CN2379876Y - Magnetic head made of stibium-indium series semiconductor magnet resistor - Google Patents
Magnetic head made of stibium-indium series semiconductor magnet resistor Download PDFInfo
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- CN2379876Y CN2379876Y CN 99236243 CN99236243U CN2379876Y CN 2379876 Y CN2379876 Y CN 2379876Y CN 99236243 CN99236243 CN 99236243 CN 99236243 U CN99236243 U CN 99236243U CN 2379876 Y CN2379876 Y CN 2379876Y
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- magnetic head
- antimony
- permanent magnet
- based semiconductor
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Abstract
The utility model relates to a magnetic head with a magnetic head of stibium-indium series semiconductor magnetic resistance films, which is formed by installing and connecting an outer housing, a magnetic resistance film, a base sheet, a sheet made of ferromagnetic material, a double-face copper clad plate, a cushion ring, a permanent magnet, an inward connecting wire, an outward leading wire and epoxy resin. The utility model has the connecting relationship that the magnetic resistance film is stuck on the base sheet to form a magnetic resistance element through vacuum thermal evaporation or sputtering deposition. The ferromagnetic sheet is respectively stuck to the base sheet and one face of the double-face copper clad plate, and the cushion ring is padded between the housing and the magnetic resistance film. The permanent magnet is connected with the copper clad plate, and one end of the outward leading wire is welded on the copper clad plate, and the other end penetrates out of the outer housing. The ferromagnetic sheet is clamped between the magnetic resistance film and the permanent magnet. The utility model has the advantages of simple manufacturing process, low cost and high sensitivity and is convenient for mass production, popularization and application.
Description
The utility model is a kind of antimony-indium based semiconductor magnetoresistive film magnetic head, and it is a kind of in the Magnetic Sensor, belongs to the electron device technology, particularly the sensor production technology.
Existing commercially available antimony-indium based semiconductor magnetic head is the indium antimonide magnetoresistive element with monocrystalline type, does not add the ferromagnetic material thin slice during assembling between magnetoresistive element and permanent magnet.When making the magnetic head of this use monocrystalline magnetoresistive element, owing to relate to grinding technics after the stickup, its complex technical process has influenced sensitivity.The result of complicate fabrication process has reduced yields and has strengthened cost, sensitivity reduces just makes the complicated cost that further strengthened again of follow-up signal processing circuit, and these all are unfavorable for producing in enormous quantities and being unfavorable for applying this Magnetic Sensor on a large scale.
The purpose of this utility model is exactly in order to overcome and when solving existing antimony-indium based semiconductor magnetic head and making manufacturing owing to structure problem, paste grinding technics process complexity and influence sensitivity, and yields is low, cost is high, unfavorable batch process and shortcoming and the problem applied etc., a kind of new structure of research and design work simplification, yields are improved, cost reduces, highly sensitive, antimony-indium based semiconductor magnetoresistive film magnetic head of being convenient to produce in batches and apply.
The utility model is realized by following technical proposals: the structural representation of antimony-indium based semiconductor magnetoresistive film magnetic head as shown in Figure 1.It is by casing of magnetic head 1, antimony-indium based semiconductor magnetoresistive film 2, substrate 3, ferromagnetic material thin slice 4, double-sided printed-circuit board 5, thin plastic washer 6, permanent magnet 7, connection wire 8, outer lead 9 connects and composes jointly, its mutual alignment and annexation are: antimony-conventional vacuum thermal evaporation of indium based semiconductor magnetoresistive film 2 usefulness or various sputter feasible method deposition stick to common formation magnetoresistive element on the substrate 3, ferromagnetic material thin slice 4 is that cementing agent is mutually bonding with substrate 3 by epoxy, the double-sided printed-circuit board 5 that makes things convenient for intraconnections 8 and outer lead 9 and magnetoresistive element to be electrically connected mutually is that cementing agent and ferromagnetic material thin slice 4 are mutually bonding by epoxy, can make the inside surface of antimony-indium based semiconductor magnetoresistive film 2 and casing of magnetic head 1 keep thin plastic washer 6 pads of a fixed range between shell 1 and semiconductor magnetoresistive film 2, when shell during with plastic injection-moulded making, shell 1 should with semiconductor magnetoresistive film 2 corresponding positions on carry out injection moulding after offering a window and embedding a wear-resistant metal sheet, permanent magnet 7 by epoxy be cementing agent with another surface of double-sided printed-circuit board 5 and be positioned at substrate 3 and ferromagnetic material thin slice 4 under locate mutually bonding, antimony-indium based semiconductor magnetoresistive film 2 is electrically connected by the copper-foil conducting electricity on internal lead 8 and the double-sided printed-circuit board 5, outer lead 9 one ends are welded in the Copper Foil of double-sided printed-circuit board lower surface, its other end stretches out outside the shell 1, the epoxy that is used for each parts in moistureproof and the fixed head shell is that resin 10 is cast in the casing of magnetic head 1, and key of the present utility model is that a ferromagnetic material thin slice 4 that can improve magnetic head sensitivity places between antimony-indium based semiconductor thin film magneto element and the permanent magnet 7.
The utility model is compared with the conventional semiconductor magnetic head has following advantage and beneficial effect: the antimony-indium based semiconductor magnetic resistance single-chip of (1) existing semiconducting-magnetic-head is to be that cementing agent is bonded to grind on glass-ceramic substrate or the ceramic substrate again and is thinned to about 30 microns with epoxy, so both time-consumingly take a lot of work and waste most of material, especially the final thickness of Yan Moing is difficult for grasping, yields is low, so cost is higher.And the utility model is antimony-indium that the magnetoresistance material deposition sticks on the substrate 3 with conventional vacuum thermal evaporation or various sputter feasible method, both material saving, time and labour saving and the advantage that has thickness to be easy to grasp, thereby improved work efficiency, and improved yields, reduced cost; (2) thickness of antimony in the magnetoresistive element-indium based material is thin more, its sensitivity is high more, with after pasting again the abrasive method final thickness only be as thin as about 30 microns, and can obtain 3 microns or thinner membraneous material with vacuum thermal evaporation or sputtering method, therefore the sensitivity of sensor is obviously improved; (3) the utility model has increased ferromagnetism thin slice 4, and when the outside surface of casing of magnetic head 1 had magnetic field to skim over, this ferromagnetism thin slice 4 had " boundling " effect, makes this part magnetic field gathering and passes magnetoresistive film 2, has also just improved the sensitivity of magnetic head significantly; (4) the utility model processing technology thereof is simple, cost is low, be convenient to produce in batches, be convenient to wide popularization and application.
Below Figure of description is further specified as follows: Fig. 1 is antimony-indium based semiconductor magnetoresistive film magnetic head, among the figure, 1 is casing of magnetic head, and 2 is antimony-indium based semiconductor magnetoresistive film, 3 is substrate, 4 is the ferromagnetic material thin slice, and 5 is double-sided printed-circuit board, and 6 are thin plastic washer, 7 is permanent magnet, 8 is connection wire, 9 is outer lead, the 10th, and the epoxy that has solidified after the cast is a resin.
Embodiment of the present utility model can be as follows: (1) by shown in Figure 1, process, make each parts.For example, casing of magnetic head 1 can be selected copper coin for use and adopt drawing process to make or make with plastics employing injection moulding process; Substrate 3 can adopt silicon chip or microcrystalline glass; Antimony-indium based semiconductor magnetoresistive film 2 can adopt the feasible method deposition of vacuum thermal evaporation or various sputters to adhere on the substrate 3 to constitute magnetoresistive element; Ferromagnetic material thin slice 4 can adopt wire cutting method processing cutting to form with silicon steel sheet or ferrite sheet; Printed circuit board (PCB) 5 can process with two-sided phenolic aldehyde copper clad plate; Permanent magnet 7 can select for use NdFeB material to adopt powder metallurgy process to process, and also can choose commercially available permanent magnet; (2) carry out bonding connection, install and be installed in the shell then by shown in Figure 1, and by the described interconnected relationship of top instructions, and to inject epoxy in the shell be resin, treat its dry solidification after, just implemented the utility model preferably.The inventor had once made a plurality of antimony-indium based semiconductor magnetoresistive film magnetic head by above-mentioned embodiment, and had carried out many comparative experiments, and the obviously visible the utility model of experimental result has its many advantages and good effect.Only lift two examples below and be enough to explanation.
Example one: be used in 0.3T magnetic field medium sensitivity R
B/ R
0The indium antimonide magnetoresistive film that is 3.5 times is made magnetoresistive element, makes the ferromagnetic material thin slice with silicon steel sheet, uses the Nd-Fe-B permanent magnet of magnetic field intensity as 0.32T, makes semiconducting-magnetic-head by the described embodiment of top instructions.With the method for testing of routine, recording its output voltage is 300mV.If the indium antimonide magnetoresistive film with identical sensitivity is made magnetoresistive element, to use the Nd-Fe-B permanent magnet of 0.32T equally, and cancelled the ferromagnetic material thin slice, the semiconducting-magnetic-head that is assembled into like this records its output voltage and only is 210mV.As seen, the semiconducting-magnetic-head of making owing to the ferromagnetic material thin slice that increases the making of use silicon steel sheet can make sensitivity improve more than 40%.
Example 2: be used in 0.3T magnetic field medium sensitivity R
B/ R
0Be 3.0 times indium arsenide monocrystalline type magnetoresistive element, make the ferromagnetic material thin slice with ferrite sheet, with the Nd-Fe-B permanent magnet of 0.32T, make semiconducting-magnetic-head by above-mentioned embodiment, recording its output voltage with conventional method of testing is 280mV.If use instead at 0.3T magnetic field medium sensitivity R
B/ R
0Be 3.0 indium arsenide film-type magnetoresistive element, other output voltage constant and the semiconductive thin film magnetic head made is 435mV, and the latter has improved more than 50% than the former.
