CN220952151U - Electroplating system - Google Patents

Abstract

The utility model discloses an electroplating system. The electroplating system includes a first electroplating apparatus comprising: a first plating bath; a soluble anode which is arranged in the first electroplating bath and forms a first electrolytic loop with a workpiece to be electroplated which is arranged in the first electroplating bath; a first management tank in communication with the first plating tank; a first insoluble anode disposed within the first management tank; and a first cathode disposed within the first management tank to form a second electrolytic circuit with the first insoluble anode. According to the electroplating system disclosed by the embodiment of the utility model, the production of a magnet product with more uniform plating thickness is facilitated.

Description

Electroplating system

Technical Field

The present utility model relates generally to the field of electroplating technology. More particularly, the present utility model relates to an electroplating system.

Background

Magnets are functional materials that are widely used in the field of electronic devices. Since the magnet substrate is easily corroded, the magnet substrate is protected by plating on the surface of the substrate. With the development of high-performance miniaturization of functional devices in the field of electronic devices, the requirements on the performance of the magnet are higher and higher, and the thickness of the plating layer becomes an important factor affecting the performance of the magnet. The thickness of the plating layer on the surface of the magnet is larger, so that the magnetic performance of the magnet can be influenced; the smaller thickness of the plating layer on the surface of the magnet may affect the corrosion resistance of the magnet. The uniformity of the plating thickness on the surface of the magnet is also important, and the performance effect, durability and the like of the whole surface of the magnet are affected.

In view of the foregoing, it is desirable to provide an electroplating solution that facilitates the production of magnet products with uniform coating thickness.

Disclosure of utility model

To solve at least one or more of the technical problems mentioned above, the present utility model provides an electroplating system comprising a first electroplating device comprising: a first plating bath; a soluble anode which is arranged in the first electroplating bath and forms a first electrolytic loop with a workpiece to be electroplated which is arranged in the first electroplating bath; a first management tank in communication with the first plating tank; a first insoluble anode disposed within the first management tank; and a first cathode disposed within the first management tank to form a second electrolytic circuit with the first insoluble anode.

In some embodiments, the first electroplating apparatus further comprises: and the second insoluble anode is attached to the soluble anode or is independently arranged in the first electroplating bath.

In other embodiments, the first plating tank has a plating solution outlet, and the first plating apparatus further comprises: a downpipe connected between the plating solution outlet of the first plating tank and the first management tank, and the first management tank is disposed at a position lower than the first plating tank; and the circulating pump is connected to a return pipeline between the first management tank and the first electroplating tank and is used for conveying the electroplating solution in the first management tank to the first electroplating tank.

In yet other embodiments, the first plating bath includes a plurality of plating cells and an overflow trough disposed between the plurality of plating cells, the overflow trough in communication with the plating solution outlet; each electroplating unit is provided with an overflow port, and the overflow ports of the plurality of electroplating units are communicated with the overflow groove.

In some embodiments, the first electroplating apparatus further comprises: and the first ion analysis device is connected with the first management tank and is used for detecting the concentration of electroplating metal ions of the electroplating liquid in the first management tank.

In other embodiments, the first electroplating apparatus further comprises: at least two first temperature measuring devices respectively arranged in the first electroplating tank and the first management tank; and a cooling device provided in the first management tank.

In still other embodiments, the cooling device comprises a cooling coil.

In some embodiments, the first electroplating apparatus further comprises: at least one first fluid replacement device; at least one first fluid infusion pump is in one-to-one correspondence with the at least one first fluid infusion device, and each first fluid infusion pump is connected between the first management tank and the corresponding first fluid infusion device.

In other embodiments, the electroplating system further comprises a second electroplating apparatus comprising: a second plating bath; a first recovery tank; and the first water pump is connected between the first recovery tank and the second electroplating tank and is used for conveying the liquid in the first recovery tank to the second electroplating tank.

In still other embodiments, the second electroplating apparatus further comprises: a second recovery tank; and the second water pump is connected between the first recovery tank and the second recovery tank and is used for conveying the liquid in the second recovery tank to the first recovery tank.

In some embodiments, the second electroplating apparatus further comprises: a second management tank in communication with the second plating tank; at least one second fluid replacement device; at least one second fluid infusion pump in one-to-one correspondence with the at least one second fluid infusion device, and each second fluid infusion pump is connected between the second management tank and the corresponding second fluid infusion device.

In other embodiments, the second electroplating apparatus further comprises: and the liquid level meter is arranged in the second management groove.

In still other embodiments, the second electroplating apparatus further comprises: at least two second temperature measuring devices respectively arranged in the second electroplating tank and the second management tank; and a first heating device disposed in the second management tank.

In some embodiments, the electroplating system further comprises a third electroplating apparatus comprising: a third plating bath; a third management tank in communication with the third plating tank; at least one third fluid replacement device; and at least one third fluid infusion pump in one-to-one correspondence with the at least one third fluid infusion device, and each third fluid infusion pump is connected between the third management tank and the corresponding third fluid infusion device.

In other embodiments, the third electroplating apparatus further comprises: and the second ion analysis device is connected with the third management tank and is used for monitoring the concentration of the electroplating metal ions of the electroplating liquid in the third management tank.

In still other embodiments, the third electroplating apparatus further comprises: at least two third temperature measuring devices respectively arranged in the third electroplating tank and the third management tank; and a second heating device disposed in the third management tank.

By providing the electroplating system as provided above, the first electroplating device provided by the embodiment of the utility model has the advantages that the first management tank communicated with the first electroplating tank is arranged, and the second electrolysis loop formed by the first insoluble anode and the first cathode is arranged in the first management tank, so that the second electrolysis loop is different from the first electrolysis loop, and can be used for adjusting the concentration of the electroplating solution in the first electroplating tank.

Drawings

The above, as well as additional purposes, features, and advantages of exemplary embodiments of the present utility model will become readily apparent from the following detailed description when read in conjunction with the accompanying drawings. In the drawings, embodiments of the utility model are illustrated by way of example and not by way of limitation, and like reference numerals refer to similar or corresponding parts and in which:

FIG. 1 shows a schematic diagram of an electroplating system according to an embodiment of the utility model;

FIG. 2 shows a schematic view of a first plating cell in communication with a first management cell, according to an embodiment of the utility model;

Fig. 3 shows a schematic top view of a first plating cell according to an embodiment of the utility model;

FIG. 4 shows a schematic view of a first electroplating apparatus according to another embodiment of the utility model;

FIG. 5 shows a schematic view of an electroplating system according to another embodiment of the utility model;

FIG. 6 shows a schematic view of a second electroplating apparatus according to an embodiment of the utility model;

FIG. 7 shows a schematic view of an electroplating system according to yet another embodiment of the utility model;

fig. 8 shows a schematic view of a third electroplating apparatus according to an embodiment of the utility model.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the present utility model. All other embodiments, based on the embodiments of the utility model, which a person skilled in the art would obtain without making any inventive effort, are within the scope of the utility model.

It should be understood that the terms "comprises" and "comprising," when used in this specification and in the claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

It is also to be understood that the terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used in the specification and claims, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should be further understood that the term "and/or" as used in the present specification and claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.

Specific embodiments of the present utility model are described in detail below with reference to the accompanying drawings.

FIG. 1 shows a schematic diagram of an electroplating system according to an embodiment of the utility model. As shown in fig. 1, the plating system 100 may include a first plating apparatus 110, and the first plating apparatus 110 may include: the first electroplating tank 111, the soluble anode 113, the first management tank 112, and the first insoluble anode 115 and the first cathode 114 disposed in the first management tank 112, wherein the soluble anode 113 may be disposed in the first electroplating tank 111 and form a first electrolytic circuit with the workpiece 10 to be electroplated disposed in the first electroplating tank 111; the first management tank 112 may be in communication with the first plating tank 111; the first insoluble anode 115 may form a second electrolytic circuit with the first cathode 113.

In some embodiments, the workpiece 10 to be electroplated may be a magnet substrate to be electroplated, such as a sintered neodymium-iron-boron magnet substrate, or the like. In other embodiments, the first plating tank 111 may be a barrel plating tank or a rack plating tank. In still other embodiments, the volume of the first plating cell 111 may be set to, for example, 3000L, or other dimensions. In some embodiments, the first plating tank 111 may have a cylindrical structure or a box structure, etc., and the open end of the first plating tank 111 may be provided with a filter, which may be used to filter the air entering the first plating tank 111 to remove impurities in the air entering the first plating tank 111.

In some embodiments, the soluble anode 113 may be a plating metal anode for dissolving metal ions required to form a plating layer in a plating solution to form a metal plating layer on the surface of the workpiece 10 to be plated. For example, the soluble anode 113 may be a copper anode plate for dissolving and generating copper ions to form an electroplated copper layer on the surface of the workpiece 10 to be electroplated; also for example, the soluble anode 113 may be a nickel anode plate for dissolving to generate nickel ions to form an electroplated nickel layer on the surface of the workpiece 10 to be electroplated. The soluble anode 113 may be provided in one or more. In the first plating tank 111, a first electrolytic circuit is formed between the soluble anode 113 and the workpiece 10 to be plated for generating an electrochemical reaction on the surface of the workpiece 10 to be plated and generating a plating layer, and a circuit device such as a power source, a rectifier, and the like may be further included in the first electrolytic circuit.

In some embodiments, the volume of the first management tank 112 may be less than the volume of the first plating tank 111. In other embodiments, the volume of the first management trough 112 may be, for example, 500L, or other dimensions. In still other embodiments, the first plating tank 111 and the first management tank 112 may be connected by a communication line, so that the plating solution in the first plating tank 111 may flow through both the first plating tank 111 and the first management tank 112, thereby enabling the first management tank 112 to communicate with the first plating tank 111.

The second electrolytic circuit and the first electrolytic circuit formed by the first insoluble anode 115 and the first cathode 113 are independently provided. In some embodiments, the first insoluble anode 115 may include a graphite anode and/or a stainless steel anode, or the like. In other embodiments, the first cathode may be made of materials other than the workpiece 10 to be electroplated, and the materials are not limited herein.

The inventors have found that the concentration fluctuations of the plated metal ions in the plating solution during the plating process directly affect the uniformity of the thickness of the plating layer. If the concentration of the plating metal ions varies more, the plating speed at which the plating layer is formed on the workpiece 10 to be plated is negligibly low, so that the uniformity of the generated plating layer is worse, the thickness tolerance of the plating layer is larger, that is, the positions on the plating layer are thinner and the positions on the plating layer are thicker; conversely, if the concentration variation range of the plating metal ions is smaller, the more uniform the plating layer is formed on the workpiece 10 to be plated, the better the uniformity of the generated plating layer is, and the smaller the plating thickness tolerance is.

The inventors have also found that, as the soluble anode 113 dissolves, particularly when the first plating layer is applied to the substrate of the workpiece 10 to be plated, the plating metal ion concentration of the plating solution in the first plating tank 111 increases significantly, resulting in a large fluctuation in the plating metal ion concentration. In the embodiment of the utility model, by arranging the first insoluble anode 115 in the second electrolytic circuit, the plating metal ions generated by dissolution of the soluble anode 113 can be reduced, so that the consumption of plating metal ions in the plating reaction is increased. That is, the first insoluble anode 115 is disposed to consume the plating metal ions in the plating solution to compensate for the concentration fluctuation of the plating metal ions caused by the increase of the plating metal ion concentration due to the dissolution reaction of the soluble anode 113, thereby stabilizing the plating metal ion concentration in the plating solution.

Further, by providing a separate second electrolytic circuit in the first management tank 112 in communication with the first plating tank 111, the second electrolytic circuit can be made to be used for independently adjusting the concentration of plated metal ions, for example, the second electrolytic circuit can be independently set on, off, current level, on time, etc., as opposed to the first electrolytic circuit, as opposed to providing an insoluble anode directly in the first electrolytic circuit. According to such an arrangement, in a practical application scenario, the user can control the opening and closing of the second electrolytic circuit, etc., according to the degree of change in the concentration of the plating metal ions in the plating solution, without thereby shutting off the ongoing plating reaction in the first electrolytic circuit.

In some application scenarios, the user may manually control the opening and closing of the second electrolytic circuit as desired, for example by controlling a switch on the second electrolytic circuit. In other application scenarios, a control device may be provided to control the opening and closing of the second electrolytic circuit, where the control device may be built in with, for example, a PLC program to implement automatic control, and the control device may include a processor, a memory, a controller, etc., which may be configured for use by purchase alone.

In still other embodiments, the first electroplating apparatus 110 may further include: the second insoluble anode may be attached to the soluble anode 113 or may be independently disposed in the first plating tank 111. The bonding of the second insoluble anode to the soluble anode 113 may be achieved by bonding or by integral molding. In some embodiments, the second insoluble anode may include a graphite anode and/or a stainless steel anode, or the like. In this embodiment, the second insoluble anode, the soluble anode 113, and the workpiece 10 to be electroplated form a first electrolytic circuit. According to such an arrangement, the second insoluble anode can be directly used to consume the plating metal ions in the plating solution to compensate for the increase in concentration of the plating metal ions caused by the dissolution reaction of the soluble anode 113, while the second electrolytic circuit can be used to fine-tune the concentration of the plating metal ions so as to more finely adjust the fluctuation range of the concentration of the plating metal ions in the plating solution, so that the fluctuation range of the concentration is smaller, thereby making the plating thickness of the produced magnet product more uniform.

While an electroplating system according to an embodiment of the present utility model has been described above by way of example with reference to fig. 1, it will be appreciated that an electroplating system according to an embodiment of the present utility model may be used to electroplate a magnet such as a neodymium-iron-boron magnet substrate, and that the concentration of electroplated metal ions in the electroplating solution during electroplating may be more easily stabilized using the electroplating system, thereby facilitating the production of a magnet product having a uniform plating layer thickness. It will also be appreciated that the above description is by way of example and not limitation, and that the communication of the first plating cell with the first management cell may be accomplished in a manner other than by the communication lines described above. An exemplary description will be given below with reference to fig. 2.

Fig. 2 shows a schematic view of a first plating cell in communication with a first management cell, according to an embodiment of the utility model. As shown in fig. 2, the first plating tank 111 may have a plating solution outlet 201, and the first plating apparatus according to the embodiment of the utility model may further include: a downpipe 202 may be connected between the plating solution outlet 201 of the first plating tank 111 and the first management tank 112, and the first management tank 112 may be disposed at a position lower than the first plating tank 111. In some embodiments, the plating solution outlet 201 may be disposed on a sidewall of the first plating tank 111 and may be below the level of the plating solution. In other embodiments, the first plating tank 111 may be disposed at the level of the second floor, and the first management tank 112 may be disposed at the level of the first floor. In still other embodiments, the height difference between the first plating vessel 111 and the first management vessel 112 may be, for example, 2 meters or the like. By disposing the first management tank 112 at a position lower than the first plating tank 111, the plating liquid in the first plating tank 111 can be caused to flow out through the plating liquid outlet 201 and automatically flow into the first management tank 112 (in the direction indicated by the arrow in the drawing) through the downpipe 202.

As further shown in fig. 2, the first plating apparatus according to the embodiment of the utility model may further include a circulation pump 203 that may be connected to a return line 204 between the first management tank 112 and the first plating tank 111 and that is configured to convey the plating solution in the first management tank 112 to the first plating tank 111 (as indicated by a dashed arrow in the drawing). By providing the circulation pump 203 and the return line 204, the plating solution in the first management tank 112 can be returned to the first plating tank 111, so that the first plating tank 111 and the first management tank 112 are in a communication state, and the plating solution can circulate in both, so that the concentration of the plating solution in the first management tank 112 is the same as the concentration of the plating solution in the first plating tank 111, and the purpose of adjusting the concentration of the plating solution in the first plating tank 111 can be achieved by providing the second electrolytic circuit to adjust the concentration of the plating solution in the first management tank 112.

The communication state and the connection relationship between the first plating vessel 111 and the first management vessel 112 according to the embodiment of the utility model are exemplarily described above with reference to fig. 2, and it is understood that the above description is exemplary and not limitative, and for example, the structure of the first plating vessel 111 may be not limited to a cylindrical structure, a box-like structure, etc., but may also include only one plating space. The structure of the first plating tank will be exemplarily described with reference to fig. 3.

Fig. 3 shows a schematic top view of a first plating cell according to an embodiment of the utility model. As shown in fig. 3, the first plating vessel 111 may include a plurality of plating cells (e.g., 301-1 and 301-2 in the illustration) and an overflow vessel 302 disposed between the plurality of plating cells 301-1 and 301-2, the overflow vessel 302 may be in communication with the plating solution outlet 201; each plating cell has an overflow (e.g., plating cell 301-1 has overflow 303-1, plating cell 302-1 has overflow 303-2), and overflow of multiple plating cells (e.g., 303-1 and 303-2 in the illustration) may be in communication with overflow trough 302.

In some embodiments, the overflow port is below the level of the plating solution and below the height of the side wall of the first plating vessel 111, and a channel for overflow of the plating solution (i.e., overflow of the plating solution) may be provided between the overflow port and the side wall of the first plating vessel 111, which channel communicates with the overflow tank 302, thereby forming a flow path (see the direction indicated by the arrow in the drawing) through which the plating solution flows out of the overflow port, then flows to the plating solution outlet 201 via the overflow tank 302, and flows into the first management tank through the downpipe 202. The overflow trough 302 has a flow guiding function and can guide the overflowed plating solution to flow to the plating solution outlet 201. In other embodiments, isopipe 302 may be elongated.

