CN221007287U - Silicon chip hidden crack detection device - Google Patents
Silicon chip hidden crack detection device Download PDFInfo
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- CN221007287U CN221007287U CN202322649825.3U CN202322649825U CN221007287U CN 221007287 U CN221007287 U CN 221007287U CN 202322649825 U CN202322649825 U CN 202322649825U CN 221007287 U CN221007287 U CN 221007287U
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 56
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 56
- 239000010703 silicon Substances 0.000 title claims abstract description 56
- 238000001514 detection method Methods 0.000 title claims abstract description 40
- 230000004888 barrier function Effects 0.000 claims abstract description 12
- 230000000903 blocking effect Effects 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 45
- 230000007547 defect Effects 0.000 description 4
- 229910021419 crystalline silicon Inorganic materials 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000010248 power generation Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 229910021422 solar-grade silicon Inorganic materials 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
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- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The utility model belongs to the technical field of silicon wafer hidden crack detection, and particularly relates to a silicon wafer hidden crack detection device. The device comprises a mounting backboard, an adjusting seat, a light source and a supporting structure, wherein the supporting structure comprises a horizontally arranged supporting plate and two supporting columns which are vertically fixed below two ends of the supporting plate through first connecting pieces respectively; the mounting backboard is fixed above the supporting plate of the supporting structure, and the adjusting seat is fixed on the mounting backboard through a second connecting piece; a light barrier and a background plate are sequentially fixed below the supporting plate from top to bottom between the two supporting columns; one end of the light source is fixed at the lower part of the first connecting piece, and the other end of the light source obliquely passes through the position between the light barrier and the background plate and extends; and a camera is further arranged on the adjusting seat. The silicon chip hidden crack detection device has a simple structure and high detection speed, so that the detection efficiency is greatly improved.
Description
Technical Field
The utility model belongs to the technical field of silicon wafer hidden crack detection, and particularly relates to a silicon wafer hidden crack detection device.
Background
The crystalline silicon solar cell technology is a mainstream technology which occupies absolute advantages in the field of photovoltaic power generation, and a crystalline silicon solar cell mainly comprises a solar grade silicon wafer. In order to ensure that the conversion efficiency of the crystalline silicon solar cell meets the technical index, various parameters such as geometric parameters, electrical parameters, internal defects and the like of the silicon wafer are tested and sorted in the production process so as to meet the technical index of the solar industry or customers. The misjudgment rate of the hidden crack detection of the silicon wafer in the internal defect of the silicon wafer in each index is very high, a plurality of non-hidden crack silicon wafers can be misjudged as hidden cracks, the number of the non-hidden crack silicon wafers is relatively large, and the wafer leaving yield of the silicon wafer is greatly reduced. The conventional solution is to recheck whether the hidden crack exists in the silicon wafer by taking the edge of the silicon wafer by a worker and shaking the silicon wafer again by sorting all the equipment, and if shaking force of the worker is mastered reasonably, the silicon wafer with the hidden crack inside is damaged, otherwise, the silicon wafer is not damaged.
With the development of photovoltaic power generation, the mode of detecting electromagnetic sheets by manpower can not meet the production requirement any more. Therefore, an automatic detection device is urgently needed to improve the detection efficiency. The traditional silicon chip hidden crack detection effect is poor, hidden cracks are not obvious, and partial misjudgment and missed judgment are possible.
Disclosure of utility model
The utility model aims to overcome the problems in the prior art, and provides a silicon wafer hidden crack detection device. The device has simple structure and high detection speed, and greatly improves the detection efficiency.
The aim and the technical problems of the utility model are realized by adopting the following technical proposal.
One embodiment of the utility model provides a silicon wafer hidden crack detection device, which comprises a mounting backboard, an adjusting seat, a light source and a supporting structure; the support structure comprises a horizontally arranged support plate and two support columns vertically fixed below two ends of the support plate through first connecting pieces respectively; the mounting backboard is fixed above the supporting plate of the supporting structure, and the adjusting seat is fixed on the mounting backboard through a second connecting piece; a light barrier and a background plate are sequentially fixed below the supporting plate from top to bottom between the two supporting columns; one end of the light source is fixed at the lower part of the first connecting piece, and the other end of the light source obliquely passes through the position between the light barrier and the background plate and extends; and a camera is further arranged on the adjusting seat.
According to the silicon wafer hidden crack detection device provided by the embodiment of the utility model, two ends of the light barrier are respectively fixed on the two support columns and are arranged vertically to the horizontal direction, and two ends of the background plate are respectively fixed on the two support columns and are arranged parallel to the horizontal direction.
According to the silicon wafer hidden crack detection device provided by the embodiment of the utility model, the plane formed by the two support columns is called a first plane, one end of the light source is positioned at the rear end of the first plane and fixed at the lower part of the first connecting piece, and the other end transversely passes through the position between the light barrier and the background plate and extends to the front end of the first plane.
According to the silicon wafer hidden crack detection device provided by the embodiment of the utility model, the adjusting seat comprises a fixed plate and a camera mounting hole seat which is fixed with the fixed plate at intervals through a third connecting piece and is arranged vertically to the fixed plate; the camera is characterized in that a first knob is arranged on the fixed plate, and a second knob is arranged on the camera mounting hole seat.
According to the silicon wafer hidden crack detection device provided by the embodiment of the utility model, the first knob is positioned at a position which is spaced between the fixed plate and the camera mounting hole seat and is vertical to the camera mounting hole seat, and the second knob is arranged outside the camera mounting hole seat and is parallel to the camera mounting hole seat; the pitching angle of the adjusting seat can be adjusted by rotating the first knob, and the horizontal angle of the adjusting seat can be adjusted by rotating the second knob.
According to the silicon wafer hidden crack detection device provided by the embodiment of the utility model, the camera is arranged on the camera mounting hole seat.
According to the silicon wafer hidden crack detection device provided by the embodiment of the utility model, the second connecting piece is a T-shaped connecting plate.
According to the silicon wafer hidden crack detection device provided by the embodiment of the utility model, the light source is 1300nm infrared light.
The beneficial effects brought by the utility model are as follows: the device provided by the utility model has the advantages that the detection speed is extremely high, and the acquisition speed of the camera can be ensured, so that compared with the traditional manual detection, the efficiency is greatly improved. The utility model can enlarge and display the originally tiny hidden cracks after special treatment, so that the defects are more obvious.
The foregoing description is only an overview of the present utility model, and is intended to provide a more thorough understanding of the present utility model, and is to be accorded the full scope of the present utility model.
Drawings
The present disclosure will become more readily understood with reference to the accompanying drawings. As will be readily appreciated by those skilled in the art: the drawings are only for illustrating the technical scheme of the present utility model and are not intended to limit the scope of the present utility model. In the figure:
FIG. 1 is a perspective view of a silicon wafer hidden crack detection device of the present utility model;
FIG. 2 is a front view of the silicon wafer hidden crack detection device of the present utility model;
FIG. 3 is a side view of the silicon wafer hidden crack detection device of the present utility model;
Fig. 4 is a detection flow chart of the silicon wafer hidden crack detection device of the utility model.
In the figure: a support structure-1; a support plate-11; support column-12; a first connector-13; mounting a backboard-2; an adjusting seat-3; a fixing plate-31; a first knob-311; a camera mounting hole seat-32; a second knob-321; a second connector-33; a third connector-34; a light barrier-4; a background plate-5; a light source-6; a camera-7; and a silicon wafer 8.
Description of the embodiments
The utility model is further described below with reference to the accompanying drawings. The following examples are only for more clearly illustrating the technical aspects of the present utility model, and are not intended to limit the scope of the present utility model.
In the description of the present utility model, it should be understood that the terms "upper," "lower," "left," "right," and the like indicate an orientation or a positional relationship based on that shown in the drawings, and are merely for convenience of description and for simplifying the description, and do not indicate or imply that the apparatus or element in question must have a specific orientation, as well as a specific orientation configuration and operation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature.
In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more. In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
As shown in fig. 1 to 3, a preferred embodiment of the present utility model provides a silicon wafer hidden crack detection device, which comprises a mounting backboard 2, an adjusting seat 3, a light source 6 and a supporting structure 1. The support structure 1 comprises a horizontally arranged support plate 11 and two support columns 12 vertically fixed below both ends of the support plate 11 by means of first connectors 13, respectively. The mounting backplate 2 is fixed above the support plate 11 of the support structure 1, and the adjusting seat 3 is fixed on the mounting backplate 2 by a second connecting piece 33. A light barrier 4 and a background plate 5 are sequentially fixed from top to bottom under the supporting plate 11 between the two supporting columns 12. The light barrier 4 is required to be installed right in front of the light source 6, so that light rays directly reflected by the surface of the silicon wafer can be prevented from directly entering the camera (the camera captures free photons which escape after extending into the silicon wafer). In order to ensure that the light of the light source can be blocked and the silicon wafer can smoothly pass through the production line, a gap of about 1mm is formed between the light blocking plate 4 and the silicon wafer to be detected, the detection purpose cannot be achieved when the gap is too large, and the assembly line is easily blocked when the gap is too small. The background plate 5 can ensure the purity of the image background. One end of the light source 6 is fixed to the lower portion of the first connecting member 13, and the other end extends obliquely through a position between the light blocking plate 4 and the background plate 5. The adjusting seat 3 is also provided with a camera 7.
Further, both ends of the light barrier 4 are respectively fixed on the two support columns 12 and are arranged vertically to the horizontal direction, and both ends of the background plate 5 are respectively fixed on the two support columns 12 and are arranged parallel to the horizontal direction.
Further, the plane formed by the two support columns 12 is referred to as a first plane, one end of the light source 6 is located at the rear end of the first plane and fixed to the lower portion of the first link 13, and the other end extends transversely across the position between the light-blocking plate 4 and the background plate 5 to the front end of the first plane.
Further, the adjustment base 3 includes a fixing plate 31 and a camera mounting hole base 32 fixed to the fixing plate 31 through a third connection member 34 at a distance from the fixing plate 31 and disposed perpendicularly to the fixing plate 31. The fixing plate 31 is provided with a first knob 311, and the camera mounting hole seat 32 is provided with a second knob 321.
