CN221447063U - Relay heat radiation structure and switching power supply - Google Patents
Relay heat radiation structure and switching power supply Download PDFInfo
- Publication number
- CN221447063U CN221447063U CN202322910420.0U CN202322910420U CN221447063U CN 221447063 U CN221447063 U CN 221447063U CN 202322910420 U CN202322910420 U CN 202322910420U CN 221447063 U CN221447063 U CN 221447063U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- relay
- copper bar
- heat
- dissipation structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000005855 radiation Effects 0.000 title claims description 8
- 230000017525 heat dissipation Effects 0.000 claims abstract description 115
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 83
- 229910052802 copper Inorganic materials 0.000 claims abstract description 83
- 239000010949 copper Substances 0.000 claims abstract description 83
- 239000011248 coating agent Substances 0.000 claims abstract description 8
- 238000000576 coating method Methods 0.000 claims abstract description 8
- 239000003292 glue Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 2
- 238000009413 insulation Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- HEZMWWAKWCSUCB-PHDIDXHHSA-N (3R,4R)-3,4-dihydroxycyclohexa-1,5-diene-1-carboxylic acid Chemical compound O[C@@H]1C=CC(C(O)=O)=C[C@H]1O HEZMWWAKWCSUCB-PHDIDXHHSA-N 0.000 description 1
- KTXUOWUHFLBZPW-UHFFFAOYSA-N 1-chloro-3-(3-chlorophenyl)benzene Chemical compound ClC1=CC=CC(C=2C=C(Cl)C=CC=2)=C1 KTXUOWUHFLBZPW-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a relay heat dissipation structure and a switching power supply, wherein the relay heat dissipation structure comprises: the relay heat dissipation structure comprises a heat dissipation shell, wherein at least one relay is arranged on the heat dissipation shell, a first copper bar is lapped on one side of the top of the relay, a second copper bar is lapped on the other side of the top of the relay, the relay heat dissipation structure further comprises a heat dissipation copper bar, the upper half part of the heat dissipation copper bar is locked and attached to the bottom of the second copper bar, the lower half part of the heat dissipation copper bar is an insulating coating, a heat dissipation cavity is arranged on the heat dissipation shell, and the lower part of the heat dissipation copper bar is inserted into the heat dissipation cavity. The utility model has simple structure, is firm and reliable, improves the heat dissipation effect of the relay, and can avoid the damage to the relay or other potential safety hazards caused by the fact that the temperature of the relay is increased beyond the rated temperature of the relay.
Description
Technical Field
The utility model relates to the technical field of vehicle-mounted switching power supply products, in particular to a relay heat dissipation structure and a switching power supply.
Background
With the increase of power, the calorific capacity of relay can be along with the increase, and the relay can be damaged to too high calorific capacity, therefore, need dispel the heat to the relay, avoid the too high damage relay of temperature or cause other potential safety hazards.
The current relay heat radiation structure is not firm and reliable in structural assembly and low in heat radiation efficiency.
Disclosure of utility model
The utility model mainly aims to provide a relay heat dissipation structure, which aims to improve the stability of the relay heat dissipation structure and improve the heat dissipation efficiency.
In order to achieve the above object, the present utility model provides a heat dissipation structure of a relay, comprising: the relay heat dissipation structure comprises a heat dissipation shell, wherein at least one relay is arranged on the heat dissipation shell, a first copper bar is lapped on one side of the top of the relay, a second copper bar is lapped on the other side of the top of the relay, the relay heat dissipation structure further comprises a heat dissipation copper bar, the upper half part of the heat dissipation copper bar is locked and attached to the bottom of the second copper bar, the lower half part of the heat dissipation copper bar is an insulating coating, a heat dissipation cavity is arranged on the heat dissipation shell, and the lower part of the heat dissipation copper bar is inserted into the heat dissipation cavity.
According to the further technical scheme, the heat dissipation copper bar is of a T-shaped structure.