According to such an arrangement, a plurality of plating cells can be provided, and the circulation of the plating liquid between the plurality of plating cells can be ensured. Each electroplating unit can be used for electroplating a workpiece to be electroplated, so that a plurality of magnet products can be produced in batches in the same batch of the same electroplating liquid, the quality consistency of the magnet products produced in batches can be guaranteed, and the uniformity of the plating thickness of the magnet products produced in batches can be controlled easily.

Compared with the overflow tank 302 arranged on one side of a plurality of electroplating units, the overflow tank 302 is arranged among the plurality of electroplating units, so that the length of the flowing path of the electroplating liquid overflowed by each electroplating unit is relatively average, thereby being beneficial to keeping the uniform flow of the electroplating liquid in the whole first electroplating tank 111, avoiding the problem that the concentration of the electroplating liquid at partial positions is high or low, and further being beneficial to ensuring the consistency and stability of the concentration of the electroplating liquid at each position in the first electroplating tank 111.

While a first plating cell including a plurality of plating cells is described above by way of example in connection with fig. 3, it is to be understood that the above description is by way of example and not limitation, and that the number of plating cells may not be limited to two as shown, and may be more or less as desired. In some embodiments, when more plating cells are provided, overflow ports may be provided between the plating cells and the side walls of the first plating tank, or between adjacent plating cells as desired, such that a flow path for overflow plating solution is formed between overflow ports of adjacent plating cells (e.g., another plating cell may be provided in a direction above the illustrated plating cell 301-1 such that a flow path is formed between overflow port 303-1 and an overflow port of another plating cell), which still leads to the overflow tank, to achieve communication between the overflow port and the overflow tank. For example, the plating solution outlet 202 and the overflow vessel 302 connected thereto may be provided not only on one side wall (i.e., the upper edge of the first plating vessel 111 in the plan view) near the overflow port in the drawing, but also on the other side wall (i.e., the lower edge of the first plating vessel 111 in the plan view) opposite to the side wall near the overflow port in the drawing.

Fig. 4 shows a schematic view of a first electroplating apparatus according to another embodiment of the utility model. As shown in fig. 4, the first electroplating apparatus 110 may include a first electroplating tank 111, a soluble anode 113, a second insoluble anode 401, a first management tank 112, and a first insoluble anode 115 and a first cathode 114 disposed in the first management tank 112, wherein the soluble anode 113 and the second insoluble anode 401 may be disposed in the first electroplating tank 111 and form a first electrolytic circuit with a workpiece 10 to be electroplated disposed in the first electroplating tank 111; the first management tank 112 may be in communication with the first plating tank 111; the first insoluble anode 115 may form a second electrolytic circuit with the first cathode 113.

As further shown in fig. 4, in some embodiments, the first electroplating apparatus 110 may further comprise a first ion analysis apparatus 402, the first ion analysis apparatus 402 may be coupled to the first management tank 112 for detecting a concentration of electroplating metal ions of the electroplating solution in the first management tank 112. In some embodiments, the first ion analysis device 402 may be an in-line ion analysis device. In other embodiments, the first ion analyzer 402 may be a copper ion analyzer that may be used to detect the copper ion concentration of the plating solution in the first management tank 112. In still other embodiments, the copper ion analysis apparatus may employ a WCU600 copper ion controller, such as Walchem, a WCU series controller, walchem, which is an apparatus for on-line analysis of copper plating or etching solution concentration changes in a plating solution using the optoelectronics principle. In other embodiments, the first ion analyzer 402 is coupled to the first management tank 112, and the sampling tube of the first ion analyzer 402 may be coupled to the first management tank 112.

In other embodiments, the first electroplating apparatus 110 may further include: at least two first temperature measuring devices are disposed in the first plating tank 111 and the first management tank 112, respectively, for example, one first temperature measuring device 403-1 in the illustration is disposed in the first plating tank 111, and the other first temperature measuring device 403-2 is disposed in the first management tank 112. In some embodiments, the first temperature measuring device may include a temperature sensor, a temperature probe, or the like.

Since the plating liquid can flow through the first plating vessel 111 and the first management vessel 112, if the plating liquid temperatures in the first plating vessel 111 and the first management vessel 112 are not uniform, it is indicated that there may be a problem of a blocked communication line, etc., the provision of the plurality of first temperature measuring devices can detect the temperatures of the plating liquid in the first plating vessel 111 and the first management vessel 112, respectively, and thus can be used to monitor and warn of a possible occurrence of a problem of a non-communication between the first management vessel 112 and the first plating vessel 111.

In other embodiments, a cooling device 404 may also be disposed within the first management tank 112. In still other embodiments, the cooling device 404 may include a cooling coil or the like. Cooling water can be introduced into the cooling coil pipe to realize the purpose of cooling. The cooling device 404 may be used to cool the plating solution, particularly when exothermic reactions are present in the reaction or when a slow down of the reaction is desired, the cooling effect may be achieved by the cooling device 404.

For example, in some application scenarios, when copper plating is required for the neodymium-iron-boron magnet matrix, because the potential of copper is higher than that of the neodymium-iron-boron magnet matrix, there is a tendency of replacing iron ions when copper ions contact the surface of the neodymium-iron-boron magnet matrix, and if a replacement reaction occurs, the replacement copper layer formed on the surface of the neodymium-iron-boron magnet matrix has a lower interfacial bonding force with the surface of the neodymium-iron-boron magnet matrix, so that the formation of the replacement copper layer on the surface of the neodymium-iron-boron magnet matrix needs to be reduced or avoided as much as possible. Through setting up cooling device in first management groove, can keep the temperature of the plating solution in the first management groove in lower temperature range, can be favorable to restraining the emergence of displacement reaction to be favorable to reducing and form the displacement copper layer on neodymium iron boron magnetism body substrate surface.

In some embodiments, the first plating apparatus 110 may further include at least one first fluid replacement apparatus 405 and at least one first fluid replacement pump 406, the at least one first fluid replacement pump 406 may be in one-to-one correspondence with the at least one first fluid replacement apparatus 405, and each first fluid replacement pump 406 is connected between the first management tank 112 and the corresponding first fluid replacement apparatus 405 for delivering the fluid replacement in the first fluid replacement apparatus 405 to the first management tank 112. In some embodiments, the first fluid replacement device 406 may include a fluid reservoir and/or a surge tank, or the like.