Further, the first knob 311 is located at a position spaced apart from the fixing plate 31 and the camera mounting hole seat 32 and perpendicular to the camera mounting hole seat 32, and the second knob 321 is disposed outside the camera mounting hole seat 32 and parallel to the camera mounting hole seat 32. The pitch angle of the adjustment seat 3 can be adjusted by rotating the first knob 311, and the horizontal angle of the adjustment seat 3 can be adjusted by rotating the second knob 321.
Further, the camera 7 is disposed on the camera mount 32.
Further, the second connection member 33 is a T-shaped connection plate.
Further, the light source 6 is 1300nm infrared light.
The working principle of the silicon chip hidden crack detection system is as follows: according to the silicon wafer hidden crack detection system, aiming at the characteristics of a silicon wafer, the semi-transparent and semi-reflective characteristics of a silicon material under 1300-1500nm infrared light are utilized, 1300nm infrared light is emitted to the silicon wafer, light rays extend inside the silicon wafer, a part of the light rays escape and are captured by a camera, a forward passage is blocked when the light rays encounter hidden cracks inside the silicon wafer, shadows are formed on an image, and cracks which are only 50 microns originally are amplified and displayed, so that the purpose of detecting the hidden cracks is achieved. Meanwhile, the method for capturing escape by the equipment is to place a baffle beside the silicon wafer to be detected, so that the defect position can be highlighted, and the algorithm identification is facilitated.
As shown in fig. 4, after the vision system is started, the silicon wafer 8 to be tested is pipelined, when the silicon wafer appears in the field of view of the camera 7, the signal camera is triggered to take a picture, and then the collected picture is subjected to image processing to judge whether hidden cracks exist.
The device is used for detecting the silicon wafer in a motion state on line at present, the general speed is more than 160mm/r, the silicon wafer is transmitted to a camera view field during detection, and the acquisition of the silicon wafer picture is realized through triggering.
While the utility model has been described with respect to preferred embodiments, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the utility model, and that any such changes and modifications as described in the above embodiments are intended to be within the scope of the utility model.
Claims (8)
1. The device is characterized by comprising a mounting backboard, an adjusting seat, a light source and a supporting structure; the support structure comprises a horizontally arranged support plate and two support columns vertically fixed below two ends of the support plate through first connecting pieces respectively; the mounting backboard is fixed above the supporting plate of the supporting structure, and the adjusting seat is fixed on the mounting backboard through a second connecting piece; a light barrier and a background plate are sequentially fixed below the supporting plate from top to bottom between the two supporting columns; one end of the light source is fixed at the lower part of the first connecting piece, and the other end of the light source obliquely passes through the position between the light barrier and the background plate and extends; and a camera is further arranged on the adjusting seat.
2. The device for detecting the hidden crack of the silicon wafer according to claim 1, wherein two ends of the light barrier are respectively fixed on the two support columns and are arranged vertically to the horizontal direction, and two ends of the background plate are respectively fixed on the two support columns and are arranged parallel to the horizontal direction.
3. The silicon wafer hidden crack detection device according to claim 1, wherein a plane formed by the two support columns is called a first plane, one end of the light source is located at a rear end of the first plane and fixed to a lower portion of the first connecting member, and the other end extends to a front end of the first plane transversely through a position between the light blocking plate and the background plate.
4. The silicon wafer hidden crack detection device according to claim 1, wherein the adjusting seat comprises a fixed plate and a camera mounting hole seat which is fixed with the fixed plate at intervals through a third connecting piece and is arranged perpendicular to the fixed plate; the camera is characterized in that a first knob is arranged on the fixed plate, and a second knob is arranged on the camera mounting hole seat.
5. The silicon wafer hidden crack detection device according to claim 4, wherein the first knob is positioned at a position spaced apart from the fixing plate and the camera mounting hole seat and perpendicular to the camera mounting hole seat, and the second knob is arranged outside the camera mounting hole seat and parallel to the camera mounting hole seat; the pitching angle of the adjusting seat can be adjusted by rotating the first knob, and the horizontal angle of the adjusting seat can be adjusted by rotating the second knob.
6. The device of claim 4, wherein the camera is disposed on the camera mount.
7. The silicon wafer hidden crack detection device according to claim 1, wherein the second connecting piece is a T-shaped connecting plate.
8. The device for detecting the hidden crack of the silicon wafer according to claim 1, wherein the light source is 1300nm infrared light.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322649825.3U CN221007287U (en) | 2023-09-28 | 2023-09-28 | Silicon chip hidden crack detection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322649825.3U CN221007287U (en) | 2023-09-28 | 2023-09-28 | Silicon chip hidden crack detection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221007287U true CN221007287U (en) | 2024-05-24 |
Family
ID=91117072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322649825.3U Active CN221007287U (en) | 2023-09-28 | 2023-09-28 | Silicon chip hidden crack detection device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221007287U (en) |
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2023
- 2023-09-28 CN CN202322649825.3U patent/CN221007287U/en active Active
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