CN202153328U - Heat radiation structure of computer power supply - Google Patents
Heat radiation structure of computer power supply Download PDFInfo
- Publication number
- CN202153328U CN202153328U CN2011201983079U CN201120198307U CN202153328U CN 202153328 U CN202153328 U CN 202153328U CN 2011201983079 U CN2011201983079 U CN 2011201983079U CN 201120198307 U CN201120198307 U CN 201120198307U CN 202153328 U CN202153328 U CN 202153328U
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- Prior art keywords
- power supply
- heat
- computer power
- dissipating structure
- pedestal
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Abstract
A heat radiation structure of a computer power supply comprises a base body, which comprises a back plate and a front plate; the lower end of the back plate is provided with a plurality of through holes; the bottom in the base body is provided with a circuit model; a fan unit, which is a transverse flow fan, is also disposed in the base body; the fan unit is in electrical connection with the circuit module; the fan unit is provided with an air outlet, which is corresponding to through hole positions of the back plate; the base body is correspondingly connected with a cover plate; a space is formed inside the base body after the corresponding connection between the cover plate and the seat body; and the fan unit disposed in the space accelerates heat radiation in the base body of the power supply through suction effect.
Description
Technical field
The utility model is the power supply unit that is applied to personal computer (PC) about a kind of, and finger has the heat-dissipating structure of the computer power supply supply of great heat radiation effect enhancement especially.
Background technology
The running of any electronic installation all needs the power supply supply just can carry out; Particularly existing large scale electronic equipment is like personal computer, because its inside is made up of electronic packages different more than a plurality of groups; Based on different electricity needs, so power supply unit arises at the historic moment.
Because power supply unit is in order to provide the power supply capacity of many groups; Simultaneously in order to satisfy the demand of different electronic modules; Be provided with the electronic package and the leads such as winding rectifier of step-down rectifier in its power supply unit, though the purpose of power supply unit is to provide power supply to electronic equipment, the essence of aforesaid electronic package is still identical; Electronic package is under long-time running; Can produce thermal source, too much heat effect meeting improves impedance and has influence on the normal usefulness of electronic package, and it is necessary therefore installing heat abstractor additional.
With regard to known technology; It then is present modal a kind of means that the interior installing of power supply unit fan dispels the heat; Through under the turn of electric fan, the inner generation fast with air outside of power supply unit flowed, carry out heat exchange action by air and electronic package after; Band is inner from power supply unit again, to keep the power supply unit temperature inside.
Yet, itself just be provided with numerous electronic packages with lead because known power supply unit is inner, but its indoor design is bad; Cause the mobile moving-wire of air to have some setbacks not enough with airflow space; The hot-air that causes original fan can't provide power supply unit inside to carry out heat interchange fully discharges, so those hot-airs continue to put and stay in the inside, and its inner product heat and temperature can't be descended; Under the continuous vicious cycle of this situation; Make the electric power output of this power supply unit operating position is related to be affected, cause the instability in its power supply, it is to cause electronic package to be easy to damage and influence its life-span that simultaneous temperature raises.
For improving above-mentioned disappearance; Those skilled in the art are provided with the large-scale fan of 12 or 14 centimeters specifications at the loam cake inner face of power supply unit; Utilize this large-scale fan to draw cool ambient air internal electrical components is blown, to reach radiating effect, with regard to said structure; This large-scale fan is located at the loam cake inboard; This motor is positioned at the fan center position, and the heating electronic component of this center does not have the windblast heat radiation, so the electronic package of its inner each position is not that good heat dissipation environment can both be arranged; Secondly, after the cold air that fan draws entering blowed to electronic package, discharged in the hole of engraving that need turn 90 degrees its side of angle, and it is not a runner smoothly, and the wall of engraving the hole still has certain windage, causes the cross-ventilation effect and not as expection; Moreover, generally be applied to the computer power supply supply of PS2 specification, wherein Intel is a length to be restricted to L:140～210 * W:150 * H:86 (mm) L, W, H of its specification; That is to say that can provide power supply unit to load maximum height is 86mm, for example, if the thickness of this large-scale fan is 25mm generally; Deduction falls necessary assemblage gap; The height of this circuit board and electronic package must not exceed 50mm, and the result of restriction is not only inner crowded to capacity after this power supply unit assembling like this; And limit the height after its assembling of all electronic packages that can supply select for use; Therefore generally must not be higher than 50mm, want to change displacement that electronic package is selected for use reaching preferable economy, or the electronic package of selecting big specification or power for use is to improve the output of power supply unit; Basically all being impossible, is to still have its disappearance.
Moreover, like TaiWan, China patent announcement M248230 patent case, be mainly one group of housing that matches and loam cake, be provided with circuit structure, electronic component and double suction turbofan at housing and the folded accommodation space of loam cake; The upper and lower end face of this double suction turbofan is provided with corresponding inlet scoop, and the one of which side is provided with exhaust outlet, and double suction turbofan and loam cake are combined into one and suspend horizontal kenel, the heat radiation that provides in view of the above in midair;
Not only work efficiency is poor for the double suction turbofan of this pattern, and the superjacent air space of same account for housing and loam cake has some setbacks the power supply unit internal gas flow; Convection effects is bad, makes circuit and electronic component efficiently radiates heat fast indirectly, in addition the person; The motor of this double suction turbofan is positioned at the center, and this center be near flat do not have distinguished and admirable, therefore; The heat radiation of the electronic packages such as winding, rectifier of this height heating can't be provided, cause the inner space radiating effect not good simultaneously.
The utility model content
To above-mentioned disappearance; The fundamental purpose of the utility model is to provide a kind of heat-dissipating structure of computer power supply supply, improves on this power supply unit space planning, makes the inside of this power supply unit form the interior space that a kind of comprehensive air-flow moving-wire circulates; And can change or select its part setting according to different demands; No longer receive outside the restriction of original spatial altitude, and the kind principle that rises with cold air decline hot-air, and be used fan and draw hot-air in better position; To promote its radiating efficiency, promote its task performance.
For reaching above-mentioned purpose, the utility model mainly provides a kind of heat-dissipating structure of computer power supply supply, mainly comprises a pedestal, and this pedestal has a header board and a backboard, and this backboard offers perforation; One circuit module is located at the bottom position in this pedestal; One fan unit, it is inner and be electrically connected this circuit module to be located at this pedestal, and this fan unit has an air outlet, and this air outlet is to punch position that should backboard; One cover plate, corresponding this pedestal that connects; Wherein after the corresponding connection of this cover plate,, draw the suction effect, quicken the inner thermolysis of pedestal via fan unit in the inner space that forms of this pedestal with this pedestal.
Wherein, a side of this backboard also is provided with a female end socket.
Wherein, a side of this backboard also is provided with a switch element.
Wherein, pedestal inside also is provided with a socket group, which is provided with at least one socket, electrically connects with this circuit module, and this socket assembling is located on this header board, and makes this socket expose to the header board outside.
Wherein, also be provided with a through hole on this header board.
Wherein, also comprise a lead, be arranged in this through hole and electrically connect with this circuit module.
Wherein, this lead also connects a joint chair group.
Wherein, this joint chair group have a public end or female termination seat each or and deposit.
Wherein, also be provided with a female termination seat on this through hole, and electrically connect with this circuit module.
Wherein, this cover plate is the ㄇ type, and the either side of its both sides is provided with pore.
Wherein, this backboard upper limb offers a groove, and the end face of cover plate has a breach, cover plate and pedestal combination, and the position of the corresponding fan unit of gap position, breach also engages a cover plate, and the cover plate other end and groove ends side chain are solid.
Wherein, this cover plate is the L type.
Wherein, this cover plate is a transparent panel.
Wherein, this fan unit is a cross flow fan.
Wherein, the lower end position of this header board is provided with a plurality of grooves of wearing.
Wherein, the lower end position of this backboard offers perforation.
Through such scheme, it is open to improve being arranged to of power supply unit inner space, so that preferable convection current guiding to be provided; Make the electronic package of heating produce heat; Can discharge fast, to reduce its working temperature and to promote efficient and serviceable life, space in other this open power supply unit; More can promote the degree of freedom that electronic package is selected for use, and then increase its power output.
For let the above-mentioned of the utility model and other purpose, feature and advantage can be more obviously understandable, hereinafter is special lifts preferred embodiment, and conjunction with figs., elaborates as follows.
Description of drawings
Fig. 1 is the spatial structure exploded front view of the utility model.
Fig. 2 is the spatial structure decomposing rearview of the utility model.
Fig. 3 is that figure is accomplished in the combination of the utility model.
Fig. 4 is the user mode figure of the utility model.
Fig. 5 is the radiating state synoptic diagram of the utility model.
Fig. 6 is the structural representation of another embodiment of the utility model.
Fig. 7 is the structural representation of the another embodiment of the utility model.
Fig. 8 is the utility model combination completion figure of an embodiment again.
Symbol description
Switch element 114 header boards 12
Wear groove 121 through holes 122
Breach 61 cover plates 7
Screw assembly 8 connects line 9
Public end lead 100 female termination seats 200
Joint chair group 300
Embodiment
See also Fig. 1 and Fig. 2, for the spatial structure exploded front view and the rear view of the utility model, as shown in the figure; The heat-dissipating structure of the computer power supply supply of the utility model mainly comprises a pedestal 1; This pedestal 1 has a backboard 11 and a header board 12, wherein is provided with a groove 111 in this backboard 11, then is provided with a plurality of perforation 112 in these groove 111 lower positions; Then be provided with a female end socket 113 in those belows, 112 positions of boring a hole, hold 113 of sockets to be provided with a switch element 114 in this mother in addition; Again; Then be provided with the circuit module 2 of a step-down rectifier in this pedestal 1 interior bottom portion position; This circuit module 2 forms electric connection in aforesaid female end socket 113 and switch element 114, more is provided with a fan unit 3 in this pedestal 1 inside in addition, and this fan unit 3 electrically connects with this circuit module 2; This fan unit 3 is a cross flow fan in present embodiment; This fan unit 3 has a flabellum group 31, then is provided with an air outlet 32 in these flabellum group 31 belows, and the position of this air outlet 32 is just corresponding to a plurality of perforation 112 positions of this backboard 11; In addition, on this header board 12, then offer a plurality of grooves 121 of wearing, then be provided with a socket group 4 in these backboard 11 inboards; This socket group 4 is electrically connected on this circuit module 2, is provided with a plug 41 in this socket group 4, is a plurality of square plugs 41 in present embodiment; This socket group 4 is outwards passed by these header board 12 inboards, makes those plugs 41 expose to this header board 12 outsides, shown in the rear view of Fig. 2; A plurality of plugs 41 of this socket group 4 use in order to the external line 9 that connects; Shown in the user mode figure of Fig. 4, offer a through hole 122 in a side position of this header board 12, on this through hole 122, then be equipped with a lead 5; This lead 5 is electrically connected on this circuit module 2, and the other end and motherboard or other electronic package are pegged graft; At last, the corresponding each other cover plate 6 that connects of this pedestal 1, this cover plate 6 is the ㄇ type; Its both sides root edge can select one of which or both sides that pore (figure do not show) is set, and the end face in this cover plate 6 has a breach 61 in addition, behind this cover plate 6 and pedestal 1 corresponding joint; The position of this breach 61 is just to top position that should fan unit 3, and the breach 61 of this cover plate 6 more engages a cover plate 7, and this cover plate 7 is L-shaped; And this cover plate 7 is a transparent panel in present embodiment, and this cover plate 7 is prior to the breach 61 corresponding joints of this cover plate 6 and with screw assembly 8 lockings, again with pedestal 1 mutual corresponding connection after; The minor face lamellar body of this cover plate 7 just is engaged in the groove 111 of pedestal 1; And with screw assembly 8 lockings, to accomplish the structure of whole power supply unit, it is as shown in Figure 3 that figure is accomplished in its combination; And this transparent cover plate 7 can provide the duty of being inspected this fan unit 3 by the outside.
See also Fig. 4 and Fig. 5, be respectively the user mode figure and the radiating state synoptic diagram of the utility model.As shown in the figure; What the power supply unit of the utility model connected electronic installation connects line 9; In order to providing motherboard or electronic device power to use, and when the inner circuit module 2 of power supply unit at the thermal source that operation produced, wear groove 121 with this header board 12 belows certainly a plurality of to enter the inner cold air of power supply unit and carry out heat interchange; Shown in the graphic arrow of Fig. 5; And after cold air absorbs the thermal source converting to hot air, promptly produce propradation, and, make this flabellum group 31 of being located at the inner fan unit 3 of this pedestal 1 suck the hot-air that those heating electronic packages shed and rise from pedestal 1 inner and upper fast easily because the design of the utility model is provided as electronic package with the inner space of pedestal 1 and produces the space that a hot-air rises and converges; And see through flabellum group 31 and deliver to this air outlet 32; The a plurality of perforation 112 that pass this backboard 11 are again seen off outside the pedestal 1, and are to accomplish this power supply unit cooling mechanism, normal to guarantee this power supply unit running; In addition, specify that the interior space of this power supply unit is a without hindrance space of putting that separates, make the electronic package height is set can be unrestricted, can provide its electronic package to select degree of freedom for use, and then increase power output.
See also Fig. 6, be the structural representation of another embodiment of the utility model.As shown in the figure, the utility model is installed in the lead 5 of the through hole 122 of this pedestal 1, also can install a female termination seat 200; And electrically connect with this circuit module; In order to external one public end lead 100, the plug 41 of this socket group 4 also can change the circular plug 41a in the present embodiment in addition.
See also Fig. 7, be the structural representation of the another embodiment of the utility model.As shown in the figure, the power supply unit in the present embodiment moves to socket group 4 with this lead 5 and forms electric connection, forms like the joint chair group 300 in this diagram, has different public affairs ends or female termination seat respectively in 300 of this joint chair groups.
Wanting ben is; This transparent cover plate 7 is covered on the design between breach 61 and the groove 111, and the essential important document of unrestricted the utility model enforcement, and is wherein as shown in Figure 8; For the embodiment again of the utility model makes up completion figure; This power supply unit comprises a pedestal 1, and pedestal 1 has a backboard 11 and a header board 12, and backboard 11 is provided with a plurality of perforation 112 and female end socket 113, switch element 114; Pedestal 1 inside is provided with circuit module 2 and through screw assembly 8 fan unit 3 of this cross flow fan pattern is installed in pedestal 1 inner space (please and with reference to figure 1, Fig. 2); Cover plate 6 correspondences cover pedestal 1, to accomplish the assembling of power supply unit, and the hot gas that makes the flabellum group 31 of the inner fan unit 3 of pedestal 1 attract the heating electronic package on the circuit modules 2 to shed and rise; See through flabellum group 31 and deliver to air outlet 32, a plurality of perforation 112 that pass backboard 11 are again discharged.
Above-described embodiment; Be to be preferred embodiment; When can not limiting the utility model practical range,, all should belong within the scope that the utility model claim contained if the equivalence of doing according to the utility model protection domain and description changes or modifies with this.
Claims (16)
1. the heat-dissipating structure of a computer power supply supply is characterized in that, comprising:
One pedestal, this pedestal have a header board and a backboard, and this backboard offers perforation;
One circuit module is located at the bottom position in this pedestal;
One fan unit, it is inner and be electrically connected this circuit module to be located at this pedestal, and this fan unit has an air outlet, and this air outlet is to punch position that should backboard;
One cover plate, corresponding this pedestal that connects;
Wherein after the corresponding connection of this cover plate,, draw the suction effect, quicken the inner thermolysis of pedestal via fan unit in the inner space that forms of this pedestal with this pedestal.
2. the heat-dissipating structure of computer power supply supply as claimed in claim 1 is characterized in that, a side of this backboard also is provided with a female end socket.
3. the heat-dissipating structure of computer power supply supply as claimed in claim 1 is characterized in that, a side of this backboard also is provided with a switch element.
4. the heat-dissipating structure of computer power supply supply as claimed in claim 1 is characterized in that, pedestal inside also is provided with a socket group; Which is provided with at least one socket; Electrically connect with this circuit module, this socket assembling is located on this header board, and makes this socket expose to the header board outside.
5. the heat-dissipating structure of computer power supply supply as claimed in claim 1 is characterized in that, also is provided with a through hole on this header board.
6. the heat-dissipating structure of computer power supply supply as claimed in claim 5 is characterized in that, also comprises a lead, is arranged in this through hole and with this circuit module to electrically connect.
7. the heat-dissipating structure of computer power supply supply as claimed in claim 6 is characterized in that, this lead also connects a joint chair group.
8. the heat-dissipating structure of computer power supply supply as claimed in claim 7 is characterized in that, this joint chair group have a public end or female termination seat each or and deposit.
9. the heat-dissipating structure of computer power supply supply as claimed in claim 5 is characterized in that, also is provided with a female termination seat on this through hole, and electrically connects with this circuit module.
10. the heat-dissipating structure of computer power supply supply as claimed in claim 1 is characterized in that, this cover plate is the ㄇ type, and the either side of its both sides is provided with pore.
11. the heat-dissipating structure of computer power supply supply as claimed in claim 1; It is characterized in that this backboard upper limb offers a groove, the end face of cover plate has a breach; Cover plate and pedestal combination; The position of the corresponding fan unit of gap position, breach also engages a cover plate, and the cover plate other end and groove ends side chain are solid.
12. the heat-dissipating structure of computer power supply supply as claimed in claim 11 is characterized in that, this cover plate is the L type.
13. the heat-dissipating structure of computer power supply supply as claimed in claim 11 is characterized in that, this cover plate is a transparent panel.
14. the heat-dissipating structure of computer power supply supply as claimed in claim 1 is characterized in that, this fan unit is a cross flow fan.
15. the heat-dissipating structure of computer power supply supply according to claim 1 or claim 2 is characterized in that, the lower end position of this header board is provided with a plurality of grooves of wearing.
16. the heat-dissipating structure of computer power supply supply as claimed in claim 1 is characterized in that, the lower end position of this backboard offers perforation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201983079U CN202153328U (en) | 2011-06-09 | 2011-06-09 | Heat radiation structure of computer power supply |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201983079U CN202153328U (en) | 2011-06-09 | 2011-06-09 | Heat radiation structure of computer power supply |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202153328U true CN202153328U (en) | 2012-02-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201983079U Expired - Fee Related CN202153328U (en) | 2011-06-09 | 2011-06-09 | Heat radiation structure of computer power supply |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202153328U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106105409A (en) * | 2013-11-06 | 2016-11-09 | 思科技术公司 | System and device for network equipment heat management |
-
2011
- 2011-06-09 CN CN2011201983079U patent/CN202153328U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106105409A (en) * | 2013-11-06 | 2016-11-09 | 思科技术公司 | System and device for network equipment heat management |
| US10776553B2 (en) | 2013-11-06 | 2020-09-15 | Cisco Technology, Inc. | Techniques for optimizing dual track routing |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120229 Termination date: 20140609 |