CN221225767U - Display module and display device - Google Patents

Abstract

The application discloses a display module and a display device, and belongs to the technical field of display. The display module includes: display panel, drive chip and buffer protection layer. Since the buffer protection layer is arranged in the display module, the driving chip in the display module can be buffer-protected, so that after the display module is assembled on the frame body in the display device, even after the display device falls or is impacted, the probability of collision between the frame body in the display device and the driving chip in the display module can be ensured to be lower through the buffer protection layer. Therefore, the driving chip is not easy to damage, and the reliability of the display device is improved. In addition, because the buffer foam layer is arranged on the display panel in the display module, the structure of the display panel is simpler, and therefore, the buffer protection layer can be arranged on the display panel by adopting automatic laminating equipment, so that the efficiency of arranging the buffer foam layer on the display panel is higher.

Description

Display module and display device

Technical Field

The application relates to the technical field of display, in particular to a display module and a display device.

Background

With the development of display technology, the demand and application range of display devices are expanding. Common display devices include mobile phones, televisions, tablet computers, notebook computers, displays and the like.

The display device may generally include: a display module and a frame (also commonly referred to as a center). Wherein, the display module assembly can include: the display panel and the driving chip which is connected with the display panel in a binding way.

However, after the display device falls or is impacted, the frame body in the display device and the driving chip in the display module are easily collided, so that the driving chip is easily damaged, and the reliability of the display device is lower.

Disclosure of utility model

The embodiment of the application provides a display module and a display device. The problem of lower reliability of the display device can be solved, and the technical scheme is as follows:

In one aspect, a display module is provided, including:

A display panel, the display panel comprising: the display panel comprises a first panel part, a second panel part and a panel bending part, wherein the first panel part and the second panel part are arranged in parallel and oppositely, the panel bending part is used for connecting the first panel part and the second panel part, and a display area of the display panel is positioned in the first panel part;

a driving chip which is in binding connection with one side of the second panel part, which is away from the first panel part;

And a buffer protection layer bonded with one side of the second panel part away from the first panel part, wherein the driving chip is positioned between the buffer protection layer and the second panel part.

Optionally, the front projection of the driving chip on the second panel part is located in the front projection of the buffer protection layer on the second panel part.

Optionally, the thickness of the buffer protection layer ranges from 0.1 mm to 0.5mm in a direction perpendicular to the display surface of the first panel part.

Optionally, a horizontal distance between each side edge of the buffer protection layer in the orthographic projection on the second panel part and a corresponding side edge of the driving chip in the orthographic projection on the second panel part is greater than or equal to 1 millimeter.

Optionally, the display module further includes: a first insulating layer and a conductive shield layer which are stacked between the second panel portion and the buffer protection layer, the first insulating layer being closer to the second panel portion than the conductive shield layer;

Wherein a part of the first insulating layer covers the driving chip, and the other part of the first insulating layer is attached to the second panel part; at least a portion of the conductive shielding layer covering the driver chip is present.

Optionally, a side of the buffer protection layer facing the second panel part is attached to a side of the conductive shielding layer facing away from the second panel part; the display module assembly still includes: the second insulation layer is positioned on one side of the buffer protection layer, which is away from the second panel part, and the orthographic projection of the conductive shielding layer on the second panel part is positioned in the orthographic projection of the second insulation layer on the second panel part.

Optionally, the second insulating layer includes: a first insulating protection portion and a second insulating protection portion; the first insulating protection part covers one side of the buffer protection layer, which is away from the second panel part, and the side surface of the buffer protection layer; and the second insulation protection part is attached to the part, which is not covered by the buffer protection layer, of the conductive shielding layer.

Optionally, one sides of the first insulating layer, the conductive shielding layer and the second insulating layer are all flush with one side of the second panel portion facing away from the panel bending portion; and the other sides of the first insulating layer, the conductive shielding layer and the second insulating layer are all flush with one side of the second panel part, which faces towards the panel bending part.

In another aspect, there is provided a display device including: the display module is characterized by comprising a frame body and a display module connected with the frame body, wherein the display module is any one of the display modules.

Optionally, the frame body includes: an annular side plate and a bottom plate connected with one side of the side plate;

The display module is located in the area surrounded by the side plates, and one side of the bottom plate, facing the display module, is provided with: and the avoiding groove is arranged corresponding to the driving chip.

The technical scheme provided by the embodiment of the application has the beneficial effects that:

A display module includes: display panel, drive chip and buffer protection layer. Since the buffer protection layer is arranged in the display module, the driving chip in the display module can be buffer-protected, so that after the display module is assembled on the frame body in the display device, even after the display device falls or is impacted, the probability of collision between the frame body in the display device and the driving chip in the display module can be ensured to be lower through the buffer protection layer. Therefore, the driving chip is not easy to damage, and the reliability of the display device is improved. In addition, because the buffer foam layer is arranged on the display panel in the display module, the structure of the display panel is simpler, and therefore, the buffer protection layer can be arranged on the display panel by adopting automatic laminating equipment, so that the efficiency of arranging the buffer foam layer on the display panel is higher.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of a display module according to an embodiment of the present application;

fig. 2 is a schematic structural diagram of another display module according to an embodiment of the present application;

fig. 3 is a schematic structural diagram of another display module according to an embodiment of the application;

fig. 4 is a schematic structural diagram of a display device according to an embodiment of the present application.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the present application more apparent, the embodiments of the present application will be described in further detail with reference to the accompanying drawings.

Referring to fig. 1, fig. 1 is a schematic structural diagram of a display module according to an embodiment of the application. The display module 000 may include: the display panel 100, the driving chip 200, and the buffer protection layer 300.

The display panel 100 in the display module 000 may include: a first panel portion 101 and a second panel portion 102 arranged in parallel, and a panel bending portion 103 for connecting the first panel portion 101 and the second panel portion 102. That is, the panel bending portion 103 may be located between the first panel portion 101 and the second panel portion 102, and one side of the panel bending portion 103 may be connected to the first panel portion 101, and the other side of the panel bending portion 103 may be connected to the second panel portion 102. Here, the display panel 100 in the display module 000 may have a display area, wherein the display area of the display panel 100 may be located within the first panel part 101.

The driving chip 200 in the display module 000 may be bonded to a side of the second panel part 102 of the display panel 100 facing away from the first panel part 101. Note that, in the display panel 100, the signal traces are integrated in the first panel portion 101, the second panel portion 102, and the panel bending portion 103, and the signal traces in the panel bending portion 103 may connect the signal traces in the first panel portion 101 and the signal traces in the second panel portion 102, and the signal traces in the first panel portion 101 may be electrically connected to the sub-pixels in the driving chip 200. After the driving chip 200 is bound to the second panel part 102 in the display panel 100, the driving chip 200 may be electrically connected to the signal lines within the second panel part 102. In this way, the driving chip 200 may send driving signals to the sub-pixels in the first panel portion 101 through the signal traces, so that the sub-pixels in the first panel portion 101 may emit light outwards, and further the first panel portion 101 may display a corresponding picture.

In an embodiment of the present application, the buffer protection layer 300 in the display module 000 may be adhered to a side of the second panel part 102 facing away from the first panel part 101, where the driving chip 200 may be located between the buffer protection layer 300 and the second panel part 102. It should be noted that, the buffer protection layer 300 is generally made of buffer foam, and the buffer foam has better buffering property. In this way, the buffer protection layer 300 can play a better role in protecting and buffering the driving chip 200 in the display module 000, and the probability of damage of the driving chip 200 caused by impact can be reduced after the driving chip 200 receives the impact force.

In the present application, since the buffer protection layer 300 is provided in the display module 000, the driving chip 200 in the display module 000 can be buffer-protected, and thus, even after the display module 000 is assembled on the frame in the display device, the probability of collision between the frame in the display device and the driving chip 200 in the display module 000 can be ensured to be low by the buffer protection layer 300 after the display device falls or is impacted. Thus, the driving chip 200 is not easily damaged, and the reliability of the display device is improved.

In addition, in the related art, a buffer foam is generally adhered to a position opposite to the driving chip in the frame body to protect the driving chip. However, the structure of the frame is generally complicated, so that the buffer foam can be adhered to the frame only manually at present, and the efficiency of adhering the buffer foam to the frame is low.

In the embodiment of the present application, the buffer protection layer 300 is disposed on the side of the second panel portion 102 facing away from the first panel portion 101. That is, the buffer protection layer 300 is disposed on the display panel 100 in the display module 000. Since the structure of the display panel 100 in the display module 000 is relatively simple, the automatic bonding apparatus may be used to identify the location of the buffer protection layer 300 on the display panel 100 and automatically bond the buffer protection layer 300 at the location in the process of bonding the buffer protection layer 300 on the display panel 100. In this way, the buffer protection layer 300 is not required to be manually provided on the display panel 100, so that the efficiency of providing the buffer foam layer 300 on the display panel 100 can be effectively improved.

In summary, the display module provided in the embodiment of the application includes: display panel, drive chip and buffer protection layer. Since the buffer protection layer is arranged in the display module, the driving chip in the display module can be buffer-protected, so that after the display module is assembled on the frame body in the display device, even after the display device falls or is impacted, the probability of collision between the frame body in the display device and the driving chip in the display module can be ensured to be lower through the buffer protection layer. Therefore, the driving chip is not easy to damage, and the reliability of the display device is improved. In addition, because the buffer foam layer is arranged on the display panel in the display module, the structure of the display panel is simpler, and therefore, the buffer protection layer can be arranged on the display panel by adopting automatic laminating equipment, so that the efficiency of arranging the buffer foam layer on the display panel is higher.

In an embodiment of the present application, referring to fig. 1, the front projection of the driving chip 200 in the display module 000 on the second panel 102 may be located in the front projection of the buffer protection layer 300 on the second panel 102. It is understood that the area of the front projection of the buffer protection layer 300 on the second panel portion 102 may be greater than or equal to the area of the front projection of the driving chip 200 on the second panel portion 102. Thus, the buffer protection layer 300 can provide a better protection buffer effect for the driving chip 200 in the display module 000.

In the present application, referring to fig. 1, the thickness d of the buffer protection layer 300 ranges from 0.1 mm to 0.5 mm in a direction perpendicular to the display surface of the first panel part 100. Thus, the thickness of the buffer protection layer 300 in the direction perpendicular to the display surface of the first panel portion 100 can be ensured to be larger, the driving chip 200 can be effectively protected by the buffer protection layer 300, and when the display module 000 is assembled in the display device, the buffer protection layer 300 can play a good role in buffering the impact force if the display device receives the impact force, and the damage probability of the driving chip can be effectively reduced.

In an embodiment of the present application, a horizontal distance L between each side A1 of the buffer protection layer 300 in the display module 000 in the front projection on the second panel 102 and the corresponding side A2 of the driving chip 200 in the front projection on the second panel 102 may be greater than or equal to 1 millimeter. In this way, the buffer glue layer 300 may completely cover the driving chip 200, and the side of the driving chip 200 facing away from the second panel 102 may be completely covered by the buffer glue layer 300. Thus, after the display module 000 receives the impact force, the buffer adhesive layer 300 can better bear the impact force, so that the impact force received by the driving chip 200 can be effectively reduced, and the damage probability of the driving chip 200 can be further reduced.

In an embodiment of the present application, please refer to fig. 2, fig. 2 is a schematic structural diagram of another display module according to an embodiment of the present application. The display module 000 may further include: a first insulating layer 400 and a conductive shielding layer 500, which are stacked between the second panel portion 102 and the buffer protection layer 300. Here, the first insulating layer 400 may be closer to the second panel part 102 than the conductive shielding layer 500.

In the display module assembly 000, the driving chip 200 is closer to the second panel 102 than the first insulating layer 400, and a part of the first insulating layer 400 may cover the driving chip 200, and another part of the first insulating layer 400 may be attached to the second panel 102. In this way, the first insulating layer 400 can completely cover each side of the driving chip 200, so as to avoid the driving chip 200 from being exposed to air, and the first insulating layer 400 can perform insulation protection on the driving chip 200.

At least a portion of the conductive shielding layer 500 covering the driving chip 200 may be present in the display module 000. For example, the front projection of the driver chip 200 onto the second panel portion 102 may be located within the front projection of the conductive shielding layer 500 onto the second panel portion 102. Here, the conductive shielding layer 500 may shield interference of external signals on signals output by the driving chip 200, so that the signals output by the driving chip 200 are stable. Since the driving chip 200 may be electrically connected to the signal trace in the first panel part 101 through the signal trace in the second panel part 102 and the signal trace in the panel bending part 103, the signal trace in the first panel part 101 may be electrically connected to the sub-pixel in the first panel part 101. Therefore, the signals output by the driving chip 200 can be transmitted to the sub-pixels in the first panel portion 101 through the signal wires, so as to control the sub-pixels to emit light normally and outwards, so that the first panel portion 101 can display a corresponding picture. When the signal output by the driving chip 200 is stable through the conductive shielding layer 500, the display effect of the picture displayed by the first panel portion 101 can be ensured to be better.

In an embodiment of the present application, the orthographic projection of the conductive shielding layer 500 on the second panel portion 102 in the display module 000 may be located within the orthographic projection of the first insulating layer 400 on the second panel portion 102. Because the first insulating layer 400 may be closer to the second panel portion 102 than the conductive shielding layer 500, the conductive shielding layer 500 and the driving chip 200 may be insulated by the first insulating layer 400, so that a short circuit phenomenon between the conductive shielding layer 500 and the driving chip 200 may not occur, and the driving chip 200 may work normally.

Alternatively, the side of the buffer protection layer 300 in the display module 000 facing the second panel part 102 in the display panel 100 may be attached to the side of the conductive shielding layer 500 facing away from the second panel part 102.

In the present application, please continue to refer to fig. 2, the display module 000 may further include: the second insulating layer 600 is located on a side of the buffer protection layer 300 facing away from the second panel portion 102. The front projection of the conductive shielding layer 500 on the second panel 102 in the display module 000 may be located in the front projection of the second insulating layer 600 on the second panel 102. That is, the area of the orthographic projection of the conductive shielding layer 500 on the second panel part 102 may be greater than or equal to the area of the orthographic projection of the second insulating layer 600 on the second panel part 102. In this case, the second insulating layer 600 may perform effective insulation protection on the conductive shielding layer 500, so as to ensure that the conductive shielding layer 500 is not corroded, so that the conductive shielding layer 500 has a better effect of shielding external signals.

In the present application, as shown in fig. 2, the second insulating layer 600 in the display module 000 may include: a first insulation protection portion 601 and a second insulation protection portion 602.

Wherein the first insulation protection portion 601 may cover a side of the buffer protection layer 300 facing away from the second panel portion 102, and a side of the buffer protection layer 300. In this way, the first insulation protection portion 601 in the second insulation layer 600 may be completely attached to each side of the buffer protection layer 300, and thus the first insulation protection portion 601 may be ensured to have an effective insulation protection effect on the buffer protection layer 300. The second insulation protection portion 602 may be attached to a portion of the conductive shielding layer 500 that is not covered by the buffer protection layer 300, so that the second insulation protection portion 602 may better perform insulation protection on the conductive shielding layer 500.

In the embodiment of the present application, one sides of the first insulating layer 400, the conductive shielding layer 500 and the second insulating layer 600 in the display module 000 may be flush with one side of the second panel portion 102 facing away from the panel bending portion 103, and the other sides of the first insulating layer 400, the conductive shielding layer 500 and the second insulating layer 600 may be flush with one side of the second panel portion 102 facing toward the panel bending portion 103. In this way, it is ensured that the first insulating layer 400, the conductive shielding layer 500, and the second insulating layer 600 all cover the second panel part 102 in the display panel 100. In this way, the signal routing integrated in the second panel portion 102 of the display panel 100 can be ensured not to be interfered by external signals through the conductive shielding layer 500, so that the display effect of the display panel 100 is not affected, and the conductive shielding layer 500 and the buffer protection layer 300 located between the first insulating layer 400 and the second insulating layer 600 can be better insulated and protected through the cooperation of the first insulating layer 400 and the second insulating layer 600.

It should be noted that, in the process of bonding each film layer structure on the second panel portion 102 in the display panel 100, firstly, the buffer protection layer 300 is die-cut and formed by adopting an automatic die-cutting device, then, the die-cut buffer protection layer 300 is bonded on the conductive shielding layer 500 by adopting an automatic bonding device, then, the second insulating layer 600 is bonded on the side of the buffer protection layer 300 away from the conductive shielding layer 500, the first insulating layer 400 is bonded on the side of the conductive shielding layer 500 away from the buffer protection layer 300, and finally, the four film layer structures are bonded on the display panel 100 after being pressed.

In an embodiment of the present application, please refer to fig. 3, fig. 3 is a schematic structural diagram of another display module according to an embodiment of the present application. The display module 000 may further include: a first support layer 700, a heat dissipation film layer 800, a support pad 900, and a second support layer 701.

The first support layer 700 in the display module 000 may be adhered to the back surface of the first panel part 101 (i.e., the surface opposite to the front surface of the first panel part 101). The first support layer 201 in the display module 000 may be used to support the first panel part 101.

The heat dissipation film 800 in the display module 000 may be located at a side of the first support layer 700 facing away from the first panel part 101, where a side of the heat dissipation film 800 facing away from the first support layer 700 may be adhered to a side of the support pad 900 facing toward the first panel part 101. The heat dissipation film 800 may be used to dissipate heat generated by the driving chip 200. In this way, the working temperature of the driving chip 200 can be effectively reduced, so that the signal wiring electrically connected with the driving chip 200 in the display panel 100 is not burned, and the display effect of the display panel 100 can be improved.

The other side of the head block 900 in the display module 000 may be bonded to the side of the second support layer 701 facing the first panel part 101. Wherein the other side of the second support layer 701 may be bonded to the side of the second panel part 102 facing the first panel part 101. Here, the driving chip 200 bound to the second panel part 102 may be supported and buffered by the supporting pad 900, so that the driving chip 200 may be protected from being damaged by buffering of the supporting pad 900 after the driving chip 200 receives an external force.

In an embodiment of the present application, the display module 000 may further include: an optical adhesive layer 1001, a circular polarizer 1002, and a protective cover 1000.

The circular polarizer 1002 in the display module 000 is located at a side of the first panel portion 101 facing away from the first supporting layer 700, the protective cover 1000 is located at a side of the circular polarizer 1002 facing away from the first panel portion 101, and the optical adhesive layer 1001 is located between the circular polarizer 1002 and the protective cover 1000.

The protection cover plate 1000 in the display module 000 may be a glass cover plate, and the protection cover plate 1000 may protect the first panel portion 101 in the display panel 100, so as to ensure that after the front surface of the display module 000 receives an impact force, the protection cover plate 1000 may bear the impact force, so as to reduce the probability of crashing the first panel portion 101 in the display panel 100.

The optical adhesive layer 1001 in the display device 000 may be used to achieve adhesion of the protective cover 1000 between the circular polarizers 1002, and the optical adhesive layer 1001 is typically made of transparent glue (e.g., acryl glue). In this way, the light emitted from the first panel portion 101 in the display panel 100 can be ensured to exit after passing through the optical adhesive layer 1001 and the protective cover 1000. In addition, the optical adhesive layer 1001 has better buffering property, so that after the front surface of the display module 000 is impacted, the probability of crashing the protective cover 1000 can be reduced through buffering of the optical adhesive layer 1001.

The circular polarizer 1002 in the display module 000 can reduce the reflectivity of the first panel 101 to ambient light, so as to ensure a better effect of the display area in the first panel 101.

In summary, the display module provided in the embodiment of the application includes: display panel, drive chip and buffer protection layer. Since the buffer protection layer is arranged in the display module, the driving chip in the display module can be buffer-protected, so that after the display module is assembled on the frame body in the display device, even after the display device falls or is impacted, the probability of collision between the frame body in the display device and the driving chip in the display module can be ensured to be lower through the buffer protection layer. Therefore, the driving chip is not easy to damage, and the reliability of the display device is improved. In addition, because the buffer foam layer is arranged on the display panel in the display module, the structure of the display panel is simpler, and therefore, the buffer protection layer can be arranged on the display panel by adopting automatic laminating equipment, so that the efficiency of arranging the buffer foam layer on the display panel is higher.

The embodiment of the application also provides a display device, which can be: any product or component with display function such as a mobile phone, a tablet computer, a television, an advertising machine, a display screen, a digital photo frame and the like. Referring to fig. 4, fig. 4 is a schematic structural diagram of a display device according to an embodiment of the application. The display device 001 may include: the frame 002, and the display module 000 connected to the frame 002, the display module 000 being any of the display modules in the above embodiments.

As shown in fig. 4, for example, the housing 002 in the display device 001 may include: a side plate 002b of annular shape, and a bottom plate 002a connected to one side of the side plate 002 b. Here, the display modules 000 may be located in an area surrounded by the side plates 002b, and a side of the bottom plate 002a facing the display module 000 may have: and an avoidance groove U arranged corresponding to the driving chip 200. In this way, the avoidance groove U in the bottom plate 002a may allow a certain distance between the film layer (for example, the second insulating layer 600) disposed on the driving chip 200 in the display module 000 and the bottom plate 002a, so that the two are not easy to collide, thereby further reducing the damage probability of the driving chip 200.

In the present disclosure, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. The term "plurality" refers to two or more, unless explicitly defined otherwise.

The foregoing description of the preferred embodiments of the present application is not intended to limit the application, but is intended to cover all modifications, equivalents, alternatives, and improvements falling within the spirit and principles of the application.

Claims (10)

1. A display module, comprising:

A display panel, the display panel comprising: the display panel comprises a first panel part, a second panel part and a panel bending part, wherein the first panel part and the second panel part are arranged in parallel and oppositely, the panel bending part is used for connecting the first panel part and the second panel part, and a display area of the display panel is positioned in the first panel part;

a driving chip which is in binding connection with one side of the second panel part, which is away from the first panel part;

And a buffer protection layer bonded with one side of the second panel part away from the first panel part, wherein the driving chip is positioned between the buffer protection layer and the second panel part.

2. The display module of claim 1, wherein the orthographic projection of the driving chip on the second panel portion is located within the orthographic projection of the buffer protection layer on the second panel portion.

3. The display module of claim 2, wherein the thickness of the buffer protection layer ranges from 0.1 mm to 0.5 mm in a direction perpendicular to the display surface of the first panel portion.

4. The display module of claim 2, wherein a horizontal distance between each side of the buffer protection layer in the orthographic projection on the second panel portion and a corresponding side of the driving chip in the orthographic projection on the second panel portion is greater than or equal to 1 millimeter.

5. The display module of any one of claims 1 to 4, wherein the display module further comprises: a first insulating layer and a conductive shield layer which are stacked between the second panel portion and the buffer protection layer, the first insulating layer being closer to the second panel portion than the conductive shield layer;

Wherein a part of the first insulating layer covers the driving chip, and the other part of the first insulating layer is attached to the second panel part; at least a portion of the conductive shielding layer covering the driver chip is present.

6. The display module assembly of claim 5, wherein a side of the buffer protective layer facing the second panel portion is bonded to a side of the conductive shield layer facing away from the second panel portion; the display module assembly still includes: the second insulation layer is positioned on one side of the buffer protection layer, which is away from the second panel part, and the orthographic projection of the conductive shielding layer on the second panel part is positioned in the orthographic projection of the second insulation layer on the second panel part.

7. The display module of claim 6, wherein the second insulating layer comprises: a first insulating protection portion and a second insulating protection portion; the first insulating protection part covers one side of the buffer protection layer, which is away from the second panel part, and the side surface of the buffer protection layer; and the second insulation protection part is attached to the part, which is not covered by the buffer protection layer, of the conductive shielding layer.

8. The display module of claim 6 or 7, wherein one side of the first insulating layer, the conductive shielding layer, and the second insulating layer are all flush with one side of the second panel portion facing away from the panel bend; and the other sides of the first insulating layer, the conductive shielding layer and the second insulating layer are all flush with one side of the second panel part, which faces towards the panel bending part.

9. A display device, comprising: the display module is characterized by comprising a frame body and a display module connected with the frame body, wherein the display module is the display module of any one of claims 1 to 8.

10. The display device according to claim 9, wherein the frame body includes: an annular side plate and a bottom plate connected with one side of the side plate;

The display module is located in the area surrounded by the side plates, and one side of the bottom plate, facing the display module, is provided with: and the avoiding groove is arranged corresponding to the driving chip.