CN221103312U - Double-sided attenuation circuit - Google Patents
Double-sided attenuation circuit Download PDFInfo
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- CN221103312U CN221103312U CN202322748372.XU CN202322748372U CN221103312U CN 221103312 U CN221103312 U CN 221103312U CN 202322748372 U CN202322748372 U CN 202322748372U CN 221103312 U CN221103312 U CN 221103312U
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- 239000000758 substrate Substances 0.000 claims abstract description 83
- 238000013016 damping Methods 0.000 claims description 20
- 239000000919 ceramic Substances 0.000 claims description 7
- 239000010408 film Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 229910003460 diamond Inorganic materials 0.000 claims description 5
- 239000010432 diamond Substances 0.000 claims description 5
- 239000010409 thin film Substances 0.000 claims description 4
- 238000004544 sputter deposition Methods 0.000 claims description 3
- 230000009977 dual effect Effects 0.000 claims 7
- 230000005540 biological transmission Effects 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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Abstract
The utility model discloses a double-sided attenuation circuit, which comprises a substrate and two groups of attenuation circuits. The two side surfaces of the substrate are provided with a first end electrode and a second end electrode which are used for connecting the two groups of attenuation circuits. The two groups of attenuation circuits are respectively a first attenuation circuit and a second attenuation circuit, and are respectively arranged on the front side and the back side of the substrate. The first attenuation circuit and the second attenuation circuit both comprise a plurality of resistors and electrodes, and the resistors and the electrodes in the two groups of attenuation circuits are correspondingly arranged at the same positions on the front side and the back side of the substrate respectively. The utility model adds the back circuit on the basis of the original single-sided attenuation circuit, improves the power capacity on the basis of not changing the matching performance and the size by reasonable calculation, and increases the application power range; compared with the original single-sided attenuation circuit, the utility model has double power area and same performance, and can be widely applied to a plurality of fields.
Description
Technical Field
The utility model relates to the technical field of attenuation resistor networks, in particular to a double-sided attenuation circuit.
Background
The attenuation resistor network is a key design in passive power absorbing devices and is widely applied to microwave communication, radar and other equipment. The attenuation resistor network is mainly used for quantitatively absorbing power in microwave passive devices.
In the prior art, the coaxially matched suspended microstrip line mainly realizes the absorption of quantitative power through a single-sided attenuation network. Under the high-power application environment, the maximum power always has a limit on the basis of certain performance due to the fact that the suspended microstrip line is limited and is matched with the thickness of the ceramic chip and the width of the microstrip line. Therefore, in a high power application environment, the power capacity is increased by adjusting the size of the ceramic chip, the width of the strip line, and the like, so as to increase the maximum power. However, the method can increase the whole volume of the structure and affect the assembly and placement of other parts.
Disclosure of utility model
The utility model aims to provide a double-sided attenuation circuit, which can improve the power capacity and increase the service power range of the circuit on the basis of not changing the matching performance and the size.
The aim of the utility model can be achieved by the following technical scheme:
The double-sided damping circuit comprises a substrate and damping circuits, wherein a first end electrode and a second end electrode are arranged on two side surfaces of the substrate, the two damping circuits are respectively a first damping circuit and a second damping circuit and are respectively arranged on the front side and the back side of the substrate, and the first damping circuit and the second damping circuit both comprise a plurality of resistors and electrodes; the resistors and the electrodes in the two groups of attenuation circuits are correspondingly arranged at the same positions on the front and back surfaces of the substrate respectively; the first attenuation circuit and the second attenuation circuit are connected through the first end electrode and the second end electrode.
As a further scheme of the utility model: the first attenuation circuit is arranged on the front surface of the substrate and comprises a first input electrode, a first output electrode, a first upper electrode, a first lower electrode, a first series resistor, a first grounding resistor and a second grounding resistor; the second attenuation circuit is arranged on the reverse side of the substrate and comprises a second input electrode, a second output electrode, a second upper electrode, a second lower electrode, a second series resistor, a third grounding resistor and a fourth grounding resistor;
The first input electrode and the second input electrode are positioned on the front side and the back side of the same position of the substrate; the first output electrode and the second output electrode are positioned on the front side and the back side of the same position of the substrate; the first upper electrode and the second upper electrode are positioned on the front side and the back side of the same position of the substrate; the first lower electrode and the second lower electrode are positioned on the front side and the back side of the same position of the substrate; the first series resistor and the second series resistor are positioned on the front side and the back side of the same position of the substrate; the first grounding resistor and the third grounding resistor are positioned on the front side and the back side of the same position of the substrate; the second grounding resistor and the fourth grounding resistor are positioned on the front side and the back side of the same position of the substrate.
