access 101 on the main board 10, so that the design and display of the shell are facilitated; corresponding to the setting position of the MICRO HDMI interface 106 on the main board 10, a built-in battery socket 28 is installed at the edge of the sub-board 20, facilitating the placement of batteries between the function indicator lamp 27 and the 5G module 21.

In one embodiment, the function indicator lights 27 include a battery function indicator light 271, a WiFi function indicator light 272, a 4G function indicator light 273, and a 5G function indicator light 274.

The battery function indicator lamp 271, the WiFi function indicator lamp 272, the 4G function indicator lamp 273 and the 5G function indicator lamp 274 are sequentially arranged and mounted at the edge of the sub-board 20 corresponding to the positions of the first net opening 1011, the second net opening 1012 and the third net opening 1013 on the main board 10.

In this embodiment, referring to fig. 3 and 7, the battery function indicator lamp 271, the WiFi function indicator lamp 272, the 4G function indicator lamp 273 and the 5G function indicator lamp 274 are disposed at the positions of the function indicator lamp 27, and the four indicator lamps corresponding to functions of different components are sequentially arranged, and the arrangement sequence thereof corresponds to the arrangement position sequence of the first network port 1011, the second network port 1012 and the third network port 1013 on the main board 10, so that the user can conveniently determine the functional status of the corresponding components.

In one embodiment, the sub-panel 20 is provided with a mounting bracket 24 mounted adjacent to the 5G module 21 and the WiFi module 23.

In the present embodiment, referring to fig. 3 and 6, a fixing frame 24 is provided on the sub-board 20 at a position adjacent to the 5G module 21 and the WiFi module 23, for fixing the 5G module 21 and the SIM card slot 26.

In one embodiment, a 5G module radiator fan receptacle 25 is mounted on the sub-board 20 adjacent to the mount 24.

In the present embodiment, the sub-board 20 adjacent to the fixing frame 24 is provided with a 5G module heat dissipation fan socket 25 for connecting a fan for dissipating heat of the 5G module.

Referring to fig. 9, a system frame diagram of a dual-layer circuit board corresponds to the CPU118 invoking the connection of ports.

It is apparent that the embodiments described above are only some embodiments of the present application, but not all embodiments, the preferred embodiments of the present application are given in the drawings, but not limiting the patent scope of the present application. This application may be embodied in many different forms, but rather, embodiments are provided in order to provide a more thorough understanding of the present disclosure. Although the present application has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing, or equivalents may be substituted for elements thereof. All equivalent structures made by the specification and the drawings of the application are directly or indirectly applied to other related technical fields, and are also within the protection scope of the application.

Claims (10)

1. The utility model provides a double-deck circuit board, includes mainboard and subplate, its characterized in that, the mainboard is through the subplate power supply socket that is equipped with on its one side and the one side of subplate stagger from top to bottom and place to be connected, all places low components and parts on the one side of this mainboard and the one side of the opposite mainboard of subplate, places fixed components and parts on the another side of this mainboard, place detachable replacement's components and parts on the another side of subplate.

2. The dual-layer circuit board as claimed in claim 1, wherein a CPU is disposed at a center on one side of the main board;

the left side of the CPU is provided with a network port, a USB3.0 interface, a Type-C interface and a power management module;

a MICRO HDMI interface, a USB2.0 interface and a USB3.0 interface are arranged on the upper side of the CPU;

and a WiFi chip and memory particles are placed on the lower side of the CPU.

3. The dual layer circuit board of claim 2, wherein the network ports include a first network port, a second network port, and a third network port;

the connecting ports of the first network port, the second network port and the third network port are arranged back to the CPU, and are sequentially and tightly arranged and connected to the edge of the main board;

the connection port of the USB3.0 interface is consistent with the network port in orientation, and is connected to the edge of the main board near the third network port;

the connection port of the Type-C interface is consistent with the network port in orientation, and is connected to the edge of the main board close to the USB3.0 interface;

the power management module is connected to the edge of the main board near the rear end of the Type-C interface.

4. The dual-layer circuit board of claim 2, wherein the connection port of the MICRO HDMI interface is disposed opposite to the CPU, and is mounted near the edge of the motherboard;

the connection port of the USB2.0 interface is oriented to be consistent with the MICRO HDMI interface, and is installed near the edge of the main board;

the connection port of the other USB3.0 interface is oriented to be consistent with the MICRO HDMI interface, and is installed at the edge of the main board near the USB2.0 interface.

5. The dual-layer circuit board of claim 2, wherein the WiFi chip is mounted on an edge of the motherboard near the first port;

and the four memory particles are sequentially arranged and placed close to the edge of the main board, where the WiFi chip is arranged.

6. The double-layer circuit board according to any one of claims 2 to 5, wherein a network card chip module is disposed on the other surface of the main board at a position corresponding to a position between the CPU and the network port, the network card chip module including a first network card chip, a second network card chip and a third network card chip, the three being arranged in a "delta" shape;

a secondary board power supply socket is arranged on the other surface of the main board at a position corresponding to the position between the Type-C interface and the power supply management module;

a TF card slot is arranged on the other surface of the main board and corresponds to the position of the USB2.0 interface, and the opening of the TF card slot is consistent with the connection port of the USB2.0 interface in orientation;

a screen wire slot and a data wire slot are sequentially arranged close to the TF card slot, and the directions of connection ports of the screen wire slot and the data wire slot are consistent with the directions of USB3.0 interfaces;

a change-over switch, two fan power supply sockets, an eMMC chip and an RTC battery socket are sequentially arranged on the edge of the other surface of the main board, which is close to the right side of the CPU, corresponding to the data line slot;

the connection ports of the fan power supply socket and the RTC battery socket are opposite to the network port.

7. The double-layer circuit board according to claim 6, wherein a 5G module, a solid state disk, a WiFi module, a SIM card slot, a function indicator light and a built-in battery socket are placed on one surface of the auxiliary board, and the other surface main board of the auxiliary board is connected with the surface on which the auxiliary board power supply socket is placed;

the 5G module is arranged on the auxiliary board at a position corresponding to the screen wire slot on the main board;

the SIM card slot is positioned below the 5G module and is arranged on the auxiliary board;

the solid state disk is arranged on the auxiliary board close to the 5G module at a position corresponding to the data line slot on the main board;

the WiFi module corresponds to the position of the RTC battery socket on the main board, and is arranged at the included angle position close to the adjacent two sides of the auxiliary board;

the function indicator lamp is arranged at the edge of the auxiliary board corresponding to the position of the net opening on the main board;

the built-in battery socket is arranged at the edge of the auxiliary board corresponding to the position of the MICRO HDMI interface on the main board.

8. The dual layer circuit board of claim 7, wherein the function indicator light comprises a battery function indicator light, a WiFi function indicator light, a 4G function indicator light, and a 5G function indicator light;

the battery function indicator lamp, the WiFi function indicator lamp, the 4G function indicator lamp and the 5G function indicator lamp correspond to the positions of the first net opening, the second net opening and the third net opening on the main board, and are sequentially arranged and installed at the edge of the auxiliary board.

9. The circuit board of claim 7, wherein the sub-board is provided with a mounting bracket mounted adjacent to the 5G module and the WiFi module.

10. The dual-layer circuit board of claim 9, wherein adjacent holders on said sub-board are provided with 5G module radiator fan receptacles.