CN220934021U

CN220934021U - Detection device and semiconductor process equipment

Info

Publication number: CN220934021U
Application number: CN202322378855.5U
Authority: CN
Inventors: 王明伟
Original assignee: Beijing Naura Microelectronics Equipment Co Ltd
Current assignee: Beijing Naura Microelectronics Equipment Co Ltd
Priority date: 2023-09-01
Filing date: 2023-09-01
Publication date: 2024-05-10
Anticipated expiration: 2033-09-01

Abstract

The utility model provides a detection device and semiconductor process equipment, relates to the technical field of semiconductor processing, and aims to solve the problem of large vibration amplitude of the detection device during operation. The detection device comprises a first mounting piece, a second mounting piece and a driving mechanism for driving the first mounting piece and the second mounting piece to rotate relatively, and the second mounting piece is provided with a first sensor; the driving mechanism comprises a driving piece and a guiding assembly, and the guiding assembly comprises a first guiding part and a first guiding piece; when the first guide piece moves along the first guide part, the second installation piece can drive the first sensor to move in or out of the wafer box, and the first sensor can detect abnormal information of the wafer when moving in the wafer box; the guide component is connected with the power output end of the driving piece in a transmission way. The detection device provided by the utility model can reduce vibration when the detection device operates.

Description

Detection device and semiconductor process equipment

Technical Field

The utility model relates to the technical field of semiconductor processing, in particular to a detection device and semiconductor process equipment.

Background

Wafer fabrication generally includes processes such as wafer processing, oxidation, photolithography, etching, deposition, interconnection, testing, packaging, etc., and during some of these processes, the equipment front end module (Equipment Front End Module, EFEM) cooperates with the process chamber to perform wafer processing. Wafers are stored, positioned, handled, and process protected by front opening standard wafer cassettes (Foup), and the interface between the wafer cassette and the semiconductor front end equipment Module is accomplished by Load Port modules (Load Port modules). The loading port is used for positioning, identifying, unlocking and detecting the wafer conveying box, and the wafer conveying box is grabbed by an internal manipulator of a front end module of semiconductor process equipment and is transmitted to the process chamber for processing.

The Load Port Module (Load Port Module) is capable of interfacing with front opening standard wafer cassettes and loading actions. At present, a 12-inch front opening standard wafer box is mainly used, and 25 wafers with the thickness of 300mm can be fully loaded. The overhead travelling crane (Overhead Hoist Transfer, OHT) places the front opening standard wafer cassette on the load port module, and performs positioning, state detection, locking, loading, unlocking and scanning detection on the load port module. The scanning detection of the wafer is a step (abbreviated as Mapping) in the execution of the action of the loading port, the purpose of the scanning detection of the detection device is to detect 25 wafers in the front opening standard wafer box layer by layer, and if phenomena such as heavy wafers, empty wafers, inclined wafers and cross grooves occur in the detection process, abnormal information is fed back. Specifically, in the detection process, the detection device needs to move up and down along with the lifting door, and the sensor extends into the front-opening standard wafer box and is parallel to the wafer to detect the phenomena of wafer heavy wafer, inclined wafer, straddling groove and the like. When the detecting device is operated and drives the optical fiber sensor for detecting the wafer to move, the detecting device can generate vibration. In the wafer detection process, the detection device is required to keep stable operation, so that adverse effects on the machine due to vibration are avoided.

Disclosure of utility model

The first object of the present utility model is to provide a detecting device, which solves the technical problem of large vibration amplitude when the existing detecting device is operated.

The detection device provided by the utility model comprises: the device comprises a first mounting piece, a second mounting piece and a driving mechanism for driving the first mounting piece and the second mounting piece to rotate relatively, wherein the second mounting piece is provided with a first sensor; the driving mechanism comprises a driving piece and a guiding assembly, wherein the guiding assembly comprises a first guiding part and a first guiding piece capable of relatively moving along the first guiding part; the first guide part is configured such that when the first guide part moves along the first guide part, the second mounting part can drive the first sensor to move in or out of a wafer box containing a wafer, and when the first sensor moves in the wafer box, the first sensor can detect abnormal information of the wafer; the guide component is in transmission connection with the power output end of the driving piece and is arranged on one of the first mounting piece and the second mounting piece, and the driving piece is connected with the other one of the first mounting piece and the second mounting piece.

In a preferred technical scheme, the first guide part is arranged on the second guide part, the driving part is arranged at the lower end of the first installation part, and the second guide part is arranged at the lower end of the second installation part.

In a preferred embodiment, the first mounting member includes:

the driving piece is arranged at the lower part of the connecting arm part.

In a preferred technical scheme, the driving piece is a linear driving piece, and the second guiding piece is arranged at the power output end of the driving piece.

In a preferred technical solution, the extending direction of the driving member is downward, and the first guiding member is located below the driving member.

In the preferred technical scheme, the driving piece is a guide rod cylinder.

In the preferred technical scheme, a magnetic position sensor is arranged on the guide rod cylinder.

In the preferred technical scheme, the guide rod cylinder is connected with a speed regulating valve.

In a preferred embodiment, the second guide further has a second guide portion, which is disposed opposite to the first guide portion.

In a preferred technical scheme, the first guide piece comprises a guide wheel capable of being in rolling connection with the first guide part and a guide shaft rotatably provided with the guide wheel, and the guide shaft is in transmission connection with the driving piece.

In a preferred embodiment, the first guide portion is configured such that, when the first guide member moves along the first guide portion, the moving speed of the first sensor gradually increases and then gradually decreases.

In a preferred technical scheme, the first guiding part comprises a speed changing section, and the included angle between the power output direction of the driving part and the speed changing section is gradually increased and then gradually decreased along the direction of the relative movement of the first guiding part and the first guiding part.

In the preferred technical scheme, the first guiding part further comprises a limiting section, the limiting section is located at the end part of the speed changing section, and the power output direction of the driving piece is parallel to the speed changing section along the direction of relative movement of the first guiding piece and the first guiding part.

In a preferred technical scheme, the second mounting piece is sleeved on the first mounting piece, and comprises a side supporting part and a top supporting part fixedly connected with the side supporting part; the first sensor is fixedly mounted to the top support.

In a preferred technical scheme, the detection device further comprises an elastic piece, wherein the elastic piece is connected between the first installation piece and the second installation piece, and the elastic piece is used for enabling the first guide piece to abut against the first guide part.

In an preferable technical scheme, the first mounting piece is pivoted with the second mounting piece, and the driving mechanism and the first sensor are respectively positioned on two opposite sides of the pivoted position of the first mounting piece and the second mounting piece.

The second object of the present utility model is to provide a semiconductor processing apparatus, which solves the technical problem of large vibration amplitude when the detecting device is operated.

The utility model provides semiconductor process equipment, which comprises a loading port module, wherein the loading port module comprises a moving platform and any detection device, the moving platform is used for bearing a wafer box and driving the wafer box to move to a detection position, and the detection device is used for detecting wafers in the wafer box at the detection position.

The utility model has the beneficial effects that:

through the motion of first guide piece along first guide part to with the motion conversion of driving piece into the motion of second installed part, can realize the stable transmission of motion, also can not take place reciprocating rocking in the second installed part motion process, thereby reduced whole detection device's vibrations range.

By providing the above-mentioned detection device in the semiconductor process equipment, accordingly, the semiconductor process equipment has all the advantages of the above-mentioned detection device, and will not be described in detail herein.

Drawings

In order to more clearly illustrate the technical solutions of embodiments or background art of the present utility model, the drawings that are needed in the description of the embodiments or background art will be briefly described below, and it is apparent that the drawings in the following description are only embodiments of the present utility model, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.

FIG. 1a is a schematic diagram of a related art first sensor when no wafer is detected; FIG. 1b is a schematic diagram of a first sensor detecting a wafer according to a related art;

FIG. 2 is a schematic structural diagram of a related art first detection device;

FIG. 3 is a schematic view of a door panel of the first related art inspection device from another direction;

FIG. 4a is a schematic diagram of a detecting device according to the first related art when the rotation shaft does not drive the swing arm to rotate; FIG. 4b is a schematic diagram of a rotation shaft driving a sensor to detect a wafer through a swing arm in a detection device of the first related art; FIG. 4c is a schematic diagram showing the comparison of the states shown in FIG. 4a and FIG. 4 b;

FIG. 5 is a schematic structural diagram of a second related art detecting device;

fig. 6 is a schematic perspective view of a detection device according to a first embodiment of the present utility model;

Fig. 7 is a schematic structural diagram of a detection device according to a first embodiment of the present utility model;

FIG. 8 is a schematic diagram of a detection device according to an embodiment of the present utility model from another perspective;

FIG. 9 is a schematic view of the detection device of FIG. 7 with the unlocking assembly and suction cup assembly omitted;

Fig. 10 is a schematic perspective view of a driving mechanism in a detection device according to a first embodiment of the present utility model;

FIG. 11 is a side view of a driving mechanism in a detecting device according to a first embodiment of the present utility model;

Fig. 12 is a schematic perspective view of a first guide member and a second guide member of a detection device according to a first embodiment of the present utility model;

FIG. 13 is a schematic view of a first guide member and a second guide member of a detection device according to a first embodiment of the present utility model;

Fig. 14 is a schematic structural diagram of a driving member in a detection device according to a first embodiment of the present utility model;

FIG. 15 is a schematic view illustrating a portion of a pivot joint between a first mounting member and a second mounting member in a detecting apparatus according to a first embodiment of the present utility model;

Fig. 16 is a schematic perspective view of another implementation manner of the first guiding portion in the detection device according to the first embodiment of the present utility model;

Fig. 17 is a schematic perspective view of a load port module in a semiconductor processing apparatus according to a second embodiment of the present utility model;

Fig. 18 is a schematic perspective view of a load port module in a semiconductor processing apparatus according to a second embodiment of the present utility model, with the rear shield omitted from another perspective;

Fig. 19 is a perspective exploded view of a lifting mechanism and a detecting device of a load port module in a semiconductor processing apparatus according to a second embodiment of the present utility model.

Reference numerals illustrate:

101-a rotating shaft; 102-limiting blocks; 103-a limiting arm; 104-a motor; 105-a driving wheel; 106, a synchronous belt; 107-driven wheel; 108-fixing base; 109-adjusting the connection block; 110-a door panel; 111-swing arms; 112-sensor holder; 113-a first sensor; 114-cylinder bracket; 115-cylinder; 116-drive links; 150-a suction cup assembly; 160-unlocking the assembly; 161-lock core; 163-connecting rod; 199-wafer;

210-a second guide; 211-a first guide; 213-a second guide; 220-a driver; 230-a first mount; 231-a body portion; 233-a connection arm; 235-cylinder fixing plate; 240-a second mount; 241-side support; 243-a top support; 250-first guide; 251-guiding shaft; 253—a guide wheel; 261-first rolling bearing; 263-pin joint shaft; 265-circlips for shafts; 267-fastening screws; 270-an elastic member; 280-a second sensor;

310-a mobile platform; 311-locating pins; 313-a compression sensor; 320-front shield; 321-a display screen; 323-oblique state sensor; 330-a rear shield; 340-a lower shield; 350-process bit plate; 360-lifting mechanism.

Detailed Description

Related art one:

When the detection device of the load port module performs the action, after the unlocking action of the wafer box is completed, the motor 104 is mainly used for driving the swing arm 111 to move forwards by a certain angle, and the swing arm 111 stretches the sensor into the wafer box FOUP for detection. As shown in fig. 1a, the first sensor 113 emits light at one end and receives light at one end. As shown in fig. 1b, the thickness of the wafer during the inspection process will block the light, the light received by the receiving end is instantaneously reduced, and the information of the wafer 199 is determined by displaying the numerical value. The subsequent load port actions are performed by analyzing the wafer 199 anomaly information, the entire inspection process is referred to as a scanning inspection (also known as a mapping inspection), and the entire inspection mechanism is required to be completed in cooperation with a lift gate that moves up and down to scan each wafer 199 within the cassette.

FIG. 2 is a schematic structural diagram of a related art first detection device; as shown in fig. 2, in this solution, the device mainly includes a rotating shaft 101, a limiting block 102, a limiting arm 103, a motor 104, a driving wheel 105, a synchronous belt 106, a driven wheel 107, a fixing seat 108, an adjusting connection plate 109, a door panel 110, a swing arm 111, a sensor bracket 112 and a first sensor 113. The rotating shaft 101 is rotatably supported on the fixed seat 108, the motor 104 is mounted on the fixed seat 108, the driving wheel 105 is mounted on an output shaft of the motor 104, and the driving wheel 105 is in transmission connection with the driven wheel 107 through the synchronous belt 106 to form synchronous belt transmission. The driven wheel 107 is fixedly connected to the rotating shaft 101, and the driven wheel 107 can transmit power to the rotating shaft 101. The rotating shaft 101 is fixedly connected with the swing arm 111, a sensor bracket 112 is mounted at the free end of the swing arm 111, and a first sensor 113 is mounted on the sensor bracket 112. When the rotation shaft 101 drives the swing arm 111 to swing, the first sensor 113 may extend into the wafer cassette to detect each wafer 199. In addition, the door panel 110 is detachably connected with the fixing seat 108 through the adjusting connection block 109, and the relative position relationship between the door panel 110 and the fixing seat 108 can be changed by changing the adjusting connection block 109 with different sizes, so as to adjust different swinging angles of the swinging arm 111.

FIG. 3 is a schematic view of a door panel of the first related art inspection device from another direction; after the load port module is positioned, identified, locked, and loaded, the front cover of the cassette contacts the door panel 110. As shown in fig. 3, since the door panel 110 is provided with the unlocking assembly and the chuck assembly 150, the chuck assembly 150 can suck the front cover of the wafer cassette, and plays a role in sucking and positioning the front cover of the wafer cassette. At this time, the unlocking assembly 160 on the door panel 110 unlocks the front cover of the wafer cassette, and the door panel 110 moves downward a small distance to leave the upper edge of the wafer cassette. At this time, the motor 104 generates a rotation moment, the driving wheel 105 synchronously rotates, and the rotation moment is transmitted to the driven wheel 107 through the synchronous belt 106, the driven wheel 107 drives the rotating shaft 101 to rotate, and since the swing arm 111 is fixedly connected with the rotating shaft 101, the swing arm 111 can drive the sensor bracket 112 to rotate, and then drive the first sensor 113 to extend into the wafer box, the door panel 110 and the fixing seat 108 move downwards to drive the front cover and the first sensor 113 to move downwards, so that each wafer 199 in the wafer box is detected. Fig. 4a shows a state when the rotation shaft is not rotated, and the first sensor 113 does not extend into the wafer cassette. Fig. 4b shows the rotated position of the rotation shaft, where the first sensor 113 extends into the wafer cassette, so that the wafer 199 can be inspected. Fig. 4c is a combined control of the swing arm 111 in the start and end positions, the rotation of the swing arm 111 being seen more directly by the control.

In addition, in this scheme, the fixing seat 108 is further provided with a limiting block 102, the limiting block 102 is fixedly connected to the fixing seat 108, and the rotating shaft 101 is also fixedly connected with a limiting swing arm 111, so that the limiting arm 103 can swing along with the rotation of the rotating shaft 101. When the limiting arm 103 contacts with the limiting block 102, the maximum angle of rotation of the rotating shaft 101 is the maximum angle of swing of the swing arm 111. If the motor 104 is powered off and the first sensor 113 is inside the wafer box, the swing arm 111 will rotate clockwise as shown in fig. 4 under the action of the moment of gravity, and the limit swing arm 111 will abut against the limit block 102, so that the rotation angle of the rotating shaft 101 can be prevented from being too large, and damage to the equipment itself or the wafer 199 inside the wafer box caused by the swing arm 111 and the first sensor 113 can be avoided.

However, the related art has the following problems:

First, when motor 104 drive pivot 101 drives swing arm 111 swing, motor 104 is by the in-process that accelerates to stopping, hold-in range 106 and action wheel 105, driven round 107 have clearance or elastic deformation, can't realize continuous, smooth stable transmission for swing arm 111 is in the swing in-process, moreover, owing to have clearance and elastic deformation, transmission structure's locate performance is not good, probably reciprocal rocking after the swing arm 111 motion is ended, influences the vibrations value.

When the motor 104 fails, the mechanical limit can only limit the movement of the swing arm 111 at one movement limit position, and can not limit the movement of the swing arm 111 from two limit positions, namely, can only limit the maximum depth of the first sensor 113 penetrating into the wafer box, and can not prevent the movement in the other direction, so that the potential safety hazard is caused.

The swing of the swing arm 111 shares two movement limit positions of the first sensor 113 extending into the wafer box and moving out of the wafer box, although the driving of the motor 104 is seemingly simple, the motor is not easy to realize in practice, the installation space is narrow, and the motor 104 moves up and down in the process of lifting along with the fixing seat 108 and is easy to interfere with other parts.

When the motor 104 drives the swing arm 111 to move toward the wafer cassette, the door panel 110 is in front of the movement of the swing arm 111, and the angle of the movement of the swing arm 111 in this direction is affected by the door panel 110, so that the wafer is easily not inserted into the wafer cassette during the wafer inspection.

And related technology II:

This scheme is largely identical to the related art, and differs mainly in that:

In the first related art, the motor 104 is used to drive the swing arm 111 to move through belt transmission. FIG. 5 is a schematic structural diagram of a second related art detecting device; in the second related art, as shown in fig. 5, a cylinder bracket 114 is mounted on the fixing base 108, and a cylinder 115 is fixedly mounted on the cylinder bracket 114. The extension and contraction direction of the piston rod of the cylinder 115 is a horizontal direction and is perpendicular to the axis of the rotating shaft 101. When the piston rod of the cylinder 115 extends, the driving connecting rod 116 is driven to move, and the rotating shaft is driven to move. Thereby driving the first sensor 113 to extend into or move out of the cassette through the swing arm 111. In this embodiment, a stopper 102 is also provided, and the stopper 102 and the cylinder 115 are located on opposite sides of the drive link 116. When the piston rod of the air cylinder 115 pushes the driving connecting rod 116 to move, if the driving connecting rod 116 encounters the limiting block 102, the movement is described to the maximum displacement, so that the swing arm 111 is limited.

But this solution creates the following problems:

When the piston rod of the cylinder 115 stretches out, the rotating shaft rotates, at the moment, the driving connecting rod 116 needs to rotate, and the piston rod of the cylinder 115 moves linearly, so that the cylinder 115 is installed in a rotating mode, and the cylinder body of the cylinder 115 has small rotation; or the cylinder 115 is fixedly installed, but the outer end of the piston rod is pivoted with an intermediate connecting rod, and the intermediate connecting rod is pivoted with the driving connecting rod 116, so that the cylinder 115 capable of realizing the common linear output power can drive the rotating shaft 101 to rotate. But this installation is inconvenient.

When the piston rod of the cylinder 115 extends, the driving connecting rod 116 and the limiting block 102 directly generate metal-to-metal impact, and the sound is loud. And metal dust may be generated by the direct collision of metal and metal, and if the metal dust is attached to the wafer, wafer defects may be caused. Further, when the swing arm 111 swings, the swing also occurs.

Likewise, the solution has problems in the related art one due to the door panel 110.

In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.

Embodiment one:

Fig. 6 is a schematic perspective view of a detection device according to a first embodiment of the present utility model; fig. 7 is a schematic structural diagram of a detection device according to a first embodiment of the present utility model; FIG. 8 is a schematic diagram of a detection device according to an embodiment of the present utility model from another perspective; fig. 12 is a schematic perspective view of a first guide member and a second guide member of a detection device according to a first embodiment of the present utility model; as shown in fig. 6-8 and 12, a detection apparatus provided in a first embodiment of the present utility model is applied to a load port module of a semiconductor processing device, and includes: the first mounting member 230, the second mounting member 240 and a driving mechanism for driving the first and second mounting members to rotate relatively, and the second mounting member 240 is provided with the first sensor 113; the driving mechanism includes a driving member 220 and a guide assembly including a first guide portion 211 and a first guide member 250 capable of relative movement along the first guide portion 211; the first guide portion 211 is configured such that when the first guide 250 moves along the first guide portion 211, the second mounting member 240 can drive the first sensor 113 to move into or out of the wafer cassette accommodating the wafers, and when the first sensor 113 moves into the wafer cassette, the first sensor 113 can perform wafer abnormality information detection; the guide assembly is drivingly connected to the power output end of the driving member 220 and disposed on one of the first and second mounting members 230, 240, and the driving member is connected to the other of the first and second mounting members 230, 240.

The first guide 250 is disposed at the power output end of the driving member 220, one of the driving member 220 and the first guide portion 211 is disposed at the first mounting member 230, and the other is disposed at the second mounting member 240. Specifically, in the present embodiment, the driving member 220 is disposed on the first mounting member 230, and the first guiding portion 211 is disposed on the second mounting member 240. In another implementation, the driving member 220 may be disposed on the second mounting member 240, and the first guiding portion 211 may be disposed on the first mounting member 230.

The first mounting member 230 and the second mounting member 240 are not limited to be rod-shaped or columnar, and may be any member as long as a physical area where the rod-shaped member is located is covered. In this embodiment, the detection of abnormal information of the wafer refers to that the first sensor 113 extends into the wafer box, and detects whether the wafer in the wafer box has phenomena such as heavy wafer, empty wafer, inclined wafer, and cross-slot, and if the phenomena occur during the detection, the abnormal information is fed back.

And the first mounting member 230 is pivotally connected to the second mounting member 240, and is located at the middle lower portion of the first mounting member 230 and is also located at the middle lower portion of the second mounting member 240.

Specifically, in this embodiment, the first mounting member 230 may include a plate-shaped body 231, where the body 231 is provided with the chuck assembly 150 and the unlocking assembly 160, where the chuck assembly 150 may attract the front cover of the wafer box, and the chuck assembly 150 may perform unlocking, scanning, locking, and other operations after the chuck assembly 150 attracts the front cover of the wafer box. The sucking disc adsorbs can make the wafer box keep stable when above-mentioned operation, both plays the locate function, can not appear rocking and dislocation in the protecgulum of wafer box in the motion process again. Therefore, the position of the wafer box when in unlocking and the position of the wafer box when in locking are the same, and the locking operation is not abnormal.

The unlocking assembly 160 comprises a connecting rod 163 and two lock cylinders 161 which move synchronously, the lock cylinders 161 which move synchronously are inserted into the wafer box, and the driven lock cylinders 161 rotate synchronously, so that the wafer box can be unlocked. And the synchronous movement of the two lock cylinders 161 can be realized by the connecting rod 163, wherein the connecting rod 163 can comprise three sub-rods, the two sub-rods are parallel, the lower ends of the two sub-rods are connected with the lock cylinders 161, the connecting line of the two lock cylinders 161 and the three sub-rods form a parallelogram, and the synchronous rotation of the two lock cylinders 161 can be ensured by the parallelogram mechanism.

By moving the first guide 250 along the first guide 211, thereby converting the movement of the driving member 220 into the movement of the second mounting member 240, stable transmission of the movement can be achieved, and reciprocating shaking does not occur during the movement of the second mounting member 240, thereby reducing the vibration amplitude of the entire detecting device.

FIG. 9 is a schematic view of the detection device of FIG. 7 with the unlocking assembly and suction cup assembly omitted; as shown in fig. 6 to 9, it is preferable that the first guide 211 is provided to the second guide 210, the driving member 220 is mounted to the lower end of the first mounting member 230, and the second guide 210 is mounted to the lower end of the second mounting member 240.

By disposing the driving mounting member at the lower end of the first mounting member 230 and the second guide member 210 at the lower end of the second mounting member 240, the space of the lower portion of the first mounting member 230 can be fully utilized, and the volume occupied by the detecting device and the thickness of the detecting device can be reduced.

In another implementation, the driving member 220 may be mounted at the lower end of the second mounting member 240, and the second guide member 210 is mounted at the lower end of the first mounting member 230, similar to the effect of the solution in the above-described embodiment.

Alternatively, in another implementation manner, the first guiding portion 211 may be directly disposed at the bottom of the second mounting member 240, instead of the second guiding member 210, for example, a curved surface or a broken line surface on which the first guiding member 250 abuts may be machined at the bottom of the second mounting member 240.

Or in another implementation, the first guide 211 is disposed at the power output end of the driving member 220. For example, the first guide 211 may be provided on the second guide 210, and the second guide 210 is fixedly connected to the power output end of the first driving member 220. One of the driving member 220 and the first guiding member 250 is disposed on the first mounting member 230, and the other is disposed on the second mounting member 240, i.e. two cases are included: a. the driving member 220 is fixed to the lower end of the first mounting member 230, and the first guide member 250 is mounted to the lower end of the second mounting member 240; b. the driving member 220 is fixed to the lower end of the second mounting member 240, and the first guide member 250 is mounted to the lower end of the first mounting member 230.

As shown in fig. 6 to 9, the first mounting member 230 preferably includes a body portion 231 and a connection arm portion 233 fixedly coupled to a lower portion of the body portion 231, and the driving member 220 is mounted to a lower portion of the connection arm portion 233.

The first mounting member 230 includes a body 231 having a substantially vertical posture, and connection arm portions 233 disposed at both ends of the bottom of the body 231, and the driving member 220 is fixedly mounted at the bottom end of the connection arm portions 233. The second guide 210 is then generally rectangular block-shaped. In this embodiment, the second mounting member 240 surrounds the first mounting member 230 from multiple directions on the outer side of the first mounting member 230, so the first guiding portion 211 is located on the inner side surface of the second mounting member 240, that is, on the side of the second mounting member 240 facing the first mounting member 230, and the first guiding portion 211 may be a first guiding surface, where different positions of the first guiding surface have different angles with respect to the power output direction of the driving member 220.

By installing the driving member 220 through the connection arm portion 233, on the one hand, space at the lower portion of the first installation member 230 can be saved, installation of the first installation member 230 and other components is facilitated, and on the other hand, installation of the driving member 220 can be achieved with less material, and the weight of the first installation member 230 can be reduced. In addition, the weight distribution of the components on the first mounting member 230 can be more uniform, so that the problem that the second mounting member 240 can be driven to rotate only by overcoming a larger resistance moment due to excessive concentration of the weight is avoided, and the stability of movement is improved.

Fig. 10 is a schematic perspective view of a driving mechanism in a detection device according to a first embodiment of the present utility model; FIG. 11 is a side view of a driving mechanism in a detecting device according to a first embodiment of the present utility model;

Fig. 14 is a schematic structural diagram of a driving member in a detection device according to a first embodiment of the present utility model; as shown in fig. 10, 11 and 14, the driving member 220 is preferably a linear driving member.

Specifically, in this embodiment, the linear driving member may be an electric push rod or an air cylinder.

The linear driving member is used to drive the first guide member 250, so that the moment caused by vibration generated by the movement of the first guide member 250 during transmission of the rotary part can be reduced, and the stability of the first sensor 113 is improved.

Alternatively, or in addition, the driving member 220 may alternatively be a swing cylinder.

As shown in fig. 6 to 11, it is preferable that the extending direction of the driving member 220 is downward, and the first guide member 250 is positioned under the driving member 220.

It is known to those skilled in the art that when the driving member 220 is disposed at the lower end of the first mounting member 230, the pivot position of the first mounting member 230 and the second mounting member 240 cannot be disposed at the lower ends of the two because the first guide member 250 is disposed at the lower ends of the two, and when the first guide member 250 moves on the first guide surface, the first guide member 250 is changed in the horizontal position, which cannot cause the relative rotation of the first mounting member 230 and the second mounting member 240. Therefore, the pivot position of the first mounting member 230 and the second mounting member 240 should be higher than the driving mechanism.

The extension direction of the driving member 220 is set to extend downward so as to utilize the free space under the driving member 220, and at the same time, to facilitate the assembly and disassembly of the first guide member 250.

As shown in fig. 10, 11 and 14, the driving member 220 is preferably a guide rod cylinder.

Specifically, the bottom end of the connection arm 233 is fixedly connected with a cylinder fixing plate 235, and the cylinder fixing plate 235 is fixedly connected with a guide rod cylinder. The guide rod cylinder means that the cylinder is fixedly connected to a mounting plate at the free end of the piston rod in addition to the output through the piston rod, by means of which the first guide member 250 can be mounted. In addition, the parts driven by the guide rod cylinder do not need an additional guide mechanism for guiding, so that the structure of the driving mechanism is simplified.

Preferably, a magnetic position sensor (not shown) is provided on the guide cylinder.

Specifically, the magnetic position sensor may be disposed on a surface of the guide cylinder, and the guide cylinder may be selected from guide cylinders whose pistons are provided with magnets. When the piston of the guide rod cylinder moves to the position corresponding to the magnetic position sensor, the magnetic position sensor can detect the position of the piston and send a signal to the control system to control the corresponding pneumatic valve to change the state, so that the position of the first guide piece 250 is controlled. Moreover, the detection device of the embodiment is reliable in transmission, the magnetic position sensor detects that the piston of the guide rod cylinder moves to the corresponding position, namely, the first sensor 113 moves to the corresponding position, and the detection mode is simple and easy to implement.

Preferably, a speed valve (not shown) is connected to the pilot cylinder.

By providing a speed valve, the amount of air flow into or out of the guide rod cylinder can be regulated, so that the speed of extension and retraction of the guide rod air rod is within a suitable range, to improve the stability of the movement of the first sensor 113. Meanwhile, the speed of the first sensor 113 is ensured to be in a proper interval, so that the movement time of the first sensor 113 is controlled, and the detection efficiency is ensured.

