CN220796731U - Chip auxiliary cooling system - Google Patents

Abstract

The utility model provides a chip auxiliary cooling system which comprises a chip test board, an air supply mechanism, an air freezing mechanism, a monitoring and adjusting mechanism and a controller, wherein the air supply mechanism is connected with the air freezing mechanism through an air inlet pipe, the air outlet end of the air freezing mechanism is connected with at least one monitoring and adjusting mechanism through a shunt pipe, each monitoring and adjusting mechanism is connected with the corresponding chip test board, the air supply mechanism, the air freezing mechanism and the monitoring and adjusting mechanism are in signal phase with the controller, the monitoring and adjusting mechanism can monitor and adjust the flow of the introduced air, the air supply mechanism can better conduct rapid heat dissipation on higher heat generated by a chip during testing, so that the cooling rate is improved, the cooling time is reduced, and the air can conduct circulating heat dissipation on the chip which generates heat during testing through the structure of the chip test board, so that the effect of uniform cooling is achieved.

Description

Chip auxiliary cooling system

Technical Field

The utility model relates to the technical field of chip heat dissipation, in particular to a chip auxiliary cooling system.

Background

The chip refers to a silicon chip containing an integrated circuit, has a small volume, namely, a circuit (miniaturization mode) is manufactured on the surface of a semiconductor wafer, and is widely applied to computers and other electronic equipment.

The chip has a wide application range, and multiple parameter tests are required to be carried out on the chip in the chip production process so as to ensure the performance of the chip. The chip to be tested is generally mounted on the base through adsorption, and the base is used for fixing the chip to be tested in an adsorption mode, but a large amount of heat can be generated in the chip testing process, such as poor heat dissipation, and the chip can be damaged.

In the prior art, the dry compressed air introduced during cooling the chip in the test cannot effectively circulate at the position where the chip needs to dissipate heat, so that the cooling is uneven, the introduced gas flow cannot be monitored, and when the gas flow is lower and the heat generated by the chip in the test is higher, the cooling rate is slower and the cooling time is longer.

Disclosure of Invention

The utility model aims to overcome the defects of the prior art and provide a chip auxiliary cooling system so as to solve the problems in the background art.

The utility model is realized by the following technical scheme:

the utility model provides a supplementary cooling system of chip, includes chip test board, air feed mechanism, gas refrigeration mechanism, monitoring adjustment mechanism and controller, air feed mechanism through the air inlet pipe with gas refrigeration mechanism links to each other, gas refrigeration mechanism's gas outlet end pass through the shunt tubes with at least one monitoring adjustment mechanism links to each other, every monitoring adjustment mechanism with the correspondence the chip test board links to each other, air feed mechanism gas refrigeration mechanism and monitoring adjustment mechanism all with the controller signal links to each other.

Preferably, the chip test board includes chip ageing board and heat preservation chamber, be provided with at least one chip test fixture on the chip ageing board, every the air vent has been seted up to chip test fixture bottom, the inside breather pipe that is provided with of heat preservation chamber, the breather pipe with at least one the air vent is linked together, the air inlet department of breather pipe is provided with the solenoid valve that admits air, the gas outlet department of breather pipe is provided with the solenoid valve that admits air, the solenoid valve that admits air the vent valve all with the controller signal links to each other.

Preferably, the air supply mechanism comprises an air source, a check valve and a total air inlet electromagnetic valve, wherein the air source is connected with the check valve, the check valve is connected with the total air inlet valve, the total air inlet valve is connected with the air inlet air pipe, and the total air inlet electromagnetic valve is connected with the controller through signals.

Preferably, the gas freezing mechanism comprises a plate heat exchanger and a freezing electromagnetic valve, the gas inlet pipe is connected with the gas inlet end of the plate heat exchanger, the gas outlet end of the plate heat exchanger is connected with at least one monitoring and adjusting mechanism through the shunt pipe, the liquid inlet end of the plate heat exchanger is connected with the freezing electromagnetic valve, and the freezing electromagnetic valve is connected with the controller through signals.

Preferably, the monitoring and adjusting mechanism comprises a throttle valve, a pressure regulating valve and a flowmeter, wherein the gas splitting end of the splitting pipe is connected with the throttle valve, the throttle valve is connected with the pressure regulating valve, the pressure regulating valve is connected with the flowmeter, the flowmeter is connected with the air inlet electromagnetic valve, and the flowmeter is connected with the controller through signals.

Preferably, a temperature sensor is arranged in the shunt tube, and the temperature sensor is in signal connection with the controller.

Preferably, a magnet is arranged on the heat preservation cavity and used for closing a limit switch, and the limit switch is in signal connection with the controller.

Preferably, the controller is in signal connection with an alarm.

Compared with the prior art, the utility model has the following beneficial effects:

the utility model provides a chip auxiliary cooling system, which is characterized in that a chip is arranged on a chip test board, a gas supply mechanism generates gas and conveys the gas to a gas freezing mechanism through a gas inlet pipe, the gas freezing mechanism can cool down the gas, then the gas is conveyed to at least one monitoring and adjusting mechanism through a shunt pipe from a gas outlet end, the monitoring and adjusting mechanism can monitor and adjust the flow of the gas, and monitored data information is sent to a controller, when the flow of the gas is low, the flow of the gas can be regulated to be high through the monitoring and adjusting mechanism, so that the cooling low-temperature gas introduced into the chip test board can quickly take away higher heat generated by the chip in the test, thereby improving the cooling rate and reducing the cooling time, and the gas can circularly dissipate heat of the chip which heats up in the test through the structure of the chip test board, thereby achieving the effect of uniform cooling.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only preferred embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of a chip auxiliary cooling system according to embodiment 1 of the present utility model.

Fig. 2 is a schematic structural diagram of a chip test board according to embodiment 1 of the present utility model.

Fig. 3 is a schematic view of the structure of the inside of the insulation cavity provided in embodiment 1 of the present utility model.

Fig. 4 is a schematic structural diagram of a chip auxiliary cooling system according to embodiment 1 of the present utility model.

Fig. 5 is a schematic structural diagram of a chip auxiliary cooling system according to embodiment 2 of the present utility model.

In the figure, 1 is a chip testing board, 101 is a chip aging board, 102 is a heat preservation cavity, 2 is a chip testing tool, 3 is a vent hole, 4 is a vent pipe, 5 is an air inlet, 6 is an air inlet electromagnetic valve, 7 is an air outlet, 8 is an air outlet electromagnetic valve, 9 is an air supply mechanism, 901 is an air source, 902 is a check valve, 903 is a total air inlet electromagnetic valve, 10 is an air inlet air pipe, 11 is a gas freezing mechanism, 1101 is a plate heat exchanger, 1102 is a freezing electromagnetic valve, 1103 is an electronic expansion valve, 12 is a monitoring and adjusting mechanism, 1201 is a throttle valve, 1202 is a pressure regulating valve, 1203 is a flowmeter, 13 is a controller, 14 is a shunt pipe, 15 is a temperature sensor, 16 is a magnet, and an alarm 17.

Detailed Description

In order to make the objects, technical solutions and advantages of the present utility model more apparent, exemplary embodiments according to the present utility model will be described in detail with reference to the accompanying drawings. It should be apparent that the described embodiments are only some embodiments of the present utility model and not all embodiments of the present utility model, and it should be understood that the present utility model is not limited by the example embodiments described herein. Based on the embodiments of the utility model described in the present application, all other embodiments that a person skilled in the art would have without inventive effort shall fall within the scope of the utility model.

In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present utility model. It will be apparent, however, to one skilled in the art that the utility model may be practiced without one or more of these details. In other instances, well-known features have not been described in detail in order to avoid obscuring the utility model.

It should be understood that the present utility model may be embodied in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the utility model to those skilled in the art.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. As used herein, the term "and/or" includes any and all combinations of the associated listed items.

In order to provide a thorough understanding of the present utility model, detailed structures will be presented in the following description in order to illustrate the technical solutions presented by the present utility model. Alternative embodiments of the utility model are described in detail below, however, the utility model may have other implementations in addition to these detailed descriptions.

