CN217766703U - Wafer handling device, probe station and wafer detection automatic line - Google Patents
Wafer handling device, probe station and wafer detection automatic line Download PDFInfo
- Publication number
- CN217766703U CN217766703U CN202220696863.7U CN202220696863U CN217766703U CN 217766703 U CN217766703 U CN 217766703U CN 202220696863 U CN202220696863 U CN 202220696863U CN 217766703 U CN217766703 U CN 217766703U
- Authority
- CN
- China
- Prior art keywords
- wafer
- motor
- tray
- rotating rod
- handling device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a wafer handling device, probe platform and wafer detection transfer machine. The technical scheme of the utility model is that: a wafer handling device comprises a mounting part; the upper side adsorption part is connected to a first motor through a vertically arranged rotating rod, and the first motor drives the rotating rod to rotate, so that the upper side adsorption part rotates along the axis of the rotating rod; the first motor is fixed on the mounting part; the lower tray part is sleeved on the rotating rod through a rolling bearing and is connected with a second motor, and the second motor is fixed on the mounting part; the lower tray part is lower than the upper adsorption part in height. A probe station is provided with the wafer carrying device. A wafer detection automatic line is provided with the wafer carrying device. The upper side adsorption part and the lower side tray part can synchronously move to transfer the wafer, different use scenes of the transferred wafer are met, and the wafer transfer efficiency is improved.
Description
Technical Field
The utility model relates to a wafer handling device, probe station and wafer detect transfer machine.
Background
The existing wafer carrying device cannot meet the requirement for transferring wafers to various scenes, a spacer material box can only adopt a lower side tray part for taking and placing materials, and a lamination material box can only adopt an upper side adsorption part for taking materials; with the improvement of the wafer detection efficiency, how to quickly transfer the lamination magazine of the wafer placed in the spacer magazine is a link for continuing to promote.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model discloses a wafer handling device, probe station and wafer inspection transfer machine.
The technical scheme of the utility model is that: a wafer handling device comprises a base plate,
an installation part;
the upper side adsorption part is connected to a first motor through a vertically arranged rotating rod, and the first motor drives the rotating rod to rotate, so that the upper side adsorption part rotates along the axis of the rotating rod; the first motor is fixed on the mounting part;
the lower side tray part is sleeved on the rotating rod through a rolling bearing and is connected with a second motor, and the second motor is fixed on the mounting part;
the lower tray part is lower than the upper adsorption part in height.
Further, the mounting portion may include,
the first motor is fixed on the first mounting plate;
the second mounting plate is arranged above the first mounting plate, and the second motor is fixed on the second mounting plate;
a first connecting portion for connecting the first mounting plate and the second mounting plate.
Further, the upper side adsorption part is connected to the rotating rod through a cantilever part.
Further, the upper side adsorption part comprises,
the sucking disc is arranged vertically upwards in the sucking direction and can suck the wafer along the vertical direction;
the linear bearing is vertically arranged and connected with the sucking disc; the vertical height of the sucker is controlled;
and one end of the linear bearing, which is far away from the sucker, is connected to the rotating rod.
Further, the upper side adsorption part further comprises a vertically arranged linear cylinder, and the linear bearing is connected to the rotating rod through the linear cylinder.
Further, the lower tray part includes,
the second connecting part is sleeved on the rotating rod, and the second motor can drive the second connecting part to rotate around the rotating rod;
the telescopic guide rail is arranged on the second connecting part, and the tray is connected to the telescopic guide rail;
and the third motor is arranged on the second connecting part and connected to the tray, and the third motor can drive the tray to move along the telescopic guide rail.
Further, the lower tray part further comprises,
the third motor is connected to the transmission belt pulley assembly and can drive the transmission belt pulley assembly to move;
the tray is provided with a connecting block, and the connecting block is connected to a belt in the transmission belt pulley assembly.
Further, the tray includes, in combination,
the first extension arm, the first limit bulge and the second limit bulge are arranged on the upper side of the first extension arm;
the second extension arm, a third limiting bulge and a fourth limiting bulge are arranged on the upper side of the second extension arm;
the first extension arm is connected with the second extension arm, when the wafer is positioned on the tray, the first extension arm supports the wafer, and the wafer is positioned between the first limiting bulge and the second limiting bulge; the second extension arm supports the wafer, and the wafer is located between the third limiting bulge and the fourth limiting bulge.
A probe station is provided with the wafer carrying device.
A wafer detection automatic line is provided with the wafer carrying device.
The beneficial effects of the utility model reside in that: the upper side adsorption part and the lower side tray part can synchronously move to transfer the wafer, different use scenes of the transferred wafer are met, and the wafer transfer efficiency is improved.
Drawings
FIG. 1 is a schematic structural view of a wafer handling apparatus according to the present invention;
FIG. 2 is a schematic view of the upper side adsorption part of the present invention;
fig. 3 is a schematic view of the structure of the lower tray part of the present invention.
Detailed Description
In order to facilitate the understanding of the technical solutions of the present invention for those skilled in the art, the technical solutions of the present invention will be described in further detail with reference to specific embodiments.
As shown in fig. 1, a wafer handling apparatus 100 for handling/transferring wafers is provided, although those skilled in the art can directly refer to the technical solution of the present invention or simply change it, so as to be applied to a sheet-like thin material like a wafer, including,
a mounting portion 20 for mounting and fixing the wafer carrier apparatus 100 in a use environment, such as a probe station;
an upper suction part 30 for sucking the wafer from the upper side thereof to pick and place the wafer; the vertically arranged rotating rod 40 is connected to a first motor 51, and the first motor 51 drives the rotating rod 40 to rotate, so that the upper side adsorption part 30 rotates along the rotating rod axis 401; the first motor 51 is fixed to the mounting portion 20; thereby realizing that the upper adsorption part 30 rotates around the vertical axis, and leading the upper adsorption part 30 to reach wafers at different positions; the rotating rod 40 is not limited to be a cylindrical structure, and components capable of realizing the rotating function should belong to the equivalent technical solutions;
a lower tray part 60 which is sleeved on the rotating rod 40 through a rolling bearing, so that the lower tray part 60 can rotate around the rotating rod 40; the lower tray part 60 is connected with a second motor 52, and the second motor 52 is fixed on the mounting part 20; the second motor 52 controls the lower tray part 60 to rotate around the rotating rod 40;
the lower tray part 60 is lower than the upper adsorption part 30 in height, and since the lower tray part 60 is controlled by the second motor 52 to rotate around the rotating rod 40, and the upper adsorption part 30 is controlled by the first motor 51 to rotate around the rotating rod 40, the lower tray part 60 is lower than the upper adsorption part 30 in height, so that the lower tray part 60 and the upper adsorption part 30 can be prevented from interfering; the upper suction portion 30 picks and places the wafer from above the wafer, and the lower tray portion 60 picks up the wafer from below the wafer to pick and place the wafer, which is beneficial to transferring the wafers at different heights.
With the above-described configuration, the wafer transfer apparatus 100 can switch between different wafer transfer modes, and can transfer wafers by controlling the rotation of the upper suction unit 30 by the first motor 51 and the rotation of the lower tray unit 60 by the second motor 52, so that the upper suction unit 30 and the lower tray unit 60 can move synchronously.
As shown in fig. 1, the mounting portion 20 includes,
a first mounting plate 21, a first motor 51 fixed to the first mounting plate 21, for controlling the rotation of the rotation rod 40;
a second mounting plate 22 disposed above the first mounting plate 21, the second motor 52 being fixed to the second mounting plate 22;
the first connecting part 23 for connecting the first mounting plate 21 and the second mounting plate 22 reduces the transmission distance of the second motor 52 connected to the lower tray part 60, thereby simplifying the rotation transmission structure of the lower tray part 60; and the first motor 51 and the second motor 52 can be distributed along the vertical direction, so that the horizontal installation space required by arranging the first motor 51 and the second motor 52 on the same horizontal plane is reduced.
By adopting the technical scheme, the occupied space of the first motor 51 and the second motor 52 in the horizontal direction is reduced, and the wafer carrying device 100 is installed in a use scene and needs to be fixed through the installation part 20, so that the first motor 51 and the second motor 52 can be conveniently installed and debugged along the vertical direction, and the use stability of the wafer carrying device 100 is improved.
As shown in fig. 1, the upper suction portion 30 is connected to the rotary rod 40 through the cantilever portion 71, and the distance from the upper suction portion 30 to the rotary rod 40 is increased, so that the movement space of the upper suction portion 30 is increased, the safe distance from the wafer to the rotary rod 40 is ensured, and the safety of the wafer transfer by the upper suction portion 30 is increased.
As shown in fig. 1 and 2, the upper suction part 30 includes,
the sucking disc 31 is arranged vertically upwards in the sucking direction, and the sucking disc 31 can suck the wafer along the vertical direction to ensure that the wafer is fixed in the transferring process;
a linear bearing 32 vertically disposed and connected to the suction cup 31; for controlling the vertical height of the suction cup 31; the sucking disc 31 can meet the requirement of height adjustment, the sucking disc 31 is enhanced to be suitable for wafers with different heights, the linear bearing 32 can buffer the acting force generated by the sucking disc 31 and resisting against the wafers, and the wafers are prevented from being damaged; a return spring 33 is sleeved outside the linear bearing 32;
the end of the linear bearing 32 remote from the suction cup 31 is connected to a rotary rod 40.
By adopting the technical scheme, the suction cup 31 can protect the wafer and can be reset by the reset spring 33, so that the suction cup 31 can conveniently take and place the wafer.
As shown in fig. 1 and 2, the upper suction part 30 further includes a vertically arranged linear cylinder 34, the linear bearing 32 is connected to the rotating rod 40 through the linear cylinder 34, and the linear cylinder 34 is used for adjusting the position height of the suction cup 31, so that the suction cup 31 meets a safety height, and the suction cup 31 in motion is prevented from colliding with other wafers.
As shown in fig. 1 and 3, the lower tray part 60 includes,
the second connecting portion 62 is sleeved on the rotating rod 40, and the second motor 52 can drive the second connecting portion 62 to rotate around the rotating rod 40, so that the lower tray portion 60 meets the use requirements of different directions;
the telescopic guide rail 63 is arranged on the second connecting portion 62, and the tray 64 is connected to the telescopic guide rail 63, the telescopic guide rail 63 is used for guiding the tray 64 to move along a preset linear direction, so that the control of taking and placing the wafer position on the tray 64 is realized, and for a wafer which is horizontally placed, the tray 64 can damage the wafer if the tray 64 is not arranged on the telescopic guide rail 63 because the tray 64 rotates on a horizontal plane to reach the wafer position;
the third motor 53 is mounted on the second connecting portion 62 and connected to the tray 64, the third motor 53 can drive the tray 64 to move along the telescopic guide rail 63, the third motor 53 drives the tray 64 to move along the telescopic guide rail 63, and the third motor 53 can realize transmission connection of the tray 64 through structures such as a gear, a rack and the like, so that limitation is not made, and the structure is safe and reliable.
As shown in fig. 1 and 3, the lower tray part 60 further includes,
a driving pulley assembly 65 arranged in parallel with the telescopic guide rail 63, the third motor 53 being connected to the driving pulley assembly 65, the third motor 53 being capable of driving the driving pulley assembly 65 to move;
the tray 64 is provided with a connecting block 66, the connecting block 66 being connected to a belt in the driving pulley assembly 65; it is achieved that the third motor 53 is connected to the tray 64 by a belt and drives the tray 64 along the telescopic guide 63.
The movement adopts the technical scheme that the third motor 53 is connected with the tray 64 through the transmission belt pulley assembly 65, so that the tray 64 can move under the driving of the third motor 53; since the tray 64 is restricted by the telescopic guide 63 to be capable of linear movement only, the third motor 53 controls the tray 64 to be linearly moved along the telescopic guide 63.
As shown in fig. 1 and 3, the tray 64 includes,
the first extension arm 641, and a first limit protrusion 6401 and a second limit protrusion 6402 disposed on the upper side of the first extension arm 641;
a second extension arm 642, and a third restriction protrusion 6403 and a fourth restriction protrusion 6404 provided at an upper side of the second extension arm 642;
the first extension arm 641 is connected to the second extension arm 642, and when the wafer is located on the tray 64, the first extension arm 641 supports the wafer, and the wafer is located between the first limit protrusion 6401 and the second limit protrusion 6402; the second extension arm 642 supports the wafer, and the wafer is located between the third limiting protrusion 6403 and the fourth limiting protrusion 6404.
By adopting the technical scheme, the weight of the tray 64 can be reduced, and the contact area between the tray 64 and the wafer is reduced, so that the pollution of the tray 64 to the wafer is reduced.
As shown in fig. 1, 2 and 3, a probe station on which the wafer transfer apparatus 100 described above is provided can be used for transferring a wafer by combining an upper suction portion 30 and a lower tray portion 60 as needed.
As shown in fig. 1, 2 and 3, the wafer inspection robot is provided with the wafer transfer apparatus 100, and the wafer inspection robot combines an upper suction unit 30 and a lower tray unit 60 as necessary to transfer a wafer by a probe station.
The above is the preferred embodiment of the present invention, which is not used to limit the protection scope of the present invention. It should be recognized that non-inventive variations and modifications to the disclosed embodiments, as understood by those skilled in the art, are intended to be included within the scope of the present invention as claimed and claimed.
Claims (10)
1. A wafer handling device, characterized in that: the wafer handling device comprises a wafer conveying device,
an installation part;
the upper side adsorption part is connected to a first motor through a vertically arranged rotating rod, and the first motor drives the rotating rod to rotate, so that the upper side adsorption part rotates along the axis of the rotating rod; the first motor is fixed on the mounting part;
the lower tray part is sleeved on the rotating rod through a rolling bearing and is connected with a second motor, and the second motor is fixed on the mounting part;
the lower tray part is lower than the upper adsorption part in height.
2. The wafer handling device of claim 1, wherein: the mounting portion includes a first mounting portion and a second mounting portion,
the first motor is fixed on the first mounting plate;
the second mounting plate is arranged above the first mounting plate, and the second motor is fixed on the second mounting plate;
a first connecting portion for connecting the first mounting plate and the second mounting plate.
