CN221328123U - Antenna, circuit board and communication equipment - Google Patents

Antenna, circuit board and communication equipment Download PDF

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Publication number
CN221328123U
CN221328123U CN202323247892.9U CN202323247892U CN221328123U CN 221328123 U CN221328123 U CN 221328123U CN 202323247892 U CN202323247892 U CN 202323247892U CN 221328123 U CN221328123 U CN 221328123U
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metal coating
antenna
plating layer
metal
metal plating
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CN202323247892.9U
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毕晓坤
杨椰楠
徐雨
谷媛
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Shenzhen Sunway Communication Co Ltd
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Shenzhen Sunway Communication Co Ltd
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Abstract

The embodiment of the utility model relates to the technical field of communication, and particularly discloses an antenna, a circuit board and communication equipment, which comprise a medium matrix, wherein the medium matrix is provided with a welding surface, a first side surface, a second side surface, a third side surface and a fourth side surface; the welding surface is provided with a first metal coating, a second metal coating, a third metal coating and a fourth metal coating; the first metal coating, the second metal coating, the third metal coating and the fourth metal coating are respectively positioned at the centers of four edges of the welding surface; the first side is provided with a fifth metal coating, the second side is provided with a sixth metal coating, the third side is provided with a seventh metal coating, and the fourth side is provided with an eighth metal coating; wherein the first metal coating, the second metal coating, the third metal coating and the fourth metal coating are respectively connected with the fifth metal coating, the sixth metal coating, the seventh metal coating and the eighth metal coating. Through the mode, the embodiment of the utility model can achieve the purposes of simplifying the design process of the dual-polarized antenna and facilitating the later installation and maintenance.

Description

Antenna, circuit board and communication equipment
Technical Field
The embodiment of the utility model relates to the technical field of communication, in particular to an antenna, a circuit board and communication equipment.
Background
With the rapid development of fifth generation (5G) mobile communications. The standard formulation and development of 5G are commonly known in the industry, and the main operating spectrum range of 5G is divided into FR1 (Sub-6G frequency band) and FR2 (millimeter wave frequency band). The millimeter wave frequency band is favored by the industry because of the advantages of wide frequency band, high information transmission rate, small antenna volume, easy integration and the like. The antenna, as an important component of a 5G communication device, determines the quality of the 5G communication.
The inventors of the present utility model found that, in the process of implementing the present utility model: currently, most of millimeter wave antennas reported before are monopole antennas, and most of dual-polarized antennas adopt a multi-layer structure design, so that the problems of complex structure, difficult installation and maintenance and the like exist, and the use of the dual-polarized antennas in 5G mobile communication is greatly limited.
Disclosure of utility model
The technical problem mainly solved by the embodiment of the utility model is to provide the dielectric millimeter wave dual-polarized antenna, which solves the problems of complex structure and inconvenient installation and maintenance of the existing dielectric millimeter wave dual-polarized antenna.
In order to solve the technical problems, the utility model adopts a technical scheme that: an antenna includes a dielectric substrate provided with a soldering face, a first side, a second side, a third side, and a fourth side; the welding surface is provided with a first metal coating, a second metal coating, a third metal coating and a fourth metal coating; the first metal coating, the second metal coating, the third metal coating and the fourth metal coating are respectively positioned at the centers of four edges of the welding surface; the first side is provided with a fifth metal coating, the second side is provided with a sixth metal coating, the third side is provided with a seventh metal coating, and the fourth side is provided with an eighth metal coating; the first metal coating is connected with a fifth metal coating on the first side, the second metal coating is connected with a sixth metal coating on the second side, the third metal coating is connected with a seventh metal coating on the third side, and the fourth metal coating is connected with an eighth metal coating on the fourth side.
Optionally, the first metal plating layer, the second metal plating layer, the third metal plating layer and the fourth metal plating layer are rectangular with equal dimensions and are symmetrical about the center point of the welding surface.
Optionally, the fifth metal coating, the sixth metal coating, the seventh metal coating and the eighth metal coating are rectangles with equal sizes, the fifth metal coating is located at the center of the intersecting edge of the first side surface and the welding surface, the sixth metal coating is located at the center of the intersecting edge of the second side surface and the welding surface, the seventh metal coating is located at the center of the intersecting edge of the third side surface and the welding surface, and the eighth metal coating is located at the center of the intersecting edge of the fourth side surface and the welding surface.
Optionally, the fifth metal plating layer, the sixth metal plating layer, the seventh metal plating layer and the eighth metal plating layer are symmetrical with respect to a straight line perpendicular to the welding surface and passing through a center point of the welding surface.
Optionally, the dielectric substrate is a cuboid ceramic block, and the dielectric constant of the cuboid ceramic block is set to 9-40.
Optionally, the length and the width of the cuboid ceramic block are equal, and the ratio of the length or the width of the cuboid ceramic block to the height of the cuboid ceramic block is 0.25-4.
In order to solve the technical problems, the utility model adopts another technical scheme that: a circuit board comprises a board body and the antenna, wherein a dielectric substrate of the antenna is welded on the board body, and two adjacent dielectric substrates serve as feed points and two adjacent dielectric substrates serve as welding points in a first metal coating, a second metal coating, a third metal coating and a fourth metal coating.
Optionally, the circuit board includes a feeding network, the feeding network is disposed on the board body, the feeding network is connected with the dielectric substrate, and the feeding network includes mutually perpendicular 50Ω microstrip lines.
In order to solve the technical problems, the utility model adopts another technical scheme that: a communication device is provided having the above-described circuit board.
The embodiment of the utility model has the beneficial effects that: different from the situation of the prior art, the embodiment of the utility model provides a patch type dielectric millimeter wave dual-polarized antenna with high isolation, which comprises a dielectric substrate, wherein the dielectric substrate is provided with a welding surface, a first side surface, a second side surface, a third side surface and a fourth side surface; the welding surface is provided with a first metal coating, a second metal coating, a third metal coating and a fourth metal coating; the first metal coating, the second metal coating, the third metal coating and the fourth metal coating are respectively positioned at the centers of four edges of the welding surface; the first side is provided with a fifth metal coating, the second side is provided with a sixth metal coating, the third side is provided with a seventh metal coating, and the fourth side is provided with an eighth metal coating; the first metal coating is connected with a fifth metal coating on the first side, the second metal coating is connected with a sixth metal coating on the second side, the third metal coating is connected with a seventh metal coating on the third side, and the fourth metal coating is connected with an eighth metal coating on the fourth side. Through the mode, the embodiment of the utility model solves the problems of complex structure and inconvenient installation and maintenance of the traditional dielectric millimeter wave dual-polarized antenna.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments of the present utility model will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present utility model, and other drawings may be obtained according to the drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of an antenna according to an embodiment of the present utility model;
Fig. 2 is a schematic structural diagram of another view of an antenna according to an embodiment of the present utility model;
FIG. 3 is a schematic diagram of a circuit board according to an embodiment of the present utility model;
fig. 4 is a schematic diagram of simulation results of S parameters of an antenna according to an embodiment of the present utility model;
fig. 5 is a simulated radiation pattern of a first feeding point of an antenna according to an embodiment of the present utility model;
fig. 6 is a simulated radiation pattern of a second feeding point of an antenna according to an embodiment of the present utility model;
FIG. 7 is a diagram of simulation results of S parameters of an antenna according to an embodiment of the present utility model to change the length or width of a dielectric substrate;
FIG. 8 is a graph of S-parameter simulation results for changing the height of a dielectric substrate for an antenna according to an embodiment of the present utility model;
FIG. 9 is a graph of S-parameter simulation results of an antenna according to an embodiment of the present utility model to change the width of a metal plating layer on a soldering surface;
FIG. 10 is a graph of S-parameter simulation results of an antenna according to an embodiment of the present utility model to change the length of a metal plating layer on a soldering surface;
fig. 11 is a diagram showing simulation results of S parameters for changing the height of a side metal plating layer of an antenna according to an embodiment of the present utility model.
Detailed Description
In order that the utility model may be readily understood, a more particular description thereof will be rendered by reference to specific embodiments that are illustrated in the appended drawings. It will be understood that when an element is referred to as being "fixed" to another element, it can be directly on the other element or one or more intervening elements may be present therebetween. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or one or more intervening elements may be present therebetween. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used in this specification includes any and all combinations of one or more of the associated listed items.
As shown in fig. 1 and 2, the antenna 100 includes a dielectric substrate 1, the dielectric substrate 1 being provided with a soldering face 11, a first side 12, a second side 13, a third side 14 and a fourth side 15; the welding surface 11 is provided with a first metal plating layer 111, a second metal plating layer 112, a third metal plating layer 113 and a fourth metal plating layer 114; the first metal plating layer 111, the second metal plating layer 112, the third metal plating layer 113 and the fourth metal plating layer 114 are respectively positioned at the centers of the four sides of the welding surface 11; the first side 12 is provided with a fifth metal plating layer 121, the second side 13 is provided with a sixth metal plating layer 131, the third side 14 is provided with a seventh metal plating layer 141, and the fourth side 15 is provided with an eighth metal plating layer 151; wherein the first metallization 111 is connected to a fifth metallization 121 on the first side 12, the second metallization 112 is connected to a sixth metallization 131 on the second side 13, the third metallization 113 is connected to a seventh metallization 141 on the third side 14, and the fourth metallization 114 is connected to an eighth metallization 151 on the fourth side 15. The required feed network board layer structure of the antenna 100 under the structure is simple in design, and the antenna 100 is convenient to install and maintain.
As for the above-mentioned metal plating layers, the first metal plating layer 111, the second metal plating layer 112, the third metal plating layer 113 and the fourth metal plating layer 114 are rectangular with equal dimensions and are symmetrical about the center point of the welding surface 11. The fifth metal plating layer 121, the sixth metal plating layer 131, the seventh metal plating layer 141 and the eighth metal plating layer 151 are rectangular with equal dimensions, the fifth metal plating layer 121 is located at the center of the intersection edge of the first side 12 and the welding surface 11, the sixth metal plating layer 131 is located at the center of the intersection edge of the second side 13 and the welding surface 11, the seventh metal plating layer 141 is located at the center of the intersection edge of the third side 14 and the welding surface 11, and the eighth metal plating layer 151 is located at the center of the intersection edge of the fourth side 15 and the welding surface 11. Wherein the fifth metal plating layer 121, the sixth metal plating layer 131, the seventh metal plating layer 141, and the eighth metal plating layer 151 are symmetrical with respect to a straight line (not shown) perpendicular to the bonding surface 11 and passing through the center point of the bonding surface 11. Among the first, second, third and fourth metal plating layers 111, 112, 113 and 114, each of the first, second, third and fourth metal plating layers 111, 112, 113 and 114 may serve as a welding point or a feeding point, with the remaining two serving as welding points when the adjacent two serve as feeding points. The metal plating layers 121, 131, 141 and 151 may be selected to form corresponding functional parts according to actual installation requirements, and the fifth metal plating layer 121, the sixth metal plating layer 131, the seventh metal plating layer 141 and the eighth metal plating layer 151 may be used to expand the matching bandwidth of the dielectric antenna 100. The design of the metal coating of the antenna 100, which is completely uniform in size and is located at the center of symmetry of the corresponding surface, simplifies the installation process of the antenna 100 and reduces the possibility of misoperation, and does not need to distinguish the placement direction of the metal coating of the welding surface by intention.
It should be noted that, when only a metal coating of the soldering surface receives the feed in the working state of the antenna 100, the antenna 100 of the embodiment is a monopole antenna 100, and the performance of the antenna 100 is consistent with the performance of a single port in the dual polarization state of the antenna 100.
For the dielectric substrate 1, the dielectric substrate 1 is a cuboid ceramic block, the dielectric constant of the cuboid ceramic block is 9-40, the length and the width of the cuboid ceramic block are equal, and the ratio of the length or the width of the cuboid ceramic block to the height of the ceramic block is 0.25-4. The arrangement of the rectangular ceramic blocks with different lengths or widths and heights plays a certain role in foolproof, so that the possibility of errors in the installation process of the antenna 100 is reduced.
The present utility model further provides an embodiment of a circuit board 200, as shown in fig. 3, where the circuit board 200 includes a board body 202 and the antenna 100 described above, and for the structure and function of the antenna 100, reference may be made to the above embodiment, which is not described herein, where the dielectric substrate 1 of the antenna 100 is soldered to the board body, the circuit board 200 includes a feeding network (not labeled), the feeding network is disposed on the board body 202, the feeding network is connected to the dielectric substrate 1, the feeding network includes 50 Ω microstrip lines 201 perpendicular to each other, in this embodiment, the first metal plating 111 and the second metal plating 112 are preferably used as feeding points, the third metal plating 113 and the fourth metal plating 114 are preferably used as soldering points, in this embodiment, one microstrip line 201 and the first metal plating 111 located at the soldering surface 11 form a first feeding point 201a, another microstrip line 201 and the adjacent metal plating 112 located at the soldering surface 11 form a second feeding point 201b, and the third metal plating 113 and the fourth metal plating 114 are soldered to the circuit board 200 together for fixing the antenna 100. The antenna 100 based on the structural design has a simple structural design of the required feed network plate layer, and is convenient for the installation and maintenance of the antenna 100.
For the convenience of the reader to better understand the concepts of the present utility model, an example simulation of antenna 100 is performed below. In the case where the dielectric substrate has a dielectric constant of 9 and a dielectric loss of 0.00054, the optimal dimensions for one set of antennas 100 are:
the length and width of the media substrate 1 are L D and W D, respectively, wherein the length L D is preferably 1.4 mm and the width W D is preferably 1.4 mm;
The height of the dielectric substrate 1 is H D, wherein the height H D is preferably 1.7 mm;
The width of the first metal plating layer 111, the width of the second metal plating layer 112, the width of the third metal plating layer 113, the width of the fourth metal plating layer 114, the width of the fifth metal plating layer 121, the width of the sixth metal 131, the width of the seventh metal plating layer 141, and the width of the eighth metal plating layer 151 are all W M, wherein the width W M is preferably 0.3 mm;
The length of the first metal plating layer 111, the length of the second metal plating layer 112, the length of the third metal plating layer 113, and the length of the fourth metal plating layer 114 are all L M, wherein L M is preferably 0.3 mm;
The height of the fifth metal plating layer 121, the height of the sixth metal plating layer 131, the height of the seventh metal plating layer 141, and the length of the eighth metal plating layer 151 are all heights, wherein the height H M is preferably 0.68 mm.
The S-parameter simulation results are shown in fig. 4 when the optimally sized antenna 100 is placed in the middle of a 10 mm by 10 mm circuit board. Since the antenna 100 is of a symmetrical double feed structure design, the reflection coefficients of the adjacent first and second feeding points 201a and 201b are uniform, and the dielectric antenna 100 is a dual polarized antenna. The reflection coefficient of the antenna 100 is smaller than-7.7 dB, the bandwidth ranges from 37 GHz to 43.02 GHz, the center frequency is 40.01 GHz, the absolute bandwidth is 6.02 GHz, the relative bandwidth is 15.05%, and the wide passband characteristics are provided. The isolation of the two ports is greater than 13.6 dB in the passband, and the high isolation characteristic is achieved.
The radiation pattern simulation results for an optimally sized antenna 100 are shown in fig. 5 and 6. As can be seen from fig. 5 and fig. 6, when one microstrip line 201 of the antenna 100 is fed through the first feeding point 201a and the other microstrip line 201 is fed through the second feeding point 201b, the amplitudes of the radiation directions of the antenna 100 are almost identical, and the maximum gains of the first feeding point 201a and the second feeding point 201b fed individually are about 6.35 dB.
Since the antenna 100 of the present embodiment is symmetrically designed and placed at the center of the circuit board 200, the reflection coefficients of the first feeding point 201a and the second feeding point 201b are uniform. Further, small dimensional changes in the dielectric substrate 1, the first metal plating layer 111, the second metal plating layer 112, the third metal plating layer 113, the fourth metal plating layer 114, the fifth metal plating layer 121, the sixth metal plating layer 131, the seventh metal plating layer 141, and the eighth metal plating layer 151 do not change the resonance mode of the antenna 100, but only cause a shift in the resonance frequency, i.e., the radiation characteristics of the antenna 100 do not change with a change in the value of the parameter under study. Therefore, it is only necessary to pay attention to the reflection coefficient at the first feeding point 201a or the second feeding point 201b and the isolation between the first feeding point 201a and the second feeding point 201b in order to study the influence of the relevant parameters of the antenna 100 on the performance of the antenna 100.
As can be seen from fig. 7, when the dielectric substrate 1 of the antenna 100 is changed only in its length L D or width W D, i.e., the length L D or width W D of the dielectric substrate 1 is increased from 1.2 mm to 1.6 mm, the resonant frequency of the antenna 100 is shifted down from 42.84 GHz to 36.93 GHz. Further, as the parameter length L D or width W D increases, the isolation of the antenna 100 at the resonant frequency becomes greater; when the length L D or the width W D of the dielectric substrate 1 is 1.4 mm, the reflection coefficient of the antenna 100 at the resonance frequency is minimum.
As can be seen from fig. 8, when the dielectric substrate 1 of the antenna 100 is changed only in its height H D, i.e., the height H D of the dielectric substrate 1 is increased from 1.6 mm to 1.8 mm, the resonance frequency thereof is shifted down from 39.91 GHz to 39.39 GHz. In addition, as the 20 height H D of the dielectric base 1 increases, the isolation of the antenna 100 slightly becomes smaller; when the height H D of the dielectric substrate 1 is 1.7 mm, the reflection coefficient of the antenna 100 at the resonance frequency is minimum.
Because the welding surface metal coating is connected with the side surface metal coating, and the width of the welding surface metal coating is consistent with that of the side surface metal coating, the size of any one part of the welding surface metal coating or the welding surface metal coating is changed, and the size of the other corresponding part is also changed. As can be seen from fig. 9, when the width W M of the metal plating of the antenna 100 is changed, i.e., the width of the metal plating W M is increased from 0.2 mm to 0.4 mm, the resonance frequency thereof is shifted down from 40.63 GHz to 39.02 GHz only. In addition, as the metal plating width W M increases, the isolation of the antenna 100 becomes greater; when the metal plating width W M is 0.3 mm, the reflection coefficient of the antenna 100 at the resonance frequency is minimum.
As can be seen from fig. 10, when the soldering surface metallization of the antenna 100 changes its length L M, i.e. the length L M of the soldering surface metallization increases from 0.2 mm to 0.4 mm, its resonance frequency shifts down from 40.41 GHz to 38.95 GHz. In addition, as the length L M of the soldering face metal plating layer increases, the isolation of the antenna 100 at the resonance frequency becomes large; when the length L M of the soldering face metallization is 0.3 mm, the reflection coefficient of the antenna 100 at the resonance frequency is minimal.
As can be seen from fig. 11, when the side metallization of the antenna 100 changes its height H D, i.e., the height H D of the side metallization increases from 0.58 to 0.78 mm, its resonant frequency shifts down from 41.71 GHz to 37.41 GHz. In addition, as the height H D of the side metal plating layer increases, the isolation of the antenna 100 at the resonance frequency becomes large; when the height H D of the side metal plating is 0.68 mm, the reflection coefficient of the antenna 100 at the resonance frequency is minimum.
In the embodiment of the utility model, the antenna 100 comprises a dielectric substrate 1, wherein the dielectric substrate 1 is provided with a welding surface 11, a first side 12, a second side 13, a third side 14 and a fourth side 15; the welding surface 11 is provided with a first metal plating layer 111, a second metal plating layer 112, a third metal plating layer 113 and a fourth metal plating layer 114; the first metal plating layer 111, the second metal plating layer 112, the third metal plating layer 113 and the fourth metal plating layer 114 are respectively positioned at the centers of the four sides of the welding surface 11; the first side 12 is provided with a fifth metal plating layer 121, the second side 13 is provided with a sixth metal plating layer 131, the third side 14 is provided with a seventh metal plating layer 141, and the fourth side 15 is provided with an eighth metal plating layer 151; wherein the first metallization 111 is connected to a fifth metallization 121 on the first side 12, the second metallization 112 is connected to a sixth metallization 131 on the second side 13, the third metallization 113 is connected to a seventh metallization 141 on the third side 14, and the fourth metallization 114 is connected to an eighth metallization 151 on the fourth side 15. The dual-polarized antenna 100 with the plate layer simple structure and high isolation and wide passband can be obtained, and the antenna 100 is convenient to install and maintain in the later stage.
The present utility model also provides an embodiment of a communication device, where the communication device includes the circuit board 200 described above, and the structure and the function of the communication device can be referred to the above embodiment, which is not described herein again.
It should be noted that while the present utility model has been illustrated in the drawings and described in connection with the preferred embodiments thereof, it is to be understood that the utility model may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, but are to be construed as providing a full breadth of the disclosure. The above-described features are further combined with each other to form various embodiments not listed above, and are considered to be the scope of the present utility model described in the specification; further, modifications and variations of the present utility model may be apparent to those skilled in the art in light of the foregoing teachings, and all such modifications and variations are intended to be included within the scope of this utility model as defined in the appended claims.

Claims (9)

1. An antenna, comprising
The medium substrate is provided with a welding surface, a first side surface, a second side surface, a third side surface and a fourth side surface; the welding surface is provided with a first metal coating, a second metal coating, a third metal coating and a fourth metal coating; the first metal coating, the second metal coating, the third metal coating and the fourth metal coating are respectively positioned at the centers of four edges of the welding surface; the first side is provided with a fifth metal coating, the second side is provided with a sixth metal coating, the third side is provided with a seventh metal coating, and the fourth side is provided with an eighth metal coating; the first metal coating is connected with a fifth metal coating on the first side, the second metal coating is connected with a sixth metal coating on the second side, the third metal coating is connected with a seventh metal coating on the third side, and the fourth metal coating is connected with an eighth metal coating on the fourth side.
2. The antenna of claim 1, wherein the antenna is configured to transmit the antenna signal,
The first metal coating, the second metal coating, the third metal coating and the fourth metal coating are rectangular with equal sizes and are symmetrical about the center point of the welding surface.
3. The antenna of claim 1, wherein the antenna is configured to transmit the antenna signal,
The fifth metal coating, the sixth metal coating, the seventh metal coating and the eighth metal coating are rectangles with equal sizes, the fifth metal coating is positioned at the center of the intersecting edge of the first side surface and the welding surface, the sixth metal coating is positioned at the center of the intersecting edge of the second side surface and the welding surface, the seventh metal coating is positioned at the center of the intersecting edge of the third side surface and the welding surface, and the eighth metal coating is positioned at the center of the intersecting edge of the fourth side surface and the welding surface.
4. The antenna of claim 1, wherein the antenna is configured to transmit the antenna signal,
The fifth metal coating, the sixth metal coating, the seventh metal coating and the eighth metal coating are all symmetrical about a straight line perpendicular to the welding surface and passing through the center point of the welding surface.
5. The antenna of claim 1, wherein the antenna is configured to transmit the antenna signal,
The dielectric matrix is a cuboid ceramic block, and the dielectric constant of the cuboid ceramic block is set to 9-40.
6. The antenna of claim 5, wherein the antenna is configured to transmit the antenna signal,
The length and the width of the cuboid ceramic block are equal, and the ratio of the length or the width of the cuboid ceramic block to the height of the ceramic block is 0.25-4.
7. A circuit board, comprising
A plate body;
The antenna according to any one of claims 1 to 6, wherein the dielectric substrate of the antenna is welded to the board body, and two adjacent ones of the first metal plating layer, the second metal plating layer, the third metal plating layer, and the fourth metal plating layer serve as feeding points, and the other two serve as welding points.
8. The circuit board of claim 7, wherein the circuit board is configured to,
The circuit board comprises a feed network, the feed network is arranged on the board body and is connected with the medium matrix, and the feed network comprises mutually perpendicular 50 omega microstrip lines.
9. A communication device comprising a circuit board according to any of claims 7-8.
CN202323247892.9U 2023-11-29 2023-11-29 Antenna, circuit board and communication equipment Active CN221328123U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202323247892.9U CN221328123U (en) 2023-11-29 2023-11-29 Antenna, circuit board and communication equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202323247892.9U CN221328123U (en) 2023-11-29 2023-11-29 Antenna, circuit board and communication equipment

Publications (1)

Publication Number Publication Date
CN221328123U true CN221328123U (en) 2024-07-12

Family

ID=91797482

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202323247892.9U Active CN221328123U (en) 2023-11-29 2023-11-29 Antenna, circuit board and communication equipment

Country Status (1)

Country Link
CN (1) CN221328123U (en)

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