According to a further technical scheme, heat-conducting glue is filled in the heat dissipation cavity in a sealing mode.
According to the further technical scheme, the heat dissipation copper bar is locked and attached to the bottom of the second copper bar through a first screw.
According to the further technical scheme, an insulating column is arranged on the heat dissipation shell, and the second copper bar is connected with the heat dissipation shell through the insulating column.
According to the further technical scheme, the second copper bar is locked and attached to the top of the insulating column through a second screw.
According to the further technical scheme, the bottom threads of the insulating columns are locked on the heat dissipation shell.
According to a further technical scheme, the copper bar bonding machine further comprises a third copper bar or a PCB which is in lap joint with the second copper bar.
According to the further technical scheme, the number of the relays is two, and the two relays are arranged on the heat dissipation shell in parallel.
In order to achieve the above object, the present utility model also proposes a switching power supply including the relay heat dissipation structure as described above.
The relay heat radiation structure and the switching power supply have the beneficial effects that:
According to the technical scheme, the heat dissipation shell is provided with at least one relay, one side of the top of the relay is lapped with the first copper bar, the other side of the top of the relay is lapped with the second copper bar, the heat dissipation structure of the relay further comprises the heat dissipation copper bar, the upper half part of the heat dissipation copper bar is locked and attached to the bottom of the second copper bar, the lower half part of the heat dissipation copper bar is an insulating coating, the heat dissipation shell is provided with the heat dissipation cavity, and the lower part of the heat dissipation copper bar is inserted into the heat dissipation cavity.
Drawings
FIG. 1 is a schematic view of the overall structure of a preferred embodiment of a heat dissipating structure of a relay according to the present utility model;
FIG. 2 is a front view of a preferred embodiment of a heat dissipating structure of a relay according to the present utility model;
FIG. 3 is a left side view of a preferred embodiment of the relay heat dissipation structure of the present utility model;
FIG. 4 is a top view of a preferred embodiment of a heat dissipating structure for a relay according to the present utility model;
Fig. 5 is a schematic diagram of the overall structure of a heat dissipating copper bar;
Fig. 6 is a front view of a heat dissipating copper bar;
FIG. 7 is a left side view of a heat dissipating copper bar;
Fig. 8 is a schematic structural view of the heat dissipation case.
Reference numerals illustrate:
a heat dissipation case 1; a relay 2; a first copper bar 3; a second copper bar 4; a heat dissipation copper bar 5; an insulating coating 6; a heat dissipation cavity 7; a first screw 8; an insulating column 9; a second screw 10; a PCB board 11.
The present utility model will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present utility model more apparent.
Detailed Description
It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
The utility model provides a relay heat dissipation structure which can be applied to high-power switch power supply products, such as a hydrogen fuel cell DCDC system, a vehicle-mounted 0BC system, an air compressor controller system and the like, or other switch power supply products.
Referring to fig. 1 to 8, a heat dissipation structure of a relay 2 according to a preferred embodiment of the present utility model includes a heat dissipation housing 1, at least one relay 2 is disposed on the heat dissipation housing 1, a first copper bar 3 is lapped on one side of a top of the relay 2, a second copper bar 4 is lapped on the other side of the top of the relay 2, the heat dissipation structure of the relay 2 further includes a heat dissipation copper bar 5, an upper half portion of the heat dissipation copper bar 5 is locked and attached to a bottom portion of the second copper bar 4, a lower half portion of the heat dissipation copper bar 5 is an insulating coating 6, a heat dissipation cavity 7 is disposed on the heat dissipation housing 1, and a lower portion of the heat dissipation copper bar 5 is inserted into the heat dissipation cavity 7.
The relay 2 is divided into two stages, and current can flow in from one end to the other end, in this embodiment, the current can flow in from the first copper bar 3, flow out from the second copper bar 4, and flow in from the second copper bar 4, and flow out from the first copper bar 3.
In this embodiment, the insulating coating 6 is disposed at the lower half of the heat dissipation copper bar 5, so that the electrical gap between the heat dissipation copper bar 5 and the heat dissipation housing 1 can be prevented from being too close.
In this embodiment, the lower portion of the heat dissipation copper bar 5 is inserted into the heat dissipation cavity 7, and heat of the relay 2 may be led into the heat dissipation housing 1 through the heat dissipation copper bar 5, so as to avoid damage to the relay 2 or other potential safety hazards caused by temperature rise of the relay 2 exceeding its rated temperature.
In this embodiment, the heat dissipating copper bar 5 is configured as a T-shaped structure, however, in other embodiments, the heat dissipating copper bar 5 may be configured as other shapes, so that the lower half of the heat dissipating copper bar 5 may be conveniently inserted into the heat dissipating cavity 7, which is not limited in the present utility model.
Further, in this embodiment, the heat-conducting glue is encapsulated in the heat dissipation cavity 7. According to the embodiment, the heat-conducting glue is encapsulated in the heat-radiating cavity 7, so that the heat-radiating effect of the relay 2 can be further improved.
Further, in this embodiment, the heat dissipation copper bar 5 is locked to the bottom of the second copper bar 4 by a first screw 8.
According to the embodiment, the heat dissipation copper bar 5 is locked and attached to the bottom of the second copper bar 4 through the first screw 8, and the assembly is simple, convenient and reliable.
In order to further improve structural stability of the heat dissipation structure of the relay 2 and meet severe vibration environment requirements, in this embodiment, an insulation column 9 is disposed on the heat dissipation housing 1, and the second copper bar 4 is connected with the heat dissipation housing 1 through the insulation column 9, and is reinforced and fixed to the second copper bar 4 through the insulation column 9.
Specifically, in this embodiment, the second copper bar 4 is locked to the top of the insulating column 9 by a second screw 10.
In this embodiment, the bottom thread of the insulating column 9 is locked on the heat dissipation housing 1.
Further, in this embodiment, the heat dissipation structure of the relay 2 further includes a third copper bar or PCB 11 overlapping with the second copper bar 4.
Further, the present embodiment considers that the rated current of one relay 2 does not satisfy the required amount of current when the current is excessively large, and thus, as an embodiment, the present embodiment is provided with two relays 2 in parallel on the heat dissipation case 1.
The heat dissipation structure of the relay has the beneficial effects that:
According to the technical scheme, the heat dissipation shell is provided with at least one relay, one side of the top of the relay is lapped with the first copper bar, the other side of the top of the relay is lapped with the second copper bar, the heat dissipation structure of the relay further comprises the heat dissipation copper bar, the upper half part of the heat dissipation copper bar is locked and attached to the bottom of the second copper bar, the lower half part of the heat dissipation copper bar is an insulating coating, the heat dissipation shell is provided with the heat dissipation cavity, and the lower part of the heat dissipation copper bar is inserted into the heat dissipation cavity.
In order to achieve the above objective, the present utility model further provides a switching power supply, where the switching power supply includes a relay heat dissipation structure as described in the above embodiments, and the structure and the working principle of the relay heat dissipation structure are described in detail above, and are not described herein again.
The foregoing description is only of the preferred embodiments of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structures or modifications in the structures or processes described in the specification and drawings, or the direct or indirect application of the present utility model to other related technical fields, are included in the scope of the present utility model.
Claims (10)
1. A relay heat dissipation structure, comprising: the relay heat dissipation structure comprises a heat dissipation shell, wherein at least one relay is arranged on the heat dissipation shell, a first copper bar is lapped on one side of the top of the relay, a second copper bar is lapped on the other side of the top of the relay, the relay heat dissipation structure further comprises a heat dissipation copper bar, the upper half part of the heat dissipation copper bar is locked and attached to the bottom of the second copper bar, the lower half part of the heat dissipation copper bar is an insulating coating, a heat dissipation cavity is arranged on the heat dissipation shell, and the lower part of the heat dissipation copper bar is inserted into the heat dissipation cavity.
