CN221531765U - Direct patch circuit board packaging structure - Google Patents
Direct patch circuit board packaging structure Download PDFInfo
- Publication number
- CN221531765U CN221531765U CN202322817491.6U CN202322817491U CN221531765U CN 221531765 U CN221531765 U CN 221531765U CN 202322817491 U CN202322817491 U CN 202322817491U CN 221531765 U CN221531765 U CN 221531765U
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- CN
- China
- Prior art keywords
- packaging
- circuit board
- direct
- shell
- packaging structure
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 95
- 230000017525 heat dissipation Effects 0.000 claims abstract description 26
- 238000003466 welding Methods 0.000 claims abstract description 19
- 239000000945 filler Substances 0.000 claims abstract description 6
- 238000013016 damping Methods 0.000 claims description 18
- 238000005538 encapsulation Methods 0.000 claims description 15
- 230000035939 shock Effects 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000005452 bending Methods 0.000 claims description 3
- 238000001816 cooling Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a direct patch circuit board packaging structure which comprises a packaging structure main body and a direct patch circuit board, wherein the packaging structure main body is arranged on the direct patch circuit board, a packaging shell is arranged on the packaging structure main body, an electronic element is arranged in the packaging shell, packaging filler is filled in the packaging shell, a packaging cover is arranged on an upper end cover of the packaging shell, the electronic element is packaged in the packaging shell, pins penetrate through the side face of the packaging shell and are connected with leads of the electronic element, a circle of groove is arranged on the side face of the upper end of the packaging cover, a heat dissipation ring of a frame structure is clamped at the groove part of the packaging cover, and a pin welding positioning seat is embedded in the direct patch circuit board and corresponds to the positions of the pins respectively. The direct patch circuit board packaging structure can rapidly perform packaging positioning treatment on the electronic element, and can efficiently perform heat dissipation treatment after the electronic element is mounted on the circuit board, so that the circuit board is convenient to use.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a direct-mounted circuit board packaging structure.
Background
A direct-mounted circuit board is an assembly technique that directly bonds electronic components to the surface of the circuit board. The direct patch circuit board has the advantages of small volume, light weight, high reliability and the like, is widely applied to various electronic equipment, such as mobile phones, computers, televisions, automobile electronics and the like, and promotes the miniaturization and high integration development of electronic products.
The existing direct chip-mounting circuit board packaging structure generally refers to packaging an electronic element on a printed circuit board, enabling the exposed electronic element (such as a chip, a diode, a resistor and the like) to be connected with a PCB in a welding mode and the like, taking certain protection measures to ensure the safety and reliability of the element, and when the pin and the PCB are welded, carrying out accurate welding positioning treatment on the pin at present, otherwise, poor contact condition can occur, but after the pin is positioned, error and the like can occur, and the processing quality and efficiency are affected.
Disclosure of utility model
The utility model aims to provide a direct chip circuit board packaging structure, which aims to solve the problems that when the direct chip circuit board packaging structure in the market provided by the background technology is used for carrying out welding treatment on pins and a PCB, accurate welding positioning treatment is required to be carried out on the pins, otherwise, poor contact is caused, but errors and the like are caused after the positioning of the current pins, and the processing quality and efficiency are affected.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a direct paster circuit board packaging structure, includes packaging structure main part and direct paster circuit board, the packaging structure main part is located on the direct paster circuit board, be equipped with the encapsulation shell in the packaging structure main part, and be equipped with electronic component in the encapsulation shell, the encapsulation shell intussuseption is filled with encapsulation filler, and the encapsulation shell upper end cover is equipped with the encapsulation lid, makes electronic component encapsulate in the encapsulation shell, the encapsulation shell side runs through there is the pin, and the pin is connected with electronic component wire, encapsulation lid upper end side is equipped with the round recess, and the recess position block of encapsulation lid has the heat dissipation ring of frame structure, direct paster circuit board is embedded to be equipped with pin welding location seat, and pin welding location seat and pin position are corresponding respectively.
Preferably, the pin is of a bending structure, and the pin is welded and fixed after being clamped with the pin welding positioning seat.
Preferably, a groove is formed in the bottom of the packaging shell, the width of the groove of the packaging shell is equal to that of the packaging shell, and the damping heat dissipation plate is fastened and clamped at the groove of the packaging shell.
Preferably, the thickness of the damping and cooling plate is smaller than the depth of the groove of the packaging shell, four integrally-formed positioning columns are uniformly arranged at the lower end of the damping and cooling plate at intervals, and grooves for cooling are uniformly arranged at the lower end of the damping and cooling plate at intervals.
