CN221102012U - Die bonder welding device - Google Patents
Die bonder welding device Download PDFInfo
- Publication number
- CN221102012U CN221102012U CN202322971892.7U CN202322971892U CN221102012U CN 221102012 U CN221102012 U CN 221102012U CN 202322971892 U CN202322971892 U CN 202322971892U CN 221102012 U CN221102012 U CN 221102012U
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- base
- fixedly connected
- sleeve
- machine table
- welding
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- 238000003466 welding Methods 0.000 title claims abstract description 58
- 238000001816 cooling Methods 0.000 claims abstract description 22
- 230000017525 heat dissipation Effects 0.000 claims abstract description 21
- 230000000087 stabilizing effect Effects 0.000 claims abstract description 7
- 238000003825 pressing Methods 0.000 claims description 11
- 239000011159 matrix material Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 abstract description 6
- 230000000694 effects Effects 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- Die Bonding (AREA)
Abstract
The application discloses a die bonder welding device, which relates to the field of welding devices and comprises a machine table, wherein a portal frame is fixedly connected to the upper surface of the machine table, a driving mechanism is arranged on the upper surface of the portal frame, a welding head is arranged at the driving end of the driving mechanism, a cooling assembly is arranged on the upper surface of the machine table, a base is fixedly connected to the upper surface of the machine table, a stabilizing assembly is arranged in the base, the cooling assembly comprises a bracket fixedly connected to the upper surface of the machine table, a round rod is fixedly connected to the outer surface of the bracket, and a sleeve is movably connected to the outer surface of the round rod. According to the application, the welding head can be pulled to move upwards by the driving mechanism, so that the pull rod can be driven to move, the sleeve can be pulled to slide on the outer surface of the round rod in the moving process of the pull rod, the sleeve drives the heat dissipation fans to be close to the base, and the heat dissipation fans on two sides are obliquely arranged, so that the purpose of cooling chips on the base is realized, the cooling rate of welding spots of the chips is accelerated, and the welding efficiency is improved.
Description
Technical Field
The utility model relates to the technical field of welding devices, in particular to a die bonder welding device.
Background
The die bonder welding device is equipment for welding operation in the semiconductor packaging process, and is used for fixing a chip or a chip assembly on a packaging substrate in the semiconductor packaging process and electrically connecting the chip or the chip assembly through a micro welding technology, and is an important component part of the die bonder for realizing automation and accurate control of the welding operation.
Through placing the chip on the base, actuating mechanism can drive the soldered connection and be close to the chip, carries out electric connection through micro-welding technique, welds the component of chip upper surface fixedly on the chip, and wait for the solder joint cooling solidification after the welding is accomplished and take off the chip can.
The cooling of the welding spot of the chip adopts a natural cooling mode, and the temperature near the welding device is higher than that of other parts due to higher temperature of the welding part, so that the time required for natural cooling of the welding spot is longer, and the welding efficiency is lower.
Disclosure of utility model
(One) solving the technical problems
Aiming at the problems in the prior art, the utility model provides a welding device of a die bonder.
(II) technical scheme
In order to achieve the above purpose, the utility model is realized by the following technical scheme: the welding device of the die bonder comprises a machine table, wherein the upper surface of the machine table is fixedly connected with a portal frame, the upper surface of the portal frame is provided with a driving mechanism, the driving end of the driving mechanism is provided with a welding head, the upper surface of the machine table is provided with a cooling assembly, the upper surface of the machine table is fixedly connected with a base, and the inside of the base is provided with a stabilizing assembly; the cooling assembly comprises a bracket fixedly connected to the upper surface of the machine table, a round rod is fixedly connected to the outer surface of the bracket, a sleeve is movably connected to the outer surface of the round rod, a pull rod is hinged to the upper surface of the sleeve, one end, far away from the sleeve, of the pull rod is hinged to the outer surface of the welding head, and a heat dissipation fan is fixedly connected to the lower surface of the sleeve; the stabilizing assembly comprises a corrugated pipe fixedly connected to the inner wall of the bottom of the base, a supporting rod is fixedly connected to the upper surface of the corrugated pipe and distributed in the base in a matrix mode, a notch is formed in the outer surface of the base, a pressing block is slidably connected to the inner portion of the notch, a spring is fixedly connected to the lower surface of the pressing block, and one end, away from the pressing block, of the spring is fixedly connected to the inner wall of the notch.
As an optimal scheme of the die bonder welding device, two heat dissipation fans are symmetrically distributed on two sides of the base, the heat dissipation fans are in an inclined state, and the included angle of the two heat dissipation fans is ninety degrees.
As a preferable scheme of the die bonder welding device, the inner wall of the sleeve is provided with the balls, two thirds of the balls are embedded into the inner wall of the sleeve, and the outer surfaces of the balls are abutted with the outer surfaces of the round rods.
As an optimal scheme of the welding device of the die bonder, the upper surface of the supporting rod is flush with the outer surface of the base, a rubber column is arranged in the corrugated pipe, and the upper surface of the rubber column is fixedly connected with the lower surface of the supporting rod.
As an optimal scheme of the welding device of the die bonder, a chute is formed in the inner wall of the notch, limiting blocks are fixedly connected to two ends of the pressing block, and the limiting blocks slide in the chute.
(III) beneficial effects
The utility model provides a welding device of a die bonder. The beneficial effects are as follows:
1. The driving mechanism stretches the welding head to move upwards, and then the pull rod is driven to move, the sleeve can be pulled to slide on the outer surface of the round rod in the moving process of the pull rod, the sleeve drives the heat dissipation fan to be close to the base, the heat dissipation fans on two sides are all obliquely arranged, the purpose of cooling the chip on the base is achieved, the cooling rate of the chip welding spots is accelerated, and the welding efficiency is improved.
2. Through setting up matrix type's branch, can promote branch downwardly extrusion bellows and rubber column on the branch is arranged in to the chip for place the position of chip sunken get into in the base, the chip surface after sunken can the butt at peripheral branch surface, the chip of multiple shape can be placed to the branch that the matrix set up, has reached the effect of carrying out stable welding to the chip of different shapes.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic view of the overall structure of the present utility model.
Fig. 2 is a schematic view of the cooling module structure of the present utility model.
Fig. 3 is a schematic view of the internal structure of the sleeve of the present utility model.
Fig. 4 is a schematic view of the base structure of the present utility model.
Fig. 5 is a schematic view of the structure of the strut of the present utility model.
In the figure, 1, a machine; 2. a portal frame; 3. a driving mechanism; 4. a welding head; 5. a cooling assembly; 501. a bracket; 502. a round bar; 503. a sleeve; 504. a pull rod; 505. a heat dissipation fan; 506. a ball; 6. a base; 7. a stabilizing assembly; 701. a notch; 702. briquetting; 703. a spring; 704. a support rod; 705. a limiting block; 706. a chute; 707. a bellows; 708. rubber column.
Detailed Description
The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model.
Example 1
Referring to fig. 1, 2 and 3, in a first embodiment of the present utility model, the embodiment provides a die bonder welding apparatus, which includes a machine table 1, a gantry 2 is fixedly connected to an upper surface of the machine table 1, a driving mechanism 3 is disposed on an upper surface of the gantry 2, a welding head 4 is disposed on a driving end of the driving mechanism 3, and a cooling assembly 5 is disposed on an upper surface of the machine table 1;
The cooling assembly 5 comprises a bracket 501 fixedly connected to the upper surface of the machine table 1, a round rod 502 is fixedly connected to the outer surface of the bracket 501, a sleeve 503 is movably connected to the outer surface of the round rod 502, a pull rod 504 is hinged to the upper surface of the sleeve 503, one end, far away from the sleeve 503, of the pull rod 504 is hinged to the outer surface of the welding head 4, and a heat dissipation fan 505 is fixedly connected to the lower surface of the sleeve 503;
Specifically, two heat dissipation fans 505 are arranged on two sides of the base 6 and symmetrically distributed, the heat dissipation fans 505 are arranged in an inclined state, an included angle of the two heat dissipation fans 505 is ninety degrees, a ball 506 is arranged on the inner wall of the sleeve 503, two thirds of the ball 506 is embedded in the inner wall of the sleeve 503, and the outer surface of the ball 506 is abutted to the outer surface of the round rod 502;
Further, actuating mechanism 3 can stretch the soldered connection 4 to shift up, and then can drive pull rod 504 and remove, and pull rod 504 removes the in-process can stimulate sleeve pipe 503 and slide at the surface of round bar 502, and the inner wall of sleeve pipe 503 is provided with ball 506, can reduce the frictional force between sleeve pipe 503 and the round bar 502, and sleeve pipe 503 drives the heat dissipation fan 505 and is close to base 6, and the equal slope of heat dissipation fan 505 of both sides sets up, realizes carrying out the purpose of cooling down to the chip on the base 6 for the cooling rate of chip solder joint has been improved welding efficiency.
Example 2
Referring to fig. 1, 4 and 5, in a second embodiment of the present utility model, based on the previous embodiment, a base 6 is fixedly connected to the upper surface of the machine 1, and a stabilizing component 7 is disposed inside the base 6;
the stabilizing component 7 comprises a corrugated pipe 707 fixedly connected to the inner wall of the bottom of the base 6, a supporting rod 704 is fixedly connected to the upper surface of the corrugated pipe 707, the supporting rods 704 are distributed in the base 6 in a matrix, a notch 701 is formed in the outer surface of the base 6, a pressing block 702 is slidably connected to the inside of the notch 701, a spring 703 is fixedly connected to the lower surface of the pressing block 702, and one end, far away from the pressing block 702, of the spring 703 is fixedly connected to the inner wall of the notch 701;
Specifically, the upper surface of the supporting rod 704 is flush with the outer surface of the base 6, a rubber column 708 is arranged in the corrugated pipe 707, the upper surface of the rubber column 708 is fixedly connected to the lower surface of the supporting rod 704, a sliding groove 706 is formed in the inner wall of the notch 701, two ends of the pressing block 702 are fixedly connected with limiting blocks 705, and the limiting blocks 705 slide in the sliding groove 706;
Further, the chip is placed on the supporting rod 704 and can push the supporting rod 704 to downwards extrude the corrugated pipe 707 and the rubber column 708, the position where the chip is placed is sunken to enter the base 6, the supporting rod 704 arranged in the matrix can be used for placing chips in various shapes, the outer surface of the sunken chip can be abutted to the outer surface of the peripheral supporting rod 704, the effect of limiting the chip is achieved, the stability of the chip is improved, after the lamp is welded, the pressing block 702 and the supporting rod 704 around the chip are downwards pressed from two sides of the base 6 by fingers until the fingers are lower than the chip, the pressing block 702 can be pushed to reset by the spring 703, meanwhile, the supporting rod 704 can be pushed to reset by the rubber column 708, and the effect of stable welding of chips in different shapes is achieved.
Working principle: in the process of welding the chip, the chip is placed on the base 6, the driving mechanism 3 is started, the driving mechanism 3 pushes the welding head 4 to approach the chip to finish welding, as the specific structure and the working principle of the welding device are the prior art well known to workers in the field, and not described in excess, after the welding head 4 finishes welding the chip, the driving mechanism 3 stretches the welding head 4 to move upwards, so that the pull rod 504 is driven to move, the sleeve 503 is pulled to slide on the outer surface of the round rod 502 in the process of moving the pull rod 504, the ball 506 is arranged on the inner wall of the sleeve 503, the friction force between the sleeve 503 and the round rod 502 can be reduced, the sleeve 503 drives the heat dissipation fans 505 to approach the base 6, and the heat dissipation fans 505 on two sides are all obliquely arranged, so that the purpose of cooling the chip on the base 6 is realized, the cooling rate of the chip welding point is accelerated, and the welding efficiency is improved;
Placing the chip on base 6, can promoting branch 704 and extruding bellows 707 and rubber post 708 downwards on placing the branch 704 on the chip for place the position of chip sunken get into in the base 6, the branch 704 that the matrix set up can place the chip of multiple shape, the chip surface after the sunken can the butt at peripheral branch 704 surface, the effect of spacing the chip has been played, the stability of chip has been improved, after the lamp welding was accomplished, the finger was pressed down briquetting 702 and branch 704 around the chip from the both sides of base 6, until the finger can take out it in the base 6 after being less than the chip, spring 703 can promote briquetting 702 and reset, rubber post 708 can promote branch 704 to reset simultaneously, the effect of carrying out stable welding to the chip of different shapes has been reached.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions.
Claims (5)
1. The utility model provides a die bonder welding set, includes board (1), its characterized in that: the device is characterized in that a portal frame (2) is fixedly connected to the upper surface of the machine table (1), a driving mechanism (3) is arranged on the upper surface of the portal frame (2), a welding head (4) is arranged at the driving end of the driving mechanism (3), a cooling component (5) is arranged on the upper surface of the machine table (1), a base (6) is fixedly connected to the upper surface of the machine table (1), and a stabilizing component (7) is arranged in the base (6);
The cooling assembly (5) comprises a bracket (501) fixedly connected to the upper surface of the machine table (1), a round rod (502) is fixedly connected to the outer surface of the bracket (501), a sleeve (503) is movably connected to the outer surface of the round rod (502), a pull rod (504) is hinged to the upper surface of the sleeve (503), one end, far away from the sleeve (503), of the pull rod (504) is hinged to the outer surface of the welding head (4), and a heat dissipation fan (505) is fixedly connected to the lower surface of the sleeve (503);
Firm subassembly (7), including bellows (707) of fixed connection at the bottom inner wall of base (6), the last fixed surface of bellows (707) is connected with branch (704), branch (704) are matrix distribution in the inside of base (6), notch (701) have been seted up to the surface of base (6), the inside sliding connection of notch (701) has briquetting (702), the lower fixed surface of briquetting (702) is connected with spring (703), the one end fixed connection at the inner wall of notch (701) of briquetting (702) is kept away from to spring (703).
2. The die bonder welding apparatus as defined in claim 1, wherein: the heat dissipation fans (505) are arranged at two sides of the base (6) and symmetrically distributed, the heat dissipation fans (505) are arranged in an inclined state, and the included angle between the two heat dissipation fans (505) is ninety degrees.
3. The die bonder welding apparatus as defined in claim 1, wherein: the inner wall of the sleeve (503) is provided with balls (506), two thirds of the balls (506) are embedded into the inner wall of the sleeve (503), and the outer surface of the balls (506) is abutted with the outer surface of the round rod (502).
4. The die bonder welding apparatus as defined in claim 1, wherein: the upper surface of branch (704) and the surface parallel and level of base (6), the inside of bellows (707) is provided with rubber post (708), the upper surface fixed connection of rubber post (708) is at the lower surface of branch (704).
5. The die bonder welding apparatus as defined in claim 1, wherein: a sliding groove (706) is formed in the inner wall of the notch (701), limiting blocks (705) are fixedly connected to the two ends of the pressing block (702), and the limiting blocks (705) slide in the sliding groove (706).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322971892.7U CN221102012U (en) | 2023-11-03 | 2023-11-03 | Die bonder welding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322971892.7U CN221102012U (en) | 2023-11-03 | 2023-11-03 | Die bonder welding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221102012U true CN221102012U (en) | 2024-06-07 |
Family
ID=91305859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322971892.7U Active CN221102012U (en) | 2023-11-03 | 2023-11-03 | Die bonder welding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221102012U (en) |
-
2023
- 2023-11-03 CN CN202322971892.7U patent/CN221102012U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant |