CN220963279U - Positioning tool for wafer - Google Patents
Positioning tool for wafer Download PDFInfo
- Publication number
- CN220963279U CN220963279U CN202322747650.XU CN202322747650U CN220963279U CN 220963279 U CN220963279 U CN 220963279U CN 202322747650 U CN202322747650 U CN 202322747650U CN 220963279 U CN220963279 U CN 220963279U
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- China
- Prior art keywords
- wafer
- driven gear
- fixedly arranged
- positioning tool
- screw rod
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Links
- 235000012431 wafers Nutrition 0.000 claims abstract description 53
- 230000007246 mechanism Effects 0.000 claims abstract description 50
- 238000003825 pressing Methods 0.000 claims abstract description 28
- 238000005520 cutting process Methods 0.000 claims abstract description 16
- 230000009471 action Effects 0.000 abstract description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005056 compaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a positioning tool for wafers, which comprises a workbench, wherein a support frame is fixedly arranged at the rear end of the upper end of the workbench, a mobile motor is fixedly arranged at one side of the support frame, a mobile screw rod is movably connected to one side of the mobile motor, a mobile block is slidably connected to the outer wall of the mobile screw rod, a cutting piece is fixedly connected to the lower end of the mobile block, and a sliding motor is fixedly arranged at the front end of the upper end of the workbench. According to the positioning tool for the wafer, the position on the placing table can be adjusted through the sliding mechanism, the cutting size can be conveniently adjusted, the fixed positioning of the wafer is facilitated through the driving mechanism, the two groups of pressing mechanisms can be used for pressing and positioning the wafer according to different sizes, the protection of the wafer can be improved through the springs and the protection plates, vibration during cutting can be reduced under the action of the springs, the practicability is improved, and the positioning tool has a better application prospect.
Description
Technical Field
The utility model relates to the field of wafers, in particular to a positioning tool for wafers.
Background
Wafer refers to a silicon wafer used for manufacturing silicon semiconductor circuits, the original material of which is silicon. The high-purity polycrystalline silicon is dissolved and then doped with silicon crystal seed, and then slowly pulled out to form cylindrical monocrystalline silicon. The silicon ingot is ground, polished, and sliced to form a silicon wafer, i.e., a wafer. In the processing process of the wafer, the wafer needs to be cut through the cutting device, and in order to enable the wafer to be more stable in cutting, the wafer needs to be fixed by using a positioning tool.
The existing positioning tool for the wafer is inconvenient to clamp the wafer when in use, is complex in operation during clamping or disassembling, so that the processing efficiency is low, and the positioning device is easy to extrude and damage the wafer or deform the wafer due to the lack of a protection mechanism during clamping the wafer, so that the later processing is influenced, the phenomenon that the positioning tool cannot be suitable for wafers of other types due to the fact that the size of the positioning tool is fixed easily occurs, and certain adverse effects are brought to the use process of people.
Disclosure of utility model
Aiming at the defects of the prior art, the utility model provides a positioning tool for wafers, which has the advantages of the positioning tool for wafers and the like and can effectively solve the problems in the background art.
Technical proposal
In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows: the utility model provides a location frock for wafer, includes the workstation, the rear end fixed mounting of workstation upper end has the support frame, one side fixed mounting of support frame has the movable motor, one side swing joint of movable motor has the movable screw, the outer wall sliding connection of movable screw has the movable block, the lower extreme fixedly connected with cutting member of movable block.
Preferably, the front end fixed mounting of workstation upper end has slide motor, one side swing joint of slide motor has slide screw, slide screw's upper end sliding connection has the platform of placing, place the upper end fixed mounting of platform has the fixed column, the upper end fixed mounting of fixed column has actuating mechanism, the both sides of fixed column all sliding connection has first hold-down mechanism, the one end sliding connection of fixed column has second hold-down mechanism.
Preferably, the driving mechanism comprises a driving motor, a driving gear, a first driven gear, a second driven gear, a first screw rod and a second screw rod, wherein the driving gear is movably connected to the lower end of the driving motor, the first driven gear and the second driven gear are movably connected to the two sides of the driving gear respectively, the first screw rod is fixedly connected to the lower ends of the first driven gear and the second driven gear, and the second screw rod is fixedly connected to the lower end of the driving gear.
Preferably, the second compressing mechanism comprises a lifting block, a compressing block, a spring and a protection plate, wherein the compressing block is fixedly arranged on one side of the lifting block, the spring is fixedly arranged at the lower end of the compressing block, and the protection plate is fixedly arranged at the lower end of the spring.
Preferably, the second compressing mechanism is located at the lower end of the first compressing mechanism, and the first compressing mechanism comprises compressing blocks, springs and protection plates.
Preferably, one side of the first pressing mechanism is respectively connected with the outer wall of the first screw rod in a sliding manner, the inner wall of the lifting block is connected with the outer wall of the second screw rod in a sliding manner, and the first driven gear and the second driven gear are respectively positioned on two sides of the inner cavity of the fixed column.
Preferably, the number of the springs is multiple.
Compared with the prior art, the utility model provides a positioning tool for wafers, which has the following beneficial effects:
1. This location frock for wafer through the cooperation of the sliding motor that sets up and sliding screw down, can adjust and place bench position, drives sliding screw operation through sliding motor to it can be at cutting piece lower extreme back-and-forth movement to drive to place the bench, the size of cutting the size of being convenient for.
2. This location frock for wafer, place the platform through setting up, the fixed column, first hold-down mechanism, the second hold-down mechanism, actuating motor in the actuating mechanism, the driving gear, first driven gear, the second driven gear, first lead screw, under the mutually supporting of second lead screw, be convenient for fix a position the wafer, drive the driving gear operation through actuating motor, then drive first driven gear and second driven gear and move simultaneously, thereby drive two sets of first lead screws and second lead screw operations, make hold-down structure compress tightly the location to the wafer, two sets of hold-down mechanism of setting in addition can compress tightly the location according to the not unidimensional wafer.
3. This location frock for wafer through the mutually supporting of lifting block, compact heap, spring, guard plate in the first hold-down mechanism and the second hold-down mechanism that set up down, can improve the protection to the wafer through spring and guard plate, under the effect of spring, vibrations when can reducing the cutting have improved the practicality.
Drawings
Fig. 1 is a schematic diagram of an overall structure of a positioning tool for wafers according to the present utility model.
Fig. 2 is a structure diagram of a positioning mechanism of a positioning tool for wafers.
Fig. 3 is a diagram showing a driving mechanism structure of a positioning tool for wafers according to the present utility model.
Fig. 4 is a block diagram of a pressing mechanism in a positioning tool for wafers.
In the figure: 1. a work table; 2. a support frame; 3. a moving motor; 4. moving the screw rod; 5. a moving block; 6. a cutting member; 7. a slide motor; 8. a sliding screw rod; 9. a placement table; 10. fixing the column; 11. a driving mechanism; 12. a first hold-down mechanism; 13. a second hold-down mechanism; 111. a driving motor; 112. a drive gear; 113. a first driven gear; 114. a second driven gear; 115. a first screw rod; 116. a second screw rod; 131. a lifting block; 132. a compaction block; 133. a spring; 134. and (5) protecting the plate.
Detailed Description
The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.
As shown in fig. 1-4, a positioning tool for wafers comprises a workbench 1, wherein a support frame 2 is fixedly arranged at the rear end of the upper end of the workbench 1, a mobile motor 3 is fixedly arranged on one side of the support frame 2, a mobile screw 4 is movably connected to one side of the mobile motor 3, a mobile block 5 is slidably connected to the outer wall of the mobile screw 4, and a cutting piece 6 is fixedly connected to the lower end of the mobile block 5.
Further, the front end fixed mounting of workstation 1 upper end has slide motor 7, and one side swing joint of slide motor 7 has slide screw 8, can adjust and place the bench position on 9, and slide screw 8's upper end sliding connection has and places bench 9, and the upper end fixed mounting of placing bench 9 has fixed column 10, and fixed column 10's upper end fixed mounting has actuating mechanism 11, and fixed column 10's both sides all sliding connection has first hold-down mechanism 12, and fixed column 10's one end sliding connection has second hold-down mechanism 13.
Further, the driving mechanism 11 comprises a driving motor 111, a driving gear 112, a first driven gear 113, a second driven gear 114, a first screw rod 115 and a second screw rod 116, the driving gear 112 is movably connected to the lower end of the driving motor 111, the first driven gear 113 and the second driven gear 114 are movably connected to two sides of the driving gear 112 respectively, the first screw rod 115 is fixedly connected to the lower ends of the first driven gear 113 and the second driven gear 114, and the second screw rod 116 is fixedly connected to the lower end of the driving gear 112, so that the wafer is conveniently fixed and positioned.
Further, the second pressing mechanism 13 includes a lifting block 131, a pressing block 132, a spring 133 and a protection plate 134, the pressing block 132 is fixedly installed on one side of the lifting block 131, the spring 133 is fixedly installed at the lower end of the pressing block 132, the protection plate 134 is fixedly installed at the lower end of the spring 133, and protection to a wafer can be improved through the spring 133 and the protection plate 134.
Further, the second pressing mechanism 13 is located at the lower end of the first pressing mechanism 12, and the first pressing mechanism 12 includes a pressing block 132, a spring 133 and a protection plate 134.
Further, one side of the first pressing mechanism 12 is slidably connected with the outer wall of the first screw rod 115, the inner wall of the lifting block 131 is slidably connected with the outer wall of the second screw rod 116, the first driven gear 113 and the second driven gear 114 are located on two sides of the inner cavity of the fixed column 10 respectively, the driving gear 112 is driven to operate through the driving motor 111, and then the first driven gear 113 and the second driven gear 114 are driven to operate simultaneously, so that two groups of first screw rods 115 and second screw rods 116 are driven to operate, the pressing structure is used for pressing and positioning wafers, and the two groups of pressing mechanisms can be used for pressing and positioning wafers according to different sizes.
Further, the number of the springs 133 is multiple, and vibration during cutting can be reduced under the action of the springs 133, so that practicability is improved.
When using this location frock for wafer, under the cooperation of sliding motor 7 and sliding screw 8 that set up, can adjust and place bench 9 upper position, drive the operation of sliding screw 8 through sliding motor 7, thereby it can be at cutting 6 lower extreme back-and-forth movement to drive and place bench 9, be convenient for adjust the size of cutting size, place bench 9 through setting up, the fixed column 10 through setting up, first hold-down mechanism 12, second hold-down mechanism 13, driving motor 111 in the actuating mechanism 11, the driving gear 112, first driven gear 113, the second driven gear 114, first lead screw 115, the second lead screw 116 mutually support down, be convenient for the fixed location to the wafer, drive driving gear 112 operation through driving motor 111, then drive first driven gear 113 and second driven gear 114 simultaneously operation, thereby drive two sets of first lead screws 115 and second lead screw 116 operation, make hold-down structure compress tightly the location to the wafer, two sets of hold-down mechanism that set up moreover, can compress tightly the location according to the wafer of different sizes, through the first hold-down mechanism 12 that sets up and second hold-down mechanism 13 lifting block 132, the spring 134, the protection plate 133 can be improved under the mutual action of the protection spring 133, the protection plate 133 can be under the protection spring, the protection of the protection plate 133 has been improved.
The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (7)
1. The utility model provides a location frock for wafer, includes workstation (1), its characterized in that: the automatic cutting device is characterized in that a supporting frame (2) is fixedly arranged at the rear end of the upper end of the workbench (1), a moving motor (3) is fixedly arranged on one side of the supporting frame (2), a moving screw (4) is movably connected on one side of the moving motor (3), a moving block (5) is slidably connected on the outer wall of the moving screw (4), and a cutting piece (6) is fixedly connected at the lower end of the moving block (5).
2. The wafer positioning tool according to claim 1, wherein: the automatic clamping device is characterized in that a sliding motor (7) is fixedly arranged at the front end of the upper end of the workbench (1), a sliding screw (8) is movably connected to one side of the sliding motor (7), a placing table (9) is slidably connected to the upper end of the sliding screw (8), a fixing column (10) is fixedly arranged at the upper end of the placing table (9), a driving mechanism (11) is fixedly arranged at the upper end of the fixing column (10), a first pressing mechanism (12) is slidably connected to two sides of the fixing column (10), and a second pressing mechanism (13) is slidably connected to one end of the fixing column (10).
3. The wafer positioning tool according to claim 2, wherein: the driving mechanism (11) comprises a driving motor (111), a driving gear (112), a first driven gear (113), a second driven gear (114), a first screw rod (115) and a second screw rod (116), wherein the driving gear (112) is movably connected to the lower end of the driving motor (111), the first driven gear (113) and the second driven gear (114) are movably connected to the two sides of the driving gear (112) respectively, the first screw rod (115) is fixedly connected to the lower ends of the first driven gear (113) and the second driven gear (114), and the second screw rod (116) is fixedly connected to the lower ends of the driving gear (112).
4. A positioning tool for wafers according to claim 3, wherein: the second pressing mechanism (13) comprises a lifting block (131), a pressing block (132), a spring (133) and a protection plate (134), wherein the pressing block (132) is fixedly arranged on one side of the lifting block (131), the spring (133) is fixedly arranged at the lower end of the pressing block (132), and the protection plate (134) is fixedly arranged at the lower end of the spring (133).
5. The wafer positioning tool according to claim 4, wherein: the second pressing mechanism (13) is located at the lower end of the first pressing mechanism (12), and the first pressing mechanism (12) comprises pressing blocks (132), springs (133) and protection plates (134).
6. The wafer positioning tool according to claim 5, wherein: one side of the first pressing mechanism (12) is respectively connected with the outer wall of the first screw rod (115) in a sliding manner, the inner wall of the lifting block (131) is connected with the outer wall of the second screw rod (116) in a sliding manner, and the first driven gear (113) and the second driven gear (114) are respectively positioned on two sides of the inner cavity of the fixed column (10).
7. The wafer positioning tool according to claim 6, wherein: the number of the springs (133) is multiple.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322747650.XU CN220963279U (en) | 2023-10-13 | 2023-10-13 | Positioning tool for wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322747650.XU CN220963279U (en) | 2023-10-13 | 2023-10-13 | Positioning tool for wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220963279U true CN220963279U (en) | 2024-05-14 |
Family
ID=91007897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322747650.XU Active CN220963279U (en) | 2023-10-13 | 2023-10-13 | Positioning tool for wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220963279U (en) |
-
2023
- 2023-10-13 CN CN202322747650.XU patent/CN220963279U/en active Active
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