Example 1

Referring to fig. 1 to 4, an auxiliary chip cooling system comprises a chip test board 1, a gas supply mechanism 9, a gas freezing mechanism 11, a monitoring and adjusting mechanism 12 and a controller 13, wherein the gas supply mechanism 9 is connected with the gas freezing mechanism 11 through a gas inlet pipe 10, a gas outlet end of the gas freezing mechanism 11 is connected with at least one monitoring and adjusting mechanism 12 through a shunt pipe 14, each monitoring and adjusting mechanism 12 is connected with the corresponding chip test board 1, and the gas supply mechanism 9, the gas freezing mechanism 11 and the monitoring and adjusting mechanism 12 are all in signal connection with the controller 13.

The chip auxiliary cooling system of the embodiment comprises a chip test board 1, a gas supply mechanism 9, a gas freezing mechanism 11, a monitoring and adjusting mechanism 12 and a controller 13, wherein the controller 13 can adopt a programmable logic controller (PLC for short) commonly used in the market, a plurality of chips are simultaneously arranged on the chip test board 1 for testing, the gas supply mechanism 9 can provide gas and convey the gas into the gas freezing mechanism 11 through a gas inlet pipe 10, the controller 13 can control the output of the gas in the gas supply mechanism 9, the gas freezing mechanism 11 can cool the introduced gas, the cooled gas is conveyed into a shunt pipe 14 through a gas outlet end, the shunt pipe 14 is connected with a plurality of monitoring and adjusting mechanisms 12, the shunt pipe 14 respectively conveys the gas into a plurality of monitoring and adjusting mechanisms 12, each monitoring and adjusting mechanism 12 conveys gas to the corresponding connected chip test board 1, the chip on the chip test board 1 can generate heat during testing, the structure of the chip test board 1 enables the cooling low-temperature gas introduced into the chip test board 1 to take away the heat generated during chip testing, the heat generated during chip testing is circularly dissipated, the monitoring and adjusting mechanism 12 can monitor and adjust the gas flow conveyed by the shunt pipe 14 and transmit the monitored data information to the controller 13, when the gas flow is lower, the gas flow can be adjusted to be higher through the monitoring and adjusting mechanism 12, the heat dissipation to the chip is facilitated, the controller 13 can control the cooling efficiency in the gas freezing mechanism 11, the cooling efficiency is increased, the cooling rate of the chip can be improved through matching with the higher gas flow, and accordingly the cooling time is shortened.

Further, the chip test board 1 includes chip burn-in board 101 and heat preservation chamber 102, is provided with at least one chip test fixture 2 on the chip burn-in board 101, and air vent 3 has been seted up to every chip test fixture 2 bottom, and heat preservation chamber 102 inside is provided with breather pipe 4, and breather pipe 4 is linked together with at least one air vent 3, and air inlet 5 department of breather pipe 4 is provided with air inlet solenoid valve 6, and air outlet 7 department of breather pipe 4 is provided with air outlet solenoid valve 8, and air inlet solenoid valve 6, air outlet solenoid valve 8 all link to each other with controller 13 signal.

Be provided with a plurality of chip test fixture 2 on the chip burn-in board 101, install the chip in chip test fixture 2, monitor adjustment mechanism 12 carries the breather pipe 4 of heat preservation chamber 102 with gas, the gas in the breather pipe 4 dispels the heat to the chip through the air vent 3 of chip test fixture 2 bottom intercommunication, the gas outlet 7 of breather pipe 4 is located the upper and lower both ends of air inlet 5, gas can form a good circulation, air inlet 5 of breather pipe 4 has air inlet solenoid valve 6, air outlet 7 has air outlet solenoid valve 8, controller 13 can carry the gas after the cooling to corresponding chip position through controlling opening of air inlet solenoid valve 6, can discharge the unnecessary heat that the chip produced through controlling opening of air outlet solenoid valve 8, maintain the temperature in the heat preservation chamber 102 betterly, reduce the temperature influence of each other during the chip test, can cool down the chip effectively, and breather pipe 4 in the heat preservation chamber 102 is fixed through the screw, can dismantle 4, and adjust and change comparatively flexibly according to the chip quantity on the chip burn-in board 101.

Further, the air supply mechanism 9 includes an air source 901, a check valve 902, and a total air intake solenoid valve 903, the air source 901 is connected to the check valve 902, the check valve 902 is connected to the total air intake valve, the total air intake valve is connected to the air intake pipe 10, and the total air intake solenoid valve 903 is signal-connected to the controller 13.