Preferably, the positioning column is internally provided with a threaded hole structure, and the positioning column is sleeved with a fastening spring.
Preferably, the direct patch circuit board is provided with a T-shaped round hole corresponding to the position of the positioning column, and a fixing screw in threaded connection with the positioning column is clamped at the bottom of the T-shaped round hole of the direct patch circuit board.
Compared with the prior art, the utility model has the beneficial effects that: the direct patch circuit board packaging structure can rapidly perform packaging positioning treatment on the electronic element, and can efficiently perform heat dissipation treatment after the electronic element is mounted on the circuit board, so that the circuit board is convenient to use. This direct paster circuit board packaging structure carries out block location processing through the pin welding location seat that has the recess to the pin welds, and the encapsulation shell that is used for electronic component encapsulation fixes a position through the shock attenuation heating panel of fixing on direct paster circuit board, and shock attenuation heating panel makes the encapsulation shell can carry out bottom heat dissipation processing.
Drawings
Fig. 1 is a side view of a direct-mounted circuit board package structure according to the present utility model;
fig. 2 is a top view of a direct-mounted circuit board package structure according to the present utility model;
FIG. 3 is a schematic diagram of the bottom structure of a shock absorbing and heat dissipating plate of a direct chip circuit board package structure according to the present utility model;
fig. 4 is a schematic diagram of a bottom structure of a package shell of a direct chip circuit board package structure according to the present utility model.
In the figure: 1. a package structure body; 2. a direct patch circuit board; 3. a heat dissipation ring; 4. a package cover; 5. an electronic component; 6. packaging the filler; 7. pins; 8. packaging the shell; 9. damping and heat dissipating plate; 10. a set screw; 11. a fastening spring; 12. welding a positioning seat on the pin; 13. and positioning columns.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-4, the present utility model provides a technical solution: the direct chip-mounting circuit board packaging structure comprises a packaging structure main body 1 and a direct chip-mounting circuit board 2, wherein the packaging structure main body 1 is arranged on the direct chip-mounting circuit board 2, a packaging shell 8 is arranged on the packaging structure main body 1, an electronic element 5 is arranged in the packaging shell 8, a packaging filler 6 is filled in the packaging shell 8, a packaging cover 4 is arranged on an upper end cover of the packaging shell 8, the electronic element 5 is packaged in the packaging shell 8, a pin 7 penetrates through the side surface of the packaging shell 8, the pin 7 is connected with a lead of the electronic element 5, the pin 7 is of a bending structure, the pin 7 is welded and fixed after being clamped with a pin welding positioning seat 12, when the direct chip-mounting circuit board 2 of the structure is used for packaging and fixing the electronic element 5, the electronic element 5 can be connected with the direct chip-mounting circuit board 2 through the pin 7 so as to realize a passage, the pin 7 and the pin welding positioning seat 12 are welded after being clamped, the packaging structure can facilitate the packaging positioning treatment of the direct chip circuit board 2 through the packaging structure main body 1, the bottom of the packaging shell 8 is provided with a groove, the width of the groove of the packaging shell 8 is equal to the width of the packaging shell 8, the groove part of the packaging shell 8 is tightly clamped with the damping heat dissipation plate 9, the structure ensures that the packaging shell 8 can perform the bottom heat dissipation treatment through the damping heat dissipation plate 9, the thickness of the damping heat dissipation plate 9 is smaller than the groove depth of the packaging shell 8, the lower end of the damping heat dissipation plate 9 is uniformly provided with four positioning columns 13 which are integrally formed, the lower end of the damping heat dissipation plate 9 is uniformly provided with grooves for heat dissipation, the damping heat dissipation plate 9 can perform the fixing treatment through the positioning columns 13 relative to the direct chip circuit board 2, the damping heat dissipation plate 9 can perform the positioning treatment on the packaging shell 8, and the packaging shell 8 can perform the heat dissipation treatment through the damping heat dissipation plate 9, the packaging cover 4 upper end side is equipped with the round recess, and the recess position block of packaging cover 4 has the heat dissipation ring 3 of frame structure, direct paster circuit board 2 is embedded to be equipped with pin welding location seat 12, and pin welding location seat 12 corresponds with pin 7 position respectively, the reference column 13 is the screw hole structure in, and the reference column 13 overcoat is equipped with fastening spring 11, this structure fastening spring 11 can carry out fastening treatment to the connection of reference column 13 relative direct paster circuit board 2, avoid not hard up condition, thereby make shock attenuation heating panel 9 firm relative encapsulation shell 8, set up the T type round hole corresponding with reference column 13 position on the direct paster circuit board 2, and direct paster circuit board 2's T type round hole bottom block has the fixed screw 10 with reference column 13 threaded connection, this structure makes shock attenuation heating panel 9 can be firm through reference column 13 and the relative direct paster circuit board 2 of fixed screw 10's cooperation.
