CN204560104U - A kind of microswitch power supply - Google Patents
A kind of microswitch power supply Download PDFInfo
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- CN204560104U CN204560104U CN201520231890.7U CN201520231890U CN204560104U CN 204560104 U CN204560104 U CN 204560104U CN 201520231890 U CN201520231890 U CN 201520231890U CN 204560104 U CN204560104 U CN 204560104U
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- power supply
- housing
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- components
- pcb board
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Abstract
The utility model provides a kind of microswitch power supply, comprise housing, pcb board, components and parts, heat conductive silica gel and connection pin, described housing is high heat conductive insulating plastics, described components and parts are SMD components and parts, described components and parts are arranged on pcb board, and described pcb board is fixedly installed in housing, the described space of heat conductive silica gel embedding between components and parts and housing, described connection pin is connected with pcb board, and described connection pin extends to outside housing.The utility model has the advantage of microminiaturization, high efficiency, ultra-wide working range, High Power Factor.
Description
Technical field
The utility model proposes a kind of Switching Power Supply, especially relate to a kind of microswitch power supply with microminiaturization, high efficiency, ultra-wide working range, High Power Factor.
Background technology
Switching Power Supply is with small-sized, light weight, and the wide and high efficiency feature of input range has been widely used in and has communicated, in the field such as household electrical appliances, industrial instrument.
The Switching Power Supply of prior art, owing to well cannot solve heat dissipation problem, therefore uses today so widely at SMD components, still uses non-SMD components, and then makes the volume of Switching Power Supply very large, takes up room large; Moreover, because Switching Power Supply of the prior art not can solve heat dissipation problem, such that the input voltage range of Switching Power Supply is little, inefficiency, and then limit the scope of application of Switching Power Supply.
Utility model content
In order to solve the problem, the utility model provide a kind of input overvoltage after the microswitch power supply that can automatically resume work.The technical solution adopted in the utility model is as follows:
A kind of microswitch power supply, comprise housing, pcb board, components and parts, heat conductive silica gel and connection pin, housing is high heat conductive insulating plastics, components and parts are SMD components and parts, components and parts are arranged on pcb board, and pcb board is fixedly installed in housing, the space of heat conductive silica gel embedding between components and parts and housing, connect pin to be connected with pcb board, and connection pin extends to outside housing.
Be characterized as further, the model of high heat conductive insulating plastics is PA6.
Be characterized as further, outside is provided with heat-conductive assembly.
Be characterized as further, heat-conductive assembly is thermal trough.
Be characterized as further, heat-conductive assembly is protruding heat conduction bar.
Be characterized as further, heat conductive silica gel is the electronic encapsulation material of TPC-213 high thermal conductivity.
Be characterized as further, microswitch power supply designs for integral sealed.
The utility model compared with the existing technology, has the following advantages and beneficial effect:
1, all components and parts in the utility model are all SMD components and parts, thus realize power supply miniaturized design, and take up room little, cost is low, are convenient to promote the use of.
2, the housing in the utility model is high heat conductive insulating plastics, and model is PA6, and the conductive coefficient of these high heat conductive insulating plastics reaches 15W/mK, is 3 times of normal power supplies plastic casing; Heat conductive silica gel in the utility model is the electronic encapsulation material of TPC-213 high thermal conductivity, its conductive coefficient reaches 1.3W/mK, for more than 2 times of typical thermal-conductive silica gel, based on above 2 reasons, this Switching Power Supply is while microminiaturization, have more heat dispersion very efficiently, prevent Switching Power Supply to quit work when temperature is too high, the Switching Power Supply that the utility model is provided can non-stop run under high load capacity condition of work.
3, the housing in the utility model adopts high heat conductive insulating plastics, compared with metal shell of the prior art, significantly reduces the weight of Switching Power Supply, decreases cost simultaneously.
4, the housing in the utility model is outside equipped with heat-conductive assembly, and this heat-conductive assembly considerably increases the surface area of housing, thus improves the heat dispersion of housing, is beneficial to the cooling of this Switching Power Supply, provides the useful life of Switching Power Supply.
5, the Switching Power Supply that the utility model provides designs for integral sealed, makes Switching Power Supply have protection against the tide, waterproof, anti-oxidation performance, thus substantially increases the useful life of Switching Power Supply.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of a kind of microswitch power supply of the utility model.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
Embodiment 1
As shown in Figure 1, a kind of microswitch power supply, comprise housing 1, pcb board 2, components and parts 3, heat conductive silica gel 4 and be connected pin 5, housing 1 is high heat conductive insulating plastics, and components and parts 3 are SMD components and parts, and components and parts 3 are arranged on pcb board 2, pcb board 2 is fixedly installed in housing 1, the space of heat conductive silica gel 4 embedding between components and parts 3 and housing 1, connects pin 5 and is connected with pcb board 2, and connection pin 5 extends to outside housing 1.
Optimal way of the present utility model is: the model of high heat conductive insulating plastics is PA6.
Housing 1 outer setting has heat-conductive assembly.
Heat-conductive assembly is thermal trough.
Heat-conductive assembly is protruding heat conduction bar.
Heat conductive silica gel 4 is the electronic encapsulation material of TPC-213 high thermal conductivity.
Microswitch power supply designs for integral sealed.
Embodiment 2
The difference of the present embodiment and embodiment 1 is that heat-conductive assembly is protruding heat conduction bar or conducting strip.
All components and parts in the utility model are all SMD components and parts, thus realize power supply miniaturized design, and take up room little, cost is low, are convenient to promote the use of.
Housing in the utility model is high heat conductive insulating plastics, and model is PA6, and the conductive coefficient of these high heat conductive insulating plastics reaches 15W/mK, is 3 times of normal power supplies plastic casing; Heat conductive silica gel in the utility model is the electronic encapsulation material of TPC-213 high thermal conductivity, its conductive coefficient reaches 1.3W/mK, for more than 2 times of typical thermal-conductive silica gel, based on above 2 reasons, this Switching Power Supply is while microminiaturization, have more heat dispersion very efficiently, prevent Switching Power Supply to quit work when temperature is too high, the Switching Power Supply that the utility model is provided can non-stop run under high load capacity condition of work.
Housing in the utility model adopts high heat conductive insulating plastics, compared with metal shell of the prior art, significantly reduces the weight of Switching Power Supply, decreases cost simultaneously.
Housing in the utility model is outside equipped with heat-conductive assembly, and this heat-conductive assembly considerably increases the surface area of housing, thus improves the heat dispersion of housing, is beneficial to the cooling of this Switching Power Supply, provides the useful life of Switching Power Supply.
The Switching Power Supply that the utility model provides designs for integral sealed, makes Switching Power Supply have protection against the tide, waterproof, anti-oxidation performance, thus substantially increases the useful life of Switching Power Supply.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all within spirit of the present utility model and principle, any amendment done, equivalent replacement, improvement etc., all should be included within protection range of the present utility model.
Claims (7)
1. a microswitch power supply, it is characterized in that, comprise housing, pcb board, components and parts, heat conductive silica gel and connection pin, described housing is high heat conductive insulating plastics, and described components and parts are SMD components and parts, and described components and parts are arranged on pcb board, described pcb board is fixedly installed in housing, the described space of heat conductive silica gel embedding between components and parts and housing, described connection pin is connected with pcb board, and described connection pin extends to outside housing.
2. a kind of microswitch power supply according to claim 1, is characterized in that, the model of described high heat conductive insulating plastics is PA6.
3. a kind of microswitch power supply according to claim 1, it is characterized in that, described outside is provided with heat-conductive assembly.
4. a kind of microswitch power supply according to claim 3, is characterized in that, described heat-conductive assembly is thermal trough.
5. a kind of microswitch power supply according to claim 3, is characterized in that, described heat-conductive assembly is protruding heat conduction bar.
6. a kind of microswitch power supply according to claim 1, is characterized in that, described heat conductive silica gel is the electronic encapsulation material of TPC-213 high thermal conductivity.
7. a kind of microswitch power supply according to claim 1, is characterized in that, described microswitch power supply designs for integral sealed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520231890.7U CN204560104U (en) | 2015-04-16 | 2015-04-16 | A kind of microswitch power supply |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520231890.7U CN204560104U (en) | 2015-04-16 | 2015-04-16 | A kind of microswitch power supply |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204560104U true CN204560104U (en) | 2015-08-12 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520231890.7U Expired - Fee Related CN204560104U (en) | 2015-04-16 | 2015-04-16 | A kind of microswitch power supply |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204560104U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107949226A (en) * | 2017-12-29 | 2018-04-20 | 广州致远电子有限公司 | A kind of surface-adhered type isolation module and preparation method thereof |
| CN109511221A (en) * | 2018-11-20 | 2019-03-22 | 咸阳威思曼高压电源有限公司 | A kind of circuit connecting method being miniaturized for Digital DC high voltage power supply and the Digital DC high voltage power supply using this method |
| CN109618514A (en) * | 2018-11-20 | 2019-04-12 | 咸阳威思曼高压电源有限公司 | It is a kind of for digitizing the insulation cabinet of high voltage power supply |
-
2015
- 2015-04-16 CN CN201520231890.7U patent/CN204560104U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107949226A (en) * | 2017-12-29 | 2018-04-20 | 广州致远电子有限公司 | A kind of surface-adhered type isolation module and preparation method thereof |
| CN109511221A (en) * | 2018-11-20 | 2019-03-22 | 咸阳威思曼高压电源有限公司 | A kind of circuit connecting method being miniaturized for Digital DC high voltage power supply and the Digital DC high voltage power supply using this method |
| CN109618514A (en) * | 2018-11-20 | 2019-04-12 | 咸阳威思曼高压电源有限公司 | It is a kind of for digitizing the insulation cabinet of high voltage power supply |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150812 Termination date: 20170416 |