CN217689298U - Energy-saving semiconductor test system - Google Patents

Abstract

The utility model provides an energy-saving semiconductor test system, which comprises a compressor, wherein the outlet of the compressor is divided into two paths, one path of the compressor is connected to a test head module after passing through a heating electronic expansion valve and an exhaust pipeline, and the exhaust pipeline is provided with an exhaust temperature sensor; another way is connected to the entry of desicator behind the condenser, the export of desicator divide into two the tunnel, and first way is connected to the exhaust pipe after refrigerating electronic expansion valve, and the second way is connected to the test head module through return-air electronic expansion valve, return-air pipe, still is connected to the compressor entry, installs return-air temperature sensor on the return-air pipe, and return-air temperature sensor, exhaust temperature sensor, compressor, return-air electronic expansion valve, heating electronic expansion valve, refrigeration electronic expansion valve, test head module are connected to control module respectively. Energy-conserving semiconductor test system, through control electronic expansion valve interact, can satisfy wide temperature and big merit chip test demand.

Description

Energy-saving semiconductor test system

Technical Field

The utility model belongs to the technical field of the test encapsulation detects, especially, relate to an energy-conserving semiconductor test system.

Background

With the development of chip technology, the test requirement for a high-power chip is also continuously increased, but the test requirement of the current high-power test equipment is mainly realized by the refrigerating capacity output by the refrigerating equipment singly and the heating equipment on the test head module, and the heater is always in high-power output in the way, so that the service life of the heater is influenced, and the heater is not beneficial to energy conservation, so that a test system which can meet the test requirement of the high-power chip and is energy-saving and environment-friendly is required to be designed.

Disclosure of Invention

In view of this, the utility model aims at providing an energy-conserving semiconductor test system has solved the problem that current equipment can not satisfy wide temperature and powerful chip test demand.

In order to achieve the above purpose, the technical scheme of the utility model is realized like this:

an energy-saving semiconductor test system comprises a temperature-making module, a control module and a test head module, wherein the temperature-making module comprises a compressor, an outlet of the compressor is divided into two paths, one path of the compressor is connected to the test head module through a heating electronic expansion valve and a rear path of an exhaust pipeline in sequence, and an exhaust temperature sensor is installed on the exhaust pipeline; another way is connected to the entry of desicator behind the condenser, the export of desicator divide into two the tunnel, and first way is connected to the exhaust pipe behind refrigeration electronic expansion valve, and the second way is connected to the test head module through the return air pipeline behind the return air electronic expansion valve, and the second way still tube coupling to the compressor entry behind the return air electronic expansion valve, installs return air temperature sensor on the return air pipeline, return air temperature sensor, exhaust temperature sensor, compressor, return air electronic expansion valve, the electronic expansion valve of heating, refrigeration electronic expansion valve, test head module signal connection respectively to control module.

Furthermore, the air return electronic expansion valve, the heating electronic expansion valve and the refrigerating electronic expansion valve are all solenoid valves or proportional valves.

Furthermore, the control module is a single chip microcomputer.

Furthermore, the return air temperature sensor and the exhaust gas temperature sensor are both thermocouples or thermal resistors.

Furthermore, the test head module comprises a liquid flow channel, a heater, a temperature control test head and a temperature sensor, the liquid flow channel is a sealed cavity, the heater is arranged on the lower surface of the liquid flow channel, the temperature control test head is arranged below the heater, the temperature sensor is arranged in the temperature control test head, and the temperature sensor is in signal connection with the control module.

Further, the heater is a heating plate.

Compared with the prior art, energy-conserving semiconductor test system have following advantage:

(1) Energy-conserving semiconductor test system, through control electronic expansion valve interact to change the circulation path and the flow size of refrigerant at, realize exporting controllable high low temperature refrigeration medium under the same output, in addition the heater of test head, can satisfy wide temperature and big merit chip test demand.