2. The relay heat dissipation structure of claim 1, wherein the heat dissipation copper bar is a T-shaped structure.
3. The relay heat dissipation structure of claim 1, wherein the heat dissipation cavity is filled with a heat conducting glue.
4. The relay heat dissipation structure of claim 1, wherein the heat dissipation copper bar is attached to the bottom of the second copper bar by a first screw.
5. The relay heat radiation structure according to claim 1, wherein an insulating column is provided on the heat radiation housing, and the second copper bar is connected with the heat radiation housing through the insulating column.
6. The relay heat dissipation structure of claim 5, wherein the second copper bar is attached to the top of the insulating column by a second screw lock.
7. The relay heat dissipating structure of claim 6, wherein the bottom threads of the insulating post are locked to the heat dissipating housing.
8. The relay heat dissipation structure of claim 1, further comprising a third copper bar or PCB board lapped with the second copper bar.
9. The relay heat dissipation structure according to claim 1, wherein the number of the relays is two, and the two relays are arranged in parallel on the heat dissipation housing.
10. A switching power supply comprising a relay heat dissipation structure as claimed in any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322910420.0U CN221447063U (en) | 2023-10-27 | 2023-10-27 | Relay heat radiation structure and switching power supply |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322910420.0U CN221447063U (en) | 2023-10-27 | 2023-10-27 | Relay heat radiation structure and switching power supply |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221447063U true CN221447063U (en) | 2024-07-30 |
Family
ID=92069612
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322910420.0U Active CN221447063U (en) | 2023-10-27 | 2023-10-27 | Relay heat radiation structure and switching power supply |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221447063U (en) |
-
2023
- 2023-10-27 CN CN202322910420.0U patent/CN221447063U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102412704B (en) | Low-voltage high-current three-phase driving power module group structure | |
| CN103051208B (en) | Frequency conversion power module of all-in-one machine of explosive-proof frequency conversion motor | |
| CN108075620B (en) | High-power unit structure formed by IGCT thyristors | |
| CN221447063U (en) | Relay heat radiation structure and switching power supply | |
| CN209448280U (en) | A kind of two-in-one high voltage distribution box | |
| CN201726303U (en) | High-power high-voltage inverter power unit | |
| CN205900524U (en) | Power semiconductor module based on heat dissipation scheme | |
| CN204560104U (en) | A kind of microswitch power supply | |
| CN202196771U (en) | Novel two-side cooler used for electromobile semiconductor | |
| CN209472561U (en) | Lamination copper bar and Three-phase high-power inverter | |
| CN208570361U (en) | Height heat dissipation thin film capacitor for electric vehicle | |
| CN203617913U (en) | Off-grid inverter bus bar component | |
| CN202058742U (en) | Solar photovoltaic component | |
| CN210246065U (en) | A quick-witted case for power conversion | |
| CN205070759U (en) | Three level power modules on NPP structure based on crimping formula switch tube | |
| CN109217636A (en) | A kind of power device of generic encapsulation | |
| CN211650663U (en) | Electric control assembly and air conditioner | |
| CN208836465U (en) | A kind of high-power low pressure inverter structure | |
| CN221067848U (en) | High-pressure box | |
| CN216056463U (en) | UPS power that possesses high-efficient heat dissipation function and barrier propterty is good | |
| CN219760871U (en) | Power unit of cascade frequency converter | |
| CN202586210U (en) | High voltage conjunction box for electric automobile | |
| CN220673639U (en) | Energy storage inverter and energy storage system | |
| CN209562399U (en) | A kind of high pressure IGBT driving plate structure | |
| CN221574257U (en) | PCB copper bar overlap joint reposition of redundant personnel structure and on-vehicle switching power supply |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |