CN221117002U - MEMS sensor packaging structure capable of reducing residual stress influence - Google Patents
MEMS sensor packaging structure capable of reducing residual stress influence Download PDFInfo
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- CN221117002U CN221117002U CN202323284551.9U CN202323284551U CN221117002U CN 221117002 U CN221117002 U CN 221117002U CN 202323284551 U CN202323284551 U CN 202323284551U CN 221117002 U CN221117002 U CN 221117002U
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 23
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 230000000694 effects Effects 0.000 claims description 7
- 239000003292 glue Substances 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 230000002596 correlated effect Effects 0.000 claims 1
- 238000005259 measurement Methods 0.000 abstract description 4
- 239000000084 colloidal system Substances 0.000 abstract description 3
- 238000004026 adhesive bonding Methods 0.000 description 3
- 238000012858 packaging process Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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Abstract
The utility model discloses a MEMS sensor packaging structure capable of reducing the influence of residual stress, which is related to the integrated packaging of an MEMS chip, an ASIC chip and a packaging tube shell. By using the MEMS sensor packaging structure, the supporting component is introduced into the chip packaging, is used as a medium, is adhered to the packaging tube shell on the premise of being adhered to the side surface of the chip, the stress born by the chip can be reduced by using the deformation of the supporting component, and the stress can be further buffered by using the colloid in the lateral mounting, so that the measurement precision of the MEMS sensor is ensured and improved.
Description
Technical Field
The present disclosure relates to packaging technology for MEMS chips, and particularly to a packaging structure for MEMS chips capable of reducing residual stress effects.
Background
MEMS chips refer to microelectromechanical systems (Micro-Electro-MECHANICAL SYSTEMS) chips, also known as microelectromechanical systems integrated circuits. The micro-mechanical component is manufactured on the surface of a chip through micro-nano manufacturing technology and is connected with a circuit element. These tiny mechanical structures can perform sensing, measuring, controlling, and executing functions. MEMS have been widely used in various sensor chips in the fields of automotive electronics, aerospace, etc., and have a core function of converting a physical signal into an electrical signal that can be recognized by electronic devices. Because MEMS chips have advantages of small size, light weight, low energy consumption, high performance, etc., they have been widely used in mobile devices, automotive applications, medical devices, industrial control, consumer electronics, environmental monitoring, etc.
However, in the present packaging solution, as shown in fig. 1, both the MEMS chip 1 and the ASIC chip 2 for constituting the MEMS sensor are usually directly fixed to the package case 3 by means of an adhesive 4. There is a large difference in Coefficient of Thermal Expansion (CTE) between different materials due to the direct contact between the different structures. Therefore, larger residual stress is generated in the curing process of the adhesive, so that the sensitive device structure is deformed greatly, and the measuring precision of the MEMS sensor is reduced to a great extent.
Disclosure of Invention
The utility model aims to provide a MEMS sensor packaging structure capable of reducing the influence of residual stress and aims to optimize the deformation resistance and the connection reliability of the packaged MEMS sensor.
The technical solution of the present utility model for achieving the above object is that the MEMS sensor package structure capable of reducing the influence of residual stress is related to the integrated package of the MEMS chip, the ASIC chip and the package case, the MEMS chip and the ASIC chip being formed by separate mounting with respect to the package case, wherein the package case is provided with a support member by adhesive bonding, the MEMS chip is independently and laterally mounted to the support member by adhesive bonding, and the ASIC chip is independently and laterally mounted to the support member by adhesive bonding.
Further, the supporting component is an integral forming part with an upward opening and an inverted U-shaped structure, the integral forming part is provided with a horizontal rod body and each vertical rod body with two ends extending upward, the MEMS chip is attached to the opposite surface of one vertical rod body, the ASIC chip is attached to the opposite surface of the other vertical rod body, and the two chips are packaged and formed to be spaced and arranged side by side.
Further, the supporting component is an integrated part in the shape of an inverted T and is provided with a horizontal rod body and a vertical rod body extending upwards in the middle of the horizontal rod body, and the MEMS chip and the ASIC chip are attached to the two opposite side surfaces of the vertical rod body and are close to each other.
Further, the supporting component is a pair of independently formed vertical rod bodies and is attached to the packaging tube shell at a certain distance, the MEMS chip is attached to the opposite surface of one vertical rod body, the ASIC chip is attached to the opposite surface of the other vertical rod body, and the two chips are packaged and formed to be spaced and arranged side by side.
Further, the supporting component is a silicon forming body with a thermal expansion coefficient similar to that of the chip, and the supporting component is provided with grooves or holes in a non-sticking area.
The MEMS sensor packaging structure has the following technical effects: the support component is introduced into the chip package and is used as a medium, and is adhered to the package tube shell on the premise of adhering to the side surface of the chip, so that the stress borne by the chip is reduced by utilizing the deformation energy of the support component, and the stress can be further buffered by utilizing the colloid in the lateral adhesion, thereby ensuring and improving the measurement accuracy of the MEMS sensor.
Drawings
Fig. 1 is a schematic diagram of the external structure of a conventional package of a MEMS sensor.
FIG. 2 is a schematic front view of a preferred embodiment of the MEMS sensor package structure of the present utility model.
FIG. 3 is a front view of a MEMS sensor package according to a preferred embodiment of the present utility model.
FIG. 4 is a front view of another preferred embodiment of the MEMS sensor package structure of the present utility model.
Detailed Description
The following detailed description of the embodiments of the present utility model is provided with reference to the accompanying drawings, so that the technical scheme of the present utility model is easier to understand and grasp, and the protection scope of the present utility model is defined more clearly.
In view of the large difference of thermal expansion coefficients of different components in the traditional packaging structure, in order to avoid the influence of deformation caused by residual stress on the measurement precision of the MEMS sensor, the utility model improves and provides the MEMS sensor packaging structure capable of reducing the influence of the residual stress, and aims to optimize the deformation resistance and the connection reliability of the packaged chip. Although the MEMS chip and the packaging tube shell are still integrally packaged, the MEMS chip and the packaging tube shell are not directly connected, and in general, a special-shaped connecting medium is added outside the adhesive, and the integrated fixation is realized by adopting lateral bonding. Namely, the MEMS chip and the ASIC chip are formed by isolated mounting relative to the packaging tube shell, wherein the two chips are respectively and independently laterally mounted on the supporting component through adhesive, and the supporting component is mounted on the packaging tube shell through adhesive.
As can be seen in the schematic front view of the preferred embodiment shown in fig. 2, the support member 5 may be formed as an integral part of a reversed-U shape with an upward opening, and has a horizontal bar body with one vertical bar body 5a extending upward at one end and another vertical bar body 5b extending upward at the other end. The corresponding packaging process is to coat the adhesive 4 on the respective sides of the two chips, paste the MEMS chip 1 on the opposite surface of one vertical rod body 5a, and paste the ASIC chip 2 on the opposite surface of the other vertical rod body. Opposite sides here refer to the side walls of one of the vertical bars facing the other and vice versa; and the length of the horizontal rod body (not marked) meets the requirement that two chips are packaged and formed into a space-apart side-by-side shape.
As can be seen from the front view of a preferred embodiment shown in fig. 3, the support member 6 is formed as an inverted T-shaped integral part which also has a lying bar and a vertical bar extending upwardly therefrom. The corresponding packaging process is that adhesive glue 4 is coated on two opposite side walls of the vertical rod body, the MEMS chip 1 and the ASIC chip 2 are respectively stuck to the glue coating positions by the respective side surfaces and pressed, and the width of the vertical rod body is thinned, so that the two chips are formed to be close to each other.
As shown in fig. 4, the supporting member 6 is a pair of independently formed vertical rods, and is attached to the package case at a distance from each other. The corresponding packaging process is to coat the adhesive 4 on the respective sides of the two chips, press-fit the MEMS chip 1 on the opposite surface of one vertical rod body 7a, and press-fit the ASIC chip 2 on the opposite surface of the other vertical rod body 7 b. And the space between the pair of vertical rod bodies meets the requirement that two chips are packaged and formed into a space-apart side-by-side shape.
As a further detailed optimization, the support part is a silicon molded body with a thermal expansion coefficient similar to that of the chip, and can be independently and custom molded and directly used for the assembly and encapsulation of the chip. To enhance the ability of the support member to absorb and counteract residual stresses, a slot or aperture may be provided in the non-bonded area thereof.
In summary, as for the scheme description and the embodiment of the MEMS sensor package structure capable of reducing the influence of residual stress, the present utility model has substantial characteristics and improvements, and the technical effects are as follows: the support component is introduced into the chip package and is used as a medium, and is adhered to the package tube shell on the premise of adhering to the side surface of the chip, so that the stress borne by the chip is reduced by utilizing the deformation energy of the support component, and the stress can be further buffered by utilizing the colloid in the lateral adhesion, thereby ensuring and improving the measurement accuracy of the MEMS sensor.
In addition to the above embodiments, other embodiments of the present utility model are possible, and all technical solutions formed by equivalent substitution or equivalent transformation are within the scope of the present utility model as claimed.
Claims (5)
1. MEMS sensor packaging structure that can reduce residual stress influence, with MEMS chip, ASIC chip and the integrative encapsulation of encapsulation shell are correlated with, its characterized in that: the MEMS chip and the ASIC chip are formed by isolated mounting relative to the packaging tube shell, wherein the packaging tube shell is provided with a supporting part by bonding glue, the MEMS chip is independently and laterally mounted on the supporting part by bonding glue, and the ASIC chip is independently and laterally mounted on the supporting part by bonding glue.
2. The MEMS sensor package structure of claim 1, wherein residual stress effects are reduced, wherein: the support part is an integral forming part with an upward opening and an inverted U-shaped structure, the integral forming part is provided with a horizontal rod body and two vertical rod bodies with two ends extending upward, the MEMS chip is attached to the opposite surface of one vertical rod body, the ASIC chip is attached to the opposite surface of the other vertical rod body, and the two chips are packaged and formed to be spaced and arranged side by side.
3. The MEMS sensor package structure of claim 1, wherein residual stress effects are reduced, wherein: the support part is an integrated part in the shape of an inverted T, and is provided with a horizontal rod body and a vertical rod body with the middle extending upwards, and the MEMS chip and the ASIC chip are attached to the two opposite side surfaces of the vertical rod body and are close to each other.
4. The MEMS sensor package structure of claim 1, wherein residual stress effects are reduced, wherein: the support part is a pair of independently formed vertical rod bodies and is attached to the packaging tube shell at a certain distance, the MEMS chip is attached to the opposite surface of one vertical rod body, the ASIC chip is attached to the opposite surface of the other vertical rod body, and the two chips are packaged and formed to be spaced and arranged side by side.
5. The MEMS sensor package structure of any one of claims 1 to 4, wherein residual stress effects are reduced: the supporting component is a silicon forming body with a thermal expansion coefficient similar to that of the chip, and the supporting component is provided with grooves or holes in a non-adhesive area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323284551.9U CN221117002U (en) | 2023-12-04 | 2023-12-04 | MEMS sensor packaging structure capable of reducing residual stress influence |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323284551.9U CN221117002U (en) | 2023-12-04 | 2023-12-04 | MEMS sensor packaging structure capable of reducing residual stress influence |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221117002U true CN221117002U (en) | 2024-06-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323284551.9U Active CN221117002U (en) | 2023-12-04 | 2023-12-04 | MEMS sensor packaging structure capable of reducing residual stress influence |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221117002U (en) |
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2023
- 2023-12-04 CN CN202323284551.9U patent/CN221117002U/en active Active
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