CN219589191U

CN219589191U - Semiconductor refrigerating device for robot under high-temperature operation

Info

Publication number: CN219589191U
Application number: CN202223220611.6U
Authority: CN
Inventors: 柳景耀
Original assignee: Xi'an Stride Zhitong Robot Technology Co ltd
Current assignee: Xi'an Stride Zhitong Robot Technology Co ltd
Priority date: 2022-12-02
Filing date: 2022-12-02
Publication date: 2023-08-25
Anticipated expiration: 2032-12-02

Abstract

The utility model relates to the technical field of semiconductor refrigerating devices and discloses a semiconductor refrigerating device for a robot under high-temperature operation, which comprises a robot main body shell, wherein a refrigerating sheet is arranged in the middle of one side end surface of the robot main body shell, a refrigerating plate is arranged on one side end surface of the refrigerating sheet, a cold guide block is fixedly connected with one side end surface of the refrigerating plate, one side of the cold guide block, which is far away from the refrigerating plate, is fixedly connected with a first bottom plate, four sides of one side end surface of the first bottom plate, which are far away from the first bottom plate, are respectively fixedly connected with a first support column, one side, which is far away from the refrigerating plate, of the four first support columns is provided with a first mounting plate, and one side, which is far away from the refrigerating plate, of the refrigerating sheet is provided with a heat radiating plate. The utility model does not need any refrigerant, can continuously work, does not have pollution sources, does not have rotating parts, does not generate a rotary effect, does not have sliding parts, is a solid piece, has no vibration, noise and long service life during working, is easy to install, and does not leak the refrigerant.

Description

Semiconductor refrigerating device for robot under high-temperature operation

Technical Field

The utility model relates to the technical field of semiconductor refrigerating devices, in particular to a semiconductor refrigerating device for a robot under high-temperature operation.

Background

After the semiconductor refrigerating sheet is electrified, a temperature difference is formed on two sides, and the side with high temperature called as a hot end and low temperature is called as a cold end. The existing technical scheme is that radiating fins are additionally arranged on a hot end and a cold end respectively, and air is supplied to the cold end and the hot end through a fan to perform air heat exchange, so that the refrigerating and radiating functions are realized.

The existing robot has the modes of air cooling, compressor refrigeration and the like, and can blow off the heat of the operation of the electric element in time under the general environment by air cooling, but the temperature of the precise electronic device can not be effectively reduced only by a fan under the high-temperature environment due to the higher air temperature. The electronic device is easy to overheat and damage, the compressor is refrigerated, a motor, a cylinder, an electronic valve and the like of the compressor cannot operate in a long process under a high-temperature environment, and in the use process, phenomena such as fluorine leakage, electric and mechanical part faults and the like possibly occur due to larger pressure of the condenser pipe under a high-temperature state, the reliability is low, the mechanism is complex, the maintenance is difficult, and the refrigeration requirement of equipment under the high-temperature condition cannot be met. Accordingly, a semiconductor refrigeration device for a robot under high temperature operation is provided by those skilled in the art to solve the problems set forth in the background art described above.

Disclosure of Invention

The utility model aims to solve the defects in the prior art, and provides a semiconductor refrigeration device for a robot under high-temperature operation, which does not need any refrigerant, can continuously work, does not have a pollution source, does not have a rotating part, does not generate a turning effect, does not have a sliding part, is a solid piece, does not have vibration, noise and long service life during working, is easy to install and does not leak a refrigerant.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the semiconductor refrigerating device for the robot under the high-temperature operation comprises a robot main body shell, wherein a refrigerating sheet is arranged in the middle of one side end surface of the robot main body shell, a refrigerating plate is arranged on one side end surface of the refrigerating sheet, a cold guide block is fixedly connected to one side end surface of the refrigerating plate, a first bottom plate is fixedly connected to one side of the cold guide block, which is far away from the refrigerating plate, first support columns are fixedly connected to four corners of one side end surface of the first bottom plate, a first mounting plate is arranged on one side of the four first support columns, which is far away from the first bottom plate, a radiating plate is arranged on one side of the refrigerating sheet, a radiating block is fixedly connected to one side end surface of the radiating plate, a radiating block is fixedly connected to one side end surface of the radiating block, a second bottom plate is fixedly connected to one side end surface of the second bottom plate, which is far away from the radiating block, a second support column is fixedly connected to one side end surface of the four second bottom plates, and a second anti-explosion fan axial flow fan is arranged in the middle of one side end surface of the second mounting plate;

through the technical scheme, no refrigerant is needed, the device can continuously work, no pollution source or rotating part is provided, no rotary effect is generated, no sliding part is provided, the device is a solid piece, no vibration or noise is generated during working, the service life is long, the device is easy to install, and the refrigerant cannot be leaked.

Further, one end of one side end face of the first mounting plate is fixedly connected with a guide plate;

through above-mentioned technical scheme, blow in the upper end of waiting the cooling chamber through the guide plate with cold wind.

Further, heat insulation cotton is filled between the robot main body shell and the refrigerating sheet;

through the technical scheme, the heat insulation cotton is made of aerogel felt materials and has good heat insulation performance.

Further, a cavity to be cooled is arranged inside the robot main body shell;

through the technical scheme, cold air is blown into the cavity to be cooled, so that the interior is rapidly refrigerated.

Further, a first explosion-proof axial flow fan is arranged on one side end surface of the first mounting plate;

through the technical scheme, cold air is blown into the cavity to be cooled through the first explosion-proof axial flow fan.

Further, the first mounting plate is tightly attached to the four first support columns;

through above-mentioned technical scheme, four first support columns fixed connection is in one side of first mounting panel.

Further, the refrigerating sheet is closely attached to the radiating plate;

through above-mentioned technical scheme, heating panel fixed connection is in one side of refrigeration piece.

Further, the refrigerating sheet is tightly attached to the refrigerating plate;

through the technical scheme, the refrigerating plate is fixedly connected to the other side of the refrigerating sheet.

The utility model has the following beneficial effects:

1. the semiconductor refrigerating device for the robot under high-temperature operation provided by the utility model does not need any refrigerant, can continuously work, does not have a pollution source or a rotating part, does not generate a gyration effect, does not have a sliding part, is a solid piece, does not vibrate, has long service life and easy installation, and does not leak a refrigerant during operation.

2. The semiconductor refrigerating device for the robot under high-temperature operation can realize high-precision temperature control through the control of input current, and is easy to realize remote control, program control and computer control by adding a temperature detection and control means, so that an automatic control system is conveniently formed, the thermal inertia of a semiconductor refrigerating sheet is very small, the refrigerating and heating time is very fast, and the maximum temperature difference of the refrigerating sheet can be achieved after the refrigerating sheet is electrified for less than one minute under the condition that a hot end dissipates heat and a cold end is empty.

3. The semiconductor refrigerating device for the robot under high-temperature operation has the advantages that the power of a single refrigerating element is small, but the single refrigerating element is combined into a galvanic pile, and if the same type of galvanic pile is combined into a refrigerating system by a serial-parallel method, the power can be quite large, so that the refrigerating power can be in the range from a few milliwatts to a ten-thousand watts.

Drawings

Fig. 1 is a schematic perspective view of a semiconductor refrigeration device for a robot under high-temperature operation according to the present utility model;

fig. 2 is a schematic diagram of an installation structure of a semiconductor refrigeration device for a robot under high-temperature operation according to the present utility model;

fig. 3 is a top view of a semiconductor refrigeration device for a robot in high temperature operation according to the present utility model;

fig. 4 is an enlarged view at a in fig. 2.

Legend description:

1. a deflector; 2. a cold guide block; 3. a refrigeration plate; 4. a heat dissipation plate; 5. a heat dissipation block; 6. a first base plate; 7. a second mounting plate; 8. a first support column; 9. a second explosion-proof axial flow fan; 10. a second support column; 11. a second base plate; 12. a cooling sheet; 13. thermal insulation cotton; 14. a robot body housing; 15. a cavity to be cooled; 16. a first explosion-proof axial flow fan; 17. a first mounting plate.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-4, one embodiment provided by the present utility model is: the utility model provides a semiconductor refrigerating plant for robot under high temperature operation, including robot main body shell 14, one side terminal surface middle part of robot main body shell 14 is provided with refrigeration piece 12, one side terminal surface of refrigeration piece 12 is provided with refrigeration board 3, one side terminal surface fixedly connected with cold guide block 2 of refrigeration board 3, one side terminal surface four corners department of cold guide block 2 keeping away from refrigeration board 3 is the first bottom plate 6 of fixedly connected with, one side terminal surface four corners department of first bottom plate 6 is the first support column 8 of fixedly connected with, one side that first bottom plate 6 was kept away from to four first support columns 8 is provided with first mounting panel 17, one side that keeps away from of refrigeration board 3 of refrigeration piece 12 is provided with heating panel 4, one side terminal surface fixedly connected with radiating block 5 of heating panel 4 is kept away from in the radiating block 5, one side terminal surface fixedly connected with second bottom plate 11 of radiating block 5 is kept away from in the second bottom plate 11, one side terminal surface four corners department of second support column 10 is the equal fixedly connected with second mounting panel 7, one side terminal surface middle part of second mounting panel 7 is provided with second axial fan 9, can not have the noise-free from the rotatory effect, can not reveal the solid refrigerant, no noise can be leaked when the rotatory, can not have the noise, the solid refrigerant is not have the long-time of life, the refrigeration piece is easy to be used for the vibration, the device is free of the work, the noise has no noise, the effect can not has the noise, the noise can not leak, and can not have the effect a long-stop, and can be easily cause.

One side terminal surface one end fixedly connected with guide plate 1 of first mounting panel 17, blow into the upper end of waiting cooling chamber 15 with cold wind through guide plate 1, it has thermal-insulated cotton 13 to fill between robot main body shell 14 and the refrigeration piece 12, thermal-insulated cotton 13 is made by aerogel felt material, good thermal insulation has, the inside of robot main body shell 14 is provided with waiting cooling chamber 15, cold wind blows into waiting in the cooling chamber 15 and makes inside quick refrigeration, one side terminal surface of first mounting panel 17 is provided with first explosion-proof axial fan 16, cold air blows into waiting in the cooling chamber 15 through first explosion-proof axial fan 16, first mounting panel 17 closely laminates with four first support columns 8, four first support columns 8 fixed connection is in one side of first mounting panel 17, refrigeration piece 12 closely laminates with heating panel 4, heating panel 4 fixed connection is in one side of refrigeration piece 12, refrigeration piece 12 closely laminates with refrigeration board 3, refrigeration board 3 fixed connection is in the opposite side of refrigeration piece 12.

Working principle: when the heat-dissipating plate is used, after the refrigerating sheet 12 is electrified, the heating surface is closely attached to the heat-dissipating plate 4 to conduct out heat on the heat-dissipating block 5, and the heat-dissipating plate 4 has a large overall shell area, has good heat conductivity and is cooled by the second explosion-proof axial flow fan 9. The heat insulation cotton 13 is aerogel felt, has good heat insulation, the refrigerating surface guides out cold energy on the refrigerating plate 3, the first explosion-proof axial flow fan 16 and the guide plate 1 blow cold energy along a path shown by an arrow in the drawing, the upper part of the heat dissipation plate 4 is tightly attached to the robot main body shell 14, air can only flow in the cavity 15 to be cooled, and returned hot air flows into the heat dissipation plate 4 from the lower part of the cavity 15 to be cooled, so that the cavity 15 to be cooled is circularly cooled with high efficiency.

Finally, it should be noted that: the foregoing description is only illustrative of the preferred embodiments of the present utility model, and although the present utility model has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements or changes may be made without departing from the spirit and principles of the present utility model.

Claims

1. A semiconductor refrigeration device for a robot under high temperature operation, comprising a robot body housing (14), characterized in that: the robot is characterized in that a refrigerating sheet (12) is arranged in the middle of one side end face of a robot main body shell (14), a refrigerating plate (3) is arranged on one side end face of the refrigerating sheet (12), a cold guide block (2) is fixedly connected to one side end face of the refrigerating plate (3), a first bottom plate (6) is fixedly connected to one side of the cold guide block (2) away from the refrigerating plate (3), first support columns (8) are fixedly connected to four corners of one side end face of the first bottom plate (6), and a first mounting plate (17) is arranged on one side of the first support columns (8) away from the first bottom plate (6);

one side of keeping away from refrigeration board (3) of refrigeration piece (12) is provided with heating panel (4), one side terminal surface fixedly connected with radiating block (5) of radiating block (5) are kept away from heating panel (4), one side terminal surface fixedly connected with second bottom plate (11) of radiating block (5), one side terminal surface four corners department that radiating block (5) were kept away from to second bottom plate (11) is all fixedly connected with second support column (10), four one side terminal surface fixedly connected with second mounting panel (7) of second support column (10), one side terminal surface middle part of second mounting panel (7) is provided with explosion-proof axial fan (9) of second.

2. A semiconductor refrigeration device for a robot for high temperature operation according to claim 1, wherein: one end of one side end face of the first mounting plate (17) is fixedly connected with a guide plate (1).

3. A semiconductor refrigeration device for a robot for high temperature operation according to claim 1, wherein: and heat insulation cotton (13) is filled between the robot main body shell (14) and the refrigerating sheet (12).

4. A semiconductor refrigeration device for a robot for high temperature operation according to claim 1, wherein: a cavity (15) to be cooled is arranged inside the robot main body shell (14).

5. A semiconductor refrigeration device for a robot for high temperature operation according to claim 1, wherein: a first explosion-proof axial flow fan (16) is arranged on one side end surface of the first mounting plate (17).

6. A semiconductor refrigeration device for a robot for high temperature operation according to claim 1, wherein: the first mounting plates (17) are tightly attached to the four first support columns (8).

7. A semiconductor refrigeration device for a robot for high temperature operation according to claim 1, wherein: the refrigerating sheet (12) is tightly attached to the radiating plate (4).

8. A semiconductor refrigeration device for a robot for high temperature operation according to claim 1, wherein: the refrigerating sheet (12) is tightly attached to the refrigerating plate (3).