After the dry gas is generated from the gas source 901, the dry gas flows through the check valve 902, the check valve 902 can prevent the gas from flowing back, and the controller 13 can control the opening and closing of the total intake solenoid valve 903, thereby controlling the dry gas to enter the intake pipe 10.

Further, the gas freezing mechanism 11 comprises a plate heat exchanger 1101 and a freezing electromagnetic valve 1102, the gas inlet pipe 10 is connected with the gas inlet end of the plate heat exchanger 1101, the gas outlet end of the plate heat exchanger 1101 is connected with the at least one monitoring and adjusting mechanism 12 through the shunt pipe 14, the liquid inlet end of the plate heat exchanger 1101 is connected with the freezing electromagnetic valve 1102, and the freezing electromagnetic valve 1102 is in signal connection with the controller 13.

The plate heat exchanger 1101 can adopt a mode that liquid and gas exchange heat, the plate heat exchanger 1101 is provided with a gas inlet end, a gas outlet end, a refrigerant liquid inlet end and a refrigerant liquid outlet end, dry gas enters the gas inlet end of the plate heat exchanger 1101 through the gas inlet pipe 10, the refrigerant liquid inlet end of the plate heat exchanger 1101 is connected with the refrigeration electromagnetic valve 1102, the controller 13 controls the quantity of refrigerant entering the plate heat exchanger 1101 by controlling the on-off state of the refrigeration electromagnetic valve 1102, the circulating working refrigerant exchanges heat with the dry air, so that the temperature of the dry air is controlled, the cooled gas flows into the shunt pipes 14 from the gas outlet end, the gas in the shunt pipes 14 flows into each monitoring and adjusting mechanism 12 connected with the shunt pipes 14, the gas freezing mechanism 11 further comprises the electronic expansion valve 1103, the electronic expansion valve 1103 is connected with the controller 13 through the driver, and the cooling of the gas by the electronic expansion valve 1103 can be controlled better.

Further, the monitoring and adjusting mechanism 12 includes a throttle valve 1201, a pressure regulating valve 1202 and a flow meter 1203, the gas split end of the split pipe 14 is connected to the throttle valve 1201, the throttle valve 1201 is connected to the pressure regulating valve 1202, the pressure regulating valve 1202 is connected to the flow meter 1203, the flow meter 1203 is connected to the intake solenoid valve 6, and the flow meter 1203 is signal-connected to the controller 13.

The shunt tube 14 shunts the gas through the gas shunt end, the shunted gas passes through the throttle valve 1201 and the regulation of the pressure regulating valve 1202, and shows the actual numerical value of the gas flow through the flowmeter 1203, then carries gas to the air inlet solenoid valve 6 department, and flowmeter 1203 and digital flow switch link to each other, and digital flow switch is used for monitoring the gas flow that flows into each chip test board 1, and flowmeter 1203 converts the gas flow who gathers into digital signal and transmits to the controller 13 and handle, and the controller 13 shows the gas flow information that obtains after handling on the display of flowmeter 1203, is convenient for control gas flow's size.

Further, a temperature sensor 15 is arranged in the shunt tube 14, and the temperature sensor 15 is in signal connection with the controller 13.

The temperature sensor 15 can monitor the temperature of the shunt tube 14, which changes in real time, and transmits the temperature to the controller 13 through RS485 communication, the controller 13 can control the opening and closing of the freezing electromagnetic valve 1102 according to the temperature in the shunt tube 14, and simultaneously, convert digital quantity signals into analog quantity signals to output the analog quantity signals in a percentage mode to control the electronic expansion valve 1103 in the gas freezing mechanism 11, so that the gas can be cooled more accurately, and the gas temperature in the shunt tube is kept at a preset temperature value.

Further, a magnet 16 is disposed on the heat preservation chamber 102, and the magnet 16 is used for closing a limit switch, and the limit switch is in signal connection with the controller 13.

The limit switch is used for judging the installation condition of the chip test board 1, the magnet 16 is installed in the heat preservation cavity 102 of the chip test board 1, when the chip test board 1 is installed in place, the magnet 16 is attracted, so that the limit switch is closed, signals are transmitted to the controller 13, and the chip is conveniently subjected to heat dissipation.

