CN220963283U - Automatic lifting and ejecting device for wafer - Google Patents
Automatic lifting and ejecting device for wafer Download PDFInfo
- Publication number
- CN220963283U CN220963283U CN202321002095.1U CN202321002095U CN220963283U CN 220963283 U CN220963283 U CN 220963283U CN 202321002095 U CN202321002095 U CN 202321002095U CN 220963283 U CN220963283 U CN 220963283U
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- CN
- China
- Prior art keywords
- curved surface
- pulley
- fixedly connected
- slide rail
- wafer
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Links
- 235000012431 wafers Nutrition 0.000 claims abstract description 33
- 238000001179 sorption measurement Methods 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to the technical field of wafer processing devices and discloses an automatic lifting ejection device for wafers, which comprises a placing table, wherein a moving device is fixedly connected to the rear side of the top of the placing table, a fixed plate is fixedly connected to the front side of the moving device, a second curved surface sliding rail is fixedly connected to the left end of the front side of the fixed plate, a first curved surface sliding rail is fixedly connected to the right end of the front side of the fixed plate, a third curved surface sliding rail is fixedly connected to the middle part of the front side of the fixed plate, a movable plate is arranged in the middle of the top end of the placing table, and second pulleys are arranged on the left side and the right side of the movable plate. According to the utility model, the first pulley and the second pulley are driven to move on the curved surface slide rail through the moving device, when the first pulley and the second pulley move to the highest point of the curved surface slide rail, the thimble can push out the processed wafer, so that the strength of the thimble for pushing out the wafer can be controlled, the wafer is not easy to damage, the production cost is reduced, and the requirement of a user can be met.
Description
Technical Field
The utility model relates to the technical field of wafer processing devices, in particular to an automatic lifting and ejection device for wafers.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor circuit, and the silicon wafer is formed after the silicon is subjected to processing modes such as grinding, polishing, slicing and the like, and is also called as a wafer, the wafer needs to be printed before being processed, and the wafer is lifted out through a lifting mechanism to carry out the next operation after the printing is finished.
Most of the existing wafer lifting devices in the current market cannot control the force of the ejector pins pushing up the wafer because the ejector pins are fixedly connected with the lifting mechanism, so that the wafer is possibly damaged, the production cost is increased, the requirements of users cannot be met, and the practicability of the device is reduced.
Disclosure of utility model
The utility model aims to solve the defects in the prior art and provides an automatic lifting and ejection device for wafers.
In order to achieve the above purpose, the present utility model adopts the following technical scheme: the utility model provides an automatic liftout attachment that goes up and down of wafer, includes places the platform, the top rear side fixedly connected with mobile device of placing the platform, mobile device's front side fixedly connected with fixed plate, the front side left end fixedly connected with second curved surface slide rail of fixed plate, the front side right-hand member fixedly connected with first curved surface slide rail of fixed plate, the front side middle part fixedly connected with third curved surface slide rail of fixed plate, the top middle part of placing the platform is provided with the fly leaf, the left and right sides of fly leaf all is provided with the second pulley, left side the bottom sliding connection of second pulley and second curved surface slide rail, the right side the bottom sliding connection of second pulley and first curved surface slide rail, the middle part of fly leaf is provided with first pulley, the top sliding connection of first pulley and third curved surface slide rail.
As a further description of the above technical solution:
The top four corners of fly leaf all fixedly connected with thimble, the top left and right sides of fly leaf all is provided with first adsorption equipment, the top of placing the platform is provided with a plurality of second adsorption equipment.
The utility model has the following beneficial effects:
1. According to the utility model, the first pulley and the second pulley are driven to move on the curved surface slide rail through the moving device, when the first pulley and the second pulley move to the highest point of the curved surface slide rail, the thimble can push out the processed wafer, the force of the thimble pushing out the wafer can be controlled, and the wafer is not easy to damage, so that the production cost is reduced, the requirements of a user can be met, and the practicability of the device is improved.
Drawings
Fig. 1 is a front view of an automatic lifting and pushing device for wafers according to the present utility model.
Legend description:
1. A placement table; 2. a mobile device; 3. a fixing plate; 4. a first curved surface slide rail; 5. the second curved surface slide rail; 6. a third curved surface slide rail; 7. a movable plate; 8. a first pulley; 9. a second pulley; 10. a first adsorption device; 11. a thimble; 12. and a second adsorption device.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1, one embodiment provided by the present utility model: the utility model provides an automatic liftout device that goes up and down of wafer, including placing platform 1, place the top rear side fixedly connected with mobile device 2 of platform 1, be used for driving first pulley 8 and second pulley 9 and remove, the front side fixedly connected with fixed plate 3 of mobile device 2, the front side left end fixedly connected with second curved surface slide rail 5 of fixed plate 3, the front side right-hand member fixedly connected with first curved surface slide rail 4 of fixed plate 3, be used for placing first pulley 8, the front side middle part fixedly connected with third curved surface slide rail 6 of fixed plate 3, be used for placing second pulley 9, the top middle part of placing platform 1 is provided with fly leaf 7, the left and right sides of fly leaf 7 all is provided with second pulley 9, the bottom sliding connection of left side second pulley 9 and second curved surface slide rail 5, the bottom sliding connection of right side second pulley 9 and first curved surface slide rail 4, the movable track of fly leaf 7 has been planned, make the fly leaf 7 remove more smooth and more, the middle part of fly leaf 7 is provided with first pulley 8, first pulley 8 and third curved surface slide rail 6's top sliding connection, strengthen between fly leaf 7 and the third curved surface slide rail 6, prevent rocking 7, make the fly leaf 7 more stable.
The top four corners of fly leaf 7 all fixedly connected with thimble 11 for open the crystal dome that prints, the top left and right sides of fly leaf 7 all is provided with first adsorption equipment 10, is used for adsorbing the wafer, processes the wafer, and the top of placing platform 1 is provided with a plurality of second adsorption equipment 12, further strengthens the absorption to the wafer.
Working principle: when the device is used, firstly, the wafer is adsorbed through the first adsorption device 10 and the second adsorption device 12, the moving device 2 is started, the moving device 2 can drive the first pulley 8 to move on the third curved surface slide rail 6, the first pulley 8 can drive the second pulley 9 to move on the first curved surface slide rail 4 and the second curved surface slide rail 5 when moving to the rear side of the first curved surface slide rail 4 and the second curved surface slide rail 5, when the second pulley 9 moves to the rear side of the third curved surface slide rail 6, the first pulley 8 can move to the highest point of the third curved surface slide rail 6, at the moment, the thimble 11 can push out a printed wafer, the force of pushing the thimble 11 out of the wafer can be controlled, the wafer is not easy to damage, thereby reducing the production cost, meeting the requirements of users and improving the practicability of the device.
Finally, it should be noted that: the foregoing description is only illustrative of the preferred embodiments of the present utility model, and although the present utility model has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements or changes may be made without departing from the spirit and principles of the present utility model.
Claims (2)
1. The utility model provides an automatic lifting ejection device of wafer, includes places platform (1), its characterized in that: place top rear side fixedly connected with mobile device (2) of platform (1), the front side fixedly connected with fixed plate (3) of mobile device (2), the front side left end fixedly connected with second curved surface slide rail (5) of fixed plate (3), the front side right-hand member fixedly connected with first curved surface slide rail (4) of fixed plate (3), the front side middle part fixedly connected with third curved surface slide rail (6) of fixed plate (3), the top middle part of placing platform (1) is provided with fly leaf (7), the left and right sides of fly leaf (7) all are provided with second pulley (9), left side the bottom sliding connection of second pulley (9) and second curved surface slide rail (5), the right side the bottom sliding connection of second pulley (9) and first curved surface slide rail (4), the middle part of fly leaf (7) is provided with first pulley (8), the top sliding connection of first pulley (8) and third curved surface slide rail (6).
2. The automatic lifting and ejection device for wafers according to claim 1, wherein: the top four corners of fly leaf (7) all fixedly connected with thimble (11), the top left and right sides of fly leaf (7) all is provided with first adsorption equipment (10), the top of placing platform (1) is provided with a plurality of second adsorption equipment (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321002095.1U CN220963283U (en) | 2023-04-28 | 2023-04-28 | Automatic lifting and ejecting device for wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321002095.1U CN220963283U (en) | 2023-04-28 | 2023-04-28 | Automatic lifting and ejecting device for wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220963283U true CN220963283U (en) | 2024-05-14 |
Family
ID=90981306
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321002095.1U Active CN220963283U (en) | 2023-04-28 | 2023-04-28 | Automatic lifting and ejecting device for wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220963283U (en) |
-
2023
- 2023-04-28 CN CN202321002095.1U patent/CN220963283U/en active Active
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| GR01 | Patent grant |