CN221197771U - Cooling device suitable for test board on test machine - Google Patents
Cooling device suitable for test board on test machine Download PDFInfo
- Publication number
- CN221197771U CN221197771U CN202322895174.6U CN202322895174U CN221197771U CN 221197771 U CN221197771 U CN 221197771U CN 202322895174 U CN202322895174 U CN 202322895174U CN 221197771 U CN221197771 U CN 221197771U
- Authority
- CN
- China
- Prior art keywords
- test
- air blowing
- cuboid
- blowing pipe
- cooling device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 70
- 238000001816 cooling Methods 0.000 title claims abstract description 20
- 238000007664 blowing Methods 0.000 claims abstract description 45
- 238000007789 sealing Methods 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 238000013100 final test Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention provides a cooling device suitable for a test board on a tester, which belongs to the technical field of semiconductor sealing and testing and comprises a base, an air blowing pipe and an air inlet pipe joint; the base is in a cuboid shape, the inside of the cuboid is hollow, compressed air is convenient to enter the cuboid and is led into the air blowing pipe, a group of threaded holes are formed in two opposite long side surfaces of the cuboid, the air blowing pipe is fixed in the threaded holes, two end surfaces of the cuboid are provided with opposite through type fixing holes, and the bottom surface of the cuboid is provided with an air inlet pipe joint; the invention designs the blowing device by utilizing the size of the groove in the test head, and realizes cooling of the test board on the test head by blowing.
Description
Technical Field
The invention relates to the technical field of semiconductor sealing and testing, in particular to a cooling device suitable for a test board on a testing machine.
Background
The integrated circuit tester can ensure high accuracy and test quality through advanced testing methods, and can provide high-speed Single-component (Single-site) and Multi-component (Multi-site) testing capability when wafer testing and final testing of high-integration components are performed; the testing machine comprises a testing head, and the single-slot module card used by the testing head has the functions of the industry per square centimeter, thereby being beneficial to reducing the volume of the testing system and reducing the cost.
However, there is no cooling device for the test board in the test head of the tester, as shown in fig. 1 of the specification, the test board generates a certain amount of heat through continuous electrical test of the chip, the temperature of the test board rises after long-time accumulation, and the temperature requirement of some client chips on the test board must be controlled below 26 ℃ during test, so that the current configuration of the tester cannot meet the test conditions, and the mass production of the chips cannot be realized.
Disclosure of Invention
The invention aims to: the invention aims to provide a cooling device suitable for a test board on a testing machine, aiming at the problem that the temperature of a test head in the prior art is too high and does not meet the test temperature of a client chip.
The technical scheme is as follows: the invention relates to a cooling device suitable for a test board on a tester, which comprises a base, an air blowing pipe and an air inlet pipe joint;
The base is cuboid shape, and the inside of cuboid is hollow, in the compressed gas of being convenient for gets into the cuboid and leads to the gas blowing pipe. Two opposite long sides of cuboid have a set of screw hole, and the screw hole is fixed with the gas blowing pipe, and two terminal surfaces of cuboid have the fixed orifices to wearing formula, and the bottom surface of cuboid has the intake pipe to connect.
Further, the size of the base corresponds to the recess of the test head.
Further, the fixing holes fix the base in the groove of the test head through the long screws, and the cooling device can be stably fixed in the groove of the test head in the test.
Further, one end of the air blowing pipe far away from the base is closed, and a group of air blowing holes 3 facing the bottom of the test plate are uniformly distributed on the pipe wall of the air blowing pipe; after the air inlet pipe joint is connected with compressed air, the air blowing hole blows air to the bottom of the test board to realize cooling.
Further, the air blowing pipe comprises a long air blowing pipe and a short air blowing pipe, the long air blowing pipe and the short air blowing pipe are communicated with the base through threaded holes, and the sizes of the long air blowing pipe and the short air blowing pipe are corresponding to the size of the groove of the test head.
Further, the air inlet pipe joint 5 is an L-shaped quick-plug air inlet joint, so that the compressed air hose can be conveniently and quickly installed and detached during testing.
Further, the L-shaped quick-plug air inlet connector is externally connected with a compressed air hose, and the compressed air hose is externally connected with plant compressed air, so that the opening and closing of the air blowing device can be conveniently controlled.
The beneficial effects are that: compared with the prior art, the invention has the advantages that:
(1) According to the invention, the cooling device is designed, so that the requirement that the test temperature of a client chip is less than 26 ℃ is met, and the chip mass production test is realized;
(2) The invention realizes the temperature control of the test board on the tester through the cooperative work of the base, the air blowing pipe and the air inlet pipe joint.
Drawings
FIG. 1 is a schematic diagram of a test head according to the background of the invention;
FIG. 2 is a schematic view of a cooling device according to the present invention;
FIG. 3 is a schematic diagram of a test head with a cooling device.
Detailed Description
The technical scheme of the invention is described in detail below through the drawings, but the protection scope of the invention is not limited to the embodiments.
The cooling device suitable for the test board on the testing machine is shown in fig. 2, and is an air blowing device 1, which comprises a base 2, an air blowing pipe and an air inlet pipe joint 5; . The base 2 is of a cuboid shape, the inside of the cuboid is hollow, the cuboid is provided with six faces, two opposite longer faces are respectively provided with 4 threaded holes for fixing the air blowing pipe, two end faces of the cuboid are provided with opposite through type fixing holes 6, and the fixing holes fix the base in the groove of the test head through long screws. The bottom surface of cuboid has intake pipe joint 5, and intake pipe joint 5 is the quick-insertion type air inlet joint of L type phi 10 in this embodiment, and the external phi 10 compressed air hose 8 that has of L type quick-insertion type air inlet joint, the external plant compressed air that has of compressed air hose 8. One end of the air blowing pipe far away from the base is closed, and a group of air blowing holes 3 facing the bottom of the test board are uniformly distributed on the pipe wall of the air blowing pipe. The blowing pipe comprises a long blowing pipe 4 and a short blowing pipe 7, and the long blowing pipe 4 and the short blowing pipe 7 are communicated with the base 2 through threaded holes.
As shown in fig. 3, the model of the testing machine used in the present embodiment is an ADV93000 testing machine, the size of the base corresponds to the groove of the testing head, the long air-blowing pipe is installed on the left side of the base, the short air-blowing pipe is installed on the right side of the base, and in the practical application process, the installation direction and the size of the air-blowing pipe are adjusted according to the size of the groove.
As described above, although the present invention has been shown and described with reference to certain preferred embodiments, it is not to be construed as limiting the invention itself. Various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (7)
1. A heat sink suitable for test board on test machine, its characterized in that: comprises a base (2), an air blowing pipe and an air inlet pipe joint (5);
the base (2) is of a cuboid shape, the inside of the cuboid is hollow, two opposite long sides of the cuboid are provided with a group of threaded holes, the threaded holes are fixedly provided with air blowing pipes, two end faces of the cuboid are provided with opposite through type fixing holes (6), and the bottom face of the cuboid is provided with an air inlet pipe joint (5).
2. A cooling device for a test panel of a test machine according to claim 1, wherein: the size of the base corresponds to the groove of the test head.
3. A cooling device for a test panel of a test machine according to claim 2, wherein: the fixing holes fix the base in the groove of the test head through long screws.
4. A cooling device for a test panel of a test machine according to claim 1, wherein: one end of the air blowing pipe far away from the base is closed, and a group of air blowing holes (3) facing the bottom of the test plate are uniformly distributed on the pipe wall of the air blowing pipe.
5. A cooling device for a test panel of a test machine as defined in claim 4, wherein: the air blowing pipe comprises a long air blowing pipe (4) and a short air blowing pipe (7), and the long air blowing pipe (4) and the short air blowing pipe (7) are communicated with the base (2) through the threaded holes.
6. A cooling device for a test panel of a test machine according to claim 1, wherein: the air inlet pipe joint (5) is an L-shaped quick-plug air inlet joint.
7. A cooling device for a test panel of a test machine as defined in claim 6, wherein: the L-shaped quick-plug air inlet connector is externally connected with a compressed air hose, and the compressed air hose is externally connected with plant compressed air.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322895174.6U CN221197771U (en) | 2023-10-27 | 2023-10-27 | Cooling device suitable for test board on test machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322895174.6U CN221197771U (en) | 2023-10-27 | 2023-10-27 | Cooling device suitable for test board on test machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221197771U true CN221197771U (en) | 2024-06-21 |
Family
ID=91526029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322895174.6U Active CN221197771U (en) | 2023-10-27 | 2023-10-27 | Cooling device suitable for test board on test machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221197771U (en) |
-
2023
- 2023-10-27 CN CN202322895174.6U patent/CN221197771U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN221197771U (en) | Cooling device suitable for test board on test machine | |
| EP2770335B1 (en) | Apparatus and method for testing electronic devices | |
| KR20160007138A (en) | Burn in test module | |
| CN208257201U (en) | A kind of temperature with high efficiency low-pressure power distribution cabinet | |
| CN102539108A (en) | Energy-saving wind tunnel for enthalpy potential method experiment device | |
| CN212872545U (en) | 64-port high-low temperature test box | |
| TW201736856A (en) | Measure machine | |
| CN111289878A (en) | Heat insulation cavity and aging test equipment | |
| CN216052580U (en) | Multimedia heat dissipation box and multimedia projector comprising same | |
| CN212082037U (en) | Heat dissipation device for purification table of pressure reduction diffusion furnace | |
| CN214845639U (en) | Chip testing jig | |
| CN203858073U (en) | Pressure-testing tool for radiator core body | |
| CN220796731U (en) | Chip auxiliary cooling system | |
| US20080143364A1 (en) | Forced air cooling of components on a probecard | |
| CN215582368U (en) | Small-space heat dissipation structure | |
| CN207840208U (en) | A kind of substrate cooling processing unit (plant) | |
| CN221224914U (en) | High-low temperature testing device | |
| CN217034607U (en) | Constant-temperature vacuum adsorption platform for testing solar cell | |
| CN201191383Y (en) | Temperature control device | |
| CN219589191U (en) | Semiconductor refrigerating device for robot under high-temperature operation | |
| CN219938825U (en) | Frequency converter frame with heat dissipation base | |
| CN210225922U (en) | Transmission mechanism on chip mounter | |
| CN220356973U (en) | Heater heat testing device | |
| CN218415207U (en) | Four-way electronic expansion valve controller | |
| CN216434283U (en) | High-low temperature testing device suitable for semiconductor chip |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 210000 No. 8, Linchun Road, Pukou Economic Development Zone, Pukou District, Nanjing, Jiangsu Province Patentee after: Jiangsu Xinde Semiconductor Technology Co.,Ltd. Country or region after: China Address before: 210000 No. 8, Linchun Road, Pukou Economic Development Zone, Pukou District, Nanjing, Jiangsu Province Patentee before: Jiangsu Xinde Semiconductor Technology Co.,Ltd. Country or region before: China |