CN220933235U

CN220933235U - Optical module

Info

Publication number: CN220933235U
Application number: CN202321990186.0U
Authority: CN
Inventors: 杨思更; 张红伟; 张洪浩
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2023-07-26
Filing date: 2023-07-26
Publication date: 2024-05-10
Anticipated expiration: 2033-07-26

Abstract

The optical module provided by the application comprises a circuit board, a cover shell, a base, an interface claw, an optical waveguide substrate, an optical receiving chip, a laser chip and a displacement prism, wherein the optical waveguide substrate is positioned between the cover shell and the base. The end part of the cover shell is provided with an optical fiber port, the end parts of the interface clamping jaws form a first clamping jaw and a second clamping jaw respectively, an optical fiber plug is arranged between the first clamping jaw and the second clamping jaw, the end part of the optical fiber plug is provided with an internal optical fiber, the optical fiber plug is in optical butt joint with the optical fiber port, and the optical waveguide substrate is also in butt joint with the optical fiber port. The first clamping part and the second clamping part are formed on two sides of the optical fiber port and are respectively connected with the first clamping jaw and the second clamping jaw. The cover shell comprises a body structure and an extension plate, wherein the surface of the body structure is provided with a first clamping part, the surface of the extension plate is provided with an optical fiber port and a second clamping part, and correspondingly, the surface of the base is downwards recessed to form a supporting groove so as to embed the extension plate. The laser chip and the optical waveguide substrate are in different layers, so that a displacement prism is adopted to guide the light emission signal into the optical waveguide substrate.

Description

Optical module

Technical Field

The application relates to the technical field of optical communication, in particular to an optical module.

Background

With the development of new business and application modes such as cloud computing, mobile internet, video and the like, the progress of optical communication technology is becoming more important. In the optical communication technology, an optical module is used as one of key devices in optical communication equipment, so that photoelectric signal conversion can be realized; in the development of optical communication technology, the data transmission rate of the optical module is required to be continuously increased.

In some configurations of optical modules, including an optical transmitting section and an optical receiving section, in order to increase the transmission rate, multi-optical path transmission is generally performed. In the case where the internal space is limited, it is difficult to rationally arrange the light emitting member and the light receiving member of the multiple optical paths.

Disclosure of utility model

The application provides an optical module, which is used for reasonably distributing light emitting components and light receiving components of multiple optical paths.

The optical module provided by the application comprises:

A circuit board;

The cover shell comprises a body structure and an extension plate which extends out relative to the body structure, wherein a first clamping part is formed on the surface of the body structure, and an optical fiber port and a second clamping part are respectively formed on the surface of the extension plate;

The base is connected with the cover shell, and an opening is formed at one end of the base so that the circuit board extends into the base; the other end of the extension plate is provided with a support groove, and the extension plate is embedded in the support groove;

The optical fiber connector comprises an interface claw, wherein a first claw and a second claw are respectively formed at the end part of the interface claw, an optical fiber plug is arranged between the first claw and the second claw, an internal optical fiber is arranged at the end part of the optical fiber plug, the optical fiber plug is in optical butt joint with the optical fiber port, the first claw is connected with the first clamping part, and the second claw is connected with the second clamping part;

The optical waveguide substrate is arranged between the cover shell and the base, and the internal optical fiber passes through the optical fiber port and enters the cover shell until being connected with the optical waveguide substrate; the optical waveguide substrate comprises a first input optical port and a first output optical port which are arranged on opposite sides so as to transmit optical receiving signals, and also comprises a second input optical port and a second output optical port which are arranged on adjacent sides so as to transmit optical transmitting signals; the first input optical port and the second output optical port are positioned on the same side, and the first output optical port and the second input optical port are positioned on different sides;

The turning prism is arranged at one side of the first light output port and is used for receiving and reflecting the light receiving signals;

The light receiving chip is arranged on the surface of the circuit board and is used for receiving the light receiving signals reflected by the turning prism;

The laser chip is not arranged on the surface of the circuit board, is positioned on a different layer from the optical waveguide and is used for generating light emission signals;

and the displacement prism is provided with a light inlet end facing the layer where the laser chip is positioned, and a light outlet end facing the second input light port so as to guide the light emission signal into the second input light port.

The application provides an optical module, which comprises a circuit board, a cover shell, a base, an interface claw, an optical waveguide substrate, a turning prism, an optical receiving chip, a laser chip and a displacement prism, wherein the optical waveguide substrate is positioned between the cover shell and the base. The base is connected with the cover shell, and one end of the base is provided with an opening, and the circuit board stretches into the base from the opening. In the application, in order to realize the transmission of optical signals, an optical fiber plug is arranged in an interface claw, an inner optical fiber is arranged at the end part of the optical fiber plug, then an optical fiber port is formed at the end part of a cover shell, the optical fiber port is arranged between the optical fiber plug and an optical waveguide substrate, one side of the optical fiber port is in optical butt joint with the optical fiber plug, and the other side of the optical fiber port is in optical butt joint with the optical waveguide substrate, so that the inner optical fiber is led out from the end part of the optical fiber plug, passes through the optical fiber port and is directly connected with the optical waveguide substrate, thereby realizing the optical coupling between the optical fiber plug and the optical waveguide substrate, and further realizing the transmission of optical signals through the inner optical fiber. In the application, in order to realize the fixation of the interface claw, a first clamping part and a second clamping part are respectively formed at the end part of the cover shell and at the two sides of the optical fiber port, and the first clamping part and the second clamping part are respectively positioned at the upper side and the lower side of the optical fiber port by way of example; the optical fiber plug is arranged between the first claw and the second claw, the first claw is connected with the first clamping part, and the second claw is connected with the second clamping part, so that the interface claw is fixed on the cover shell. In the application, the optical waveguide substrate is arranged between the cover shell and the base, the cover shell comprises a body structure, the body structure is used for covering and wrapping the optical waveguide substrate, and the optical fiber plug is in optical butt joint with the optical waveguide substrate, and the optical fiber plug is arranged between the first clamping jaw and the second clamping jaw which are arranged vertically oppositely, so that the first clamping part and the second clamping part are respectively arranged at the upper side and the lower side of the optical waveguide substrate, and the upper structure of the optical waveguide substrate is the body structure, so that the first clamping part is formed on the surface of the body structure. Because the distance between first jack catch and the second jack catch is less than the thickness of base, consequently second joint portion is unsuitable to be set up on the base, then set up second joint portion on the lid shell, because the thickness of body structure is less than the distance between first jack catch and the second jack catch, then stretch out downwards in order to form the extension board at body structure's one end, form second joint portion at the bottom surface of extension board, set up the optic fibre mouth simultaneously at the surface of extension board for the optic fibre mouth is located between first joint portion and the second joint portion. Based on the structure of the cover shell, the surface of the base is downwards sunken to form a supporting groove, and the extension plate is embedded in the supporting groove, so that the cover shell is connected with the base. In the application, based on the optical coupling of the optical waveguide substrate and the optical fiber plug, the optical receiving signal and the optical transmitting signal are transmitted through the optical waveguide substrate, the optical waveguide substrate comprises a first input optical port and a first output optical port which are arranged on opposite sides and used for transmitting the optical receiving signal, and also comprises a second input optical port and a second output optical port which are arranged on adjacent sides and used for transmitting the optical transmitting signal, wherein the first input optical port and the second output optical port are positioned on the same side, the first output optical port and the second input optical port are positioned on different sides, the input of the receiving optical signal and the output of the transmitting optical signal are converged on one side, the output of the receiving optical signal and the input of the transmitting optical signal are dispersed on different transmission paths, and the transmission routes of the receiving optical signal and the transmitting optical signal are reasonably distributed. The light receiving chip is arranged on one side of the first output light port, the light receiving chip is arranged on the surface of the circuit board, and the circuit board stretches into the base, and the optical waveguide substrate is arranged on the surface of the base, so that the height of the optical waveguide substrate is larger than that of the light receiving chip, a turning prism is arranged in front of the light receiving chip, the turning prism is arranged on one side of the first output light port so as to receive a received light signal output by the optical waveguide substrate, and the received light signal is reflected towards the light receiving chip so as to be transmitted to the surface of the light receiving chip. In the present application, the laser chip is not disposed on the surface of the circuit board, and in an exemplary manner, the laser chip is disposed at a position different from the optical waveguide substrate, and in order to transmit the light emission signal generated by the laser chip through the optical waveguide substrate, the displacement prism is used to guide the light emission signal generated by the laser chip to the second input optical port, so that the light emission signal is transmitted into the optical waveguide substrate.

Drawings

In order to more clearly illustrate the technical solutions of the present disclosure, the drawings used in some embodiments of the present disclosure will be briefly described below, and it is apparent that the drawings in the following description are only drawings of some embodiments of the present disclosure, and other drawings may be obtained according to these drawings to those of ordinary skill in the art. Furthermore, the drawings in the following description may be regarded as schematic diagrams, not limiting the actual size of the products, the actual flow of the methods, the actual timing of the signals, etc. according to the embodiments of the present disclosure.

FIG. 1 is a partial architectural diagram of an optical communication system according to some embodiments;

FIG. 2 is a partial block diagram of a host computer according to some embodiments;

FIG. 3 is a block diagram of an optical module according to some embodiments;

Fig. 4 is an exploded view of a light module according to some embodiments;

FIG. 5 is a schematic diagram of an assembly of an interface pawl with a fiber optic plug according to some embodiments;

FIG. 6 is a block diagram of an interface dog according to some embodiments;

FIG. 7 is an exploded view of an assembly of an interface pawl, fiber optic plug, according to some embodiments;

FIG. 8 is a schematic diagram of an assembly of a cover and a base according to some embodiments;

FIG. 9 is an assembled cross-sectional view of an interface dog according to some embodiments;

fig. 10 is a partially exploded schematic illustration of a light module in accordance with some embodiments;

FIG. 11 is a partially exploded schematic illustration two of an optical module according to some embodiments;

FIG. 12 is a block diagram of a cover shell in accordance with some embodiments;

FIG. 13 is a second block diagram of a cover shell according to some embodiments;

FIG. 14 is a block diagram of a base in accordance with some embodiments;

FIG. 15 is a second block diagram of a base according to some embodiments;

FIG. 16 is a block diagram III of a base according to some embodiments;

FIG. 17 is a schematic diagram illustrating an assembled cross-section of a cover and base according to some embodiments;

FIG. 18 is an exploded view of an assembly of a cover and base according to some embodiments;

FIG. 19 is a second schematic view in section illustrating the assembly of a cover and a base according to some embodiments;

FIG. 20 is an exploded view of a cover and base assembly according to some embodiments;

FIG. 21 is a schematic structural view of an optical waveguide substrate according to some embodiments;

FIG. 22 is a schematic diagram of an optical path of an optical waveguide substrate transmitting an optical signal according to some embodiments;

Fig. 23 is a cross-sectional view of an internal structure of an optical module according to some embodiments;

FIG. 24 is a schematic illustration of a protective cover according to some embodiments;

FIG. 25 is a schematic illustration of an assembled cross-section of a protective cover according to some embodiments;

FIG. 26 is a second schematic illustration of an assembled cross-section of a protective cover according to some embodiments;

FIG. 27 is an exploded view of an assembly of a protective cover according to some embodiments;

Fig. 28 is a schematic view of a transmission optical path of a light receiving member according to some embodiments;

FIG. 29 is a schematic diagram showing a relative positional relationship among a circuit board, a light emitting device, and a light receiving device according to some embodiments;

FIG. 30 is a schematic diagram showing a second relative positional relationship among a circuit board, a light emitting device, and a light receiving device according to some embodiments;

Fig. 31 is a block diagram of a light receiving chip according to some embodiments;

FIG. 32 is an exploded view of a light receiving chip according to some embodiments;

FIG. 33 is an exploded view of a second light receiving chip according to some embodiments;

fig. 34 is a block diagram of another light receiving chip according to some embodiments;

FIG. 35 is an exploded view of another light receiving chip according to some embodiments;

FIG. 36 is an exploded view of a second light receiving chip according to another embodiment;

Fig. 37 is a schematic partial structure of another light receiving chip according to some embodiments;

FIG. 38 is a cross-sectional view of another optical module internal structure according to some embodiments;

Fig. 39 is a cross-sectional view of yet another optical module internal structure in accordance with some embodiments;

FIG. 40 is an assembled schematic view of a base and circuit board according to some embodiments;

fig. 41 is a block diagram of a light emitting component according to some embodiments;

FIG. 42 is a cross-sectional view of a light emitting component according to some embodiments;

FIG. 43 is a partial block diagram of a light emitting component according to some embodiments;

FIG. 44 is an optical path diagram of a light emitting component according to some embodiments;

FIG. 45 is a side view, cross-section one of a light emitting component according to some embodiments;

fig. 46 is a side view, in section, of a light emitting component according to some embodiments.

Detailed Description

In the optical communication technology, in order to establish information transfer between information processing apparatuses, it is necessary to load information onto light, and transfer of information is realized by propagation of light. Here, the light loaded with information is an optical signal. The optical signal can reduce the loss of optical power when transmitted in the information transmission device, so that high-speed, long-distance and low-cost information transmission can be realized. The signal that the information processing apparatus can recognize and process is an electrical signal. Information processing devices typically include optical network terminals (Optical Network Unit, ONUs), gateways, routers, switches, handsets, computers, servers, tablets, televisions, etc., and information transmission devices typically include optical fibers, optical waveguides, etc.

The optical module can realize the mutual conversion of optical signals and electric signals between the information processing equipment and the information transmission equipment. For example, at least one of the optical signal input end or the optical signal output end of the optical module is connected with an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected with an optical network terminal; the optical module converts the first optical signal into a first electrical signal and transmits the first electrical signal to an optical network terminal; the second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber. Since information transmission can be performed between the plurality of information processing apparatuses by an electric signal, it is necessary that at least one of the plurality of information processing apparatuses is directly connected to the optical module, and it is unnecessary that all of the information processing apparatuses are directly connected to the optical module. Here, the information processing apparatus directly connected to the optical module is referred to as an upper computer of the optical module. In addition, the optical signal input or the optical signal output of the optical module may be referred to as an optical port, and the electrical signal input or the electrical signal output of the optical module may be referred to as an electrical port.

Fig. 1 is a partial block diagram of an optical communication system according to some embodiments. As shown in fig. 1, the optical communication system mainly includes a remote information processing apparatus 1000, a local information processing apparatus 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

One end of the optical fiber 101 extends in the direction of the remote information processing apparatus 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through an optical port of the optical module 200. The optical signal may be totally reflected in the optical fiber 101, and the propagation of the optical signal in the direction of total reflection may almost maintain the original optical power, and the optical signal may be totally reflected in the optical fiber 101 a plurality of times to transmit the optical signal from the remote information processing apparatus 1000 into the optical module 200, or transmit the optical signal from the optical module 200 to the remote information processing apparatus 1000, thereby realizing remote, low power loss information transfer.

The optical communication system may include one or more optical fibers 101, and the optical fibers 101 are detachably connected, or fixedly connected, with the optical module 200. The upper computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor or control the operating state of the optical module 200.

The host computer 100 includes a substantially rectangular parallelepiped housing (housing), and an optical module interface 102 provided on the housing. The optical module interface 102 is configured to access the optical module 200, so that the host computer 100 and the optical module 200 establish a unidirectional or bidirectional electrical signal connection.

The upper computer 100 further includes an external electrical interface, which may access an electrical signal network. For example, the pair of external electrical interfaces includes a universal serial bus interface (Universal Serial Bus, USB) or a network cable interface 104, and the network cable interface 104 is configured to access the network cable 103 so as to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the network cable 103. One end of the network cable 103 is connected to the local information processing apparatus 2000, and the other end of the network cable 103 is connected to the host computer 100, so that an electrical signal connection is established between the local information processing apparatus 2000 and the host computer 100 through the network cable 103. For example, the third electrical signal sent by the local information processing apparatus 2000 is transmitted to the upper computer 100 through the network cable 103, the upper computer 100 generates a second electrical signal according to the third electrical signal, the second electrical signal from the upper computer 100 is transmitted to the optical module 200, the optical module 200 converts the second electrical signal into a second optical signal, and the second optical signal is transmitted to the optical fiber 101, where the second optical signal is transmitted to the remote information processing apparatus 1000 in the optical fiber 101. For example, a first optical signal from the remote information processing apparatus 1000 propagates through the optical fiber 101, the first optical signal from the optical fiber 101 is transmitted to the optical module 200, the optical module 200 converts the first optical signal into a first electrical signal, the optical module 200 transmits the first electrical signal to the host computer 100, the host computer 100 generates a fourth electrical signal from the first electrical signal, and the fourth electrical signal is transmitted to the local information processing apparatus 2000. The optical module is a tool for realizing the mutual conversion between the optical signal and the electric signal, and the information is not changed in the conversion process of the optical signal and the electric signal, and the coding and decoding modes of the information can be changed.

The host computer 100 includes an Optical line terminal (Optical LINE TERMINAL, OLT), an Optical network device (Optical Network Terminal, ONT), a data center server, or the like, in addition to the Optical network terminal.

Fig. 2 is a partial block diagram of a host computer according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, fig. 2 only shows the structure of the host computer 100 related to the optical module 200. As shown in fig. 2, the upper computer 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on a surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access an electrical port of the optical module 200; the heat sink 107 has a convex structure such as a fin that increases the heat dissipation area.

The optical module 200 is inserted into the cage 106 of the host computer 100, the optical module 200 is fixed by the cage 106, and heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected with the electrical connector inside the cage 106, so that the optical module 200 and the host computer 100 are connected by bi-directional electrical signals. Furthermore, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 establishes a bi-directional optical signal connection with the optical fiber 101.

Fig. 3 is a block diagram of an optical module according to some embodiments, and fig. 4 is an exploded view of an optical module according to some embodiments. As shown in fig. 3 and 4, the optical module 200 includes a housing (shell), a circuit board 300 disposed within the housing, a light emitting part, and a light receiving part. The present disclosure is not limited thereto and in some embodiments, the optical module 200 includes one of a light emitting part and a light receiving part.

The housing includes an upper housing 201 and a lower housing 202, the upper housing 201 being capped on the lower housing 202 to form the above-described housing having two openings 204 and 205; the outer contour of the housing generally presents a square shape.

