CN221379342U - High-voltage isolation packaging structure - Google Patents

Abstract

The utility model discloses a high-voltage isolation packaging structure which comprises a first base island and a second base island, wherein the upper end of the first base island is fixedly connected with a second binding material, the upper end of the second binding material is provided with a first separator, the upper end of the first separator is provided with a third binding material, the upper end of the third binding material is provided with a second separator, and the upper end of the second separator is provided with a low-voltage chip. In the utility model, the structure is simple, and the process is easy to realize; the pressure endurance capacity is greatly improved, and the high-voltage isolation requirement can be met; due to the addition of the multi-layer bonding material and the spacer, the creepage distance of the corresponding adjacent chips is also greatly increased; the structural principle can be used on all multi-chip packaging or stacked packaging products to meet the pressure-resistant requirement.

Description

A high voltage isolation packaging structure

Technical Field

The utility model relates to a field, in particular to a high-voltage isolation packaging structure.

Background technique

The miniaturization and integration of electronic components is an irresistible trend. Therefore, chips with different requirements are often sealed in the same package in applications. In particular, when the voltage difference between multiple chips is large, there is a risk of high-voltage breakdown, which poses a major safety hazard to the product.

Conventionally, when high-voltage chips and low-voltage chips exist on the same substrate at the same time, insulating glue is used to bond the low-voltage chips, and conductive glue is used to bond the high-voltage chips. Due to the advantages of low cost, high efficiency and convenient switching of the dispensing method, the chip bonding is basically carried out by dispensing. However, the thickness of the bonding material operated by the bonding method generally depends on the characteristics of the bonding material itself, especially the thickness of the insulating bonding material is related to its filler. The thickness with filler can be about 10um to 15um, and the thickness without filler is generally 5 to 10um. The insulation characteristics are directly related to the thickness of the insulation layer. Such a thickness cannot meet the requirements of high voltage resistance.

Utility Model Content

The utility model aims to solve the shortcomings in the prior art and proposes a high-voltage isolation packaging structure.

In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a high-voltage isolation packaging structure, including a first base island and a second base island, the upper end of the first base island is fixedly connected with a binding material 2, the upper end of the binding material 2 is provided with an insulator 1, the upper end of the insulator 1 is provided with a binding material 3, the upper end of the binding material 3 is provided with an insulator 2, and the upper end of the insulator 2 is provided with a low-voltage chip.

As a further description of the above technical solution:

The upper end of the first base island is fixedly connected with a bonding material 1, the upper end of the bonding material 1 is fixedly connected with a high-voltage chip, and leads are arranged between the high-voltage chip and the low-voltage chip and the second base island, and a plastic package is arranged on the first base island.

The utility model has the following beneficial effects:

The scheme listed in this embodiment mainly increases the thickness of the insulating layer by adding insulator 1 and insulator 2 and simultaneously adopts binder 2 and binder 3 to directly increase the thickness of the insulating layer, directly improves the insulating capacity and meets the high-voltage isolation requirements. Among them, the choice of insulator 1 and insulator 2 can select insulating materials with a linear expansion coefficient similar to that of the chip, such as silicon dioxide, etc., and its thickness can be achieved through a grinding process. The processing is simple, the cost is low and it is easy to achieve. Both binder 2 and binder 3 can be achieved using a common dispensing process, which is easy to operate. Binding material 3 can be achieved by insulating film attachment or insulating glue coating process before low-voltage chip wafer dicing. The operation is simple and easy to achieve, the structure is simple, and the process is easy to achieve. The voltage resistance is greatly improved to meet the high-voltage isolation requirements. Due to the addition of multiple layers of binders and insulators, the creepage distance of the corresponding adjacent chips is also greatly increased. This structural principle can be used on all multi-chip packaging or stacked packaging products to meet the voltage resistance requirements.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG1 is a side view of a high voltage isolation packaging structure proposed by the present invention;

FIG. 2 is an enlarged view of A in FIG. 1 .

illustration:

1. Plastic package; 2. High-voltage chip; 3. Binding material 1; 4. First base island; 5. Binding material 2; 6. Isolator 1; 7. Binding material 3; 8. Isolator 2; 9. Low-voltage chip; 10. Second base island.

Detailed ways

1-2, the utility model provides an embodiment: a high-voltage isolation packaging structure, including a first base island 4 and a second base island 10, the upper end of the first base island 4 is fixedly connected with a bonding material 2 5, the upper end of the bonding material 2 5 is provided with an insulator 1 6, the upper end of the insulator 1 6 is provided with a bonding material 3 7, the upper end of the bonding material 3 7 is provided with an insulator 2 8, and the upper end of the insulator 2 8 is provided with a low-voltage chip 9. The bonding material 2 5 and the bonding material 3 7 are mostly made of insulating materials, such as insulating glue, etc. The insulator 1 6 can use a bare silicon wafer in consideration of low cost, and a ceramic wafer can be considered in consideration of insulation effect, and the insulator 2 8 can use insulating glue or insulating film.

The upper end of the first base island 4 is fixedly connected with a binding material 3, and the binding material 3 mostly uses a conductive material, such as solder paste, lead-tin wire, conductive glue, etc. The upper end of the binding material 3 is fixedly connected with a high-voltage chip 2, and leads are arranged between the high-voltage chip 2 and the low-voltage chip 9 and the second base island 10. A plastic package 1 is arranged on the first base island 4.

Working principle: Insulator 1 6 and insulator 2 8 use binding material 2 5 and binding material 3 7 to directly increase the thickness of the insulation layer, directly improve the insulation capacity, and meet the high-voltage isolation requirements. Insulator 1 6 and insulator 2 8 can be selected from insulating materials with a linear expansion coefficient similar to that of the chip, such as silicon dioxide, and their thickness can be achieved through a grinding process. The processing is simple, low-cost and easy to achieve. Binding material 2 5 and binding material 3 7 can both be achieved using a common dispensing process, which is easy to operate. Binding material 3 7 can be achieved by insulating film attachment or insulating glue coating process before the low-voltage chip 9 wafer is diced. The operation is simple and easy to achieve.

Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims (2)

1. A high-voltage isolation packaging structure, comprising a first base island (4) and a second base island (10), characterized in that: a second bonding material (5) is fixedly connected to the upper end of the first base island (4), an insulator (6) is arranged on the upper end of the second bonding material (5), a third bonding material (7) is arranged on the upper end of the insulator (6), a second insulator (8) is arranged on the upper end of the third bonding material (7), and a low-voltage chip (9) is arranged on the upper end of the insulator (8). 2. A high-voltage isolation packaging structure according to claim 1, characterized in that: the upper end of the first base island (4) is fixedly connected to a bonding material (3), the upper end of the bonding material (3) is fixedly connected to a high-voltage chip (2), and leads are arranged between the high-voltage chip (2), the low-voltage chip (9) and the second base island (10), and a plastic sealing body (1) is arranged on the first base island (4).