(2) Energy-conserving semiconductor test system, adopt different refrigerating system to make the refrigerant can realize cold and hot temperature regulation, when the chip of test needs very big suppression power, this scheme can provide great cold volume, when test environment needs high temperature, this scheme can reduce the cold volume of cold source refrigerant to make test head module internal heating ware reduce output and reduce the energy consumption.

Drawings

The accompanying drawings, which form a part hereof, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention without undue limitation. In the drawings:

fig. 1 is a schematic diagram of an energy-saving semiconductor test system according to an embodiment of the present invention;

fig. 2 is a schematic view of a test head module according to an embodiment of the present invention.

Description of reference numerals:

1-a temperature-making module; 101-a compressor; 102-a condenser; 103-a dryer; 104-return air electronic expansion valve; 105-a heating electronic expansion valve; 106-refrigeration electronic expansion valve; 107-exhaust gas temperature sensor; 108-return air temperature sensor; 2-a control module; 3-a test head module; 301-liquid flow path; 302-a heater; 303-temperature control test head; 304-a temperature sensor; 4-machine table.

Detailed Description

It should be noted that, in the present invention, the embodiments and features of the embodiments may be combined with each other without conflict.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.

The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

An energy-saving semiconductor testing system is disclosed, as shown in fig. 1 and fig. 2, and comprises a temperature-making module 1, a control module 2 and a testing head module 3, wherein the temperature-making module 1 comprises a compressor 101, a condenser 102, a dryer 103, an air-return electronic expansion valve 104, a heating electronic expansion valve 105, a refrigerating electronic expansion valve 106, an air-return temperature sensor 108 and an exhaust temperature sensor 107, the outlet of the compressor 101 is divided into two paths, one path is connected with the inlet of the condenser 102, the other path is connected with the inlet of the heating electronic expansion valve 105, the outlet of the heating electronic expansion valve 105 is connected to the testing head module 3 through an exhaust line, the exhaust temperature sensor 107 is arranged on the exhaust line, the outlet of the condenser 102 is connected with the inlet of the dryer 103, the outlet of the dryer 103 is divided into two paths, and the two paths are respectively connected with the inlet of the refrigerating electronic expansion valve 106 and the inlet of the air-return electronic expansion valve 104; the outlet of the return air electronic expansion valve 104 is connected to the test head module 3 through an air return pipeline respectively, the return air electronic expansion valve is connected to the inlet of the compressor 101 through a pipeline, an air return temperature sensor 108 is installed on the air return pipeline, and the return air temperature sensor 108, the exhaust temperature sensor 107, the compressor 101, the return air electronic expansion valve 104, the heating electronic expansion valve 105 and the refrigerating electronic expansion valve 106 are connected to the control module 2 through signals respectively.

The temperature control module can change a circulation path of a refrigerant in the temperature control module by controlling an internal electronic expansion valve to provide a low-temperature refrigerant or a high-temperature refrigerant for the test head module, and the test head can realize temperature control in a wide temperature range under the dual functions of the temperature control module and the heater, provide a specified temperature for testing and bear a large load.

The control module 2 is a single chip microcomputer, and the air return electronic expansion valve 104, the heating electronic expansion valve 105 and the refrigerating electronic expansion valve 106 can be control devices such as electromagnetic valves and proportional valves. The control processes of the single chip microcomputer and the three expansion valves are all the prior art, the control mode of the control system is controlled by the controller, the control circuit of the controller can be realized by simple programming of technicians in the field, and the power supply also belongs to the common knowledge in the field, so the control mode and the circuit connection are not explained in detail in the application.

The condenser 102 may be a fan-cooled, external water-cooled, or the like cooling device.

The function of the return electronic expansion valve 104: the operation of the compressor 101 has certain requirements on the return air temperature, and if the temperature is too high, the normal operation of the compressor is affected, so the return air electronic expansion valve 104 is used for controlling the return air temperature, so that the compressor can normally operate.

The return air temperature sensor 108 and the exhaust gas temperature sensor 107 may be temperature sensors such as a thermocouple, a thermal resistor, and the like. The exhaust temperature sensor 107 is used for collecting the temperature of the junction of the outlets of the refrigeration electronic expansion valve 106 and the heating electronic expansion valve 105, and the temperature of the junction of the air return pipeline of the air return temperature sensor 108 and the air return electronic expansion valve 104. Thereby controlling the opening and closing sizes of the refrigeration electronic expansion valve 106, the heating electronic expansion valve 105 and the return air electronic expansion valve 104, and realizing the temperature control of each temperature point. The electric control module 2 collects the temperature of the test head through the test head temperature sensor 304 in the test head module 3, so as to control the heater 302 in the test head module to work and realize the stability of the control temperature.

The test head module 3 comprises a liquid flow channel 301, a heater 302, a temperature control test head 303 and a temperature sensor 304, wherein the liquid flow channel 301 is a sealed cavity, the heater 302 is fixed on the lower surface of the liquid flow channel by a fixing part through screws, the temperature control test head 303 is a target position for finally implementing temperature control, and is fixed on the lower part of the heater 302 through screws, and the temperature control is realized under the action of the liquid flow channel 301 or the heater 302. The middle part of the temperature control test head 303 is provided with a mounting hole, a temperature sensor 304 is mounted in the mounting hole, and the heater 302 and the temperature sensor 304 are both connected to the singlechip of the control module 2 through communication wires or wireless signals.

The heater 302 may be a conventional heating sheet.

The working principle of the energy-saving semiconductor test system is as follows:

the refrigerant can be any refrigerant, and the circulation flow of the refrigerant is as follows: the circulation of the refrigerant is divided into three paths, the first path: the outlet of the compressor 101 sequentially passes through the condenser 102, the dryer 103, the refrigeration electronic expansion valve 106 and the air return pipeline and then is connected to the inlet of the liquid flow channel 301, and the outlet of the liquid flow channel 301 is connected to the inlet of the compressor 101; and a second path: the outlet of the compressor 101 sequentially passes through the heating electronic expansion valve 105 and the air return pipeline and then is connected to the inlet of the liquid channel 301, and the outlet of the liquid channel 301 is connected to the inlet of the compressor 101; and a third path: the air conditioner is connected to the inlet of the compressor 101 after passing through a condenser 102, a dryer 103 and an electronic air return expansion valve 104 from the outlet of the compressor 101 in sequence;