FIG. 13 is a schematic view of a first guide member and a second guide member of a detection device according to a first embodiment of the present utility model; as shown in fig. 12 and 13, the second guide 210 preferably further has a second guide portion 213, and the second guide portion 213 is disposed opposite to the first guide portion 211.

Specifically, the second guide 213 may be a second guide surface disposed opposite to the first guide surface, and the first guide 250 runs in a guide groove therebetween. The notch of the guide groove faces the center position of the first mounting member 230.

By providing the second guide part 213, a guide groove can be formed with the first guide part 211, and the first guide part 250 can be limited from opposite sides of the first guide part 250, thereby improving the movement stability of the first guide part 250 and reducing the shake of the second mounting part 240 and the first sensor 113. Also, the accuracy of the inspection process can be improved by replacing the second guide 210 having the angle guide groove of a different size to increase or decrease the rotation angle of the second mount 240.

Fig. 16 is a schematic perspective view of another implementation manner of the first guiding portion in the detection device according to the first embodiment of the present utility model; as shown in fig. 16, in another implementation, the second guide 210 may not be provided with the second guide 213, for example, the second guide 210 may be a triangular guide block, a trapezoidal guide block, or a special-shaped guide block, and the inclined surfaces of the special-shaped guide block, the triangular guide block, and the trapezoidal guide block may be the first guide surface, and although the second guide 210 adopting such a shape has a lower guiding effect than the second guide 210 described later, it may also serve as a basic guiding function.

As shown in fig. 12 and 13, the first guide 250 preferably includes a guide wheel 253 capable of being rollably connected with the first guide portion 211, and a guide shaft 251 rotatably mounting the guide wheel 253, and the guide shaft 251 is drivingly connected with the driving member 220.

The guide shaft 251 may be fixedly connected to an output end of the guide rod cylinder, and a second rolling bearing (not shown) is penetrated through the guide shaft 251 to be fixedly connected to the guide wheel 253.

By providing the guide wheel 253 in rolling connection with the first guide portion 211, friction between the first guide member 250 and the first guide surface can be reduced, and the service life of the detecting device can be prolonged.

In other implementations, the guide member may not use a combination of the guide shaft 251 and the second rolling bearing and the guide wheel 253, may be a guide post in a cylindrical shape, or may be spherical or hemispherical, and may still perform a guide function although there is friction during movement.

As shown in fig. 12 and 13, it is preferable that the first guide 211 is configured such that the moving speed of the first sensor 113 is gradually increased and then gradually decreased as the first guide 250 moves along the first guide 211.

The first guide portion 211 is configured in such a manner that the movement of the first guide 250 is smoother, and rapid acceleration or deceleration is avoided, so that the detection device operates smoothly in the whole course.

As shown in fig. 12 and 13, preferably, the first guide portion 211 includes a gear shift section, and an included angle between a power output direction of the driving member 220 and the gear shift section is gradually increased and then gradually decreased in a direction in which the first guide member 250 and the first guide portion 211 move relatively.

In fig. 12, when the first guide member 250 runs from top to bottom, the first guide member 250 contacts the starting section first, then contacts the middle section, and finally contacts the ending section, that is, for the case that the first guide member 250 runs from top to bottom, the upper part of the speed change section is the starting section, the middle part is the middle section, and the lower part is the stopping section, wherein the starting section and the stopping section are both smooth transition curves. If the downward travel speed of the first guide 250 is uniform, the start segment may cause the horizontal speed of the second guide 210 relative to the first mount 230 to increase, the horizontal speed therebetween may be stable in the middle segment, and the relative horizontal speed therebetween may be reduced when the segment is ended. The speed change section is arranged in such a way, so that the motion process from slow speed to acceleration, uniform speed and deceleration can be realized, the scanning detection process can run more stably, the vibration value is smaller than 0.7G, and the scanning detection process is smooth and has no sharp peak value.

In other words, when the first guide 250 is operated from the bottom up, the lower part of the gear shift stage is the start stage, the middle part is the middle stage, and the upper part is the stop stage, and the acceleration and deceleration processes are also exactly opposite to the downward operation.

By providing the speed change section of the first guide portion 211 and the power output direction of the driving member 220 to be changed in this way, the horizontal speed of the second guide portion 213 with respect to the first mounting member 230 is gradually increased and then gradually decreased, so that the acceleration and deceleration process is slowed down and the stability of the movement is improved.

As shown in fig. 12 and 13, the first guide portion 211 preferably further includes a limit section at an end of the speed change section, and the power output direction of the driving member 220 is parallel to the speed change section along the direction in which the first guide member 250 moves relative to the first guide portion 211.

Specifically, in fig. 13, the limiting section, that is, the area of the first guide surface above and below the gear shift section, is vertically disposed when the piston rod of the guide rod cylinder is retracted, and the piston rod of the guide rod cylinder is vertically extended, so that the second mounting member 240 does not rotate relative to the first mounting member 230 when the first guide member 250 is operated in the limiting section. That is, when the second mounting member 240 moves into place after moving into and out of the sensor, as long as the guide cylinder does not malfunction, even if the guide cylinder leaks, the first guiding portion 211 and the second mounting member 240 are pivoted, and the first mounting member 230 and the second mounting member 240 can not rotate relatively due to the matching locking of the first mounting member 230 and the second mounting member 240, so that the sensor position can be ensured, and other parts or wafers 199 can not be accidentally damaged.

In addition, at the moment of starting and stopping the power output end of the driving member 220, the first guiding member 250 is located at the limiting section, and only the abrupt change of the speed of the first guiding member 250 along the limiting section does not occur, and the impact force of starting and stopping is not converted into obvious vibration of the second mounting member 240. Specifically, in fig. 13, if the first guide 250 is suddenly changed in the vertical direction in the illustrated position-restricting section, the speed is suddenly changed only in the vertical direction, and the speed is not changed to the speed suddenly changed in the horizontal direction of the second guide 210.

As shown in fig. 6 to 9, preferably, the second mounting member 240 is sleeved on the first mounting member 230, and the second mounting member 240 includes a side supporting portion 241 and a top supporting portion 243 fixedly connected to the side supporting portion 241; the first sensor 113 is fixedly mounted to the side support 243.

In this embodiment, there are two side supporting portions 241 disposed on two opposite side edges of the first mounting member 230, and the two side supporting portions 241 and the top supporting portion 243 together form a zig-zag structure. As seen in fig. 9, the second mounting member 240 in the shape of a letter "door" half surrounds the first mounting member 230, and two first sensors 113 are disposed on the top support 243, and the two first sensors 113 are arranged along the length direction of the top support 243.

By sleeving the second mounting member 240 on the first mounting member 230, the top support portion 243 and the side support portion 241 for mounting the first sensor 113 can not interfere with the first mounting member 230 during movement, so that a larger movement range can be provided to ensure that the first sensor 113 can extend into the wafer box to measure the wafer 199 inside the wafer box.

In other implementations, the second mount 240 may also be provided in an inverted L-shape, i.e. including only one side support 241, while the top support 243 is also a cantilever structure. Although a cantilever structure is adopted, the second mounting member 240 does not play a bearing role, but only drives the first sensor 113 to move, so that the rigidity can also meet the basic requirement.

As shown in fig. 7, preferably, the detecting device further includes an elastic member 270, the elastic member 270 being connected between the first mounting member 230 and the second mounting member 240, the elastic member 270 being configured to enable the first guide member 250 to abut the first guide portion 211.

One end of the elastic member 270 is connected to the first mounting member 230, and the other end is connected to the second mounting member 240, so that a tensile force exists between the first mounting member 230 and the second mounting member 240. The resilient member 270 in this embodiment may alternatively be a cylindrical helical extension spring. In another implementation, both ends of the cylindrical coil compression spring may be selectively abutted against the first mount 230 and the second mount 240, and more specifically, may be abutted against the side support portion 241 and the connection arm portion 233. Although the first guide portion 211 and the second guide portion 213 form a guide groove, a clearance is also caused between the guide groove and the guide member due to tolerance fit, and if the first guide member 250 includes the guide wheel 253 fitted with the second rolling bearing, and the first rolling bearing 261 between the second mounting member 240 and the second mounting member 240, a clearance is also caused, the provision of the elastic member 270 can significantly reduce or even eliminate the clearance, so that the first guide member 250 can be brought close to the first guide portion 211, thereby reducing vibration during movement.

As shown in fig. 6-9, the first mounting member 230 is preferably pivotally connected to the second mounting member 240, and the driving mechanism and the first sensor 113 are respectively located on opposite sides of the pivotal connection position of the first mounting member 230 and the second mounting member 240.

Specifically, the driving mechanism is located below the pivot position of the first mounting member 230 and the second mounting member 240, and the first sensor 113 is located above the pivot position.

The specific structure of the pivot connection between the first mounting member 230 and the second mounting member 240 may be:

As shown in fig. 15, the connection arm 233 of the first mounting member 230 is provided with step holes, each step hole is embedded with two adjacent first rolling bearings 261, the first rolling bearings 261 are sleeved on the pivot shaft 263, the pivot shaft 263 is provided with a pillow block abutting against the inner ring of the first rolling bearing 261, and the other side of the first rolling bearing 261 is provided with a shaft elastic check ring 265 arranged on the pivot shaft 263 for limiting. The other end of the pivot shaft 263 is fixed to the side support portion 241 of the second mounting member 240 by a fastening screw 267.

By disposing the driving mechanism and the first sensor 113 on opposite sides of the pivot position of the second mounting member 240 to the first mounting member 230, weight balance on both sides of the pivot position can be achieved.

The action principle of the embodiment is as follows:

when the second sensor on the body 231 detects that the wafer cassette is adjacent to the body 231, the chuck assembly 150 adsorbs the front cover of the wafer cassette, and the unlocking assembly 160 performs an unlocking action, so that the front cover of the wafer cassette can move relative to the wafer cassette.

A piston rod of a guide rod cylinder connected to the bottom end of the arm 233 as the driving member 220 is extended to drive the first guide member 250 to move substantially downward along the first guide portion 211. Since the guide groove of the second guide member 210 is S-shaped and is not in an absolute vertical direction, the first guide member 250 moves downward in the guide groove as a whole, and when the first guide member 250 moves to the speed change section, the first guide member 250 generates a horizontal thrust to the inclined portion of the speed change section, so as to push the second guide member 210 to generate a horizontal movement relative to the first mounting member 230, and the second guide member 210 drives the second mounting member 240 to rotate relative to the first mounting member 230, so that the first sensor 113 is fed into the wafer cassette. Thus, the first sensor 113 can detect the wafer 199 within the wafer cassette.

After the detection process is finished, the piston rod is retracted, and the first guide member 250 is driven to move generally upwards along the first guide portion 211. Similarly, movement of the first guide 250 within the guide slot causes horizontal movement of the second guide 210 relative to the first mount 230, which in turn causes rotation of the second mount 240 relative to the first mount 230, moving the first sensor 113 out of the cassette.

Embodiment two:

Fig. 17 is a schematic perspective view of a load port module in a semiconductor processing apparatus according to a second embodiment of the present utility model; fig. 18 is a schematic perspective view of a load port module in a semiconductor processing apparatus according to a second embodiment of the present utility model, with the rear shield omitted from another perspective; fig. 19 is a perspective exploded view of a lifting mechanism and a detecting device of a load port module in a semiconductor processing apparatus according to a second embodiment of the present utility model; as shown in fig. 17-19, the second embodiment further provides a semiconductor process apparatus, which includes a load port module, where the load port module includes a moving platform 310 and a detecting device in the first embodiment, the moving platform 310 is configured to carry a wafer cassette and drive the wafer cassette to move to a detection position, and the detecting device is configured to detect abnormal information of a wafer 199 in the wafer cassette located in the detection position.

The load port module further includes a process plate 350 and a lift mechanism 360, both the mobile platform 310 and the lift mechanism 360 being disposed on the process plate 350; the lifting mechanism 360 is connected to the detecting device and is used for driving the detecting device to lift.

In addition to the unlocking assembly 160 and the chuck assembly 150, the first mounting member 230 is further provided with a second sensor 280, and the second sensor 280 is configured to detect whether the wafer cassette approaches the body 231, and if the second sensor 280 detects that the wafer cassette approaches the body 231, the second sensor may detect the signal and transmit the signal to a control system (not shown in the figure) to perform the adsorption action of the chuck assembly 150 and the unlocking action of the unlocking assembly 160.

In addition, the load port module further includes a front shroud 320, a lower shroud 340, and a rear shroud 330. The upper portion of the front cover 320 is provided with a display screen 321. The moving platform 310 is disposed on the process plate 350, and the moving platform 310 is further provided with a positioning pin 311 and a pressing sensor 313 for detecting whether the wafer cassette is stably placed on the positioning pin 311. The lower shield 340 is disposed below the process plate 350, and the rear shield 330 is disposed at the rear side of the lower shield 340. In addition, an oblique state sensor 323 is provided on the front cover 320 to detect a placement state of the wafer cassette on the moving platform 310.

The action principle of the embodiment is as follows:

The wafer cassette is placed on the positioning pins 311 by the crown block, and the positioning pins 311 are inserted into the positioning holes of the wafer cassette. At this time, the pressing sensor 313 senses that the wafer cassette is stably placed on the positioning pins, and sends a correct placement signal; then, the oblique state sensor 323 detects whether the placement state of the wafer cassette is correct, and after the detection is correct, the wafer cassette is locked, and the wafer cassette is fixed on the moving platform 310 to prevent manual handling or misoperation.

The moving platform 310 carries the wafer cassette to move toward the detecting device, and when the second sensor 280 detects that the wafer cassette is close to the body 231, the operation of the first embodiment can be performed, which is not described in detail in this embodiment.

After detection, the manipulator side of the equipment front end module can operate.

When the process is completed, the robot of the front end module of the apparatus returns the processed wafer 199 to the inside of the wafer box, and the lifting mechanism 360 drives the detecting device to lift, locks the front cover of the wafer box with the wafer box body, and waits for the crown block to perform operations such as removing the wafer box.

Although the present utility model is disclosed above, the present utility model is not limited thereto. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the utility model, and the scope of the utility model should be assessed accordingly to that of the appended claims.

Finally, it is further noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

In the above embodiments, descriptions of orientations such as "up", "down", and the like are shown based on the drawings.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present utility model. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model.

Thus, the present utility model is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A detection apparatus, characterized by comprising: a first mounting piece (230), a second mounting piece (240) and a driving mechanism for driving the first mounting piece and the second mounting piece to rotate relatively, wherein the second mounting piece (240) is provided with a first sensor (113); the drive mechanism comprises a drive (220) and a guide assembly comprising a first guide (211) and a first guide (250) relatively movable along the first guide (211); the first guide part (211) is configured such that when the first guide part (250) moves along the first guide part (211), the second mounting part (240) can drive the first sensor (113) to move in or out of a wafer box containing a wafer, and when the first sensor (113) moves in the wafer box, wafer abnormality information detection can be performed; the guide assembly is drivingly connected to the power output end of the driving member (220).

2. The detection device according to claim 1, wherein the first guide portion (211) is disposed on a second guide member (210), the driving member (220) is mounted on a lower end of the first mounting member (230), and the second guide member (210) is mounted on a lower end of the second mounting member (240).

3. The detection device according to claim 2, wherein the first mount (230) comprises:

The driving device comprises a body part (231) and a connecting arm part (233) fixedly connected to the lower part of the body part (231), wherein the driving piece (220) is installed on the lower part of the connecting arm part (233).

4. The detection device according to claim 2, wherein the driving member (220) is a linear driving member.

5. The device according to claim 4, characterized in that the extension direction of the driving element (220) is downward, the first guiding element (250) being located below the driving element (220).

6. The device according to claim 5, wherein the driving member (220) is a guide rod cylinder.

7. The detection device according to any one of claims 2-6, characterized in that the second guide (210) further has a second guide portion (213), the second guide portion (213) being arranged opposite the first guide portion (211).

8. The detection device according to any one of claims 1-6, characterized in that the first guide member (250) comprises a guide wheel (253) capable of being in rolling connection with the first guide portion (211), and a guide shaft (251) rotatably mounting the guide wheel (253), the guide shaft (251) being in driving connection with the driving member (220).

9. The detection device according to any one of claims 1-6, wherein the first guide (211) is configured such that the movement speed of the first sensor (113) increases gradually and then decreases gradually as the first guide (250) moves along the first guide (211).

10. The detecting device according to claim 9, wherein the first guiding portion (211) includes a speed change section, and an angle between a power output direction of the driving member (220) and the speed change section is gradually increased and then gradually decreased along a direction in which the first guiding member (250) and the first guiding portion (211) move relatively.

11. The detecting device according to claim 10, wherein the first guide portion (211) further includes a limiting section located at an end of the speed change section, and the power output direction of the driving member (220) is parallel to the speed change section along a direction in which the first guide member (250) and the first guide portion (211) move relatively.

12. The detection device according to any one of claims 1-6, wherein the second mounting member (240) is sleeved on the first mounting member (230), the second mounting member (240) comprises a side support portion (241), and a top support portion (243) fixedly connected to the side support portion (241); the first sensor (113) is fixedly mounted to the top support (243).

13. The detection device according to any one of claims 1-6, further comprising an elastic member (270), the elastic member (270) being connected between the first mounting member (230) and the second mounting member (240), the elastic member (270) being adapted to cause the first guide member (250) to abut the first guide portion (211).

14. The device according to any one of claims 1-6, wherein the first mounting member (230) is pivotally connected to the second mounting member (240), and the driving mechanism and the first sensor (113) are located on opposite sides of the pivotal connection of the first mounting member (230) to the second mounting member (240), respectively.

15. A semiconductor processing apparatus, characterized in that the semiconductor processing apparatus comprises a load port module, the load port module comprising a moving platform (310) and a detection device according to any one of claims 1 to 14, the moving platform (310) being configured to carry a wafer cassette and drive the wafer cassette to move to a detection position, and the detection device being configured to detect abnormal information of a wafer (199) in the wafer cassette at the detection position.