The liquid to be replenished or added in the plating reaction may be stored in the first replenishing means 405 in advance so as to be replenished into the first management tank 112 during the plating process, depending on the liquid to be replenished or added. Depending on the type of fluid that is desired to be replenished, one or more first replenishing devices 405 may be provided. In some application scenarios, assuming that the complexing agent, the pH adjuster, etc. need to be supplemented separately, at least two first fluid replacement devices may be provided to provide the complexing agent, the pH adjuster, etc. separately.

While the first electroplating apparatus according to another embodiment of the utility model has been described above by way of example and not limitation with reference to fig. 4, it is to be understood that the above description is intended by way of example and not limitation, and that in some embodiments, the first electroplating apparatus may further comprise a pretreatment tank that may contain a pretreatment solution and that is used to pretreat the workpiece to be electroplated in the pretreatment tank prior to the workpiece to be electroplated entering the first electroplating tank for electroplating. For example, in some application scenarios, a solution including a complexing agent may be placed in the pretreatment tank, so that the surface of the neodymium-iron-boron magnet substrate is attached with the complexing agent, and then when the neodymium-iron-boron magnet substrate attached with the complexing agent is placed in the first electroplating tank for copper plating treatment, the surface of the neodymium-iron-boron magnet substrate can be effectively prevented from undergoing a displacement reaction to affect the bonding force between the plating layer and the substrate.

Fig. 5 shows a schematic view of an electroplating system according to another embodiment of the utility model. As shown in fig. 5, the electroplating system 100 may include a first electroplating apparatus 110 and a second electroplating apparatus 510. In some application scenarios, the first electroplating device 110 and the second electroplating device 510 may be used to form two electroplated layers on the same workpiece to be electroplated, and the electroplating solutions of the first electroplating device 110 and the second electroplating device 510 may include the same or different components and may be used for electroplating processes of the same or different electroplated metals. For example, in some application scenarios, the first electroplating device 110 may be used to perform a bottom copper layer electroplating process on a workpiece to be electroplated, and the second electroplating device 510 may be used to perform a thick copper layer electroplating process on a workpiece to be electroplated that includes a bottom copper layer, or perform other metal layer electroplating processes, and so on.

The first electroplating apparatus 110 may include a first electroplating tank 111, a soluble anode 113, a first management tank 112, and a first insoluble anode 115 and a first cathode 114 disposed in the first management tank 112, wherein the soluble anode 113 may be disposed in the first electroplating tank 111 and form a first electrolytic circuit with a workpiece 10 to be electroplated disposed in the first electroplating tank 111; the first management tank 112 may be in communication with the first plating tank 111; the first insoluble anode 115 may form a second electrolytic circuit with the first cathode 113. The first electroplating device 110 has been described in detail in connection with any of fig. 1-4, and will not be described again.

As shown in fig. 5, the second electroplating apparatus 510 may include a second electroplating tank 511, a first recovery tank 512, and a first water pump 513, wherein the first water pump 513 is connected between the first recovery tank 512 and the second electroplating tank 511, for delivering the liquid in the first recovery tank 512 into the second electroplating tank 511. In other embodiments, the volume of the second plating tank 511 may be set to, for example, 3000L, or other dimensions. In some embodiments, the second plating tank 511 may have a cylindrical structure or a box structure, etc., and the open end of the second plating tank 511 may be provided with a filter, which may be used to filter the air entering the second plating tank 511 to remove impurities in the air entering the second plating tank 511. In some embodiments, a soluble anode may also be provided in the second plating tank 511 for providing metal cations required for plating. In still other embodiments, the second plating tank 511 may include a plurality of plating units, and the structure thereof may be the same as or similar to that of the first plating tank 111 described above in connection with fig. 3, and will not be described again.

In some embodiments, the second plating tank 511 may be a barrel plating tank, and the first recovery tank 512 may be used to perform a first cleaning of a barrel plating cylinder and recover a cleaning liquid. The first water pump 513 is a mechanism that delivers or pressurizes the liquid. In some embodiments, first water pump 513 may include, for example, a positive displacement pump, or a vane pump, or the like. Since the liquid in the first recovery tank 512 is a liquid obtained by cleaning the drum and contains plating liquid components at a low concentration, the liquid in the first recovery tank 512 is fed to the second plating tank 511 by the first water pump 513, and the plating liquid in the second plating tank 511 can be replenished by the cleaning process of the drum in the barrel plating process. Particularly, when the plating liquid in the second plating vessel 511 is reduced in concentration due to evaporation or the like, for example, the replenishment of the plating liquid in the first recovery vessel 512 is advantageous in reducing the influence on the concentration of the plating liquid in the second plating vessel 511, and thus in keeping the concentration of the plating liquid stable, as compared with the replenishment of pure water or the plating liquid of the same concentration directly into the second plating vessel 511.

While an electroplating system according to another embodiment of the utility model has been described above in connection with fig. 5, it is to be understood that the above description is by way of example and not limitation, and that the second electroplating apparatus 510 may not be limited to include only the second electroplating tank 511, the first recovery tank 512, and the first water pump 513, but may include other devices in other embodiments. As will be described below in connection with fig. 6.

Fig. 6 shows a schematic view of a second electroplating apparatus according to an embodiment of the utility model. As shown in fig. 6, the second electroplating apparatus 510 may include a second electroplating tank 511, a first recovery tank 512, and a first water pump 513, and may further include a second recovery tank 601 and a second water pump 602, wherein the second water pump 602 is connected between the first recovery tank 512 and the second recovery tank 601, for transferring the liquid in the second recovery tank 601 into the first recovery tank 512.

In some embodiments, the second recovery tank 601 may be used to perform a second cleaning of the first cleaned drum, with the liquid recovered after the cleaning containing a lower concentration of plating solution components than in the first recovery tank 512. After the first cleaning and the second cleaning are sequentially performed on the drum, a gradient difference from large to small in concentration of the plating solution is formed among the second plating tank 511, the first recovery tank 512, and the second recovery tank 601. The second water pump 602 is a mechanism that delivers or pressurizes a liquid. In some embodiments, second water pump 602 may include, for example, a positive displacement pump, or a vane pump, or the like. In other embodiments, the second electroplating device 510 may further include a pure water pipe for connection with a pure water source and a pure water solenoid valve for controlling pure water in the pure water pipe to be transferred to the second recovery tank 601, which may be connected between the pure water pipe and the second recovery tank 601.

Compared to directly replenishing pure water into the second plating tank 511, the method of replenishing the second plating tank 511 step by utilizing the concentration gradient difference between the first recovery tank 512, the second recovery tank 601 and the second plating tank 511 according to the embodiment of the utility model is not only beneficial to reducing the influence degree of concentration fluctuation of the second plating tank 511 in the process of replenishing the second plating tank, but also fully utilizes water resources, namely, only the pure water is required to be replenished in the last stage recovery tank, but not the pure water is required to be replenished in each stage of recovery tank.

As further shown in fig. 6, the second electroplating apparatus 510 may further include: a second management tank 603, which may be in communication with the second plating tank 511. In some embodiments, the volume of the second management tank 603 may be less than the volume of the second plating tank 511. In other embodiments, the volume of the second management tank 603 may be, for example, 500L, or other dimensions. In still other embodiments, the second management tank 603 may be disposed at a position lower than the second plating tank 511. The implementation of the communication between the second management tank 603 and the second plating tank 511 may be the same as or similar to the communication between the first management tank and the first plating tank described above, and will not be repeated here. In other embodiments, insoluble anodes and cathodes may also be provided in the second management tank 603 for adjusting the concentration of the plating solution or for electrolyzing impurities in the plating solution.

In some embodiments, the second electroplating apparatus 510 may further include a level gauge 604, which may be disposed within the second management tank 603. In other embodiments, the level gauge 604 may comprise a float gauge or the like. In still other embodiments, one or more fluid level gauges 604 may be provided in the second management tank 603. In some application scenarios, when a plurality of liquid level gauges 604 are disposed in the second management tank 603, the plurality of liquid level gauges 604 may be fixed at different height positions in the second management tank 603 for respectively detecting different liquid level heights. In other embodiments, a level gauge may also be provided in first recovery tank 512 and/or second recovery tank 602.

As further shown in fig. 6, in still other embodiments, the second electroplating apparatus 510 may further comprise: at least two second temperature measuring devices (e.g., 606-1 and 606-2 in the drawing) which may be disposed in the second plating vessel 511 and the second management vessel 603, respectively; and a first heating device 605, which may be disposed within the second management tank 603. Since the plating solution can flow through the second plating vessel 511 and the second management vessel 603, if the plating solution temperatures in the second plating vessel 511 and the second management vessel 603 are not uniform, it is indicated that there may be a problem of a blocked communication line, etc., and therefore, the provision of a plurality of second temperature measuring devices can detect the temperature of the plating solution in the second plating vessel 511 and the second management vessel 603, respectively, and thus can be used to monitor and warn of a possible occurrence of a problem of a non-communication between the second management vessel 603 and the second plating vessel 511. In some embodiments, the second temperature measuring device may include a temperature sensor, a temperature probe, or the like.

In some embodiments, the first heating device 605 may include a heating coil or a heating resistor, and the heating coil may be heated by passing a heating medium such as hot water or hot oil through the heating coil, or may be heated by passing electricity through the heating resistor. The first heating device 605 may be provided for use in situations where it is desirable to heat up the plating solution.

In other embodiments, the second electroplating apparatus 510 may further include: at least one second fluid replacement device 607 and at least one second fluid replacement pump 608, the at least one second fluid replacement pump 608 may be in one-to-one correspondence with the at least one second fluid replacement device 607, and each second fluid replacement pump 608 may be connected between the second management tank 603 and the corresponding second fluid replacement device 607 for delivering the fluid replacement in the second fluid replacement device 607 to the second management tank 603. In some embodiments, the second fluid replacement device 607 may include a fluid reservoir and/or a buffer reservoir, or the like.

The liquid to be replenished or added according to the plating reaction in the second plating vessel 511 may be stored in the second replenishing device 607 in advance so as to be replenished into the second management tank 603 during the plating process. Depending on the type of fluid that is desired to be replenished, one or more second replenishing devices 607 may be provided. In some application scenarios, assuming that separate replenishment of additives and pH adjusters is required, at least two second fluid replacement devices 607 may be provided to provide the additives and pH adjusters, respectively.

While the second electroplating apparatus according to the embodiment of the present utility model has been described in detail above with reference to fig. 6, it will be understood by those skilled in the art that the above description is exemplary and not limiting, and that the number of recovery tanks may be not limited to two in the drawings, but may be more or less according to actual process requirements. It can be further understood that by means of the step-by-step automatic fluid infusion, concentration fluctuation of the plating solution in the second plating tank of the second plating device due to water evaporation and the like can be effectively reduced, so that effective control over the concentration fluctuation range of the plating solution in the second plating tank is facilitated.

Fig. 7 shows a schematic view of an electroplating system according to yet another embodiment of the utility model. As shown in fig. 7, the plating system 100 may include a first plating device 110, a second plating device 510, and a third plating device 710. In some application scenarios, the first electroplating device 110, the second electroplating device 510, and the third electroplating device 710 may be used to form three layers of electroplated layers on the same workpiece to be electroplated, and the electroplating solutions of the first electroplating device 110, the second electroplating device 510, and the third electroplating device 710 may include the same or different components and may be used for electroplating treatments of the same or different electroplated metals.

For example, in some application scenarios, the first electroplating device 110 may be used to perform, for example, a bottom copper layer electroplating process on a workpiece to be electroplated, the second electroplating device 510 may be used to perform, for example, a thick copper layer electroplating process on a workpiece to be electroplated that includes a bottom copper layer, and the third electroplating device 710 may be used to perform, for example, a nickel-phosphorus electroplating process on a workpiece to be electroplated that includes a bottom copper layer and a thick copper layer. In other applications, the first electroplating device 110 may be used to perform a first copper plating process on the neodymium-iron-boron magnet matrix to form a first copper plated magnet; the second electroplating device 510 may be used to perform a second copper plating process on the first copper-plated magnet to form a second copper-plated magnet; the third electroplating apparatus 710 may be used to electroplate nickel phosphorous on the second copper plated magnet to form a neodymium iron boron magnet product comprising a multi-layer electroplated layer.

The first electroplating device 110 and the second electroplating device 510 have been described in detail in connection with the drawings, and will not be described again. An exemplary description of the third electroplating apparatus 710 will be provided below.

As shown in fig. 7, the third electroplating apparatus 710 may include: the third plating tank 711, the third management tank 712, at least one third fluid replacement device 713, and at least one third fluid replacement pump 714, wherein the third management tank 712 is in communication with the third plating tank 711, the at least one third fluid replacement pump 714 may be in one-to-one correspondence with the at least one third fluid replacement device 713, and each third fluid replacement pump 714 is connected between the third management tank 712 and the corresponding third fluid replacement device 713 for delivering the fluid replacement in the third fluid replacement device 713 to the third management tank 712.

In other embodiments, the volume of the third plating bath 711 may be set to, for example, 3000L, or other dimensions. In some embodiments, the third plating tank 711 may have a cylindrical structure or a box structure, and the open end of the third plating tank 711 may be provided with a filter, which may be used to filter the air entering the third plating tank 711 to remove impurities in the air entering the third plating tank 711. In some embodiments, a soluble anode may also be provided in the third plating bath 711 for providing the metal cations required for plating. In still other embodiments, the third plating vessel 711 may include a plurality of plating cells, and the structure thereof may be the same as or similar to the structure of the first plating vessel 111 described above in connection with fig. 3, and will not be described again.

In some embodiments, the volume of the third management tank 712 may be less than the volume of the third plating tank 711. In other embodiments, the volume of the third management trough 712 may be, for example, 500L, or other dimensions. In still other embodiments, the third management tank 712 may be disposed at a position lower than the third plating tank 711. The implementation of the communication between the third management tank 712 and the third plating tank 711 may be the same as or similar to the communication between the first management tank and the first plating tank described above, and will not be repeated here. In other embodiments, insoluble anodes and cathodes may also be provided in the third management tank 712 for adjusting the concentration of the plating solution or for electrolyzing impurities in the plating solution.

In some embodiments, the third fluid replacement device 713 may include a fluid reservoir and/or a surge tank, or the like. The liquid to be replenished or added according to the plating reaction in the third plating vessel 711 may be stored in the third liquid replenishing device 713 in advance so as to be replenished into the third management vessel 712 during the plating process. Depending on the type of fluid to be replenished, one or more third fluid replacement devices 713 may be provided. In some application scenarios, assuming that separate replenishment of additives and pH adjusters is required, at least two third fluid replacement devices 713 may be provided to provide the additives and pH adjusters, respectively.

While an electroplating system according to yet another embodiment of the utility model has been described above in connection with fig. 7, it is to be understood that the above description is by way of example and not limitation, and that the third electroplating apparatus 710 may not be limited to include only the third electroplating bath 711, the third management bath 712, the third fluid replacement apparatus 713, and the third fluid replacement pump 714, but may include other devices in other embodiments. As will be described below in connection with fig. 8.

Fig. 8 shows a schematic view of a third electroplating apparatus according to an embodiment of the utility model. As shown in fig. 8, the third plating apparatus 710 may include a third plating tank 711, a third management tank 712, a third fluid replacement apparatus 713, a third fluid replacement pump 714, and a second ion analysis apparatus 801, and the second ion analysis apparatus 801 may be connected to the third management tank 712 and configured to monitor the concentration of plating metal ions of the plating fluid in the third management tank 712.

In some embodiments, the second ion analysis device 801 may be an in-line ion analysis device. In some embodiments, the second ion analysis device 801 may include a titration analysis device or the like. In other embodiments, the second ion analysis device 801 may be a nickel ion analysis device that may be used to detect the nickel ion concentration of the plating solution in the third management tank 712. In other embodiments, the nickel ion analyzer may continuously determine the nickel ion concentration in the plating solution using spectrophotometry. In other embodiments, the second ion analyzer 801 is connected to the third management tank 712, and a sampling tube of the second ion analyzer 801 may be connected to the third management tank 712.

In some application scenarios, the third fluid replacement device 713 may contain a nickel sulfate solution, and when the nickel ion concentration monitored by the nickel ion analysis device is lower than a certain preset threshold, the nickel sulfate solution in the third fluid replacement device 713 may be delivered to the third management tank 712 by the third fluid replacement pump 714. According to such a configuration, the nickel ion concentration of the plating liquid in the third management tank 712 can be made to fluctuate within a small range, thereby ensuring substantial stability of the nickel ion concentration. This application scenario is exemplary, and when the third fluid replacement device 713 contains a plating metal ion solution, the third fluid replacement device may be used in combination with the second ion analysis device 801 to stabilize the plating metal ion concentration in the plating solution.

As further shown in fig. 8, in still other embodiments, the third electroplating apparatus 710 may further comprise: at least two third temperature measuring devices (e.g., 802-1 and 802-2 in the figures) may be disposed within the third plating vessel 711 and within the third management vessel 712, respectively. In some embodiments, the third temperature measuring device may include a temperature sensor, a temperature probe, or the like.

Since the plating liquid can flow through the third plating vessel 711 and the third management vessel 712, if the plating liquid temperatures in the third plating vessel 711 and the third management vessel 712 are not uniform, it is indicated that there may be a problem of clogging of the communication line, etc., and therefore, the provision of a plurality of third temperature measuring devices can detect the temperature of the plating liquid in the third plating vessel 711 and the third management vessel 712, respectively, and thus can be used to monitor and warn of a problem of non-communication between the third management vessel 712 and the third plating vessel 711 that may occur.

Optionally, in some embodiments, the third electroplating device 710 may further include a second heating device 803, which may be disposed within the third management trough 712. In some embodiments, the second heating device 803 may include a heating coil or a heating resistor, and a heating medium such as hot water or hot oil may be passed through the heating coil to achieve the purpose of heating, or the heating resistor may be energized to achieve the purpose of heating. The provision of the second heating means 803 may be used in a scenario where a temperature increase of the plating liquid is required.

While the electroplating system according to the embodiment of the utility model has been described in detail with reference to the drawings, it will be appreciated that the electroplating system according to the embodiment of the utility model may have the function of stabilizing the concentration of metal ions to be electroplated by providing the second electrolytic circuit, etc., so as to facilitate the production of electroplated magnet products with uniform plating thickness and small thickness tolerance.

In some embodiments, the ion concentration in the electroplating solution can be kept stable from the angle of keeping the liquid level height of the electroplating solution by the way of filling the liquid in the electroplating solution tank with the recycling tank, and the method is suitable for the requirements of producing products with uniform plating thickness in the scenes of electroplating solution loss or water evaporation and the like in the electroplating process.

While various embodiments of the present utility model have been shown and described herein, it will be obvious to those skilled in the art that such embodiments are provided by way of example only. Numerous modifications, changes, and substitutions will occur to those skilled in the art without departing from the spirit and scope of the utility model. It should be understood that various alternatives to the embodiments of the utility model described herein may be employed in practicing the utility model. The appended claims are intended to define the scope of the utility model and are therefore to cover all equivalents or alternatives falling within the scope of these claims.

Claims (16)

1. An electroplating system comprising a first electroplating device, the first electroplating device comprising:

a first plating bath;

A soluble anode which is arranged in the first electroplating bath and forms a first electrolytic loop with a workpiece to be electroplated which is arranged in the first electroplating bath;

A first management tank in communication with the first plating tank;

A first insoluble anode disposed within the first management tank; and

And the first cathode is arranged in the first management groove so as to form a second electrolytic loop with the first insoluble anode.

2. The plating system as recited in claim 1, wherein said first plating device further comprises:

And the second insoluble anode is attached to the soluble anode or is independently arranged in the first electroplating bath.

3. The plating system as recited in claim 1 or 2, wherein said first plating tank has a plating solution outlet, said first plating device further comprising:

a downpipe connected between the plating solution outlet of the first plating tank and the first management tank, and the first management tank is disposed at a position lower than the first plating tank;

And the circulating pump is connected to a return pipeline between the first management tank and the first electroplating tank and is used for conveying the electroplating solution in the first management tank to the first electroplating tank.

4. The electroplating system of claim 3, wherein the electroplating system comprises a plurality of electroplating cells,

The first electroplating tank comprises a plurality of electroplating units and an overflow tank arranged among the plurality of electroplating units, and the overflow tank is communicated with the plating solution outlet; each electroplating unit is provided with an overflow port, and the overflow ports of the plurality of electroplating units are communicated with the overflow groove.

5. The plating system as recited in claim 1, 2 or 4, wherein said first plating device further comprises:

And the first ion analysis device is connected with the first management tank and is used for detecting the concentration of electroplating metal ions of the electroplating liquid in the first management tank.

6. The plating system as recited in claim 1, 2 or 4, wherein said first plating device further comprises:

At least two first temperature measuring devices respectively arranged in the first electroplating tank and the first management tank; and

And the cooling device is arranged in the first management groove.

7. The plating system of claim 6, wherein the cooling device comprises a cooling coil.

8. The plating system as recited in claim 1 or 2, wherein said first plating device further comprises:

At least one first fluid replacement device;

At least one first fluid infusion pump is in one-to-one correspondence with the at least one first fluid infusion device, and each first fluid infusion pump is connected between the first management tank and the corresponding first fluid infusion device.

9. The plating system of claim 1 or 2, further comprising a second plating device, the second plating device comprising:

a second plating bath;

a first recovery tank;

And the first water pump is connected between the first recovery tank and the second electroplating tank and is used for conveying the liquid in the first recovery tank to the second electroplating tank.

10. The plating system as recited in claim 9, wherein said second plating device further comprises:

a second recovery tank;

And the second water pump is connected between the first recovery tank and the second recovery tank and is used for conveying the liquid in the second recovery tank to the first recovery tank.

11. The plating system as recited in claim 9 or 10, wherein said second plating device further comprises:

A second management tank in communication with the second plating tank;

At least one second fluid replacement device;

At least one second fluid infusion pump in one-to-one correspondence with the at least one second fluid infusion device, and each second fluid infusion pump is connected between the second management tank and the corresponding second fluid infusion device.

12. The plating system as recited in claim 11, wherein said second plating device further comprises:

and the liquid level meter is arranged in the second management groove.

13. The plating system as recited in claim 11, wherein said second plating device further comprises:

At least two second temperature measuring devices respectively arranged in the second electroplating tank and the second management tank; and

The first heating device is arranged in the second management groove.

14. The plating system as recited in claim 1 or 2, wherein said plating system further comprises a third plating device, said third plating device comprising:

a third plating bath;

a third management tank in communication with the third plating tank;

at least one third fluid replacement device; and

At least one third fluid infusion pump in one-to-one correspondence with the at least one third fluid infusion device, and each third fluid infusion pump is connected between the third management tank and the respective third fluid infusion device.

15. The plating system as recited in claim 14, wherein said third plating device further comprises:

And the second ion analysis device is connected with the third management tank and is used for monitoring the concentration of the electroplating metal ions of the electroplating liquid in the third management tank.

16. The plating system as recited in claim 14, wherein said third plating device further comprises:

At least two third temperature measuring devices respectively arranged in the third electroplating tank and the third management tank; and

And the second heating device is arranged in the third management groove.