the test head module 3 is installed on the machine table 4, can move to a specified position and realize a test function, the temperature control module 1 provides low-temperature refrigerant or high-temperature refrigerant for the test head module 3, and the temperature control test head 303 can realize temperature control in a wide temperature range under the dual functions of the temperature control module 1 and the heater 302, provide specified temperature for test and bear large load. In the heating module 1, under the mutual control of the heating electronic expansion valve 105 and the refrigeration electronic expansion valve 106, thereby realizing the wide range control from low temperature to high temperature, when the temperature control is needed, the control module 2 receives the test requirement provided by the upper computer, meanwhile, the compressor 101 starts working, the refrigerant starts circulating, the electronic control module controls the refrigeration electronic expansion valve 106 to be opened, the refrigerant is compressed by the compressor 101 and condensed by the condenser 102, the refrigerant can be changed from a high-temperature high-pressure gaseous state to a high-pressure normal-temperature liquid state, and the shunting action of the refrigeration electronic expansion valve 106, so that the heating refrigerant can be changed into a low-temperature low-pressure gaseous state to generate a low-temperature refrigerant, and the electronic control module 2 can control the opening and closing size of the refrigeration electronic expansion valve 106 to control the cooling capacity of the refrigerant. The refrigerant which does not pass through the condenser can not be cooled by shunting, so the heating electronic expansion valve 105 can only control the flow of the uncondensed refrigerant so as to control the heat, and the refrigeration electronic expansion valve 106 and the heating electronic expansion valve 105 can be mutually adjusted to generate the refrigerant with controllable temperature, and the electronic expansion valve at one end can be independently closed if the limit temperature is required. When the compressor 101 operates, the refrigerant is compressed from a low-temperature low-pressure gas state to a high-temperature high-pressure gas state, and when the refrigerant passes through the condenser 102, the refrigerant becomes a normal-temperature high-pressure liquid state, and then the refrigerant passes through the refrigeration electronic expansion valve 106 and the return-air electronic expansion valve 104 to reduce the pressure of the refrigerant and adjust the flow rate of the refrigerant to achieve low-temperature output control. When the refrigeration medium is conveyed to the liquid flow channel 301 from the exhaust pipeline, the exhaust temperature sensor 107 in the exhaust pipeline transmits data acquired in real time to the single chip microcomputer, and the single chip microcomputer controls the flow rate of the refrigeration medium according to the opening and closing size of the refrigeration electronic expansion valve 106 and the air return electronic expansion valve 104 which are preset; similarly, the single chip microcomputer controls the opening and closing of the return electronic expansion valve 104 through the feedback of the return temperature sensor 108 in the return pipe, and when the refrigerant directly flows into the heating electronic expansion valve 105 without passing through the condenser 102, although the heating electronic expansion valve 105 also performs the function of reducing the pressure, the state of the refrigerant is not changed, and the heat absorption and heat release conditions are not generated, so that the heating electronic expansion valve 105 only performs a function of adjusting the amount of heating. Therefore, when the machine module 4 needs to be cooled, the heating electronic expansion valve 105 is closed, the cooling electronic expansion valve 106 works, and the cooling capacity is output by the heating unit 1. When the machine module 4 needs to be heated, the cooling electronic expansion valve 106 is closed, and when the heating electronic expansion valve 105 works, the heating unit 1 outputs heating quantity. The mutual adjustment of the refrigeration electronic expansion valve 105 and the heating electronic expansion valve 104 can control the high-low temperature change of the temperature control equipment, and the control of the return air electronic expansion valve can stabilize the temperature of the refrigerant before returning to the compressor, so that the compressor can normally and stably run.

This scheme adopts different refrigerating system to make the refrigerant can realize cold and hot temperature regulation, and when the chip of test needed very big suppression power, this scheme can provide great cold volume, and when the test environment needed high temperature, this scheme can reduce the cold volume of cold source refrigerant to make 3 internal heating wares of test head module reduce output and reduce the energy consumption.

The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (6)

1. An energy-saving semiconductor test system, characterized by: the system comprises a heating module, a control module and a test head module, wherein the heating module comprises a compressor, an outlet of the compressor is divided into two paths, one path of the compressor is connected to the test head module after sequentially passing through a heating electronic expansion valve and an exhaust pipeline, and an exhaust temperature sensor is arranged on the exhaust pipeline; another way is connected to the entry of desicator behind the condenser, the export of desicator divide into two the tunnel, and first way is connected to the exhaust pipe behind refrigeration electronic expansion valve, and the second way is connected to the test head module through the return air pipeline behind the return air electronic expansion valve, and the second way still tube coupling to compressor entry behind the return air electronic expansion valve, installs return air temperature sensor on the return air pipeline, and return air temperature sensor, exhaust temperature sensor, compressor, return air electronic expansion valve, heating electronic expansion valve, refrigeration electronic expansion valve, test head module signal connection respectively to control module.

2. The power saving semiconductor test system of claim 1, wherein: the air return electronic expansion valve, the heating electronic expansion valve and the refrigerating electronic expansion valve are all solenoid valves or proportional valves.

3. The power saving semiconductor test system of claim 1, wherein: the control module is a singlechip.

4. The power saving semiconductor test system of claim 1, wherein: the return air temperature sensor and the exhaust gas temperature sensor are both thermocouples or thermal resistors.

5. The power saving semiconductor test system of claim 1, wherein: the testing head module comprises a liquid flow channel, a heater, a temperature control testing head and a temperature sensor, the liquid flow channel is a sealed cavity, the heater is arranged on the lower surface of the liquid flow channel, the temperature control testing head is arranged below the heater, the temperature sensor is arranged in the temperature control testing head, and the temperature sensor is in signal connection with the control module.

6. The power saving semiconductor test system of claim 5, wherein: the heater is a heating plate.

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