CN202153328U - Heat Dissipation Structure of Computer Power Supply - Google Patents

Abstract

A heat dissipation structure of a computer power supply mainly includes a base body, the base body has a back plate and a front plate, wherein the lower end position of the back plate is provided with a plurality of through holes, a circuit module is provided at the bottom position of the base body, and a fan unit is provided inside the base body. The fan unit is a cross-flow fan, the fan unit is electrically connected to the circuit module, and the fan unit has an air outlet, and the air outlet corresponds to the through hole position of the back plate. Finally, the base body is correspondingly connected to a cover plate, whereby after the cover plate is correspondingly connected to the base body, a space is formed inside the base body, and the heat dissipation inside the base body of the power supply is accelerated through the suction effect of the fan unit provided in the space.

Description

Heat Dissipation Structure of Computer Power Supply

technical field

The utility model relates to a power supply applied to a personal computer (PC), in particular to a heat dissipation structure of a computer power supply with improved heat dissipation effect.

Background technique

The operation of any electronic device requires a power supply, especially the current large-scale electronic equipment, such as a personal computer, because its interior is composed of multiple groups of different electronic components, based on different power requirements, so the power supply should be used And born.

In order to provide multiple sets of power supply capabilities and to meet the needs of different electronic components, the power supply is equipped with electronic components such as step-down rectifier winding rectifiers and wires, although the purpose of the power supply is to provide power to On electronic equipment, the essence of the above-mentioned electronic components is still the same. Under long-term operation of electronic components, heat sources will be generated. Excessive heat will increase the impedance and affect the normal performance of electronic components. Therefore, a cooling device is installed necessary.

As far as the known technology is concerned, installing a fan in the power supply to dissipate heat is the most common method at present. With the rotation of the fan blades, the air inside and outside the power supply will flow rapidly, and the air and After heat exchange, the electronic components are taken away from the inside of the power supply to maintain the temperature inside the power supply.

However, because the known power supply itself has many electronic components and wires inside, but its internal design is poor, resulting in the flow of air is not smooth and the airflow space is insufficient, so that the original fan cannot fully provide the power supply. The hot air that has been heat-exchanged inside is discharged outside, so the hot air continues to stay inside, making the inside accumulate heat and the temperature cannot be lowered. In this situation, the power output of the power supply is continuously reduced The usage is affected in turn, resulting in the instability of its power supply. At the same time, the temperature rise will cause the electronic components to be easily damaged and affect their life.

In order to improve the above deficiencies, those skilled in the art install a large fan with a size of 12 or 14 cm on the inside of the upper cover of the power supply, and use the large fan to draw cold air from the outside to blow the internal electronic components to achieve heat dissipation. In terms of structure, the large fan is located inside the upper cover, the motor is located at the center of the fan, and the heat-generating electronic components at the center are not blown by the air to dissipate heat, so the electronic components at all positions inside it cannot have a good cooling effect. The heat dissipation environment; secondly, after the fan draws in the cold air and blows it to the electronic components, it needs to turn 90 degrees and discharge it to the perforated hole on its side. It is not a smooth flow channel, and the wall of the perforated hole still has certain wind resistance. The air convection effect is not as expected; moreover, it is generally used in PS2 computer power supplies, where Intel limits its specifications to L: 140~210×W: 150×H: 86(mm)L, W, H is length, width, and height, that is to say, the maximum height of the power supply that can be loaded is 86mm. For example, if the thickness of the large fan is generally 25mm, after deducting the necessary installation clearance, the height of the circuit board and electronic components It must not exceed 50mm. As a result of this restriction, not only the interior of the power supply is crowded after assembly, but also the height of all available electronic components after assembly is limited, generally not higher than 50mm. Therefore, it is necessary to change the selection of electronic components. It is basically impossible to replace to achieve better economy, or to use electronic components with larger specifications or power to increase the output of the power supply, so there are still some missing parts.

Furthermore, such as the patent case No. M248230 of China Taiwan Patent Announcement, it is mainly a set of matching shells and upper covers, and a circuit structure, electronic parts and double-suction turbines are arranged in the accommodation space between the shells and the upper covers. Fan; the upper and lower ends of the double-suction turbofan are provided with corresponding air inlets, and one side is provided with an air outlet. heat dissipation;

This type of double-suction turbofan not only has poor working efficiency, but also occupies the upper space of the housing and the upper cover, making the internal air flow of the power supply not smooth, and the convection effect is not good, which indirectly prevents the circuit and electronic components from being able to dissipate heat quickly and effectively. Or, the motor of the double-suction turbofan is located at the center, and the center is almost flat without airflow. Therefore, it cannot provide heat dissipation for the high-heating windings, rectifiers and other electronic components, and at the same time, the heat dissipation effect of the internal space is not good.

Utility model content

In view of the above-mentioned deficiency, the main purpose of this utility model is to provide a heat dissipation structure of a computer power supply, which improves the space planning of the power supply, and makes the inside of the power supply form a kind of omni-directional air flow line circulation flow The inner space can be changed or selected according to different needs. It is no longer limited by the height of the original space. It also makes good use of the principle of cold air falling and hot air rising, and uses fans to draw hot air at a better position. In order to improve its heat dissipation efficiency and improve its working performance.

In order to achieve the above purpose, the utility model mainly provides a heat dissipation structure of a computer power supply, which mainly includes a base body, the base body has a front plate and a back plate, and the back plate is provided with perforations; a circuit module, It is located at the bottom of the base body; a fan unit is located inside the base body and is electrically connected to the circuit module. The fan unit has an air outlet corresponding to the perforation position of the back plate; a cover plate corresponding to Connecting the base body; wherein after the cover plate is correspondingly connected with the base body, a space is formed inside the base body, and the heat dissipation inside the base body is accelerated through the sucking effect of the fan unit.

Wherein, one side of the backboard is also provided with a female socket.

Wherein, one side of the backboard is also provided with a switch unit.

Wherein, a socket group is also provided inside the seat body, and at least one socket is arranged on it to be electrically connected with the circuit module. The socket group is arranged on the front board, and the socket is exposed outside the front board.

Wherein, the front plate is also provided with a through hole.

Wherein, a wire is also included, which is passed through the through hole and electrically connected with the circuit module.

Wherein, the wire is also connected to a socket set.

Wherein, the socket set has any one or both of a male end or a female end socket.

Wherein, the through hole is also provided with a female terminal socket, and is electrically connected with the circuit module.

Wherein, the cover plate is ㄇ-shaped, and air holes are arranged on either side of its two sides.

Wherein, a groove is provided on the upper edge of the back plate, and a gap is formed on the top surface of the cover plate. The cover plate and the seat body are combined, and the position of the gap corresponds to the position of the fan unit. Locked end to side.

Wherein, the cover sheet is L-shaped.

Wherein, the cover sheet is a transparent plate.

Wherein, the fan unit is a cross-flow fan.

Wherein, the lower end of the front plate is provided with a plurality of through slots.

Wherein, the lower end of the backboard is provided with a perforation.

Through the above solution, the arrangement of the internal space of the power supply can be improved to be open, so as to provide better convection guidance, so that the heat generated by the heating electronic components can be quickly discharged, so as to reduce its operating temperature and improve its efficiency and service life. The open space inside the power supply can further enhance the freedom of selection of electronic components, thereby increasing its power output.

In order to make the above and other objects, features and advantages of the present invention more comprehensible, preferred embodiments will be described in detail below together with the accompanying drawings.

Description of drawings

Fig. 1 is the exploded front view of the three-dimensional structure of the present utility model.

Fig. 2 is an exploded rear view of the three-dimensional structure of the utility model.

Fig. 3 is the combined completion figure of the utility model.

Fig. 4 is the use status diagram of the utility model.

Fig. 5 is a schematic diagram of the heat dissipation state of the utility model.

Fig. 6 is a schematic structural diagram of another embodiment of the present invention.

Fig. 7 is a schematic structural diagram of another embodiment of the present invention.

Fig. 8 is a completed assembly diagram of yet another embodiment of the utility model.

Symbol Description

Seat 1

Backplane 11 Groove 111

Perforation 112 Female socket 113

Switch unit 114 Front panel 12

Groove 121 Through hole 122

Circuit module 2 Fan unit 3

Fan blade group 31 Air outlet 32

Socket group 4 plug 41, 41a

Wire 5 Cover Plate 6

Gap 61 Cover 7

Screw assembly 8 conductor wire 9

Male wire 100 Female terminal seat 200

Socket set 300

Detailed ways

Please refer to Fig. 1 and Fig. 2, which are the exploded front view and rear view of the three-dimensional structure of the present invention. The back plate 11 and a front plate 12, wherein a groove 111 is provided on the back plate 11, a plurality of perforations 112 are provided below the groove 111, and a female socket is provided below the perforations 112 113, and a switch unit 114 is provided on the female socket 113; and a step-down and rectifying circuit module 2 is provided at the inner bottom of the seat body 1, and the circuit module 2 is connected to the aforementioned female socket 113 and the switch The unit 114 is electrically connected, and a fan unit 3 is further provided inside the base body 1. The fan unit 3 is electrically connected to the circuit module 2. In this embodiment, the fan unit 3 is a cross-flow fan. The unit 3 has a fan blade set 31, and an air outlet 32 is provided below the fan blade set 31, and the position of the air outlet 32 corresponds to the positions of the plurality of perforations 112 of the back plate 11; 12 is provided with a plurality of slots 121, and a socket set 4 is provided inside the back plate 11. The socket set 4 is electrically connected to the circuit module 2, and a plug 41 is provided on the socket set 4. In this embodiment Among them are a plurality of square plugs 41, and the socket set 4 passes outward from the inside of the front plate 12, so that these plugs 41 are exposed outside the front plate 12, as shown in the rear view of Figure 2, the socket set 4 A plurality of plugs 41 are used for external connection wires 9, as shown in the use state diagram of Figure 4, a through hole 122 is provided on one side of the front plate 12, and a wire 5 is passed through the through hole 122. , the wire 5 is electrically connected to the circuit module 2, and the other end is plugged into the main board or other electronic components; finally, the base body 1 is connected to a cover plate 6 corresponding to each other, and the cover plate 6 is ㄇ-shaped. One or both sides of the bottom edge can be selected to be provided with air holes (not shown), and there is a notch 61 on the top surface of the cover plate 6. After the cover plate 6 is connected with the base body 1, the position of the notch 61 is exactly Corresponding to the upper position of the fan unit 3, the notch 61 of the cover plate 6 is further joined with a cover piece 7, the cover piece 7 is L-shaped, and in this embodiment the cover piece 7 is a transparent plate, the cover piece 7 is engaged with the notch 61 of the cover plate 6 and locked with the screw assembly 8, and then connected with the seat body 1 correspondingly, the short side of the cover plate 7 just engages with the groove 111 of the seat body 1 , and locked with screw assembly 8 to complete the structure of the entire power supply, its assembled view is shown in Figure 3, and the transparent cover 7 can provide the working state of the fan unit 3 from the outside.

Please refer to FIG. 4 and FIG. 5 , which are respectively the usage state diagram and the heat dissipation state diagram of the utility model. As shown in the figure, the power supply of the present invention is connected to the conductive wire 9 of the electronic device to provide power for the motherboard or the electronic device, and when the heat source generated by the circuit module 2 inside the power supply during operation, Exchange heat with the cold air that enters the inside of the power supply from the multiple slots 121 below the front panel 12, as shown by the arrow in FIG. state, and because the design of the utility model provides the inner space of the base body 1 as a space for the electronic components to generate hot air rising and converging, the fan blade group 31 of the fan unit 3 located inside the base body 1 can be easily and quickly The heat-generating electronic components are inhaled from the top of the seat body 1, and the rising hot air is released, and sent to the air outlet 32 through the fan blade set 31, and then passed through the multiple perforations 112 of the back plate 11 and sent out of the seat body 1. , to complete the heat dissipation mechanism of the power supply to ensure the normal operation of the power supply; in addition, it should be specially noted that the inner space of the power supply is an open space without barriers, so that the height of the electronic components can be set without restriction , which can provide the degree of freedom in the selection of its electronic components, thereby increasing the power output.

Please refer to FIG. 6 , which is a schematic structural diagram of another embodiment of the present invention. As shown in the figure, the wire 5 installed in the through hole 122 of the base body 1 of the present invention can also be equipped with a female terminal socket 200, and is electrically connected with the circuit module to connect a male terminal externally. The wire 100 and the plug 41 of the socket set 4 can also be changed to a circular plug 41a in this embodiment.

Please refer to FIG. 7 , which is a schematic structural diagram of another embodiment of the present invention. As shown in the figure, the power supply in this embodiment moves the socket set 4 to form an electrical connection with the wire 5 to form the socket set 300 in this figure, and the socket set 300 has different male or female terminal socket.

It should be emphasized that the design of the transparent cover sheet 7 covering between the notch 61 and the groove 111 is not a necessary requirement for limiting the implementation of the present utility model. As shown in Figure 8, it is another embodiment of the present utility model. The complete picture of the combination of the embodiment, the power supply includes a base body 1, the base body 1 has a back plate 11 and a front plate 12, the back plate 11 is provided with a plurality of perforations 112, a female socket 113, a switch unit 114, the base body 1 is provided with a circuit module 2 inside and the fan unit 3 of the cross-flow fan type is installed in the inner space of the base body 1 through a screw assembly 8 (please also refer to Figure 1 and Figure 2), and the cover plate 6 corresponds to cover the base body 1 to complete Assembling the power supply, the fan blade set 31 of the fan unit 3 inside the base body 1 attracts the heat-generating electronic components on the circuit module 2 to dissipate rising hot air, and sends it to the air outlet 32 through the fan blade set 31, and then passes out. A plurality of perforations 112 of the back plate 11 are discharged.

The above-mentioned implementation mode is a preferred embodiment, and should not limit the implementation scope of the present utility model. If the equivalent changes or modifications made according to the protection scope of the present utility model and the content of the description, all should belong to the utility model within the scope of the claims.

Claims (16)

1. the heat-dissipating structure of a computer power supply supply is characterized in that, comprising:

One pedestal, this pedestal have a header board and a backboard, and this backboard offers perforation;

One circuit module is located at the bottom position in this pedestal;

One fan unit, it is inner and be electrically connected this circuit module to be located at this pedestal, and this fan unit has an air outlet, and this air outlet is to punch position that should backboard;

One cover plate, corresponding this pedestal that connects;

Wherein after the corresponding connection of this cover plate,, draw the suction effect, quicken the inner thermolysis of pedestal via fan unit in the inner space that forms of this pedestal with this pedestal.

2. the heat-dissipating structure of computer power supply supply as claimed in claim 1 is characterized in that, a side of this backboard also is provided with a female end socket.

3. the heat-dissipating structure of computer power supply supply as claimed in claim 1 is characterized in that, a side of this backboard also is provided with a switch element.

4. the heat-dissipating structure of computer power supply supply as claimed in claim 1 is characterized in that, pedestal inside also is provided with a socket group; Which is provided with at least one socket; Electrically connect with this circuit module, this socket assembling is located on this header board, and makes this socket expose to the header board outside.

5. the heat-dissipating structure of computer power supply supply as claimed in claim 1 is characterized in that, also is provided with a through hole on this header board.

6. the heat-dissipating structure of computer power supply supply as claimed in claim 5 is characterized in that, also comprises a lead, is arranged in this through hole and with this circuit module to electrically connect.

7. the heat-dissipating structure of computer power supply supply as claimed in claim 6 is characterized in that, this lead also connects a joint chair group.

8. the heat-dissipating structure of computer power supply supply as claimed in claim 7 is characterized in that, this joint chair group have a public end or female termination seat each or and deposit.

9. the heat-dissipating structure of computer power supply supply as claimed in claim 5 is characterized in that, also is provided with a female termination seat on this through hole, and electrically connects with this circuit module.

10. the heat-dissipating structure of computer power supply supply as claimed in claim 1 is characterized in that, this cover plate is the ㄇ type, and the either side of its both sides is provided with pore.

11. the heat-dissipating structure of computer power supply supply as claimed in claim 1; It is characterized in that this backboard upper limb offers a groove, the end face of cover plate has a breach; Cover plate and pedestal combination; The position of the corresponding fan unit of gap position, breach also engages a cover plate, and the cover plate other end and groove ends side chain are solid.

12. the heat-dissipating structure of computer power supply supply as claimed in claim 11 is characterized in that, this cover plate is the L type.

13. the heat-dissipating structure of computer power supply supply as claimed in claim 11 is characterized in that, this cover plate is a transparent panel.

14. the heat-dissipating structure of computer power supply supply as claimed in claim 1 is characterized in that, this fan unit is a cross flow fan.

15. the heat-dissipating structure of computer power supply supply according to claim 1 or claim 2 is characterized in that, the lower end position of this header board is provided with a plurality of grooves of wearing.

16. the heat-dissipating structure of computer power supply supply as claimed in claim 1 is characterized in that, the lower end position of this backboard offers perforation.

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