From top two comparative examples, the sensitivity that visible the utility model can improve semiconducting-magnetic-head greatly, and work simplification in the actual manufacture process, be easy to mass production.
Claims (1)
1, a kind of shell that comprises, semiconductive thin film, substrate, the antimony of permanent magnet-indium based semiconductor magnetoresistive film magnetic head, it is characterized in that: it is by casing of magnetic head (1), antimony-indium based semiconductor magnetoresistive film (2), substrate (3), ferromagnetic material thin slice (4), double-sided printed-circuit board (5), thin plastic washer (6), permanent magnet (7), connection wire (8), outer lead (9) connects and composes jointly, its mutual alignment and annexation are: antimony-indium based semiconductor magnetoresistive film (2) sticks to substrate (3) with vacuum thermal evaporation or various sputter feasible method deposition and goes up the common magnetoresistive element that constitutes, ferromagnetic material thin slice (4) is that cementing agent is mutually bonding with substrate (3) by epoxy, the double-sided printed-circuit board (5) that makes things convenient for internal lead (8) and outer lead (9) and magnetoresistive element to be electrically connected mutually is that cementing agent and ferromagnetic material thin slice (4) are mutually bonding by epoxy, can make the inside surface of antimony-indium based semiconductor magnetoresistive film (2) and casing of magnetic head (1) keep thin plastic washer 6 pads of a fixed range between shell (1) and semiconductor magnetoresistive film, when shell during with plastic injection-moulded making, shell (1) should with the corresponding position of semiconductor magnetoresistive film (2) on carry out injection moulding after offering a window and embedding a wear-resistant metal sheet, permanent magnet (7) by epoxy be cementing agent with another surface of double-sided printed-circuit board (5) and be positioned at substrate (3) and ferromagnetic material thin slice (4) under locate mutually bonding, antimony-indium based semiconductor magnetoresistive film (2) is electrically connected with copper-foil conducting electricity on the double-sided printed-circuit board (5) mutually by internal lead (8), outer lead (9) one ends are welded in the Copper Foil of double-sided printed-circuit board lower surface, its other end stretches out outside the shell (1), the epoxy that is used for each parts in moistureproof and the fixed head shell is that resin (10) is cast in the casing of magnetic head (1), and the ferromagnetic material thin slice (4) that can improve magnetic head sensitivity places between antimony-indium based semiconductor thin film magneto element and the permanent magnet (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 99236243 CN2379876Y (en) | 1999-06-04 | 1999-06-04 | Magnetic head made of stibium-indium series semiconductor magnet resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 99236243 CN2379876Y (en) | 1999-06-04 | 1999-06-04 | Magnetic head made of stibium-indium series semiconductor magnet resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2379876Y true CN2379876Y (en) | 2000-05-24 |
Family
ID=34024086
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 99236243 Expired - Fee Related CN2379876Y (en) | 1999-06-04 | 1999-06-04 | Magnetic head made of stibium-indium series semiconductor magnet resistor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2379876Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103576101A (en) * | 2012-07-31 | 2014-02-12 | 北京嘉岳同乐极电子有限公司 | Multi-channel integrated type magnetic sensor |
| CN103791921A (en) * | 2012-10-29 | 2014-05-14 | 北京嘉岳同乐极电子有限公司 | Magnetic sensor and manufacturing method thereof |
| CN103969605A (en) * | 2013-01-30 | 2014-08-06 | 北京嘉岳同乐极电子有限公司 | Chip type magnetic sensor and manufacturing method thereof |
| CN104915614A (en) * | 2014-03-10 | 2015-09-16 | 北京嘉岳同乐极电子有限公司 | Magnetic head and card reader |
-
1999
- 1999-06-04 CN CN 99236243 patent/CN2379876Y/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103576101A (en) * | 2012-07-31 | 2014-02-12 | 北京嘉岳同乐极电子有限公司 | Multi-channel integrated type magnetic sensor |
| CN103791921A (en) * | 2012-10-29 | 2014-05-14 | 北京嘉岳同乐极电子有限公司 | Magnetic sensor and manufacturing method thereof |
| CN103791921B (en) * | 2012-10-29 | 2016-10-12 | 北京嘉岳同乐极电子有限公司 | A kind of Magnetic Sensor and preparation method thereof |
| CN103969605A (en) * | 2013-01-30 | 2014-08-06 | 北京嘉岳同乐极电子有限公司 | Chip type magnetic sensor and manufacturing method thereof |
| CN104915614A (en) * | 2014-03-10 | 2015-09-16 | 北京嘉岳同乐极电子有限公司 | Magnetic head and card reader |
| CN104915614B (en) * | 2014-03-10 | 2019-03-19 | 北京嘉岳同乐极电子有限公司 | Magnetic head and card reader |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |