CN221320065U - Vacuum cavity with uniform air flow distribution - Google Patents
Vacuum cavity with uniform air flow distribution Download PDFInfo
- Publication number
- CN221320065U CN221320065U CN202223187854.4U CN202223187854U CN221320065U CN 221320065 U CN221320065 U CN 221320065U CN 202223187854 U CN202223187854 U CN 202223187854U CN 221320065 U CN221320065 U CN 221320065U
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- shell
- air
- fan
- vacuum
- pipe
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- 238000009826 distribution Methods 0.000 title claims abstract description 11
- 238000007789 sealing Methods 0.000 claims abstract description 15
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 239000010453 quartz Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 238000009827 uniform distribution Methods 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 abstract description 9
- 238000001771 vacuum deposition Methods 0.000 abstract description 5
- 239000007888 film coating Substances 0.000 abstract description 2
- 238000009501 film coating Methods 0.000 abstract description 2
- 239000007789 gas Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000009504 vacuum film coating Methods 0.000 description 1
Abstract
The utility model discloses a vacuum cavity with uniform air flow distribution, which is applied to vacuum coating processing of wafers. The vacuum cavity comprises a shell for providing a vacuum processing space, an air inlet pipe positioned at the position of one side corresponding to the shell, a vacuumizing pipe positioned at the position of the other side corresponding to the shell, two groups of air homogenizing structures fixedly connected with the air inlet pipe and the vacuumizing pipe respectively, a sealing disc positioned at the bottom of the shell and a cavity sealing ring filled between the shell and the sealing disc. Each group of air homogenizing structures comprises a fan-shaped plate positioned in the shell, an air outlet formed in the position of the plate surface of the fan-shaped plate, and a branch pipe fixedly mounted on the corresponding fan-shaped plate. The utility model has special internal structure to disperse air flow, and the air flow is evenly distributed and acts on the surface of the product, so that the surface of the product forms a film layer with even thickness, and the quality of the film coating of the product is high when the product is processed in vacuum.
Description
Technical Field
The utility model relates to the field of vacuum cavities, in particular to a vacuum cavity with uniform air flow distribution.
Background
Such as wafers, semiconductors, and microelectronics, the constituent materials of which are affected by gas molecules can cause damage to electrical or optical properties, and the requirements for processing environments are severe, so that the devices need to be placed in a vacuum chamber for processing.
However, the traditional vacuum cavity is structurally a cover body and is matched with the sealing chassis to form an independent vacuum processing space, so that the vacuum processing space only plays a role in enclosing when the vacuum cavity is applied to wafer film coating processing, the function is single, the uniformity of film forming thickness on the surface of a wafer is uncontrollable, and the quality of vacuum film coating of a product cannot be controlled.
Disclosure of utility model
In view of the above-mentioned drawbacks of the prior art, an object of the present utility model is to provide a vacuum chamber with a uniform air flow distribution to achieve the effect that the air flow is uniformly distributed and acts on the surface of the product, so that a film layer with uniform thickness is formed on the surface of the product.
A vacuum chamber having a uniform airflow distribution, comprising:
A housing providing a vacuum processing space;
The air inlet pipe is positioned at the position of one side corresponding to the shell;
the vacuumizing tube is positioned at the position of the other side corresponding to the shell; and
The two groups of air homogenizing structures are fixedly connected with the air inlet pipe and the vacuumizing pipe respectively;
Each group of air homogenizing structures comprises a fan-shaped plate positioned in the shell, an air outlet formed in the position of the plate surface of the fan-shaped plate, and a branch pipe fixedly mounted on the corresponding fan-shaped plate.
In one embodiment, the shell, the air inlet pipe, the vacuumizing pipe and the air homogenizing structure are all made of quartz.
In one embodiment, the two groups of the fan-shaped plates are symmetrically distributed by taking the longitudinal axis of the shell as a center, and the fan-shaped plates are of a hollow structure; the branch pipe is fixedly connected to the side wall of the shell in a penetrating way.
Further, the branch pipe is positioned at one side and is used for communicating the air inlet pipe with the corresponding fan-shaped plate; the branch pipe is positioned at the other side and is used for communicating the vacuumizing pipe and the corresponding fan-shaped plate.
Still further, the air outlet is arranged back to the corresponding branch pipe; the number of the air outlets is a plurality of groups, and the air outlets of the groups are uniformly distributed.
In one embodiment, the vacuum cavity further comprises a sealing disk at the bottom of the housing, and a cavity sealing ring filled between the housing and the sealing disk.
Compared with the prior art, the utility model has the beneficial effects that: the vacuum coating device has the advantages that the device is provided with a special internal structure for dispersing air flow, the air flow is uniformly distributed and acts on the surface of a product, so that the effect of forming a film layer with uniform thickness on the surface of the product is achieved, the function of a vacuum cavity is enriched, and the coating quality of the product is high when the product is subjected to vacuum processing.
Drawings
Fig. 1 is a front view of a vacuum chamber with uniform airflow distribution.
Fig. 2 is a schematic diagram of the structure of fig. 1.
Fig. 3 shows the intake diagram of fig. 2.
Fig. 4 is a drawing of the vacuum of fig. 2.
Description of the main reference signs
1. A housing; 2. an air inlet pipe; 3. vacuumizing the tube; 4. a gas homogenizing structure; 41. a fan-shaped plate; 42. an air outlet; 43. and a branch pipe.
The foregoing general description of the utility model will be described in further detail with reference to the drawings and detailed description.
Detailed Description
The present utility model will be described in detail with reference to the accompanying drawings.
Referring to fig. 1-2, the present embodiment provides a vacuum chamber with uniform air flow distribution, which is applied to vacuum coating processing of wafers. The vacuum cavity comprises a shell 1 for providing a vacuum processing space, an air inlet pipe 2 positioned at the position of one side corresponding to the shell 1, an evacuating pipe 3 positioned at the position of the other side corresponding to the shell 1, two groups of air homogenizing structures 4 fixedly connected with the air inlet pipe 2 and the evacuating pipe 3 respectively, a sealing disc positioned at the bottom of the shell 1 and a cavity sealing ring filled between the shell 1 and the sealing disc.
The shell 1, the air inlet pipe 2, the vacuumizing pipe 3 and the air homogenizing structure 4 are all made of quartz. In this embodiment, the bottom of the housing 1 is sealed by a sealing disc and a cavity sealing ring, so as to form an independent vacuum processing space, which is separated from the external environment, and the wafer is placed in the vacuum processing space for vacuum coating treatment. It should be noted that, the sealing disc of the present embodiment is designed to have a through center, and a suitable carrier (such as a rotating disc for supporting a wafer) is adapted based on the through channel, so that the product (wafer) is placed in a vacuum processing space and is coated with a film, which is not described herein.
Wherein, each group of the air homogenizing structures 4 comprises a fan-shaped plate 41 positioned in the shell 1, an air outlet 42 arranged at the position of the plate surface of the fan-shaped plate 41, and a branch pipe 43 fixedly arranged on the corresponding fan-shaped plate 41.
The two groups of the fan-shaped plates 41 are symmetrically arranged by taking the longitudinal axis of the shell 1 as a center, and the fan-shaped plates 41 are of a hollow structure. The air outlets 42 are arranged back to the corresponding branch pipes 43, the number of the air outlets 42 is a plurality of groups, and the air outlets 42 of the plurality of groups are uniformly distributed. The branch pipe 43 is fixedly connected to the side wall of the shell 1 in a penetrating way, one side of the branch pipe 43 is used for communicating the air inlet pipe 2 with the corresponding fan-shaped plate 41, and the other side of the branch pipe 43 is used for communicating the vacuumizing pipe 3 with the corresponding fan-shaped plate 41.
In order to obtain a product with a uniform film formed on the surface when the product is processed by rotation, the housing 1 of the present embodiment is mounted with a uniform air structure 4, and the fan-shaped plate 41 is designed to disperse the air flow, and the air flow is uniformly distributed to act on the surface of the product, so that a film layer with a uniform thickness is formed on the surface of the product.
Referring to fig. 3-4, the vacuum chamber of the present embodiment has the following specific operation procedures:
during vacuum coating processing, special gas (such as oxygen and nitrogen) is introduced into the air inlet pipe 2, the gas enters the corresponding fan-shaped plate 41 along the branch pipe 43, and a plurality of groups of air outlets 42 uniformly distributed at the rear edge are dispersed and bulged and escape into a vacuum processing space provided by the shell 1, and at the moment, the surfaces of products (wafers) positioned in the space are uniformly contacted with the special gas, so that the effect of uniform film formation is achieved;
when the evacuation is performed, the intake pipe 2 is closed, and the evacuation operation is performed along the evacuation pipe 3.
In summary, compared with the conventional vacuum chamber structure, the vacuum chamber of the present embodiment has the following advantages: the vacuum cavity of this embodiment possesses special inner structure and disperses the air current, reaches air current evenly distributed and acts on product surface department for the product surface forms the effect of the even rete of thickness, has enriched the function of vacuum cavity, and the vacuum cavity of this embodiment is when carrying out the vacuum processing to the product, and the coating film quality of product is high.
The naming of the components involved is based on the functions described in the specification as naming standards, and is not limited by the specific terms used in the present utility model, and other terms may be selected by those skilled in the art to describe the names of the components of the present utility model.
Claims (6)
1. A vacuum chamber having a uniform airflow distribution, comprising:
A housing (1) providing a vacuum processing space;
an air inlet pipe (2) positioned at a position on a corresponding side of the housing (1);
The vacuumizing tube (3) is positioned at the position of the other side corresponding to the shell (1); and
Two groups of air homogenizing structures (4) which are respectively and fixedly connected with the air inlet pipe (2) and the vacuumizing pipe (3);
Each group of air homogenizing structures (4) comprises a fan-shaped plate (41) positioned in the shell (1), an air outlet (42) formed in the position of the plate surface of the fan-shaped plate (41), and a branch pipe (43) fixedly mounted on the corresponding fan-shaped plate (41).
2. The vacuum cavity with uniform air flow distribution according to claim 1, wherein the shell (1), the air inlet pipe (2), the vacuumizing pipe (3) and the air homogenizing structure (4) are all made of quartz materials.
3. A vacuum chamber with uniform air flow distribution according to claim 1, characterized in that two groups of the fan-shaped plates (41) are symmetrically arranged with the longitudinal axis of the shell (1) as the center, and the fan-shaped plates (41) are hollow structures;
the branch pipe (43) is fixedly connected at the side wall of the shell (1) in a penetrating way.
4. A vacuum chamber with a uniform distribution of air flow according to claim 3, characterized in that said branch pipe (43) is positioned on one side for communicating the air inlet pipe (2) with the corresponding sector plate (41);
the branch pipe (43) is positioned at the other side and is used for communicating the vacuumizing pipe (3) with the corresponding fan-shaped plate (41).
5. A uniformly distributed vacuum chamber according to claim 4, wherein the outlets (42) are arranged facing away from the corresponding branch pipe (43);
The number of the air outlets (42) is a plurality of groups, and the air outlets (42) of the plurality of groups are uniformly distributed.
6. A uniformly distributed air flow vacuum chamber as claimed in claim 1, further comprising a sealing disc at the bottom of the housing (1), and a chamber seal ring filled between the housing (1) and the sealing disc.
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221320065U true CN221320065U (en) | 2024-07-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant |