CN221282078U - Slide glass platform of film sticking machine and film sticking machine - Google Patents
Slide glass platform of film sticking machine and film sticking machine Download PDFInfo
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- CN221282078U CN221282078U CN202322849516.0U CN202322849516U CN221282078U CN 221282078 U CN221282078 U CN 221282078U CN 202322849516 U CN202322849516 U CN 202322849516U CN 221282078 U CN221282078 U CN 221282078U
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- 239000011521 glass Substances 0.000 title claims description 4
- 239000002699 waste material Substances 0.000 claims description 17
- 238000004891 communication Methods 0.000 claims description 14
- 238000007747 plating Methods 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 3
- 239000012528 membrane Substances 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 238000001179 sorption measurement Methods 0.000 abstract description 10
- 235000012431 wafers Nutrition 0.000 description 51
- 238000000034 method Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 4
- 230000010354 integration Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 210000004400 mucous membrane Anatomy 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a film loading platform of a film sticking machine and the film sticking machine. The platform is used for bearing a wafer, and the surface of the platform is provided with: a first annular groove that is centrally symmetric about a center point of the platform surface; the second annular groove is centrally symmetrical around the center point of the surface of the platform; the second annular groove is arranged on the outer side of the first annular groove in a surrounding mode, and the first annular groove and the second annular groove are communicated with the air pump so as to form a vacuum environment inside the first annular groove and the second annular groove. Through setting up a plurality of annular grooves on the platform surface, a plurality of annular grooves become vacuum environment with the wafer that the platform surface born and then promote the adsorption affinity of platform to the wafer, promote the production efficiency of laminator.
Description
Technical Field
The utility model relates to the technical field of semiconductor manufacturing equipment, in particular to a film loading platform of a film sticking machine and the film sticking machine.
Background
In the semiconductor manufacturing process, the wafer film attaching process is a key technology. To achieve higher integration and smaller device sizes, the wafer is subjected to a series of processes, including thinning processes. The thinning process is to reduce the thickness of the wafer from the original thickness to a thinner state, so that the higher device integration requirement can be met. In this process, in order to protect the wafer from damage, a protective film needs to be applied to the surface thereof.
A laminator (e.g., takatori ATM 1100 ka) is a type of laminator suitable for 4 inch, 5 inch, 6 inch and 8 inch wafers. However, when a thin wafer (thickness of less than 400 μm) is subjected to film lamination, the film lamination opportunity is alerted. The thick mucous membrane is adhered to the wafer, and the thick mucous membrane is cut by the blade and then adhered to the wafer, so that the wafer is separated from the waste film, and the edge of the wafer is deformed, so that vacuum leakage is caused, the adsorption force of the platform to the wafer is reduced, and the wafer is shifted and lifted. Frequent alarms of the laminator can affect production efficiency and also reduce product quality.
Therefore, in order to enhance the adsorption force of the laminator platform, the platform needs to be optimized and improved to increase the production efficiency.
Disclosure of Invention
The utility model aims to provide a film loading platform of a film sticking machine and the film sticking machine. Through setting up a plurality of annular grooves on the platform surface, a plurality of annular grooves become vacuum environment with the wafer that the platform surface born and then promote the adsorption affinity of platform to the wafer, promote the production efficiency of laminator.
In order to solve the above problems, the present utility model provides a slide platform of a film sticking machine, the platform is used for carrying a wafer, and the surface of the platform is provided with: a first annular groove that is centrally symmetric about a center point of the platform surface; the second annular groove is centrally symmetrical around the center point of the surface of the platform; the second annular groove is arranged on the outer side of the first annular groove in a surrounding mode, and the first annular groove and the second annular groove are communicated with the air pump so as to form a vacuum environment inside the first annular groove and the second annular groove.
In some embodiments, the platform surface is further provided with a communication groove connected between the first annular groove and the second annular groove, enabling the air pump to communicate with both the first annular groove and the second annular groove.
In some embodiments, a through hole is provided at a bottom of at least one of the first annular groove, the second annular groove, and the communication groove, and penetrates the platform, so that the first annular groove, the communication groove, and the second annular groove communicate with the air pump.
In some embodiments, the bottom of the first annular groove and the bottom of the second annular groove are both provided with through holes, which penetrate through the platform so that the first annular groove and the second annular groove communicate with the air pump.
In some embodiments, the shape of the first annular groove and the second annular groove are each independently selected from one of a circle, a triangle, or a square.
In some embodiments, the platform includes a main body and a step, the first annular groove and the second annular groove are disposed at a first end of the main body, the step is disposed at a second end of the main body and circumferentially disposed around the main body, and a fixing hole is disposed on the step, and the fixing hole is used for fixing the platform on a base of a laminator, and the first end and the second end are opposite ends of the main body.
In some embodiments, the mesa surface is provided with a plating or the mesa surface is blackened.
In order to solve the problems, the utility model also provides a film sticking machine, which comprises a waste film tray, a cutter and the platform, wherein the platform is used for bearing wafers; the cutter is arranged above the platform and is used for cutting the film on the wafer carried by the platform; the waste film tray is sleeved on the outer side of the platform.
In some embodiments, a third annular groove is arranged on the surface, close to the edge of the platform, of the waste film tray, and a through hole is arranged on the third annular groove and is used for connecting an air pump.
According to the technical scheme, the first annular groove and the second annular groove which are symmetrical around the center point of the surface of the platform are formed in the surface of the platform, and meanwhile, the first annular groove and the second annular groove are connected with the air pump. When the platform bears the wafer, a vacuum environment is formed between the wafer and the first annular groove and between the wafer and the second annular groove, so that the adsorption force of the platform to the wafer is improved, and the production efficiency is further improved.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the utility model as claimed. Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but should be considered part of the specification where appropriate.
Drawings
In order to more clearly illustrate the technical solutions of the specific manner of the present utility model, the drawings that are required to be used in the embodiments of the present utility model will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person of ordinary skill in the art.
Fig. 1 is a schematic structural diagram of a slide platform of a laminator according to an embodiment of the utility model;
Fig. 2 is a perspective view of a slide platform of a laminator according to an embodiment of the utility model;
fig. 3 is a schematic structural diagram of a slide platform of a film sticking machine according to a second embodiment of the present utility model;
fig. 4 is a perspective view of a slide platform of a laminator provided in the second embodiment of the utility model;
fig. 5 is a cross-sectional view of a laminator according to an embodiment of the utility model.
Description of main reference numerals:
10. a platform; 11. a main body; 12. a step; 121. a fixing hole; 21. a first annular groove; 22. a second annular groove; 23. a communication groove; 24. a through hole; 30. an air pump; 40. a base; 41. a waste film tray; 411. a third annular groove; 42. a cutter; 43. and (3) a wafer.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In order to solve the problems in the prior art, the embodiment of the utility model provides a slide glass platform of a film sticking machine and the film sticking machine. Through setting up a plurality of annular grooves on the platform surface, a plurality of annular grooves become vacuum environment with the wafer that the platform surface born and then promote the adsorption affinity of platform to the wafer, promote the production efficiency of laminator.
Example 1
The following first describes a slide platform of a film sticking machine according to an embodiment of the present utility model.
Referring to fig. 1 to fig. 2, fig. 1 is a schematic structural diagram of a slide platform of a laminator provided in an embodiment of the utility model, and fig. 2 is a perspective view of a slide platform of a laminator provided in an embodiment of the utility model.
As shown in fig. 1, the stage 10 is configured to carry a wafer, and a surface of the stage 10 is provided with: a first annular groove 21, said first annular groove 21 being centrally symmetrical about a centre point of the surface of said platform 10. A second annular groove 22, said second annular groove 22 being centrally symmetrical about a centre point of the surface of said platform 10. The second annular groove 22 is disposed around the outside of the first annular groove 21, and the first annular groove 21 and the second annular groove 22 are communicated with the air pump 30, so as to form a vacuum environment inside the first annular groove 21 and the second annular groove 22.
The present embodiment provides the first annular groove 21 and the second annular groove 22 on the surface of the platform 10, which are center-symmetrical around the center point of the surface of the platform 10, while connecting the first annular groove 21 and the second annular groove 22 with the air pump 30. When the platform 10 carries a wafer, a vacuum environment is formed between the wafer and the first annular groove 21 and between the wafer and the second annular groove 22, so as to improve the adsorption force of the platform 10 on the wafer and further improve the production efficiency.
In this embodiment, the platform surface is also provided with a communication groove 23. The communication groove 23 is connected between the first annular groove 21 and the second annular groove 22, so that the air pump 30 can communicate with the first annular groove 21 and the second annular groove 22 at the same time. Since the stage 10 carries the wafer, when the air pump 30 is operated, the air in the first annular groove 21 and the air in the second annular groove 22 are exhausted through the air pump 30, and a vacuum environment is formed between the first annular groove 21 and the wafer and between the second annular groove 22 and the wafer.
In this embodiment, a through hole 24 is provided at the bottom of at least one of the first annular groove 21, the second annular groove 22, and the communication groove 23, and the through hole 24 penetrates the platform 10, so that the first annular groove 21, the communication groove, and the second annular groove 22 communicate with the air pump 30. Since the communication groove 23 communicates the first annular groove 21 and the second annular groove 22, when the bottom of at least one of the first annular groove 21, the second annular groove 22, and the communication groove 23 is provided with the through hole 24, the gas in the first annular groove 21, the second annular groove 22, and the communication groove 23 can be discharged to the outside environment through the through hole 24 by means of the air pump 30 to form a vacuum environment.
In this embodiment, the shape of the first annular groove 21 and the second annular groove 22 are each independently selected from one of a circular ring, a regular triangle, or a square. The first annular groove 21 and the second annular groove 22 are formed in a shape that is centrosymmetric with respect to a center point of the stage so that the wafer is uniformly adsorbed on the surface of the stage 10.
As shown in fig. 1 and 2, in the present embodiment, the platform 10 includes a main body 11 and a step 12, the first annular groove 21 and the second annular groove 22 are disposed at a first end of the main body 11, the step 12 is located at a second end of the main body 11 and circumferentially disposed around the main body 11, a fixing hole 121 is disposed on the step 12, and the fixing hole 121 is used for fixing the platform 10 on a base 40 of a film laminating machine, where the first end and the second end are opposite ends of the main body 11. The height of the step 12 is lower than that of the main body 11, and the step 12 provides support for the main body 11, thereby improving the stability of the main body 11.
In this embodiment, the surface of the platform 10 is provided with a plating layer or the surface of the platform 10 is blackened, so that the surface of the platform 10 has low adhesion. Since the diameter of the wafer is smaller than that of the stage 10, in order to prevent the waste film from adhering to the surface of the stage 10, it is necessary to reduce the adhesion of the stage 10, thereby ensuring the working efficiency of the apparatus.
Example two
The second embodiment of the utility model provides a slide platform of a film sticking machine.
Fig. 3 to 4 are schematic diagrams of a slide platform of a laminator according to the second embodiment of the present utility model, and fig. 4 is a perspective view of the slide platform of the laminator according to the second embodiment of the present utility model.
As shown in fig. 3, the stage 10 is configured to carry a wafer, and a surface of the stage 10 is provided with: a first annular groove 21, said first annular groove 21 being centrally symmetrical about a centre point of the surface of said platform 10. A second annular groove 22, said second annular groove 22 being centrally symmetrical about a centre point of the surface of said platform 10. The second annular groove 22 is disposed around the outside of the first annular groove 21, and the first annular groove 21 and the second annular groove 22 are communicated with the air pump 30, so as to form a vacuum environment inside the first annular groove 21 and the second annular groove 22.
The present embodiment provides the first annular groove 21 and the second annular groove 22 on the surface of the platform 10, which are center-symmetrical around the center point of the surface of the platform 10, while connecting the first annular groove 21 and the second annular groove 22 with the air pump 30. When the platform 10 carries a wafer, a vacuum environment is formed between the wafer and the first annular groove 21 and between the wafer and the second annular groove 22, so as to improve the adsorption force of the platform 10 on the wafer and further improve the production efficiency.
In this embodiment, through holes 24 are formed at the bottom of the first annular groove 21 and the bottom of the second annular groove 22, and the through holes 24 penetrate the platform 10, so that the first annular groove 21 and the second annular groove 22 communicate with the air pump 30. Since the first annular groove 21 and the second annular groove 22 are both communicated with the air pump 30, the air in the first annular groove 21 and the second annular groove 22 can be discharged to the outside environment through the through hole 24 by means of the air pump 30 to form a vacuum environment.
In this embodiment, the shape of the first annular groove 21 and the second annular groove 22 are each independently selected from one of a circular ring, a regular triangle, or a square. The shapes of the first annular groove 21 and the second annular groove 22 are centrosymmetric with respect to the center point of the stage so that the wafer is uniformly adsorbed on the surface of the stage 10.
As shown in fig. 3 and 4, in the present embodiment, the platform 10 includes a main body 11 and a step 12, the first annular groove 21 and the second annular groove 22 are disposed at a first end of the main body 11, the step 12 is located at a second end of the main body 11 and circumferentially disposed around the main body 11, a fixing hole 121 is disposed on the step 12, and the fixing hole 121 is used for fixing the platform 10 on a base 40 of a film laminating machine, where the first end and the second end are opposite ends of the main body 11. The height of the step 12 is lower than that of the main body 11, and the step 12 provides support for the main body 11, thereby improving the stability of the main body 11.
In this embodiment, the surface of the platform 10 is provided with a plating layer or the surface of the platform 10 is blackened, so that the surface of the platform 10 has low adhesion. Since the diameter of the wafer is smaller than that of the stage 10, in order to prevent the waste film from adhering to the surface of the stage 10, it is necessary to reduce the adhesion of the stage 10, thereby ensuring the working efficiency of the apparatus.
Based on the same inventive concept, the utility model also provides a film sticking machine.
The following describes a film sticking machine according to an embodiment of the present utility model. Referring to fig. 5, fig. 5 is a cross-sectional view of a laminator according to an embodiment of the utility model.
As shown in fig. 5, the laminator includes a waste film tray 41 and a cutter 42. The laminator also includes a platen 10 according to the present utility model, the platen 10 is configured to carry a wafer 43. The cutter 42 is disposed above the platform 10, and is used for cutting the film on the wafer 43 carried by the platform 10. The waste film tray 41 is sleeved outside the platform 10. The platform 10 includes a body 11 and a step 12. The waste film tray 41 is sleeved outside the main body 11 of the platform 10, and the waste film tray 41 is fixed on the base 40 of the film sticking machine. In order to ensure the flatness of the film, the surface of the wafer 43 carried by the stage 10 is substantially flush with the surface of the waste film tray 41.
In this embodiment, a third annular groove 411 is disposed on the surface of the waste film tray 41 near the edge of the platform 10, and a through hole is disposed on the third annular groove 411 for connecting with the air pump 30. When the film is covered on the wafer 43, the film exceeding the wafer area is covered on the waste film tray 41, at this time, the air pump 30 is in a working state, the air pump 30 makes a vacuum environment between the third annular groove 411 and the film, and generates an adsorption force on the film in the non-wafer area, which is helpful for the cutter 42 to cut the film and separate the waste film at the same time, so as to improve the working efficiency of the film sticking machine.
The above technical solution is to provide the first annular groove 21 and the second annular groove 22 on the surface of the platform 10, which are centrosymmetric around the center point of the surface of the platform 10, and simultaneously connect the first annular groove 21 and the second annular groove 22 with the air pump 30. When the platform 10 carries the wafer 43, a vacuum environment is formed between the wafer 43 and the first annular groove 21 and between the wafer 43 and the second annular groove 22, so as to improve the adsorption force of the platform 10 on the wafer 43 and further improve the production efficiency.
It is noted that relational terms such as second and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, the statement "comprises" and "comprises" does not exclude the presence of other elements than those listed in any process, method, article, or apparatus that comprises the element.
In this specification, each embodiment is described in a related manner, and identical and similar parts of each embodiment are all referred to each other, and each embodiment mainly describes differences from other embodiments.
The foregoing is merely a preferred embodiment of the present utility model and is not intended to limit the scope of the present utility model. It should be noted that modifications and adaptations to the present utility model may occur to one skilled in the art without departing from the principles of the present utility model and are intended to be comprehended within the scope of the present utility model.
Claims (9)
1. Slide glass platform of laminator, the platform is used for bearing the wafer, its characterized in that, the platform surface is provided with:
a first annular groove that is centrally symmetric about a center point of the platform surface;
The second annular groove is centrally symmetrical around the center point of the surface of the platform; the second annular groove is arranged on the outer side of the first annular groove in a surrounding mode, and the first annular groove and the second annular groove are communicated with the air pump so as to form a vacuum environment inside the first annular groove and the second annular groove.
2. The platform of claim 1, wherein the platform surface is further provided with a communication groove connected between the first annular groove and the second annular groove, enabling the air pump to communicate with both the first annular groove and the second annular groove.
3. The platform of claim 2, wherein a bottom of at least one of the first annular groove, the second annular groove, and the communication groove is provided with a through hole penetrating the platform such that the first annular groove, the communication groove, and the second annular groove communicate with the air pump.
4. The platform of claim 1, wherein the bottom of the first annular groove and the bottom of the second annular groove are each provided with a through hole that penetrates the platform such that the first annular groove and the second annular groove communicate with the air pump.
5. The platform of claim 1, wherein the first annular groove and the second annular groove are each independently shaped from one of a circle, a triangle, or a square.
6. The platform of claim 1, wherein the platform comprises a main body and a step, the first annular groove and the second annular groove are disposed at a first end of the main body, the step is disposed at a second end of the main body and circumferentially around the main body, a fixing hole is disposed on the step, the fixing hole is used for fixing the platform on a base of a laminator, and the first end and the second end are opposite ends of the main body.
7. The platform of claim 1, wherein the platform surface is provided with a plating or the platform surface is blackened.
8. The utility model provides a laminator, includes useless membrane tray and cutter, its characterized in that:
The laminator further comprising a platen according to any one of claims 1 to 7 for carrying a wafer;
The cutter is arranged above the platform and is used for cutting the film on the wafer carried by the platform;
the waste film tray is sleeved on the outer side of the platform.
9. The laminator of claim 8, wherein a third annular groove is formed in a surface of the waste film tray adjacent to the platform edge, and a through hole is formed in the third annular groove for connecting an air pump.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322849516.0U CN221282078U (en) | 2023-10-23 | 2023-10-23 | Slide glass platform of film sticking machine and film sticking machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322849516.0U CN221282078U (en) | 2023-10-23 | 2023-10-23 | Slide glass platform of film sticking machine and film sticking machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221282078U true CN221282078U (en) | 2024-07-05 |
Family
ID=91701525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322849516.0U Active CN221282078U (en) | 2023-10-23 | 2023-10-23 | Slide glass platform of film sticking machine and film sticking machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221282078U (en) |
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2023
- 2023-10-23 CN CN202322849516.0U patent/CN221282078U/en active Active
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