CN220984492U - Wafer centering device - Google Patents

Abstract

The utility model provides a wafer centering device which comprises a horizontal arm, a driving assembly arranged at one end of the horizontal arm and a centering assembly arranged at the other end of the horizontal arm, wherein the centering assembly comprises a bearing plate, base plates symmetrically arranged at two sides of the bearing plate, a driving part arranged on the base plates, a centering plate arranged on the driving part, and a detection device arranged at one side of the centering plate far away from the bearing plate, wherein the bearing plate and the centering plate are both in circular arc shape and are concentrically arranged, the detection device is used for detecting whether a wafer on the bearing plate is centered, and the driving part is used for driving the centering plate to move vertically and horizontally so as to enable the centering plate to push the wafer to move for centering. The wafer centering device solves the technical problems that in the prior art, when a yellow light process is carried out, a wafer on a manipulator is required to be centered through an independent centering device, so that the yellow light process is long in time consumption and low in efficiency.

Description

Wafer centering device

Technical Field

The utility model relates to the technical field of semiconductor manufacturing, in particular to a wafer centering device.

Background

A yellow light station is arranged in the chip manufacturing process, and the yellow light station copies the pattern on the photomask to the wafer so as to achieve a target station for transferring the designed pattern. The main working procedures of the yellow light station comprise gluing, exposure, development and visual inspection, and the purposes of gluing, exposure and development are mainly to obtain the patterns required by the design in the whole yellow light process.

Currently, in semiconductor manufacturing, photolithography, yellow light, is generally performed a plurality of times; in the process of gluing and developing, a mechanical arm (tooth fork) is required to take and place the wafer in the machine table, and in the gluing or developing process, in order to ensure the uniformity of gluing and developing the product, the wafer is required to be adsorbed in the center of the rotary sucker in the gluing or developing tank, so that after the tooth fork of the gluing and developing machine table takes the wafer, a wafer centering process is performed, namely the aim of ensuring the coincidence between the center of the wafer and the center of the rotary sucker of the gluing and developing machine table is fulfilled.

However, in the existing centering mode of the gluing and developing machine, the wafer is taken out from the material box through the manipulator, placed on the centering device, and then subjected to gradual horizontal correction centering by the independently arranged centering device, the whole centering process is complex in operation steps, long in time consumption, low in machine concentration and unfavorable for continuous operation.

Disclosure of utility model

Based on the above, the utility model aims to provide a wafer centering device, which aims to solve the technical problems of long time consumption and low efficiency of a yellow light process caused by the fact that a wafer on a manipulator needs to be centered by an independent centering device when the yellow light process is carried out in the prior art.

The utility model provides a wafer centering device, which comprises a horizontal arm, a driving assembly arranged at one end of the horizontal arm, and a centering assembly arranged at the other end of the horizontal arm, wherein the centering assembly comprises a bearing plate, base plates symmetrically arranged at two sides of the bearing plate, a driving part arranged on the base plates, a centering plate arranged on the driving part, and a detection device arranged at one side of the centering plate far away from the bearing plate, wherein the bearing plate and the centering plate are both in circular arc shape and are concentrically arranged, the detection device is used for detecting whether a wafer on the bearing plate is centered, and the driving part is used for driving the centering plate to vertically and horizontally move so as to enable the centering plate to push the wafer to move for centering.

Above-mentioned wafer centering device, remove through drive assembly drive horizontal arm for the horizontal arm is brought centering subassembly and is removed, and then makes the take over the board with the wafer jack-up from the charging tray transport to take over on the board, and whether the rethread detection device detects the wafer on the board and center, and confirm the position and the distance that the wafer deviates from through detection device, and then control the centering board that drive part driven both sides promotes the extrusion wafer, makes the wafer accomplish centering on taking over the board, later with the wafer transport remove the rubber coating station. Through directly setting up detection device and centering subassembly on the accept board for the wafer centering can be directly accomplished on the arm, and need not to transport to extra centering device department and carry out the centering, reduced the time that spends of transporting, and the mode of centering subassembly is simple, only need through the centering board promote the wafer remove detection device survey definite distance can, greatly improved the efficiency of whole yellow light technology. Therefore, the utility model solves the technical problems of long time consumption and low efficiency of the yellow light process caused by the fact that the wafer on the manipulator needs to be centered by an independent centering device when the yellow light process is carried out in the prior art.

In addition, the wafer centering device provided by the utility model can also have the following additional technical characteristics:

Preferably, the driving part comprises a vertical electric telescopic rod arranged on the base plate, a mounting plate arranged on the top of the vertical electric telescopic rod, and a horizontal electric telescopic rod arranged on the mounting plate, and the horizontal electric telescopic rod is connected with the centering plate.

Preferably, the receiving plates are C-shaped arcs, and the midpoints of the two middle plates are located on a connecting line of the midpoints of the two sides of the substrate.

Preferably, a positioning sucker for adsorbing and fixing the wafer is arranged on the upper surface of the bearing plate.

Preferably, the positioning suckers are symmetrically arranged on two sides of the bearing plate and are equidistantly arranged along the circumferential direction of the bearing plate.

Preferably, the central angle corresponding to the arc-shaped length of the centering plate is 30-120 degrees.

Preferably, a centering groove is formed in one side, close to the bearing plate, of the centering plate, and a protection pad is arranged in the centering groove.

Preferably, the depth of the centering groove gradually increases from two sides to the middle.

Preferably, the two detecting devices are symmetrically arranged at two sides of the centering plate, and the detecting devices at least partially protrude out of the centering plate, so that connecting lines of the detecting devices diagonally arranged at two sides of the bearing plate pass through the circle center of the bearing plate.

Preferably, the driving assembly comprises a base, a lifting cylinder arranged on the base, a jacking pipe arranged on the lifting cylinder and a horizontal cylinder connected with the side surface of the jacking pipe, wherein the horizontal cylinder is connected with the horizontal arm.

Drawings

FIG. 1 is a schematic diagram of a wafer centering apparatus according to a first embodiment of the present utility model;

FIG. 2 is a bottom view of FIG. 1;

FIG. 3 is an enlarged partial cross-sectional view of FIG. 1;

fig. 4 is an enlarged partial cross-sectional view of fig. 2.

Description of main reference numerals:

Horizontal arm	10	Driving assembly	20
				Centering assembly	30	Bearing plate	31
Substrate board	32	Driving part	33
				Centering plate	34	Detection device	35
Vertical electric telescopic rod	331	Mounting plate	332
				Horizontal electric telescopic rod	333	Positioning sucker	311
Centering groove	341	Protective pad	342
				Base seat	21	Lifting cylinder	22
Push pipe	23	Horizontal cylinder	24

The utility model will be further described in the following detailed description in conjunction with the above-described figures.

Detailed Description

In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. Several embodiments of the utility model are presented in the figures. This utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "mounted" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1 to 4, a wafer centering apparatus according to a first embodiment of the present utility model includes a horizontal arm 10, a driving assembly 20 disposed at one end of the horizontal arm 10, and a centering assembly 30 disposed at the other end of the horizontal arm 10, wherein the centering assembly 30 includes a receiving plate 31, a base plate 32 symmetrically disposed on both sides of the receiving plate 31, a driving member 33 disposed on the base plate 32, a centering plate 34 disposed on the driving member 33, and a detecting device 35 disposed on a side of the centering plate 34 away from the receiving plate 31, the receiving plate 31 and the centering plate 34 are both circular-arc-shaped and concentrically disposed, the detecting device 35 is used for detecting whether a wafer on the receiving plate 31 is centered, and the driving member 33 is used for driving the centering plate 34 to move vertically and horizontally so that the centering plate 34 pushes the wafer to perform centering.

It can be appreciated that the horizontal arm 10 is driven to move by the driving component 20, so that the horizontal arm 10 moves with the centering component 30, and then the receiving plate 31 jacks up and transfers the wafer from the tray to the receiving plate 31, the detecting device 35 detects whether the wafer on the receiving plate 31 is centered, the detecting device 35 determines the deviating position and distance of the wafer, and the driving component 33 is controlled to drive the centering plates 34 on two sides to push and squeeze the wafer, so that the wafer is centered on the receiving plate 31, and then the wafer is transferred to the photoresist coating station. Through directly setting up detection device 35 and centering subassembly 30 on accepting the board 31 for the wafer centering can be directly accomplished on the arm, and need not to transport to extra centering device department and carry out the centering, reduced the time that the transportation spent, and the centering subassembly 30 centering mode is simple, only need through the centering board 34 promote the wafer move detection device 35 detect definite distance can, greatly improved the efficiency of whole yellow light technology. Therefore, the utility model solves the technical problems of long time consumption and low efficiency of the yellow light process caused by the fact that the wafer on the manipulator needs to be centered by an independent centering device when the yellow light process is carried out in the prior art.

In addition, the driving part 33 includes a vertical electric telescopic rod 331 provided on the base plate 32, a mounting plate 332 provided on top of the vertical electric telescopic rod 331, and a horizontal electric telescopic rod 333 provided on the mounting plate 332, the horizontal electric telescopic rod 333 being connected to the centering plate 34. Specifically, when the wafer needs to be centered, the mounting plate 332 is driven to move up and down by the vertical electric telescopic rod 331, so that the centering plate 34 is at a proper height, and then the centering plate 34 is driven to move towards the wafer by the horizontal electric telescopic rod 333, so that the centering plates 34 on both sides push or squeeze the wafer to a desired position, thereby completing the centering of the wafer.

Further, the receiving plate 31 is a C-shaped arc, and the midpoints of the two pairs of middle plates 34 are located on the connecting line of the midpoints of the two sides of the base plate 32. The two middle plates 34 are arranged in such a way that when the middle plates 34 center the wafer, the middle plates 34 push and squeeze the middle parts of the two sides of the wafer, so that the middle plates 34 are prevented from squeezing the side parts of one side of the wafer, and the wafer is prevented from sliding off the bearing plate 31 towards the other side when the two sides are squeezed.

Specifically, the upper surface of the receiving plate 31 is provided with a positioning chuck 311 for adsorbing and fixing a wafer. Setting up positioning chuck 311 makes the wafer firmly fixed can not drop on the board 31 that holds when transporting, needs to say, when carrying out the centering, positioning chuck 311 does not start adsorbing the wafer, after the centering is accomplished, positioning chuck 311 just adsorbs the wafer.

Specifically, the positioning sucking discs 311 are symmetrically disposed on two sides of the receiving plate 31, and are disposed at equal intervals along the circumferential direction of the receiving plate 31. The plurality of positioning suckers 311 are uniformly distributed on the bearing plate 31, the wafers are uniformly stressed on the bearing plate 31 and cannot be damaged, and the wafers are adsorbed on the bearing plate 31, so that the wafers are ensured to be stably transported.

In addition, the central angle corresponding to the arc-shaped length of the centering plate 34 is 30 ° to 120 °. Even if the length of the centering plate is proper, the centering plate 34 can be stably attached to the edge of the wafer in a large area, the wafer is stably centered and corrected, the stress of the substrate 32 is prevented from being excessively increased by the centering plate 34, and materials are wasted.

Specifically, a centering groove 341 is disposed on a side of the centering plate 34 adjacent to the receiving plate 31, and a protection pad 342 is disposed in the centering groove 341. By arranging the protection pad 342, when the centering plate 34 pushes and extrudes the wafer to perform centering, two sides of the wafer are not in direct contact with the centering plate 34, so that the wafer is protected, and damage during centering of the wafer is prevented.

In addition, the depth of the centering groove 341 gradually increases from the both sides to the middle. By setting the centering groove 341 in a V shape, and the plane where the center of the centering groove 341 is generally higher than the plane where the top end of the positioning chuck 311 is located, the centering groove 341 can stably position the edge of the wafer, so that the wafer is prevented from slipping in the process of being pushed and corrected by the centering plate 34.

Specifically, the two detecting devices 35 are symmetrically disposed at two sides of the centering plate 34, and the detecting devices 35 at least partially protrude out of the centering plate 34, so that the connecting lines of the detecting devices 35 diagonally disposed at two sides of the receiving plate 31 pass through the center of the receiving plate 31. The arrangement is such that the detecting device 35 can accurately measure and position the wafer in multiple directions, and determine whether centering is required or not, and the distance that the centering needs to be moved. Further, in the present embodiment, the detection device 35 may employ a laser range finder.

In addition, the driving unit 20 includes a base 21, a lifting cylinder 22 provided on the base 21, a jacking pipe 23 provided on the lifting cylinder 22, and a horizontal cylinder 24 connected to a side surface of the jacking pipe 23, and the horizontal cylinder 24 is connected to the horizontal arm 10. Specifically, the lifting cylinder 22 controls the up-and-down movement of the horizontal arm 10, and the horizontal cylinder 34 controls the horizontal movement of the horizontal arm 10, so that the receiving plate 31 can move to the tray position to transfer the wafer on the tray.

In the implementation, firstly, the lifting air cylinder 22 and the horizontal air cylinder 24 in control of the control console are used for enabling the bearing plate 31 at the tail end of the horizontal arm 10 to move to the lower part of the wafer in the material tray, enabling the bearing plate 31 to move upwards, enabling the top surface of the positioning sucker 311 to be attached to the bottom surface of the wafer, lifting the wafer, separating from the supporting structure of the material tray, and then controlling the horizontal air cylinder 24 to enable the bearing plate 311 to completely withdraw the wafer from the material tray; starting a laser range finder in the extraction process, detecting the position of the edge of the wafer in real time by the symmetrically distributed laser range finders, when the detection data are consistent, not centering, starting a positioning sucker 311, adsorbing and fixing the wafer, continuously controlling a lifting cylinder 22 and a horizontal cylinder 24, moving a bearing plate 31 and the wafer to a gluing station until the wafer is placed on the gluing station, controlling the positioning sucker 311 to exhaust, releasing the fixation of the wafer, controlling the lifting cylinder 22 and the horizontal cylinder 24, and separating the bearing plate 31 from the wafer;

If the detection data of the laser range finder are inconsistent, the wafer needs to be centered, the lifting cylinder 22 and the horizontal cylinder 24 pause working, the control desk analyzes the detection data, the vertical electric telescopic rod 331 is started, the vertical height of the centering plate 34 is adjusted, the center of the centering groove 341 is aligned with the horizontal plane where the wafer is positioned, the horizontal electric telescopic rod 333 is controlled to push the centering plates 34 on two sides to move horizontally, the protection pad 342 on the inner side of the centering groove 341 is contacted with the edge of the wafer, the wafer is extruded, the top of the positioning sucker 311 is enabled to displace until the wafer centering is finished, the vertical electric telescopic rod 331 and the horizontal electric telescopic rod 333 are controlled to reset, the centering plate 34 is enabled to be far away from the wafer, and the positioning sucker 311 is controlled to work to fix the wafer in an adsorption mode; finally, the lifting cylinder 22 and the horizontal cylinder 24 are continuously controlled, the bearing plate 31 and the wafer are moved to the gluing station until the wafer is placed on the gluing station, the positioning sucker 311 is controlled to exhaust, the fixation of the wafer is relieved, the lifting cylinder 22 and the horizontal cylinder 24 are controlled, and the bearing plate 31 is moved downwards and horizontally pulled out to be separated from the wafer.

In summary, in the wafer centering device according to the above embodiment of the present utility model, the driving component 20 drives the horizontal arm 10 to move, so that the horizontal arm 10 moves with the centering component 30, and then the receiving plate 31 lifts up and transfers the wafer from the tray to the receiving plate 31, and then the detecting device 35 detects whether the wafer on the receiving plate 31 is centered, and the detecting device 35 determines the deviated position and distance of the wafer, and then the driving component 33 is controlled to drive the centering plates 34 on both sides to push the pressed wafer, so that the wafer is centered on the receiving plate 31, and then the wafer is transferred to the photoresist coating station. Through directly setting up detection device 35 and centering subassembly 30 on accepting the board 31 for the wafer centering can be directly accomplished on the arm, and need not to transport to extra centering device department and carry out the centering, reduced the time that the transportation spent, and the centering subassembly 30 centering mode is simple, only need through the centering board 34 promote the wafer move detection device 35 detect definite distance can, greatly improved the efficiency of whole yellow light technology. Therefore, the utility model solves the technical problems of long time consumption and low efficiency of the yellow light process caused by the fact that the wafer on the manipulator needs to be centered by an independent centering device when the yellow light process is carried out in the prior art.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The foregoing examples illustrate only a few embodiments of the utility model and are described in detail herein without thereby limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims (10)

1. The utility model provides a wafer centering device, its characterized in that includes the horizontal arm, sets up drive assembly of horizontal arm one end, set up the centering subassembly at the horizontal arm other end, centering subassembly includes the board of accepting, symmetry setting is in the base plate of accepting the board both sides, set up drive unit on the base plate, and set up centering board on the drive unit, and set up centering board is kept away from accepting the detection device of board one side, accept the board with centering board all is circular-arc and concentric setting, detection device is used for detecting whether the wafer on the board is centered, drive unit is used for the drive centering board is vertical and horizontal motion, so that centering board promotes the wafer removes in order to center.

2. The wafer centering apparatus of claim 1, wherein the drive means comprises a vertical electric telescopic rod disposed on the base plate, a mounting plate disposed on top of the vertical electric telescopic rod, a horizontal electric telescopic rod disposed on the mounting plate, the horizontal electric telescopic rod being connected to the centering plate.

3. The wafer centering device of claim 1, wherein the receiving plate is a C-shaped arc, and the midpoints of the two centering plates are located on a line connecting the midpoints of the two sides of the substrate.

4. The wafer centering device of claim 1, wherein the upper surface of the receiving plate is provided with a positioning chuck for suction-securing the wafer.

5. The wafer centering device of claim 4, wherein a plurality of the positioning suction cups are symmetrically disposed on both sides of the receiving plate and are equally spaced circumferentially along the receiving plate.

6. The wafer centering device of claim 1, wherein the centering plate has an arcuate length corresponding to a central angle of 30 ° to 120 °.

7. The wafer centering apparatus of any one of claims 1-6, wherein the centering plate has a centering groove on a side thereof adjacent to the receiving plate, and wherein a protective pad is disposed in the centering groove.

8. The wafer centering apparatus of claim 7, wherein the depth of the centering groove increases gradually from side to side.

9. The wafer centering device of claim 6, wherein two of the probing devices are symmetrically disposed on both sides of the centering plate, and the probing devices at least partially protrude from the centering plate such that a line connecting the probing devices diagonally disposed on both sides of the receiving plate passes through a center of the receiving plate.

10. The wafer centering apparatus of claim 6, wherein the drive assembly comprises a base, a lift cylinder disposed on the base, a top tube disposed on the lift cylinder, a horizontal cylinder connected to a side of the top tube, the horizontal cylinder connected to the horizontal arm.