CN221088583U - Combined type wax-free polishing adsorption pad - Google Patents
Combined type wax-free polishing adsorption pad Download PDFInfo
- Publication number
- CN221088583U CN221088583U CN202322440570.XU CN202322440570U CN221088583U CN 221088583 U CN221088583 U CN 221088583U CN 202322440570 U CN202322440570 U CN 202322440570U CN 221088583 U CN221088583 U CN 221088583U
- Authority
- CN
- China
- Prior art keywords
- adsorption
- polyurethane
- base cloth
- polishing
- adsorption layer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000001179 sorption measurement Methods 0.000 title claims abstract description 71
- 238000005498 polishing Methods 0.000 title claims abstract description 31
- 229920002635 polyurethane Polymers 0.000 claims abstract description 31
- 239000004814 polyurethane Substances 0.000 claims abstract description 31
- 239000002390 adhesive tape Substances 0.000 claims abstract description 21
- 239000004744 fabric Substances 0.000 claims abstract description 21
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 17
- 229910052710 silicon Inorganic materials 0.000 abstract description 17
- 239000010703 silicon Substances 0.000 abstract description 17
- 238000004140 cleaning Methods 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 15
- 238000000034 method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000003325 follicular Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model discloses a combined type wax-free polishing adsorption pad which comprises base cloth, an adsorption structure and a pasting structure, wherein the adsorption structure is arranged on the base cloth, the pasting structure is arranged on the base cloth, the adsorption structure comprises a polyurethane adsorption layer and an annular air cavity, the polyurethane adsorption layer is pasted on the base cloth, and the annular air cavity is arranged on the polyurethane adsorption layer. The utility model belongs to the technical field of polishing equipment, and particularly relates to a combined type waxless polishing adsorption pad, which effectively solves the problems that when the waxless polishing adsorption pad in the current market is used, low-quality double faced adhesive tape is used, a large amount of adhesive remains on a polishing disc after being uncovered, time is required to be spent for cleaning, and meanwhile, when the adsorption pad is taken down from a silicon wafer, the adsorption pad is required to be pulled by force, so that the silicon wafer is easy to tear, and economic loss is caused.
Description
Technical Field
The utility model belongs to the technical field of polishing equipment, and particularly relates to a combined wax-free polishing adsorption pad.
Background
Silicon wafers are the base materials for semiconductor devices and integrated circuits. The quality of polishing the surface of the silicon wafer directly affects the quality of the surface of the silicon wafer, and the surface of the silicon wafer is lossless, so that the silicon wafer is an important ring for improving the yield of semiconductor devices and large-scale integrated circuits. When the conventional waxless polishing adsorption pad is used, a low-quality double faced adhesive tape is used, a large amount of adhesive remains on the polishing disc after being uncovered, time is required to be spent for cleaning, and meanwhile, when the adsorption pad is taken down from a silicon wafer, the adsorption pad is required to be pulled with force, so that the silicon wafer is easy to tear, and economic loss is caused.
Disclosure of utility model
Aiming at the situation, in order to overcome the defects of the prior art, the combined type waxless polishing adsorption pad provided by the utility model effectively solves the problems that when the waxless polishing adsorption pad in the current market is used, low-quality double faced adhesive tape is used, a large amount of adhesive remains on a polishing disk after being uncovered, time is required to be spent for cleaning, and meanwhile, when the adsorption pad is taken down from a silicon wafer, the adsorption pad is required to be pulled with force, so that the silicon wafer is easy to tear, and economic loss is caused.
The technical scheme adopted by the utility model is as follows: the utility model provides a combined type wax-free polishing adsorption pad, which comprises base cloth, an adsorption structure and a pasting structure, wherein the adsorption structure is arranged on the base cloth, the pasting structure is arranged on the base cloth, the adsorption structure comprises a polyurethane adsorption layer and an annular air cavity, the polyurethane adsorption layer is pasted on the base cloth, the polyurethane adsorption layer plays a role in adsorption, the annular air cavity is arranged on the polyurethane adsorption layer, and the annular air cavity plays a role in reducing adsorption force when being adsorbed and fixed and uncovered.
Preferably, the adhesion structure comprises a non-residual double faced adhesive tape and release paper, the non-residual double faced adhesive tape is adhered to the base cloth, the non-residual double faced adhesive tape has an adhesion effect, and the release paper is adhered to the non-residual double faced adhesive tape.
In order to better achieve the pasting effect, the base is arranged between the residue-free double faced adhesive tape and the polyurethane adsorption layer.
In order to achieve the aim of adsorption faster, the polyurethane adsorption layer and the annular air cavity are arranged in parallel.
Further, the annular air cavity is arranged in an annular mode, and the polyurethane adsorption layer is arranged in a circular mode.
In order to achieve the effect of reducing resistance, the annular air cavity is provided with a plurality of groups.
The beneficial effects obtained by the utility model by adopting the structure are as follows: the combined type waxless polishing adsorption pad provided by the scheme uses the high-quality double faced adhesive tape without residues, no residues exist after uncovering, cleaning work is reduced, meanwhile, the circular annular air cavity on the polyurethane adsorption layer is convenient for entering air, so that the adsorption force is reduced to the minimum, and therefore, a silicon wafer is easily taken down, and damage is avoided.
Drawings
FIG. 1 is a schematic view of the overall structure of a combined wax-free polishing and adsorbing pad according to the present utility model;
Fig. 2 is a schematic diagram of the overall structure of a combined wax-free polishing adsorption pad according to the present utility model.
1, Base cloth, 2, an adsorption structure, 3, a pasting structure, 4, a polyurethane adsorption layer, 5, an annular air cavity, 6, a residue-free double faced adhesive tape and 7, and release paper.
The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the embodiments of the utility model, serve to explain the utility model.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model; all other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
As shown in fig. 1 and fig. 2, the combined wax-free polishing adsorption pad provided by the utility model comprises a base cloth 1, an adsorption structure 2 and a pasting structure 3, wherein the adsorption structure 2 is arranged on the base cloth 1, the pasting structure 3 is arranged on the base cloth 1, the adsorption structure 2 comprises a polyurethane adsorption layer 4 and an annular air cavity 5, the polyurethane adsorption layer 4 is pasted on the base cloth 1, the polyurethane adsorption layer 4 plays an adsorption role, the annular air cavity 5 is arranged on the polyurethane adsorption layer 4, and the annular air cavity 5 plays a role of reducing adsorption force when being adsorbed, fixed and uncovered.
As shown in fig. 1 and fig. 1, the adhesion structure 3 includes a non-residual double faced adhesive tape 6 and release paper 7, the non-residual double faced adhesive tape 6 is adhered to the base fabric 1, the non-residual double faced adhesive tape 6 has an adhesion function, and the release paper 7 is adhered to the non-residual double faced adhesive tape 6.
As shown in fig. 1, the base cloth 1 is provided between the residue-free double-sided tape 6 and the polyurethane adsorbing layer 4.
As shown in fig. 1 and 2, the polyurethane adsorption layer 4 is disposed in parallel with the annular air chamber 5.
As shown in fig. 1 and 2, the annular air chamber 5 is arranged in an annular shape, and the polyurethane adsorption layer 4 is arranged in a circular shape.
As shown in fig. 2, the annular air chamber 5 is provided with several groups.
When the device is specifically used, a user firstly cleans the polishing disc, then uncovers the release paper 7 from the non-residual double faced adhesive tape 6, then spreads the non-residual double faced adhesive tape 6 on the polishing disc, notices that no air bubbles exist, influences the product quality, wets the polyurethane adsorption layer 4 with water, then extrudes the silicon wafer on the polyurethane adsorption layer 4, at the moment, because the polyurethane adsorption layer 4 has a follicular ventilation structure, under the action of a certain pressure, air in the follicular hole of the adsorption area is discharged, and meanwhile, the air in the annular air cavity 5 is extruded and discharged, thereby forming vacuum to adsorb the silicon wafer, then polishing is carried out, after polishing is finished, the non-residual double faced adhesive tape 6 is uncovered from the polishing disc, then uncovers one side of the polyurethane adsorption layer 4 from the silicon wafer, at the moment, the air enters the inside the silicon wafer and the polyurethane adsorption layer 4 through the release paper 7, so that vacuum disappears, and the adsorption pad is easily removed, and the silicon wafer is prevented from being damaged.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
The utility model and its embodiments have been described above with no limitation, and the actual construction is not limited to the embodiments of the utility model as shown in the drawings. In summary, if one of ordinary skill in the art is informed by this disclosure, a structural manner and an embodiment similar to the technical solution should not be creatively devised without departing from the gist of the present utility model.
Claims (6)
1. A combination type wax-free polishing adsorption pad, which is characterized in that: the polyurethane adsorption structure comprises a base cloth, an adsorption structure and a pasting structure, wherein the adsorption structure is arranged on the base cloth, the pasting structure is arranged on the base cloth, the adsorption structure comprises a polyurethane adsorption layer and an annular air cavity, the polyurethane adsorption layer is pasted on the base cloth, and the annular air cavity is arranged on the polyurethane adsorption layer.
2. A combination waxless polishing pad according to claim 1, wherein: the sticking structure comprises a non-residual double faced adhesive tape and release paper, wherein the non-residual double faced adhesive tape is stuck on the base cloth, and the release paper is stuck on the non-residual double faced adhesive tape.
3. A combination waxless polishing pad according to claim 2, wherein: the base is arranged between the residue-free double faced adhesive tape and the polyurethane adsorption layer.
4. A combination waxless polishing pad according to claim 3, wherein: the polyurethane adsorption layer is arranged in parallel with the annular air cavity.
5. A combination waxless polishing pad according to claim 4, wherein: the annular air cavity is in annular arrangement, and the polyurethane adsorption layer is in circular arrangement.
6. A combination waxless polishing pad according to claim 5, wherein: the annular air cavity is provided with a plurality of groups.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322440570.XU CN221088583U (en) | 2023-09-08 | 2023-09-08 | Combined type wax-free polishing adsorption pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322440570.XU CN221088583U (en) | 2023-09-08 | 2023-09-08 | Combined type wax-free polishing adsorption pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221088583U true CN221088583U (en) | 2024-06-07 |
Family
ID=91325852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322440570.XU Active CN221088583U (en) | 2023-09-08 | 2023-09-08 | Combined type wax-free polishing adsorption pad |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221088583U (en) |
-
2023
- 2023-09-08 CN CN202322440570.XU patent/CN221088583U/en active Active
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