3. The wafer handling device of claim 1, wherein:
the upper side adsorption part is connected to the rotating rod through a cantilever part.
4. The wafer handling device of claim 1, wherein: the upper side adsorption part comprises a plurality of adsorption parts,
the sucking disc is arranged vertically upwards in the sucking direction and can suck the wafer along the vertical direction;
the linear bearing is vertically arranged and connected with the sucking disc; the vertical height of the sucker is controlled;
and one end of the linear bearing, which is far away from the sucker, is connected to the rotating rod.
5. The wafer handling device of claim 4, wherein: the upper side adsorption part further comprises a vertically arranged linear cylinder, and the linear bearing is connected to the rotating rod through the linear cylinder.
6. The wafer handling device of claim 1, wherein: the lower tray portion includes a lower tray portion having,
the second connecting part is sleeved on the rotating rod, and the second motor can drive the second connecting part to rotate around the rotating rod;
the telescopic guide rail is arranged on the second connecting part, and the tray is connected to the telescopic guide rail;
the third motor is installed on the second connecting portion and connected to the tray, and the third motor can drive the tray to move along the telescopic guide rail.
7. The wafer handling device of claim 6, wherein: the lower tray part further comprises a lower tray part,
the third motor is connected to the transmission belt pulley assembly and can drive the transmission belt pulley assembly to move;
the tray is provided with a connecting block, and the connecting block is connected to a belt in the transmission belt pulley assembly.
8. The wafer handling device of claim 6, wherein: the tray comprises a tray body and a tray body,
the first extension arm, the first limit bulge and the second limit bulge are arranged on the upper side of the first extension arm;
the second extension arm, a third limiting bulge and a fourth limiting bulge are arranged on the upper side of the second extension arm;
the first extension arm is connected with the second extension arm, when the wafer is positioned on the tray, the first extension arm supports the wafer, and the wafer is positioned between the first limiting bulge and the second limiting bulge; the second extension arm supports the wafer, and the wafer is located between the third limiting bulge and the fourth limiting bulge.
9. A probe station, characterized by: the probe station is provided with the wafer handling device of any one of 1-8.
10. A wafer detects transfer machine which characterized in that: the wafer detection automatic line is provided with the wafer carrying device in any one of the items 1-8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220696863.7U CN217766703U (en) | 2022-03-29 | 2022-03-29 | Wafer handling device, probe station and wafer detection automatic line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220696863.7U CN217766703U (en) | 2022-03-29 | 2022-03-29 | Wafer handling device, probe station and wafer detection automatic line |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217766703U true CN217766703U (en) | 2022-11-08 |
Family
ID=83882691
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220696863.7U Active CN217766703U (en) | 2022-03-29 | 2022-03-29 | Wafer handling device, probe station and wafer detection automatic line |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217766703U (en) |
-
2022
- 2022-03-29 CN CN202220696863.7U patent/CN217766703U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101343894B1 (en) | Buffered storage and transport device for tool utilization | |
| KR102230179B1 (en) | Stacker crane | |
| CN113716493A (en) | Transfer robot and transfer method thereof | |
| KR100394127B1 (en) | Apparatus for transferring dies and small items | |
| US20240017922A1 (en) | Gripping device | |
| CN111661646A (en) | Material taking device | |
| CN217766703U (en) | Wafer handling device, probe station and wafer detection automatic line | |
| CN211107518U (en) | Article moving device with supporting legs | |
| CN216784979U (en) | FPC feed machine | |
| CN213184220U (en) | Platform deck device and autonomous transfer robot | |
| CN214526603U (en) | Charging tray feeding and recycling device | |
| CN106391515B (en) | Ceramic tile on-line sorting device | |
| CN210709631U (en) | Transfer manipulator | |
| CN211493152U (en) | Material loading and unloading and laminating equipment | |
| CN216444560U (en) | U shell conveying manipulator with jacking function | |
| CN219497744U (en) | Double-station silicon wafer discharging device | |
| CN219800802U (en) | Silicon wafer feeding device | |
| CN217437074U (en) | Silicon wafer carrying device and silicon wafer screen printing production line | |
| CN219146061U (en) | High-speed laminating machine | |
| CN219009241U (en) | Material moves and carries device and automated production equipment | |
| CN220457322U (en) | Stop device, photovoltaic board subassembly, photovoltaic support subassembly, photovoltaic board erection equipment | |
| CN220200664U (en) | Panel conveying mechanism and panel feeding conveying system | |
| CN219525517U (en) | Material taking device and production line | |
| CN113991165B (en) | Soft packet of electric core moves and carries mechanism | |
| CN219746121U (en) | Automatic feeding device for machining |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |