CN221149971U - Manipulator device for positioning center of wafer - Google Patents
Manipulator device for positioning center of wafer Download PDFInfo
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- CN221149971U CN221149971U CN202322530046.1U CN202322530046U CN221149971U CN 221149971 U CN221149971 U CN 221149971U CN 202322530046 U CN202322530046 U CN 202322530046U CN 221149971 U CN221149971 U CN 221149971U
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- 238000001179 sorption measurement Methods 0.000 abstract description 13
- 238000000034 method Methods 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000003287 optical effect Effects 0.000 abstract description 5
- 239000000463 material Substances 0.000 description 3
- 230000001360 synchronised effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a manipulator device for positioning the center of a wafer, which comprises a manipulator arm and a positioning component which are connected; the mechanical arm comprises an interdigital and a supporting arm which are connected, and the supporting arm is controlled by a driving component; the alignment assembly comprises a step structure arranged on the interdigital, the step structure is arranged below the interdigital, the step structure is enclosed to form a semi-closed inverted circular table-shaped space, the area of the end part of the inverted circular table-shaped space, which is far away from the interdigital, is smaller than the area of the end part, which is close to the interdigital, of the inverted circular table-shaped space, and the area of the end part of the inverted circular table-shaped space, which is far away from the interdigital, is the same as the surface area of the wafer. According to the utility model, an independent mechanical or optical positioning device is not required, so that certain manufacturing cost is saved, and meanwhile, a vacuum adsorption device is not required to be configured to ensure the stability of the wafer relative to a mechanical arm in the process of transporting the wafer, so that the problem that the wafer is offset or even falls due to unstable vacuum adsorption can be avoided.
Description
Technical Field
The utility model relates to the technical field of semiconductor preparation, in particular to a manipulator device for positioning the center of a wafer.
Background
At present, in the center positioning operation of a wafer, a plurality of independent mechanical or optical positioning devices are used, the wafer is conveyed to the center positioning device through a mechanical arm, and after the center positioning device finishes center positioning calibration on the wafer, the wafer is conveyed to a process manufacturing unit through vacuum adsorption of the mechanical arm.
In the above process, an independent mechanical or optical positioning device needs to be arranged, so that the manufacturing cost is increased; the mechanical arm is required to be provided with a vacuum adsorption device for fixing the stability of the wafer in the transmission process; during the transportation process, the vacuum adsorption is unstable, and the wafer position is deviated or even falls off.
Disclosure of utility model
Based on this, the present utility model aims to provide a manipulator device for positioning the center of a wafer, so as to solve the defects in the prior art.
In order to achieve the above object, the present utility model provides a manipulator device for wafer center positioning, comprising a manipulator arm and a positioning assembly connected with each other;
The mechanical arm comprises an interdigital and a supporting arm which are connected, and the supporting arm is controlled by a driving component;
The alignment assembly comprises a step structure arranged on the interdigital, the step structure is arranged below the interdigital, the step structure is enclosed to form a semi-closed inverted circular truncated cone-shaped space, the inverted circular truncated cone-shaped space is used for accommodating a wafer, the area of the end part of the inverted circular truncated cone-shaped space, which is far away from the interdigital, is smaller than the area of the end part, which is close to the interdigital, of the inverted circular truncated cone-shaped space, and the area of the end part, which is far away from the interdigital, is the same as the surface area of the wafer;
The driving assembly is used for driving the mechanical arm and the step structure to synchronously move so that the wafer on the step structure is positioned on a vacuum column.
The beneficial effects of the utility model are as follows: the step structure is arranged on the interdigital, the step structure encloses to form a semi-closed inverted circular table-shaped space for accommodating the wafer, the area of the end part of the inverted circular table-shaped space, which is far away from the interdigital, is consistent with the surface area of the wafer, when the wafer is conveyed onto the vacuum column by using the mechanical arm, the wafer is positioned in the inverted circular table-shaped space, and under the action of the step structure, the central axis of the wafer is collinear with the central axis of the inverted circular table-shaped space, so that the centering positioning operation is realized, an independent mechanical or optical positioning device is not required to be arranged, a certain manufacturing cost is saved, and meanwhile, the vacuum adsorption device is not required to be configured to ensure the stability of the wafer relative to the mechanical arm in the transportation process, so that the problem that the wafer is offset or even falls due to unstable vacuum adsorption can be avoided.
Preferably, an embedded groove is formed in the bottom of the step structure, the embedded groove is communicated with the inverted circular truncated cone-shaped space, and the central axis of the embedded groove and the central axis of the inverted circular truncated cone-shaped space are in the same straight line.
Preferably, the opening width of the embedded groove is larger than the end face diameter of the vacuum column.
Preferably, the interdigital structure is U-shaped.
Preferably, the step structure comprises a connecting part, an inclined part and a supporting part which are arranged from top to bottom, one end of the inclined part is connected with the connecting part, the other end of the inclined part is connected with the supporting part, and the connecting part is connected with the inner side walls of the interdigital.
Preferably, the surface area of the connecting portion is larger than the surface area of the supporting portion, the connecting portion, the interdigital and the supporting portion are parallel, and the inclined portion is inclined relative to the supporting portion.
Preferably, the interdigital finger is detachably connected with the supporting arm through a bolt structure.
Preferably, the driving assembly comprises a guide rail, a sliding block arranged on the guide rail and a driving structure, wherein the sliding block is in sliding connection with the guide rail through the driving structure, and the sliding block is connected with the supporting arm.
Preferably, the driving structure comprises a driving motor, two belt pulleys and a synchronous belt, wherein the driving motor is fixedly connected with one belt pulley, the two belt pulleys are positioned on two opposite sides of the guide rail, the synchronous belt is arranged around the two belt pulleys, and the sliding block is connected with the synchronous belt.
Preferably, the vacuum column is connected with the wafer through a vacuum adsorption structure.
Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.
Drawings
Fig. 1 is a schematic structural diagram of a manipulator device for wafer center positioning according to an embodiment of the present utility model;
FIG. 2 is a cross-sectional view of a step structure provided by an embodiment of the present utility model;
FIG. 3 is a cross-sectional view of a vacuum column provided in an embodiment of the present utility model;
fig. 4 is a schematic structural diagram of a driving assembly according to an embodiment of the present utility model.
Description of main reference numerals:
10. A mechanical arm; 11. an interdigital; 12. a support arm; 20. a step structure; 21. an embedding groove; 22. a connection part; 23. an inclined portion; 24. a support part; 30. a vacuum column; 31. air holes; 40. a bolt structure; 51. a guide rail; 52. a slide block; 53. a drive motor; 54. a belt pulley; 55. a timing belt; 60. and (3) a wafer.
The utility model will be further described in the following detailed description in conjunction with the above-described figures.
Detailed Description
In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. Several embodiments of the utility model are presented in the figures. This utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "mounted" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 to 4, a robot apparatus for centering a wafer 60 according to an embodiment of the present utility model includes a robot 10 and an alignment assembly.
Wherein: the mechanical arm 10 includes an interdigital 11 and a supporting arm 12 connected, the interdigital 11 is in a U-shaped structure, the supporting arm 12 is controlled by a driving component, the alignment component includes a step structure 20 arranged on the interdigital 11, the step structure 20 is positioned below the interdigital 11, and the step structure 20 encloses to form a semi-closed type inverted circular-cone-shaped space for accommodating the wafer 60, it is to be noted that the area of the end of the inverted circular-cone-shaped space far away from the interdigital 11 is smaller than the area of the end of the inverted circular-cone-shaped space near the interdigital 11, and the area of the end of the inverted circular-cone-shaped space far away from the interdigital 11 is the same as the surface area of the wafer 60, that is, the area of the end surface of the inverted circular-cone-shaped space near the interdigital 11 is larger than the surface area of the wafer 60, so that the wafer 60 is easier to enter the step structure 20 when the mechanical arm 10 is utilized to obtain the wafer 60, and then under the action of the inner wall of the inverted circular-cone-shaped space, the wafer 60 is caused to slide to the end of the inverted circular-cone-shaped space far away from the interdigital 11, and the center axis of the wafer 60 is positioned on the same straight line, so that the alignment operation of the wafer 60 is realized.
It can be appreciated that the driving assembly is configured to drive the robot 10 and the step structure 20 to move synchronously, so that the wafer 60 located on the step structure 20 can be located on a vacuum column 30, and the wafer 60 is located at a center position of the vacuum column 30, and the vacuum column 30 is in a cylindrical structure, so that the surface area of the vacuum column 30 is designed to be smaller than the surface area of the wafer 60 in order to ensure that the wafer 60 can be successfully picked up by the robot 10.
In this embodiment, the bottom of the step structure 20 is provided with the embedded groove 21, the embedded groove 21 is connected with the inverted circular truncated cone-shaped space, wherein the opening width of the embedded groove 21 is larger than the end surface diameter of the vacuum column 30, so that the wafer 60 can be smoothly placed on the vacuum column 30 by the mechanical arm 10 with the alignment assembly, it should be noted that, in order to ensure that the wafer 60 is placed on the vacuum column 30, the central axis of the embedded groove 21 is collinear with the central axis of the vacuum column 30, so as to avoid the problem that the subsequent process is affected due to the re-alignment of the wafer 60.
In this embodiment, the step structure 20 includes a connecting portion 22, an inclined portion 23 and a supporting portion 24 disposed from top to bottom, one end of the inclined portion 23 is connected to the connecting portion 22, the other end is connected to the supporting portion 24, the connecting portion 22 is integrally connected to the inner side walls of the fingers 11, that is, the connecting portion 22 is adapted to the fingers 11, the connecting portion 22 is in a U-shaped structure, the supporting portion 24 is used for supporting the wafer 60, the supporting portion 24 is in a semi-closed ring-shaped structure, and the inclined portion 23 is disposed, with respect to the connecting portion 22, in a downward inclination toward a direction away from the inner side walls of the fingers 11.
The surface area of the connecting portion 22 is larger than the surface area of the supporting portion 24, the width of the connecting portion 22 is larger than the width of the supporting portion 24, and the connecting portion 22, the fingers 11 and the supporting portion 24 are parallel.
In this embodiment, the interdigital finger 11 is made of wear-resistant material, and the interdigital finger 11 is detachably connected with the supporting arm 12 through the bolt structure 40, so that after long-time operation, the interdigital finger 11 is excessively worn, and can be independently disassembled and replaced, thereby reducing the replacement cost of the whole mechanical arm 10.
In this embodiment, the driving assembly includes a guide rail 51, a slider 52 disposed on the guide rail 51, and a driving structure, wherein the slider 52 is slidably connected with the guide rail 51 and is connected with the support arm 12 through the driving structure, and it can be understood that the driving structure is used for driving the slider 52 to move along the guide rail 51 so as to drive the support arm 12 and the interdigital 11 to move synchronously, specifically, the driving structure includes a driving motor 53, two pulleys 54 and a timing belt 55, the two pulleys 54 are mounted on opposite sides of the guide rail 51, the timing belt 55 surrounds the two pulleys 54 to form an annular cavity, the guide rail 51 and the slider 52 are both disposed in the annular frame, wherein the slider 52 is connected with the timing belt 55, the driving motor 53 is fixedly connected with a pulley 54, and the driving motor 53 drives the pulley 54 to rotate so as to drive the timing belt 55 to move along the guide rail 51 along with the rotation of the pulley 54.
In this embodiment, the vacuum column 30 is connected to the wafer 60 through a vacuum adsorption structure, specifically, the vacuum adsorption structure includes a vacuum pump and a connecting pipe, a plurality of air holes 31 are formed in the vacuum column 30, and the air holes 31 are connected to the vacuum pump through the connecting pipe, so that the vacuum pump works to perform vacuum adsorption on the wafer 60 disposed on the vacuum column 30 through the connecting pipe and the air holes 31.