As a further scheme of the utility model: the first upper electrode and the first lower electrode are respectively positioned on the upper side and the lower side of the front surface of the substrate; the first input electrode and the first output electrode are positioned on a central line of the front surface of the substrate; the first series resistor is arranged between the first input electrode and the first output electrode; the first grounding resistor and the second grounding resistor are arranged on two sides of the first series resistor, and the first series resistor, the first grounding resistor and the second grounding resistor are connected in parallel;
The second upper electrode and the second lower electrode are respectively positioned on the upper side and the lower side of the back surface of the substrate; the second input electrode and the second output electrode are positioned on a central line on the back surface of the substrate; the second series resistor is arranged between the second input electrode and the second output electrode; the third grounding resistor and the fourth grounding resistor are arranged on two sides of the second series resistor, and the second series resistor, the third grounding resistor and the fourth grounding resistor are connected in parallel.
As a further scheme of the utility model: the number of the first series resistors is the same as the number of the second series resistors.
As a further scheme of the utility model: the first series resistor, the first grounding resistor and the second grounding resistor are symmetrically distributed along the central line of the front surface of the substrate;
The second series resistor, the third grounding resistor and the fourth grounding resistor are symmetrically distributed along the central line of the back surface of the substrate.
As a further scheme of the utility model: the first end electrode, the second end electrode, the first input electrode, the second input electrode, the first output electrode and the second output electrode have the same width.
As a further scheme of the utility model: the attenuation circuit can be prepared by thick film printing or thin film process sputtering.
As a further scheme of the utility model: the substrate is a ceramic substrate or a diamond substrate.
The utility model has the beneficial effects that:
The back circuit is added on the basis of the original single-sided attenuation circuit, the power capacity is improved on the basis of not changing the matching performance and the size by reasonable calculation, and the range of the used power is increased
Compared with the original single-sided attenuation circuit, the double-sided attenuation circuit has double power area and same performance, and can be widely applied to the equipment fields of aviation, aerospace, radar, radio stations, broadcast communication and the like.
Drawings
The utility model is further described below with reference to the accompanying drawings:
FIG. 1 is a schematic view of the front side of a substrate in the present utility model;
FIG. 2 is a schematic view of the left side of the substrate of the present utility model;
FIG. 3 is a schematic view of the right side of the substrate of the present utility model;
FIG. 4 is a schematic view of the reverse side of a substrate in accordance with the present utility model;
FIG. 5 is a schematic diagram of a first single-sided damping circuit in accordance with the present utility model;
FIG. 6 is a schematic diagram of a prior art standard distribution parameter attenuation sheet;
wherein the reference numerals are as follows:
1a, a first input electrode; 1b, a second input electrode; 2a, a first output electrode; 2b, a second output electrode; 3a, a first upper electrode; 3b, a second upper electrode; 4a, a first lower electrode; 4b, a second lower electrode; 5a, a first series resistor; 5b, a second series resistor; 6a, a first grounding resistor; 6b, a third grounding resistor; 7a, a second grounding resistor; 7b, a fourth grounding resistor; 8a, a first end electrode; 8b, a second terminal electrode.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1 to 3, a dual-sided attenuator circuit includes a substrate and two sets of attenuator circuits. Wherein, the two side surfaces of the substrate are provided with a first end electrode 8a and a second end electrode 8b. The two groups of attenuation circuits are respectively a first attenuation circuit and a second attenuation circuit, and are respectively arranged on the front side and the back side of the substrate. The first attenuation circuit and the second attenuation circuit both comprise a plurality of resistors and electrodes, and the resistors and the electrodes in the two groups of attenuation circuits are correspondingly arranged at the same positions on the front side and the back side of the substrate respectively. The two sets of attenuation circuits are connected by a first terminal electrode 8a and a second terminal electrode 8b.
Wherein the substrate is a ceramic substrate or a diamond substrate. Compared with the diamond substrate, the ceramic substrate has wider application range and lower cost. Compared to ceramic substrates, diamond has a higher thermal conductivity at the same size.
The attenuation circuit can be prepared by thick film printing or thin film process sputtering.
Referring to fig. 1, the first attenuation circuit is disposed on the front surface of the substrate and includes a first input electrode 1a, a first output electrode 2a, a first upper electrode 3a, a first lower electrode 4a, a first series resistor 5a, a first ground resistor 6a and a second ground resistor 7a. Wherein the first upper electrode 3a and the first lower electrode 4a are respectively positioned on the upper side and the lower side of the front surface of the substrate. The first input electrode 1a and the first output electrode 2a are positioned on the central line of the front surface of the substrate; the first series resistor 5a is arranged between the first input electrode 1a and the first output electrode 2 a; the first ground resistor 6a and the second ground resistor 7a are provided on both sides of the first series resistor 5 a. The first series resistor 5a, the first grounding resistor 6a and the second grounding resistor 7a are connected in parallel.
Referring to fig. 4, the second attenuation circuit is disposed on the opposite side of the substrate and includes a second input electrode 1b, a second output electrode 2b, a second upper electrode 3b, a second lower electrode 4b, a second series resistor 5b, a third ground resistor 6b and a fourth ground resistor 7b. Wherein the first input electrode 1a and the second input electrode 1b are positioned on the front and back surfaces of the same position of the substrate; the first output electrode 2a and the second output electrode 2b are positioned on the front and back surfaces of the same position of the substrate; the first upper electrode 3a and the second upper electrode 3b are positioned on the front and back surfaces of the same position of the substrate; the first lower electrode 4a and the second lower electrode 4b are positioned on the front and back surfaces of the same position of the substrate; the first series resistor 5a and the second series resistor 5b are positioned on the front side and the back side of the same position of the substrate; the first grounding resistor 6a and the third grounding resistor 6b are positioned on the front side and the back side of the same position of the substrate; the second ground resistor 7a and the fourth ground resistor 7b are positioned on the front and back surfaces of the same position of the substrate.
Specifically, the second upper electrode 3b and the second lower electrode 4b are respectively located on the upper side and the lower side of the opposite surface of the substrate; the second input electrode 1b and the second output electrode 2b are positioned on the central line of the opposite side of the substrate; the second series resistor 5b is arranged between the second input electrode 1b and the second output electrode 2 b; the third ground resistor 6b and the fourth ground resistor 7b are provided on both sides of the second series resistor 5 b. The second series resistor 5b, the third grounding resistor 6b and the fourth grounding resistor 7b are connected in parallel.
In order to facilitate connection of the substrate front and back side attenuation circuits, the first end electrode 8a, the second end electrode 8b, the first input electrode 1a, the second input electrode 1b, the first output electrode 2a, and the second output electrode 2b have the same width. Specifically, the first terminal electrode 8a is used to connect the first input electrode 1a and the second input electrode 1b, and the second terminal electrode 8b is used to connect the first output electrode 2a and the second output electrode 2b.
Further, the number of the first series resistors 5a is several, and the number of the first series resistors 5a is set between the first grounding resistor 6a and the second grounding resistor 7 a. The number of the first series resistors 5a and the second series resistors 5b is the same, and a plurality of the second series resistors 5b are arranged between the third grounding resistor 6b and the fourth grounding resistor 7 b.
On the front surface of the substrate, the first series resistor 5a, the first ground resistor 6a and the second ground resistor 7a are symmetrically distributed along the center line of the front surface of the substrate. On the opposite side of the substrate, the second series resistor 5b, the third ground resistor 6b and the fourth ground resistor 7b are symmetrically distributed along the center line of the opposite side of the substrate.
The first input electrode 1a, the first output electrode 2a, the first series resistors 5a, the first grounding resistor 6a and the second grounding resistor 7a form a T-shaped attenuation network end for absorbing power. The front and back sides of the substrate are the same. The first terminal electrode 8a and the second terminal electrode 8b are connected with the attenuation circuits on the front and back sides of the substrate to form equivalent parallel connection.
Specifically, as shown in fig. 5, the resistor X corresponds to a plurality of first series resistors 5a, and the resistor y corresponds to a first grounding resistor 6a and a second grounding resistor 7a. When the second end electrode 8b is an input port and the first end electrode 8a is an output port, signals are input from the second end electrode 8b and pass through the attenuation circuits on the front side and the back side of the substrate; the signal passes through the first series resistors 5a, the second series resistors 5b, the first grounding resistor 6a, the third grounding resistor 6b, the second grounding resistor 7a and the fourth grounding resistor 7b at the same time, and finally is output through the signal output port of the first end electrode 8 a.
The correlation calculation for the substrate single-sided attenuation circuit is as follows:
According to the transmission line equation:
Where R is a transmission constant, α is an attenuation constant, β is a phase-contrast constant, Z 0 is a characteristic impedance, R is a series resistance per unit length, G is a parallel admittance per unit length, L is a series inductance per unit length, C is a distributed capacitance per unit length, and jω is an imaginary part.
For a lossy transmission line, let l=0, c=0, β=0,
The method is obtained by a formula (1):
The method is obtained by a formula (2):
Referring to fig. 6, in a typical standard distribution parameter attenuation sheet:
series resistance per unit length:
Parallel admittance per unit length:
Where R s1 is the square resistance of the middle series resistor R s1 shown in fig. 6, R s2 is the square resistance of the two-side ground resistor R s2 shown in fig. 6, l is the resistor film width, b is the ground width, and ω is the transmission line width.
Substituting formulas (5) and (6) into formulas (3) and (4) to obtain:
the total attenuation is:
characteristic impedance:
The formulas (7) and (8) are direct current calculation formulas of the equal-square resistance distribution parameter attenuation sheet, and are applicable to thick film circuits and thin film circuits.
As is clear from the equation (7), the single-sided attenuation of the circuit is independent of the resistance value. The design of the attenuation circuit is unchanged according to the single-sided figure design.
Referring to FIG. 6, in the actual single-sided decay circuit calculation, the values of Z 0、Rs and α α are known; substituting the values of Z 0 and R s into a formula (9) to obtain a relational expression of b and w; b, w values meeting the requirements are selected according to the actual design requirements and the relation between b and w; substituting the values of b, w and alpha α into the formula (8) to obtain the value of l, and obtaining the width of the circuit single-sided resistor film.
Since the two-sided circuit is equivalent to the equivalent parallel connection, the power voltage of each side is equal. As can be seen from p=u 2/R, when the resistance becomes 2×r, the power received by each circuit is P/2. Therefore, the first series resistor 5a, the first grounding resistor 6a, the second grounding resistor 7a, the second series resistor 5b, the third grounding resistor 6b and the fourth grounding resistor 7b in the first attenuation circuit are all calculated and designed according to the design requirement of 2 XZ 0, and the output power of the attenuation circuits on the front side and the back side of the substrate is consistent with that of the single-sided circuit.
The back circuit is added on the basis of the original single-sided attenuation circuit, and compared with the conventional attenuation circuit, the back circuit has double power area and the same performance, and can be widely applied to the equipment fields of aviation, aerospace, radar, radio stations, broadcast communication and the like; and the power capacity is improved on the basis of not changing the matching performance and the size by reasonable calculation, and the range of the used power is increased.
The foregoing describes one embodiment of the present utility model in detail, but the description is only a preferred embodiment of the present utility model and should not be construed as limiting the scope of the utility model. All equivalent changes and modifications within the scope of the present utility model are intended to be covered by the present utility model.
Claims (8)
1. The utility model provides a two-sided decay circuit, includes base plate and decay circuit, the both sides side of base plate is provided with first end electrode (8 a) and second end electrode (8 b), its characterized in that:
The damping circuits are two groups, namely a first damping circuit and a second damping circuit which are respectively arranged on the front side and the back side of the substrate, and each of the first damping circuit and the second damping circuit comprises a plurality of resistors and electrodes; the resistors and the electrodes in the two groups of attenuation circuits are correspondingly arranged at the same positions on the front and back surfaces of the substrate respectively; the first attenuation circuit and the second attenuation circuit are connected through the first end electrode (8 a) and the second end electrode (8 b).
2. The dual sided damping circuit of claim 1, wherein: the first attenuation circuit is arranged on the front surface of the substrate and comprises a first input electrode (1 a), a first output electrode (2 a), a first upper electrode (3 a), a first lower electrode (4 a), a first series resistor (5 a), a first grounding resistor (6 a) and a second grounding resistor (7 a); the second attenuation circuit is arranged on the reverse side of the substrate and comprises a second input electrode (1 b), a second output electrode (2 b), a second upper electrode (3 b), a second lower electrode (4 b), a second series resistor (5 b), a third grounding resistor (6 b) and a fourth grounding resistor (7 b);
The first input electrode (1 a) and the second input electrode (1 b) are positioned on the front side and the back side of the same position of the substrate; the first output electrode (2 a) and the second output electrode (2 b) are positioned on the front side and the back side of the same position of the substrate; the first upper electrode (3 a) and the second upper electrode (3 b) are positioned on the front side and the back side of the same position of the substrate; the first lower electrode (4 a) and the second lower electrode (4 b) are positioned on the front side and the back side of the same position of the substrate; the first series resistor (5 a) and the second series resistor (5 b) are positioned on the front side and the back side of the same position of the substrate; the first grounding resistor (6 a) and the third grounding resistor (6 b) are positioned on the front side and the back side of the same position of the substrate; the second grounding resistor (7 a) and the fourth grounding resistor (7 b) are positioned on the front side and the back side of the same position of the substrate.
3. The dual sided damping circuit of claim 2, wherein: the first upper electrode (3 a) and the first lower electrode (4 a) are respectively positioned on the upper side and the lower side of the front surface of the substrate; the first input electrode (1 a) and the first output electrode (2 a) are positioned on a central line of the front surface of the substrate; the first series resistor (5 a) is arranged between the first input electrode (1 a) and the first output electrode (2 a); the first grounding resistor (6 a) and the second grounding resistor (7 a) are arranged on two sides of the first series resistor (5 a), and the first series resistor (5 a), the first grounding resistor (6 a) and the second grounding resistor (7 a) are connected in parallel;
The second upper electrode (3 b) and the second lower electrode (4 b) are respectively positioned on the upper side and the lower side of the back surface of the substrate; the second input electrode (1 b) and the second output electrode (2 b) are positioned on the central line of the back surface of the substrate; the second series resistor (5 b) is arranged between the second input electrode (1 b) and the second output electrode (2 b); the third grounding resistor (6 b) and the fourth grounding resistor (7 b) are arranged on two sides of the second series resistor (5 b), and the second series resistor (5 b), the third grounding resistor (6 b) and the fourth grounding resistor (7 b) are connected in parallel.
4. The dual sided damping circuit of claim 2, wherein: the number of the first series resistors (5 a) is a plurality, and the number of the first series resistors (5 a) and the number of the second series resistors (5 b) are the same.
5. The dual sided damping circuit of claim 2, wherein: the first series resistor (5 a), the first grounding resistor (6 a) and the second grounding resistor (7 a) are symmetrically distributed along the central line of the front surface of the substrate;
the second series resistor (5 b), the third grounding resistor (6 b) and the fourth grounding resistor (7 b) are symmetrically distributed along the central line of the back surface of the substrate.
6. The dual sided damping circuit of claim 2, wherein: the first end electrode (8 a), the second end electrode (8 b), the first input electrode (1 a), the second input electrode (1 b), the first output electrode (2 a) and the second output electrode (2 b) have the same width.
7. The dual sided damping circuit of claim 2, wherein: the attenuation circuit can be prepared by thick film printing or thin film process sputtering.
8. The dual sided damping circuit of claim 1, wherein: the substrate is a ceramic substrate or a diamond substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322748372.XU CN221103312U (en) | 2023-10-13 | 2023-10-13 | Double-sided attenuation circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322748372.XU CN221103312U (en) | 2023-10-13 | 2023-10-13 | Double-sided attenuation circuit |
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| Publication Number | Publication Date |
|---|---|
| CN221103312U true CN221103312U (en) | 2024-06-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322748372.XU Active CN221103312U (en) | 2023-10-13 | 2023-10-13 | Double-sided attenuation circuit |
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| CN (1) | CN221103312U (en) |
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2023
- 2023-10-13 CN CN202322748372.XU patent/CN221103312U/en active Active
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