Example 2

Referring to fig. 5, this embodiment 2 differs from embodiment 1 in that the controller 13 is signal-connected to the alarm 17.

In the chip auxiliary cooling system of the embodiment, the lowest gas flow and the highest gas flow are preset in the process of monitoring the gas flow by the monitoring and adjusting mechanism 12, and when the actual gas flow monitored by the flow meter 1203 is lower than the lowest gas flow or higher than the highest gas flow, the controller 13 controls the alarm 17 to alarm, so as to remind the staff of the test chip to adjust the gas flow through the throttle valve 1201 and the pressure regulating valve 1202.

It should be noted that, the controller 13, the air inlet solenoid valve 6, the air outlet solenoid valve 8, the total air inlet solenoid valve 903, the plate heat exchanger 1101, the refrigeration solenoid valve 1102, the electronic expansion valve 1103, the flow meter 1203, the temperature sensor 15, the alarm 17, the limit switch and the digital flow switch used in the above embodiment are all conventional electronic components of those skilled in the art, and the specific connection circuit and how to select a specific model are common knowledge of those skilled in the art, and the above embodiment is not specifically described.

The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather to enable any modification, equivalent replacement, improvement or the like to be made within the spirit and principles of the utility model.

Claims (8)

1. The utility model provides a supplementary cooling system of chip, its characterized in that includes chip test board, air feed mechanism, gas freezing mechanism, monitoring adjustment mechanism and controller, air feed mechanism through the trachea that admits air with gas freezing mechanism links to each other, gas freezing mechanism's gas outlet end pass through the shunt tubes with at least one monitoring adjustment mechanism links to each other, every monitoring adjustment mechanism with the chip test board that corresponds links to each other, air feed mechanism gas freezing mechanism and monitoring adjustment mechanism all with the controller signal links to each other.

2. The chip auxiliary cooling system according to claim 1, wherein the chip test board comprises a chip burn-in board and a heat preservation cavity, at least one chip test tool is arranged on the chip burn-in board, vent holes are formed in the bottoms of the chip test tools, a vent pipe is arranged in the heat preservation cavity, the vent pipe is communicated with at least one vent hole, an air inlet electromagnetic valve is arranged at an air inlet of the vent pipe, an air outlet electromagnetic valve is arranged at an air outlet of the vent pipe, and the air inlet electromagnetic valve and the air outlet electromagnetic valve are connected with the controller through signals.

3. The chip assist cooling system as set forth in claim 1 wherein said air supply mechanism includes an air supply, a check valve and a total air inlet solenoid valve, said air supply being connected to said check valve, said check valve being connected to said total air inlet solenoid valve, said total air inlet solenoid valve being connected to said air inlet air line, said total air inlet solenoid valve being signal connected to said controller.

4. The chip auxiliary cooling system according to claim 1, wherein the gas freezing mechanism comprises a plate heat exchanger and a freezing electromagnetic valve, the gas inlet pipe is connected with the gas inlet end of the plate heat exchanger, the gas outlet end of the plate heat exchanger is connected with at least one monitoring and adjusting mechanism through the shunt pipe, the liquid inlet end of the plate heat exchanger is connected with the freezing electromagnetic valve, and the freezing electromagnetic valve is in signal connection with the controller.

5. The chip assist cooling system as set forth in claim 2 wherein said monitoring and regulating mechanism includes a throttle valve, a pressure regulating valve and a flow meter, said gas diverting end of said diverting tube being connected to said throttle valve, said throttle valve being connected to said pressure regulating valve, said pressure regulating valve being connected to said flow meter, said flow meter being connected to said intake solenoid valve, said flow meter being signal connected to said controller.

6. The chip assist cooling system as set forth in claim 1, wherein a temperature sensor is disposed in the shunt tube, the temperature sensor being in signal communication with the controller.

7. The chip auxiliary cooling system according to claim 2, wherein a magnet is arranged on the heat preservation chamber, the magnet is used for closing a limit switch, and the limit switch is in signal connection with the controller.

8. The chip assist cooling system as set forth in claim 1 wherein the controller is in signal communication with the alarm.