Working principle: when the direct chip circuit board packaging structure is used, firstly, the electronic element 5 is packaged in the packaging shell 8 through the packaging filler 6, the packaging cover 4 and the packaging shell 8 are welded and fixed to form a sealing structure, the heat dissipation ring 3 enables the packaging cover 4 to have a heat dissipation function, the pins 7 are respectively clamped with the pin welding positioning seats 12 embedded in the direct chip circuit board 2, meanwhile, the grooves at the lower end of the packaging shell 8 are fastened with the damping heat dissipation plate 9 in a clamping manner, the damping heat dissipation plate 9 is fastened with the direct chip circuit board 2 relatively through the cooperation of the fixing screws 10 and the positioning columns 13, the fastening springs 11 conduct stable treatment on the damping heat dissipation plate 9, the damping heat dissipation plate 9 is used for positioning the packaging shell 8, and then the pins 7 and the pin welding positioning seats 12 are welded and fixed to complete the work of the packaging structure main body 1, so that a series of works are completed.
Although the present utility model has been described with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements and changes may be made without departing from the spirit and principles of the present utility model.
Claims (6)
1. The utility model provides a direct paster circuit board packaging structure, includes packaging structure main part (1) and direct paster circuit board (2), on direct paster circuit board (2) are located to packaging structure main part (1), its characterized in that: the packaging structure is characterized in that a packaging shell (8) is arranged on the packaging structure main body (1), an electronic element (5) is arranged in the packaging shell (8), packaging filler (6) is filled in the packaging shell (8), a packaging cover (4) is arranged on an upper end cover of the packaging shell (8), the electronic element (5) is packaged in the packaging shell (8), pins (7) penetrate through the side face of the packaging shell (8), the pins (7) are connected with the electronic element (5) through wires, a circle of grooves are formed in the side face of the upper end of the packaging cover (4), a radiating ring (3) of a frame-shaped structure is clamped at the groove part of the packaging cover (4), a pin welding positioning seat (12) is embedded in the direct patch circuit board (2), and the positions of the pin welding positioning seat (12) and the pins (7) are respectively corresponding.
2. The direct-mounted circuit board packaging structure according to claim 1, wherein: the pin (7) is of a bending structure, and the pin (7) is welded and fixed after being clamped with the pin welding positioning seat (12).
3. The direct-mounted circuit board packaging structure according to claim 1, wherein: a groove is formed in the bottom of the packaging shell (8), the width of the groove of the packaging shell (8) is equal to that of the packaging shell (8), and a damping heat dissipation plate (9) is fastened and clamped at the groove of the packaging shell (8).
4. A direct-mounted circuit board package structure according to claim 3, wherein: the thickness of shock attenuation heating panel (9) is less than the recess degree of depth of encapsulation shell (8), and shock attenuation heating panel (9) lower extreme evenly spaced is equipped with four reference columns (13) that constitute integrally to shock attenuation heating panel (9) lower extreme evenly spaced is equipped with the recess that is used for radiating.
5. The direct-mounted circuit board packaging structure according to claim 4, wherein: the positioning column (13) is internally provided with a threaded hole structure, and the positioning column (13) is sleeved with a fastening spring (11).
6. The direct-mounted circuit board packaging structure according to claim 1, wherein: t-shaped round holes corresponding to the positioning columns (13) are formed in the direct patch circuit board (2), and fixing screws (10) in threaded connection with the positioning columns (13) are clamped at the bottoms of the T-shaped round holes of the direct patch circuit board (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322817491.6U CN221531765U (en) | 2023-10-20 | 2023-10-20 | Direct patch circuit board packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322817491.6U CN221531765U (en) | 2023-10-20 | 2023-10-20 | Direct patch circuit board packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221531765U true CN221531765U (en) | 2024-08-13 |
Family
ID=92207227
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322817491.6U Active CN221531765U (en) | 2023-10-20 | 2023-10-20 | Direct patch circuit board packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221531765U (en) |
-
2023
- 2023-10-20 CN CN202322817491.6U patent/CN221531765U/en active Active
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| GR01 | Patent grant |