CN221305968U - Mobile phone back-mounted expansion equipment - Google Patents
Mobile phone back-mounted expansion equipment Download PDFInfo
- Publication number
- CN221305968U CN221305968U CN202323114676.7U CN202323114676U CN221305968U CN 221305968 U CN221305968 U CN 221305968U CN 202323114676 U CN202323114676 U CN 202323114676U CN 221305968 U CN221305968 U CN 221305968U
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- Prior art keywords
- mobile phone
- interface
- heat dissipation
- expansion
- shell
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 28
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 20
- 229910052782 aluminium Inorganic materials 0.000 claims description 20
- 239000004065 semiconductor Substances 0.000 claims description 20
- 238000005192 partition Methods 0.000 claims description 7
- 239000007787 solid Substances 0.000 claims description 6
- 239000002390 adhesive tape Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 238000001179 sorption measurement Methods 0.000 claims description 3
- 238000009434 installation Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract description 2
- 230000006870 function Effects 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
Abstract
The utility model relates to the field of mobile phone back-mounted expansion equipment, in particular to mobile phone back-mounted expansion equipment, which comprises a mobile phone, a connecting wire and expansion equipment, wherein the expansion equipment is connected with the mobile phone through the connecting wire, the rear surface of the expansion equipment is provided with a connecting structure, the surface of the expansion equipment is provided with a shell, the top surface of the shell is provided with an upper cover, the inner side of the shell is provided with a storage bin with an L-shaped structure, one side of the storage bin is provided with a heat dissipation bin, and the inner side of the storage bin is provided with a storage expansion module. The utility model provides a heat dissipation integrated body of a back-mounted mobile phone expander and a related installation method thereof.
Description
Technical Field
The utility model relates to the field, in particular to a mobile phone back-mounted expansion device.
Background
With the rapid development of technology, smart phones have more and more powerful functions, but are limited by physical dimensions and built-in hardware, and certain specific functions or performances under application scenarios still have certain limitations, so that some structures for expansion, such as the prior art with patent number CN210274147U, are added on the smart phones, and such similar devices are disclosed.
The existing expansion equipment has the defects that the wire is inconvenient to use due to the fact that the wire is connected with the expansion equipment directly, heat dissipation equipment is not arranged, and high temperature of a mobile phone and an expander is easily caused, so that a back-mounted mobile phone expander is needed to provide more additional function expansion, enhancement and mobile phone heat dissipation capacity on the basis that the hardware of the mobile phone is not changed.
Disclosure of utility model
The utility model aims to overcome the defects of the prior art, provide the mobile phone back-mounted expansion device, and solve the technical problems that the mobile phone back-mounted expansion device is easy to generate heat, the expansion interfaces are fewer, and the occupied area of the expansion device is overlarge when the expansion interfaces are more.
In order to solve the technical problems, the utility model provides the following technical scheme:
The mobile phone comprises a mobile phone, a connecting wire and expansion equipment, wherein the expansion equipment is connected with the mobile phone through the connecting wire, the rear surface of the expansion equipment is provided with a connecting structure, the surface of the expansion equipment is provided with a shell, the top surface of the shell is provided with an upper cover, the inner side of the shell is provided with a storage bin with an L-shaped structure, one side of the storage bin is provided with a heat dissipation bin, the inner side of the storage bin is provided with a storage expansion module, one end of the storage expansion module is provided with a connecting module, and the inner part of the heat dissipation bin is provided with a semiconductor radiator;
the storage expansion module comprises a storage expansion module, wherein a storage expansion module and a storage expansion module are arranged at the bottom of the storage expansion module, a TF interface is arranged at the upper end of one side of the TF interface, the M interface and the TF interface are arranged in an up-down staggered mode, an M solid state disk is arranged at the inner side of the M interface, the connection module comprises a PCB and a bottom access port, and the connection module is arranged at the bottom of the shell.
As a preferable technical scheme of the utility model, the top end of the semiconductor radiator is provided with a radiating aluminum row, one end of the radiating aluminum row is provided with a turbofan, the bottom end of the radiating aluminum row is provided with a semiconductor refrigerating sheet, one side surface of the radiating bin, which is far away from the storage bin, is provided with an air inlet, and the top end of the radiating bin is provided with an air outlet.
As a preferable technical scheme of the utility model, a partition plate with an L-shaped structure is arranged between the heat dissipation bin and the storage bin, heat conducting adhesive tapes are arranged on the surfaces of two sides of the partition plate, and the shell is made of aluminum materials.
As a preferable technical scheme of the utility model, the connecting structure is a magnetic ring or an adsorption disc structure, and the expanding equipment is connected with the mobile phone through the connecting structure.
As a preferable technical scheme of the utility model, the upper cover is arranged in a touch screen mode, the upper cover and the shell are detachably connected, and an opening of the TF interface is positioned on the surface of the shell.
As a preferable technical scheme of the utility model, the connecting module is respectively connected with the upper cover, the m. interface and the semiconductor radiator, and the turbofan is connected with the radiating fins of the radiating aluminum row.
Compared with the prior art, the utility model has the following beneficial effects:
The utility model provides a heat dissipation integrated body of a back-mounted mobile phone expander and a related installation method thereof.
The utility model integrates various connecting modules and heat dissipation systems, and the inside of the heat dissipation system comprises a plurality of types c and tf card slots outside an M.2 interface to provide sufficient external storage for the mobile phone and further connect the earphone with the possibility of external power supply; the upper cover of the device is a touch screen, so that the device is convenient to use a rear camera of the mobile phone for self-shooting and mobile phone control, and the device is provided with a semiconductor radiator to avoid unstable caused by overhigh temperature of the mobile phone and the device when the device is attached to the back of the mobile phone, so that the device is convenient to carry and use, and the original appearance and operation habit of the mobile phone are not changed; the enhancement and expansion of multiple functions can be realized rapidly, and the practicability and user experience of the mobile phone are improved.
Drawings
The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the embodiments of the utility model, serve to explain the utility model. In the drawings:
FIG. 1 is a schematic view of the overall structure of the present utility model;
FIG. 2 is a split view of the modular structure of the present utility model;
FIG. 3 is an exploded view of the expansion device of the present utility model;
FIG. 4 is a top view of the expansion device of the present utility model;
In the figure: 1. a mobile phone; 101. a connecting wire; 2. expanding equipment; 201. a housing; 202. an upper cover; 203. a storage bin; 204. a heat dissipation bin; 3. a storage expansion module; 301. a TF interface; 302. m.2 interface; 303. m.2 solid state disk; 4. a connection module; 5. a semiconductor heat sink; 501. a heat-dissipating aluminum row; 502. a turbo fan; 503. a semiconductor refrigeration sheet; 6. an air inlet; 601. an air outlet; 7. a partition plate; 8. and a magnetic ring.
Detailed Description
The preferred embodiments of the present utility model will be described below with reference to the accompanying drawings, it being understood that the preferred embodiments described herein are for illustration and explanation of the present utility model only, and are not intended to limit the present utility model.
Wherein like reference numerals refer to like elements throughout.
Example 1
As shown in fig. 1-4, the utility model provides a mobile phone back-mounted expansion device, which comprises a mobile phone 1, a connecting wire 101 and an expansion device 2, wherein the expansion device 2 and the mobile phone 1 are connected through the connecting wire 101, the rear surface of the expansion device 2 is provided with a connecting structure, the surface of the expansion device 2 is provided with a shell 201, the top surface of the shell 201 is provided with an upper cover 202, the inner side of the shell 201 is provided with a storage bin 203 with an L-shaped structure, one side of the storage bin 203 is provided with a heat dissipation bin 204, the inner side of the storage bin 203 is provided with a storage expansion module 3, one end of the storage expansion module 3 is provided with a connecting module 4, and the inner part of the heat dissipation bin 204 is provided with a semiconductor radiator 5;
The bottom of storing expansion module 3 is provided with TF interface 301, and M.2 interface 302 is installed to one side upper end of TF interface 301, is the crisscross setting from top to bottom between M.2 interface 302 and the TF interface 301, and M.2 solid-state hard disk 303 is installed to the inboard of M.2 interface 302, and connecting module 4 includes PCB board and bottom access mouth, and connecting module 4 is located the bottom of shell 201.
The top of semiconductor radiator 5 is provided with heat dissipation aluminium row 501, and turbofan 502 is installed to the one end of heat dissipation aluminium row 501, and semiconductor refrigeration piece 503 is installed to the bottom of heat dissipation aluminium row 501, and the side surface that heat dissipation storehouse 204 kept away from storage storehouse 203 is provided with into wind gap 6, and the top of heat dissipation storehouse 204 is provided with air outlet 601.
A partition plate 7 with an L-shaped structure is arranged between the heat dissipation bin 204 and the storage bin 203, heat conducting adhesive tapes are arranged on the surfaces of two sides of the partition plate 7, and the shell 201 is made of aluminum materials.
The connecting structure is a magnetic ring 8 or an adsorption disc structure, and the expanding equipment is connected with the mobile phone through the connecting structure.
The upper cover 202 is arranged in a touch screen mode, the upper cover 202 and the shell are detachably connected, and an opening of the TF interface 301 is located on the surface of the shell 201.
The connection module 4 is respectively connected with the upper cover 202, the M.2 interface 302 and the semiconductor radiator 5, the turbofan 502 is connected with the radiating fins of the radiating aluminum row 501, and a plurality of typec interfaces are arranged at the bottom of the connection module 4.
Specifically, the whole device is an expansion device 2 installed based on the mobile phone 1, the expansion device 2 is electrically connected with the mobile phone through a connecting wire 101, a power supply required by the expansion device 2 is provided, the expansion device is mechanically connected with the mobile phone 1 based on a connecting structure, the connecting structure is a detachable mechanism such as a sucker or a magnetic ring 8, and the like, then the expansion device 2 can be directly connected into the mobile phone 1 to adapt and use the M.2 solid state disk 303 and an additionally installed TF disk, or the expansion device is connected to a wireless connection module or other devices and the like based on the connecting module 4, for example, a plurality of typec interfaces at the bottom of the connecting module 4 can be respectively connected with a power supply device, an external microphone or a wireless module and the like.
The expansion device 2 comprises a shell 201 and an upper cover 202, a slot with a TF interface 301 is arranged on the left side surface of the shell 201, a socket with a connection module 4 is arranged at the bottom, and the connection module 4 can be connected with the connection line 101; inside the housing 201, a storage bin 203 with an L-shaped structure and a heat dissipation bin 204 with a rectangular structure are provided, and the storage bin 203 comprises a stacked socket structure: the M.2 interface 302 is arranged at the tail end, and one end, far away from the M.2 interface 302, of the inner side of the shell 201 is provided with a screw hole for installing the M.2 solid state disk 303; the m.2 interface 302 is arranged at a high position and is installed on a PCB board of the connection module 4, the TF interface 301 is arranged at a lower position, namely, as shown in fig. 3, when the m.2 solid state disk 303 is installed, the TF interface 301 is blocked at the bottom, the stacked structure can increase internal expansion sockets under a limited internal space, the PCB board can be made into an L shape when necessary, and the L shape is arranged upwards along with the structure of the TF interface 301, so that the expansion device 2 is additionally provided with a plurality of plug-in flash memory cards with different sizes according to actual requirements.
The semiconductor radiator 5 is arranged in the radiating bin 204, the semiconductor radiator 5 is tightly attached to the back of the baffle 7 and the back of the shell 201, and the back of the shell 201 is connected with the mobile phone 1, so that the semiconductor radiator 5 can exchange heat with the shell 201 made of an aluminum structure based on a heat conduction teaching strip, and the heat of the mobile phone 1 and the storage bin 203 is reduced; the semiconductor radiator 5 includes a heat dissipating aluminum row 501 and a turbo fan 502, the semiconductor cooling plate 503 at the bottom of the heat dissipating aluminum row 501 is continuously cooled at the side facing the mobile phone 1, the side close to the heat dissipating aluminum row 501 is in a heating shape, and forms a heat dissipating effect through the cooling plate on the heat dissipating aluminum row 501, finally, air is pumped in from the air inlet 6 of the housing 201, hot air is exhausted from the air outlet 601, the air inside is circulated, dust in the air cannot enter the storage bin 203, dust accumulation in the storage bin 203 is avoided, and air is exhausted from the air inlet on the special design side surface of the ultrathin radiator, so that discomfort of the hand due to hot air blowing can be avoided.
Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present utility model, and the present utility model is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present utility model has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
Claims (6)
1. The mobile phone back-mounted expansion device comprises a mobile phone (1), a connecting wire (101) and expansion equipment (2), wherein the expansion equipment (2) is connected with the mobile phone (1) through the connecting wire (101), the rear surface of the expansion equipment (2) is provided with a connecting structure, and the mobile phone back-mounted expansion device is characterized in that the surface of the expansion equipment (2) is provided with a shell (201), the top surface of the shell (201) is provided with an upper cover (202), the inner side of the shell (201) is provided with a storage bin (203) with an L-shaped structure, one side of the storage bin (203) is provided with a heat dissipation bin (204), the inner side of the storage bin (203) is provided with a storage expansion module (3), one end of the storage expansion module (3) is provided with a connecting module (4), and the inner part of the heat dissipation bin (204) is provided with a semiconductor radiator (5);
the storage expansion module (3) is characterized in that a TF interface (301) is arranged at the bottom end of the storage expansion module (3), an M.2 interface (302) is arranged at the upper end of one side of the TF interface (301), the M.2 interface (302) and the TF interface (301) are arranged in an up-down staggered mode, an M.2 solid state disk (303) is arranged at the inner side of the M.2 interface (302), the connection module (4) comprises a PCB and a bottom access port, and the connection module (4) is located at the bottom end of the shell (201).
2. The mobile phone back-mounted expansion device according to claim 1, wherein a heat dissipation aluminum row (501) is arranged at the top end of the semiconductor radiator (5), a turbofan (502) is arranged at one end of the heat dissipation aluminum row (501), a semiconductor refrigerating sheet (503) is arranged at the bottom end of the heat dissipation aluminum row (501), an air inlet (6) is arranged on one side surface of the heat dissipation bin (204) far away from the storage bin (203), and an air outlet (601) is arranged at the top end of the heat dissipation bin (204).
3. The mobile phone back-mounted expansion device according to claim 1 or 2, wherein a partition board (7) with an L-shaped structure is arranged between the heat dissipation bin (204) and the storage bin (203), heat conducting adhesive tapes are arranged on two side surfaces of the partition board (7), and the shell (201) is made of aluminum materials.
4. The mobile phone back-mounted expansion device according to claim 1, wherein the connecting structure is a magnetic ring (8) or an adsorption disc structure, and the expansion device is connected with the mobile phone through the connecting structure.
5. The mobile phone back extension device according to claim 1, wherein the upper cover (202) is provided with a touch screen, and the upper cover (202) and the housing are detachably connected, and an opening of the TF interface (301) is located on the surface of the housing (201).
6. The mobile phone back-mounted expansion device according to claim 2, wherein the connection module (4) is respectively connected with the upper cover (202), the m.2 interface (302) and the semiconductor radiator (5), the turbofan (502) is connected with the radiating fins of the radiating aluminum row (501), and a plurality of typec interfaces are arranged at the bottom and the side surface of the connection module (4).
Publications (1)
Publication Number | Publication Date |
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CN221305968U true CN221305968U (en) | 2024-07-09 |
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