In a specific implementation, by arranging the step structure 20 on the interdigital 11, the step structure 20 encloses a semi-closed inverted circular table-shaped space for accommodating the wafer 60, the area of the end of the inverted circular table-shaped space far away from the interdigital 11 is consistent with the surface area of the wafer 60, when the wafer 60 is conveyed onto the vacuum column 30 by the mechanical arm 10, the wafer 60 is positioned in the inverted circular table-shaped space, and under the action of the step structure 20, the central axis of the wafer 60 is collinear with the central axis of the inverted circular table-shaped space, so that the centering positioning operation is realized, an independent mechanical or optical positioning device is not required, a certain manufacturing cost is saved, and meanwhile, a vacuum adsorption device is not required to be configured to ensure the stability relative to the mechanical arm 10 in the transportation process of the wafer 60, thereby avoiding the problem that the wafer 60 is offset or even drops due to unstable vacuum adsorption.
It should be noted that the foregoing implementation procedure is only for illustrating the feasibility of the present application, but this does not represent that the robot device for wafer centering of the present application has only one implementation procedure, and may be incorporated into the feasible implementation of the robot device for wafer centering of the present application.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing examples illustrate only a few embodiments of the utility model and are described in detail herein without thereby limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.
Claims (10)
1. The manipulator device for positioning the center of the wafer is characterized by comprising a manipulator arm and a positioning assembly which are connected;
The mechanical arm comprises an interdigital and a supporting arm which are connected, and the supporting arm is controlled by a driving component;
The alignment assembly comprises a step structure arranged on the interdigital, the step structure is arranged below the interdigital, the step structure is enclosed to form a semi-closed inverted circular truncated cone-shaped space, the inverted circular truncated cone-shaped space is used for accommodating a wafer, the area of the end part of the inverted circular truncated cone-shaped space, which is far away from the interdigital, is smaller than the area of the end part, which is close to the interdigital, of the inverted circular truncated cone-shaped space, and the area of the end part, which is far away from the interdigital, is the same as the surface area of the wafer;
The driving assembly is used for driving the mechanical arm and the step structure to synchronously move so that the wafer on the step structure is positioned on a vacuum column.
2. The manipulator device for positioning a center of a wafer according to claim 1, wherein an embedded groove is formed in the bottom of the step structure, the embedded groove is communicated with the inverted circular-table-shaped space, and a central axis of the embedded groove is in a same straight line with a central axis of the inverted circular-table-shaped space.
3. The robot apparatus for wafer centering of claim 2, wherein the opening width of the embedded groove is larger than the end face diameter of the vacuum column.
4. The robot assembly for wafer centering of claim 1, wherein the fingers are U-shaped in configuration.
5. The robot apparatus for centering a wafer according to claim 1, wherein the step structure comprises a connecting portion, an inclined portion and a supporting portion which are disposed from top to bottom, one end of the inclined portion is connected to the connecting portion, the other end is connected to the supporting portion, and the connecting portion is connected to an inner side wall of the interdigital.
6. The robot apparatus for wafer centering of claim 5, wherein the surface area of the connection portion is larger than the surface area of the support portion, the connection portion, the fingers, and the support portion are parallel, and the inclined portion is inclined with respect to the support portion.
7. The robot assembly for wafer centering of claim 1, wherein the fingers are removably coupled to the support arms by a bolt structure.
8. The robot assembly for wafer centering of claim 1, wherein the drive assembly comprises a rail, a slider disposed on the rail, and a drive structure, the slider being slidably coupled to the rail via the drive structure, and the slider being coupled to the support arm.
9. The robot apparatus for wafer centering of claim 8, wherein the drive structure comprises a drive motor fixedly coupled to one of the pulleys, two pulleys positioned on opposite sides of the guide rail, and a timing belt disposed around the two pulleys, the slider being coupled to the timing belt.
10. The robot assembly for wafer centering of claim 1, wherein the vacuum column is coupled to the wafer by a vacuum suction structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322530046.1U CN221149971U (en) | 2023-09-18 | 2023-09-18 | Manipulator device for positioning center of wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322530046.1U CN221149971U (en) | 2023-09-18 | 2023-09-18 | Manipulator device for positioning center of wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221149971U true CN221149971U (en) | 2024-06-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322530046.1U Active CN221149971U (en) | 2023-09-18 | 2023-09-18 | Manipulator device for positioning center of wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221149971U (en) |
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2023
- 2023-09-18 CN CN202322530046.1U patent/CN221149971U/en active Active
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