In some embodiments, the lower housing 202 includes a bottom plate 2021 and two lower side plates 2022 disposed on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper housing 201 includes a cover 2011, and the cover 2011 is covered on two lower side plates 2022 of the lower housing 202 to form the housing.

In some embodiments, the lower housing 202 includes a bottom plate 2021 and two lower side plates 2022 disposed on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper housing 201 includes a cover 2011, and two upper side plates disposed on two sides of the cover 2011 and perpendicular to the cover 2011, and the two upper side plates are combined with two lower side plates 2022 to cover the upper housing 201 on the lower housing 202.

The direction of the connection line of the two openings 204 and 205 may be identical to the length direction of the optical module 200 or not identical to the length direction of the optical module 200. For example, opening 204 is located at the end of light module 200 (right end of fig. 3) and opening 205 is also located at the end of light module 200 (left end of fig. 3). Or opening 204 is located at the end of light module 200 and opening 205 is located at the side of light module 200. The opening 204 is an electrical port, and the golden finger 301 of the circuit board 300 extends out of the opening 204 and is inserted into the electrical connector of the upper computer 100; the opening 205 is an optical port configured to access the external optical fiber 101 so that the optical fiber 101 connects the light emitting part and the light receiving part in the optical module 200.

The circuit board 300, the light emitting component, the light receiving component and the like are conveniently installed in the upper shell 201 and the lower shell 202 in a combined assembly mode, and the upper shell 201 and the lower shell 202 can encapsulate and protect the devices. In addition, when the circuit board 300, the light emitting part, the light receiving part, and the like are assembled, the arrangement of the positioning part, the heat radiating part, and the electromagnetic shielding part of these devices is facilitated, and the automated production is facilitated.

In some embodiments, the upper housing 201 and the lower housing 202 are made of metal materials, which is beneficial to electromagnetic shielding and heat dissipation.

In some embodiments, the light module 200 further includes an unlocking member 600 located outside its housing. The unlocking part 600 is configured to achieve a fixed connection between the optical module 200 and the upper computer, or to release the fixed connection between the optical module 200 and the upper computer.

For example, the unlocking member 600 is located outside the two lower side plates 2022 of the lower housing 202, and includes an engaging member that mates with the cage 106 of the upper computer 100. When the optical module 200 is inserted into the cage 106, the optical module 200 is fixed in the cage 106 by the engaging part of the unlocking part 600; when the unlocking member 600 is pulled, the engaging member of the unlocking member 600 moves along with the unlocking member, so that the connection relationship between the engaging member and the host computer is changed, and the fixation between the optical module 200 and the host computer is released, so that the optical module 200 can be pulled out from the cage 106.

The circuit board 300 includes circuit traces, electronic components, chips, etc., and the electronic components and the chips are connected according to a circuit design through the circuit traces to realize functions of power supply, electric signal transmission, grounding, etc. The electronic components may include, for example, capacitors, resistors, transistors, metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET). The chips may include, for example, a micro control unit (Microcontroller Unit, MCU), a laser driving chip, a transimpedance amplifier (TRANSIMPEDANCE AMPLIFIER, TIA), a limiting amplifier (LIMITING AMPLIFIER), a clock data recovery chip (Clock and Data Recovery, CDR), a power management chip, a Digital Signal Processing (DSP) chip.

The circuit board 300 is generally a hard circuit board, and the hard circuit board can also realize a bearing function due to the relatively hard material, for example, the hard circuit board can stably bear the electronic components and chips; the rigid circuit board may also be inserted into an electrical connector in the cage 106 of the host computer 100.

The circuit board 300 further includes a gold finger 301 formed on an end surface thereof, the gold finger 301 being composed of a plurality of pins independent of each other. The circuit board 300 is inserted into the cage 106 and is electrically connected to the electrical connector within the cage 106 by the gold finger 301. The golden finger 301 may be disposed on a surface of only one side of the circuit board 300 (for example, an upper surface shown in fig. 4), or may be disposed on surfaces of both sides of the circuit board 300, so as to provide a greater number of pins, thereby adapting to occasions with a large number of pins. The golden finger 301 is configured to establish electrical connection with an upper computer to achieve power supply, grounding, two-wire synchronous serial (Inter-INTEGRATED CIRCUIT, I2C) signal transmission, data signal transmission, and the like. Of course, flexible circuit boards may also be used in some optical modules. The flexible circuit board is generally used in cooperation with the rigid circuit board to supplement the rigid circuit board.

At least one of the light emitting part or the light receiving part is located at a side of the circuit board 300 remote from the gold finger 301.

In some embodiments, the light emitting and receiving components are physically separated from the circuit board 300, respectively, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connections, respectively.

In some embodiments, at least one of the light emitting component or the light receiving component may be disposed directly on the circuit board 300. For example, at least one of the light emitting part or the light receiving part may be provided on the surface of the circuit board 300 or the side of the circuit board 300.

In some embodiments, the surface of the circuit board 300 is further provided with a DSP chip 302, the electrical signal is input from the electrical interface unit, the DSP chip 302 performs preprocessing, signal modulation, and the like on the electrical signal, outputs a modulated electrical signal, and loads the modulated electrical signal onto a driving chip, the driving chip transmits the modulated electrical signal to a laser chip, and the laser chip converts the modulated electrical signal into an optical signal, thereby obtaining an optical emission signal carrying data. In the present application, the side provided with the DSP chip 302 may be referred to as the front side of the circuit board 300, and the opposite side may be the back side of the circuit board 300.

The circuit board 300 is electrically connected to the optical transceiver cavity, and one end of the circuit board 300 is illustratively extended into the optical transceiver cavity. The interior of the optical transceiver cavity is used for arranging each optical element of the light receiving end and each optical element of the light emitting end. The light emitting component and the light receiving component of the multi-optical path are reasonably distributed in the light receiving and transmitting cavity, so that multi-optical path transmission is realized, and the transmission rate is improved.

To transmit an optical signal, an optical port side of the optical transceiver is connected to one end of the optical fiber plug 800b, and the other end of the optical fiber plug 800b is connected to the optical fiber connector 800 c. The optical fiber connector 800c is connected with an external optical fiber, the optical port side of the optical transceiver cavity is connected with an internal optical fiber, and the external optical fiber and the internal optical fiber are connected through the optical fiber plug 800b, so that optical signals can be transmitted, for example, optical receiving signals to be transmitted to the optical receiving end are sequentially transmitted into the optical transceiver cavity through the external optical fiber, the optical fiber connector 800c, the optical fiber plug 800b and the internal optical fiber, and then transmitted to the optical receiving component; the light emission signals generated by the light emission end are sequentially transmitted out of the light receiving and transmitting cavity through the internal optical fiber, the optical fiber plug 800b, the optical fiber connector 800c and the external optical fiber, and then transmitted into the optical module.

In some embodiments, the interface claw 800a is used to couple the optical fiber connector 800c and the optical fiber plug 800b together, the optical fiber connector 800c is connected with an external optical fiber, the end portion of the optical fiber plug 800b is connected with an internal optical fiber, the optical fiber connector 800c is inserted into one end of the interface claw 800a, the optical fiber plug 800b is inserted into the other end of the interface claw 800a, and the optical fiber connector 800c and the optical fiber plug 800b are butted inside the interface claw 800a, so that the optical butt joint of the internal optical fiber and the external optical fiber is realized.

FIG. 5 is a schematic diagram of an assembly of an interface pawl with a fiber optic plug according to some embodiments; fig. 6 is a block diagram of an interface dog according to some embodiments. As shown in fig. 5 and 6, one end of the interface claw 800a is provided with a first claw 801a and a second claw 802a respectively along the vertical direction, the first claw 801a and the second claw 802a are oppositely arranged, the optical fiber plug 800b is arranged between the first claw 801a and the second claw 802a, and the first claw 801a and the second claw 802a are respectively clamped in the optical transceiver cavity, so that one end of the interface claw 800a is connected with the optical transceiver cavity; the other end of the interface claw 800a is respectively provided with a third claw 803a and a fourth claw 804a along the horizontal direction, and the third claw 803a and the fourth claw 804a are respectively clamped on the optical fiber connector 800c, so that the other end of the interface claw 800a is connected with the optical fiber connector 800 c.

In some embodiments, the surface of the first jaw 801a is recessed upward to form a first limit portion 8011a, and the surface of the second jaw 802a is recessed downward to form a second limit portion 8021a.

In order to prevent the optical fiber plug 800b from falling out of the interface claw 800a, a limiting piece 800d is arranged at the end of the optical fiber plug 800b, the limiting piece 800d is arranged between the first limiting part 8011a and the second limiting part 8021a, the first limiting part 8011a and the second limiting part 8021a respectively clamp the limiting piece 800d, so that the limiting piece 800d is fixed, the limiting piece 800d is used for limiting the optical fiber plug 800b between the interface claw 800a and the limiting piece 800d by supporting the optical fiber plug 800b, and accordingly the optical fiber plug 800b is prevented from falling out of the interface claw 800a, and the optical fiber plug 800b is limited.

In some embodiments, the optical fiber plug 800b has a first pin 801b and a second pin 802b formed at the ends thereof, and the first pin 801b and the second pin 802b are used to connect with the optical transceiver. The end of the optical fiber plug 800b is extended with an internal optical fiber, the internal optical fiber is arranged between the first jaw 801a and the second jaw 802a, one end of the internal optical fiber is led out from the end of the optical fiber plug 800b, and the other end extends into the optical transceiver cavity so as to realize optical signal transmission with an internal optical element. In view of the structure of fiber optic plug 800b, the structure of retention tab 800d illustratively includes corresponding through holes for receiving first and second pins 801b, 802b, and corresponding through holes for receiving an internal optical fiber.

Fig. 7 is an exploded view of an assembly of an interface pawl, fiber optic plug, according to some embodiments. As shown in fig. 7, in some embodiments, the optical transceiver cavity includes a cover 910 and a base 920 that are connected in a covering manner, and the cover 910 is embedded between two sidewalls of the base 920.

After the optical fiber plug 800b is connected to the optical transceiver, the limiting piece 800d is attached to the end surface of the cover shell 910, and at this time, the limiting piece 800d is located between the optical fiber plug 800b and the end surfaces of the cover shell 910 and the base 920.

Fig. 8 is an assembled schematic view of a cover and base according to some embodiments. As shown in fig. 8, an optical fiber port 913 is formed on an end edge of the cover 910, and the optical fiber plug 800b is optically abutted with the optical fiber port 913 so that an internal optical fiber guided from the optical fiber plug 800b passes therethrough, directly extends into the cover 910, and establishes an optical connection with an optical element inside the cover 910.

First insertion holes 914a and second insertion holes 914b are formed on both sides of the optical fiber port 913, so that the first pins 801b and the second pins 802b are inserted respectively, and the optical fiber plug 800b and the cover 910 are inserted together, thereby realizing connection between the two.

Since the optical fiber plug 800b connected with the internal optical fiber is disposed between the first jaw 801a and the second jaw 802a, the first jaw 801a and the second jaw 802a are disposed opposite to each other along the vertical direction, and the internal optical fiber needs to be optically abutted with the optical fiber port 913, at this time, in the cover shell 910, a first clamping portion 9111 and a second clamping portion 9121 are respectively formed on the upper and lower sides of the optical fiber port 913, the first clamping portion 9111 and the second clamping portion 9121 are disposed in the vertical direction, in some embodiments, the first jaw 801a is inserted into the first clamping portion 9111, and the second jaw 802a is inserted into the second clamping portion 9121, so that the interface jaw 800a is fixed on the cover shell 910 to achieve connection therebetween. In some embodiments, when the thicknesses of the first jaw 801a and the second jaw 802a are relatively large, the depth of the first clamping portion 9111 is relatively large, so as to set the first jaw 801a; the third clamping portion 9281 is disposed at a relative position of the second clamping portion 9121, the third clamping portion 9281 is away from the second jaw 802a, a larger space is provided for clamping the second jaw 802a, and at this time, the second jaw 802a is disposed between the second clamping portion 9121 and the third clamping portion 9281.

In some embodiments, an optical waveguide substrate is disposed inside the cover shell 910, and an optical waveguide for transmitting an optical receiving signal and an optical transmitting signal is included in the optical waveguide substrate, where the optical receiving signal is an optical signal to be transmitted to the optical receiving end, the optical transmitting signal is an optical signal generated by the optical transmitting end, the optical fiber port 913 is disposed between the optical fiber plug 800b and the optical waveguide substrate, one side of the optical fiber port 913 is optically abutted with the optical fiber plug 800b, and the other side of the optical fiber port 913 is optically abutted with the optical waveguide substrate, and illustratively, the optical fiber port 913 is optically connected with the optical port of the optical waveguide substrate, one end of the internal optical fiber is guided out from the optical fiber plug 800b, and then the other end of the internal optical fiber passes through the optical fiber port 913 optically abutted with the optical fiber plug 800b until the other end of the internal optical fiber extends to the optical port of the optical waveguide substrate, so as to optically abut the internal optical fiber with the optical waveguide substrate, thereby realizing the transmission of the optical signal.

In the present application, the optical fiber plug 800b is disposed between the first jaw 801a and the second jaw 802a, the optical fiber port is disposed between the first clamping portion 9111 and the second clamping portion 9121, the optical fiber plug 800b is optically abutted with the optical fiber port, the first jaw 801a is connected with the first clamping portion 9111, and the second jaw 802a is connected with the second clamping portion 9121, so that the optical fiber plug 800b is optically abutted with the optical fiber port, and the interface jaw 800a is fixed on the cover shell 910.

Fig. 9 is an assembled cross-sectional view of an interface dog according to some embodiments. As shown in fig. 9, in some embodiments of the present application, since an optical waveguide substrate for transmitting an optical signal is disposed in the cover 910, an optical fiber port 913 is formed at an end of the cover 910, the optical fiber port 913 is optically abutted with the optical waveguide substrate, and the internal optical fiber is disposed in the first and second clamping claws 801a and 802a disposed opposite to each other in the vertical direction, and the internal optical fiber is required to be optically abutted with the optical fiber port 913 so as to pass through the optical fiber port 913 until being optically abutted with the optical waveguide substrate, therefore, at the end of the cover 910, a first clamping part 9111 and a second clamping part 9121 are formed on the upper and lower sides of the optical fiber port 913, respectively, and a first clamping claw 801a above the internal optical fiber is disposed in the first clamping part 9111 above the optical fiber port 913, and a second clamping claw 802a below the internal optical fiber is disposed in the second clamping part 9121 below the optical fiber port 913, so as to simultaneously realize optical butt-joint of the internal optical fiber with the optical fiber port 913, and connection of the clamping claw 800a with the cover 910.

Fig. 10 is a partially exploded schematic illustration of an optical module in accordance with some embodiments. As shown in fig. 10, in some embodiments, the optical transceiver cavity includes a cover 910 and a base 920 that are connected in a covering manner, and two sidewalls of the base 920 are recessed relative to the surface, so that the cover 910 is disposed between the two sidewalls of the base 920.

The optical waveguide substrate 900a is disposed between the cover case 910 and the base 920, and the cover case 910 has a receiving cavity for receiving the optical waveguide substrate 900a, so that the optical waveguide substrate 900a is disposed on the surface of the base 920 and covered and wrapped by the cover case 910.

In some embodiments, the cover 910 includes a body structure 911, and the body structure 911 is configured to cover and encapsulate the optical waveguide substrate 900a. Because the optical fiber plug 800b is optically abutted with the optical waveguide substrate 900a, and the optical fiber plug 800b is disposed between the first jaw 801a and the second jaw 802a that are disposed opposite to each other, the first clamping portion 9111 and the second clamping portion 9121 should be disposed on the upper and lower sides of the optical waveguide substrate 900a, respectively, and because the upper structure of the optical waveguide substrate 900a is the body structure 911, the first clamping portion 9111 is formed on the surface of the body structure 911, as described above, the surface of the first jaw 801a is recessed upward to form the first limiting portion 8011a, the surface of the second jaw 802a is recessed downward to form the second limiting portion 8021a, and in order to realize the limiting and fixing of the first jaw 801a and the second jaw 802a, the first clamping portion 9111 is recessed downward on the upper surface of the body structure 911 to form the first jaw 801a; the second clamping portion 9121 is formed by upwardly recessing at a certain position to set the second claw 802a, and the distance between the first claw 801a and the second claw 802a is smaller than the thickness of the base 920, so that the upwardly recessing second clamping portion 9121 is not suitable for being set on the base 920, and the second clamping portion 9121 should be set on the cover shell 910, and since the thickness of the body structure 911 of the cover shell optical waveguide substrate 900a is smaller than the distance between the first claw 801a and the second claw 802a, the second clamping portion 9121 is formed by upwardly recessing at one end of the body structure 911 to form the extension plate 912, and the optical fiber port 913 is set on the surface of the extension plate 912, so that the optical fiber port 913 is located between the first clamping portion 9111 and the second clamping portion 9121.

In order to connect the cover 910 and the base 920, a supporting groove 928 is formed at an end of the base 920, and an extension plate 912 is embedded in the supporting groove 928 to connect the cover 910 and the base 920. For example, when the thickness of the second claw 802a is larger, the surface of the supporting groove 928 may be recessed downward to form the third clamping portion 9281, and the third clamping portion 9281 is disposed opposite to the second clamping portion 9121, so as to avoid the second claw 802a, and provide a larger space for the clamping extension of the second claw 802 a.

An optical waveguide substrate 900a is disposed between the cover 910 and the base 920, the optical waveguide substrate 900a is optically abutted against the optical fiber port 913, and the internal optical fiber is led out from the end of the optical fiber plug 800b, passes through the optical fiber port 913, and is directly connected to the optical waveguide substrate 900a, so that optical coupling between the optical fiber plug 800b and the optical waveguide substrate 900a is realized, and optical signal transmission is performed by the internal optical fiber. Illustratively, the light receiving chip is transmitted to the light receiving end sequentially via the external optical fiber, the optical fiber connector 800c, the optical fiber plug 800b, the internal optical fiber, the optical channel within the optical waveguide substrate 900 a; the light emission signal is sequentially transmitted to the outside of the optical module through the optical channel in the optical waveguide substrate 900a, the internal optical fiber, the optical fiber plug 800b, the optical fiber connector 800c, and the external optical fiber.

An opening 927 is formed at one end of the base 920, so that the circuit board 300 extends into the base 920, and the circuit board 300 is electrically connected with the light receiving end and the light emitting end respectively, so as to transmit electrical signals.

One end of the circuit board 300 is provided with a golden finger 301, the surface of the circuit board is provided with a DSP chip 302, and the other end of the circuit board extends into the optical transceiver cavity, so that an electric signal is transmitted to the optical transmitting end, or an electric signal generated by the optical receiving end is transmitted to an upper computer through the golden finger 301. In the present application, the side of the circuit board 300 provided with the DSP chip 302 is referred to as the front side of the circuit board 300, and the opposite side is the back side of the circuit board 300. Illustratively, the front side of the circuit board 300 is provided with a portion of the optical elements of the light receiving end, and the back side of the circuit board 300 is electrically connected with the electrical elements of the light emitting end. Because the DSP chip 302 has a large heat dissipation capacity during operation, the DSP chip 302 is disposed on the front surface of the circuit board 300, and at this time, because the upper housing 201 is covered on the front surface of the circuit board 300, the heat generated by the DSP chip 302 can be dissipated through the upper housing 201. Of course, the DSP chip may be disposed on the opposite side of the circuit board 300.

Fig. 11 is a partially exploded schematic illustration two of an optical module according to some embodiments. As shown in fig. 11, in some embodiments, the surface of the extension plate 912 is provided with an optical fiber port 913 and a second clamping portion 9121, so that the optical fiber port 913 is optically abutted with the optical waveguide substrate 900a, and the internal optical fiber penetrates the optical fiber port 913 until extending into the optical waveguide substrate 900 a.

Based on the arrangement of the extension plate 912, a supporting groove 928 is formed by downwardly recessing one end surface of the base 920, and the cover 910 is connected to the base 920 by embedding the extension plate 912 in the supporting groove 928.

In the present application, since the bottom surface of the extension plate 912 needs to be recessed upward to form the second clamping portion 9121, the supporting area between the extension plate 912 and the supporting groove 928 is smaller, in order to increase the supporting surface between the extension plate 912 and the supporting groove 928 to facilitate limiting, the width of the extension plate 912 is set smaller than the width of the body structure 911, so that the overlapping portions 915 are formed between the extension plate 912 and the body structure 911, respectively, two sides of the extension plate 912 are formed with overlapping portions 915, and correspondingly, the width of the supporting groove 928 is smaller than the width of the surface of the base 920, so that the first supporting portion 9244 and the second supporting portion 9245 are formed at two sides of the supporting groove 928, the overlapping portion 915 at one side is connected with the first supporting portion 9244, and the overlapping portion 915 at the other side is connected with the second supporting portion 9245, so as to increase the supporting surface between the extension plate 912 and the supporting groove 928, and limiting connection between the cover shell 910 and the base 920 are realized.

In the present application, a light receiving chip 503 is disposed at one side of an output light port of an optical waveguide substrate, and illustratively, the light receiving chips 503 are disposed in an array form, each light receiving chip 503 disposed in an array form is disposed on a surface of a circuit board, and since the circuit board extends into the base 920 and the optical waveguide substrate is disposed on the surface of the base 920, the height of the optical waveguide substrate is greater than the height of the light receiving chip 503, in some embodiments, a turning prism 502 may be disposed before the light receiving chip 503, and the turning prism 502 is disposed at one side of an output light port of the optical waveguide substrate to receive a light receiving signal output by the optical waveguide substrate and reflect the light receiving signal toward the light receiving chip 503 to transmit the light receiving signal to the surface of the light receiving chip 503. Illustratively, a light receiving chip 503 is disposed on the front surface of the circuit board 300, the turning prism 502 is located on the light outlet side of the optical waveguide substrate 900a, the surface of the base 920 is relatively higher than the surface of the circuit board 300, the light outlet surface of the turning prism 502 faces the light receiving chip 503, and the turning prism 502 is used for turning the light signal output by the optical waveguide substrate 900a towards the light receiving chip 503, so as to turn the light receiving signal to the surface of the light receiving chip 503.

In some embodiments, a first lens 501 is disposed between the light outlet of the optical waveguide substrate 900a and the turning prism 502. Illustratively, the first lens 501 is a converging lens for converging the optical signal output by the optical waveguide substrate 900a to reduce the received optical power loss, and then transmits the optical signal into the turning prism 502.

In some embodiments, a TIA504 is disposed on a surface of the circuit board 300 and on an outgoing light path of the light receiving chip 503, where the TIA504 is configured to convert a photocurrent signal generated by the light receiving chip 503 into a voltage signal, and amplify the voltage signal.

FIG. 12 is a block diagram of a cover shell in accordance with some embodiments; fig. 13 is a second block diagram of a cover shell according to some embodiments. As shown in fig. 12 and 13, the cover 910 includes a body structure 911, a surface of the body structure 911 is recessed downward to form a first clamping portion 9111, one end of the body structure 911 is extended downward to form an extension plate 912, and a surface of the extension plate 912 is used for providing the optical fiber port 913 and the second clamping portion 9121. Illustratively, a bottom surface of the extension plate 912 is recessed upward to form a second catch 9121.

An optical fiber port is formed at the end of the optical fiber plug 800b, and the internal optical fiber is inserted through the optical fiber port 913 so as to be optically abutted with the optical fiber port 913, and the internal optical fiber is inserted through the optical fiber port 913 to extend to the optical port of the optical waveguide substrate 900 a. The optical fiber plug 800b has a first pin 801b and a second pin 802b provided on both sides of an optical fiber port, and a first insertion hole 914a and a second insertion hole 914b are formed on both sides of an optical fiber port 913, respectively, the first insertion hole 914a being used for inserting the first pin 801b, and the second insertion hole 914b being used for inserting the second pin 802b, thereby connecting the optical fiber plug 800b with the cover 910.

Illustratively, the body structure 911 includes a first side wall 9112 and a second side wall 9113 disposed opposite to each other, an avoidance groove 9114 is formed in the middle of the first side wall 9112, and a boss 9115 is formed on one side of the first side wall 9112.

A receiving cavity 9116 is formed between the first and second sidewalls 9112 and 9113 to encapsulate and receive the optical waveguide substrate 900a. In order to facilitate disassembly and the like of the optical waveguide substrate 900a, a corner 9117 is formed on one side of the second side wall 9113, so that the optical waveguide substrate 900a can be taken out to assist in disassembly and the like by a certain work from the corner 9117.

FIG. 14 is a block diagram of a base in accordance with some embodiments; fig. 15 is a block diagram of a second base in accordance with some embodiments. As shown in fig. 14 and 15, in some embodiments, the base 920 includes a third sidewall 921 and a fourth sidewall 922, the surface of the base 920 is relatively recessed in the third sidewall 921 and the fourth sidewall 922, and the distance between the third sidewall 921 and the fourth sidewall 922 is greater than the distance between the first sidewall 9112 and the second sidewall 9113, so as to locate the cover 910 between the third sidewall 921 and the fourth sidewall 922.

The base 920 is a layered structure, and a baffle 923 is formed in the middle of the base 920, and the base 920 is divided into: the upper layer space 924 is located above the baffle 923 and the lower layer space 925 is located below the baffle 923, the upper layer space 924 and the lower layer space 925 are separated by the baffle 923, the upper layer space 924 is used for arranging the optical waveguide substrate 900a, the first lens 501 and the turning prism 502, and the lower layer space 925 is used for arranging an optical element of a light emitting end. Turning prism 502 is disposed on a surface of barrier 923. Turning prism 502 is illustratively disposed within upper space 924.

Since the optical waveguide substrate 900a, the first lens 501 and the turning prism 502 are all located in the upper space 924, the optical signals output by the optical waveguide substrate 900a are transmitted in the same layer, and the optical paths of the optical signals are not required to be switched and guided between the upper space and the lower space, so that the optical receiving road is simple, and the optical power loss is reduced.

The upper space 924 includes a first surface 9241, a second surface 9242, and a third surface 9243, where the first surface 9241, the second surface 9242, and the third surface 9243 are located on a top surface of the barrier 923, the optical waveguide substrate 900a is disposed between the cover 910 and the first surface 9241, the second surface 9242 is used for disposing the first lens 501, and the third surface 9243 is used for disposing the turning prism 502. The height of the second surface 9242 may be higher than the height of the third surface 9243, so that the optical axis of the first lens 501 and the optical axis of the turning prism 502 are on the same axis.

One end of the baffle 923 is formed with an opening 927, so that the circuit board 300 extends into the baffle 923, and the front surface of the circuit board 300 can be used for carrying the light receiving chip 503 and the TIA504, so as to establish electrical connection with the light receiving terminal, and the circuit board 300 extends into the light emitting component, so as to establish electrical connection with the light emitting terminal.

The first surface 9241 includes a surface for carrying the optical waveguide substrate 900a, and further includes a first support portion 9244, a second support portion 9245, and a third support portion 9246, where the first support portion 9244, the second support portion 9245 are located on an optical port side of the optical transceiver cavity, and the third support portion 9246 is located on an electrical port side of the optical transceiver cavity.

A support groove 928 is disposed between the first support portion 9244 and the second support portion 9245, the support groove 928 has a U shape, and the support groove 928 is recessed with respect to the surface of the base 920, for example, the support groove 928 is recessed with respect to the surface of the first surface 9241, so that the extension plate 912 is disposed in the support groove 928, and the overlapping portions 915 on two sides overlap the first surface 9241. Illustratively, the overlapping portions 915 on two sides overlap the first support portion 9244 and the second support portion 9245, so that the extension plate 912 is inserted into the support groove 928, the support groove 928 supports the extension plate 912, and then the overlapping portions 915 overlap the first support portion 9244 and the second support portion 9245, so as to realize the limit connection between the cover shell 910 and the base 920.

In some embodiments, a fourth surface 929 is formed in the first surface 9241 on a side near the third side wall 921, and the fourth surface 929 is illustratively recessed with respect to the first surface 9241.

In some embodiments, the third side wall 921 is hollowed to form an embedded portion 926, the embedded portion 926 is a through hole, the embedded portion 926 exposes both the upper and lower surfaces of the barrier 923, and illustratively, the height of the embedded portion 926 is greater than the height of the barrier 923, so that both the upper and lower surfaces of the barrier 923 are exposed by the embedded portion 926.

Fig. 16 is a block diagram third of a base according to some embodiments. As shown in fig. 16, the surfaces of the lower space 925 are respectively recessed toward the upper space 924 to form a first recess 9251 and a second recess 9252, the first recess 9251 and the second recess 9252 are located on the bottom surface of the barrier 923, and the first recess 9251 and the second recess 9252 are for providing an optical element of a light emitting end, and the first recess 9251 is recessed relative to the second recess 9252. One side of the second recess 9252 is connected to the first vertical surface 9253 and the second vertical surface 9254, respectively.

The first recess 9251 and the second recess 9252 are used for disposing optical elements of the light emitting end, respectively.

Fig. 17 is a schematic diagram illustrating an assembled cross-section of a cover and a base according to some embodiments. As shown in fig. 17, the width between the third side wall 921 and the fourth side wall 922 of the base 920 is relatively greater than the width between the first side wall 9112 and the second side wall 9113 of the cover 910, so that the cover 910 is disposed between the third side wall 921 and the fourth side wall 922, and the surface of the cover 910 may be on the same plane with the surfaces of the third side wall 921 and the fourth side wall 922.

The optical waveguide substrate 900a is disposed between the cover 910 and the base 920, and illustratively, the optical waveguide substrate 900a is disposed between the cover 910 and the upper space 924 of the base 920, the second side wall 9113 of the cover 910 wraps the optical waveguide substrate 900a, and the width of the optical waveguide substrate 900a is smaller than the width between the first side wall 9112 and the second side wall 9113, so that a distance is still reserved between one side of the optical waveguide substrate 900a and the second side wall 9113, so as to implement design and adjustment of an optical path. In some packaging processes, the optical waveguide substrate 900a is fixed first, and the optical waveguide substrate 900a may be wrapped by the cover 910, for example, to fix the optical waveguide substrate 900a.

Since the optical waveguide substrate 900a is located in the upper space 924 and the optical element of the light emitting end is located in the lower space 925, the transmission of the light emitting signal is a cross-layer transmission, and it is necessary to switch and guide the transmission path of the light emitting signal in height, for example, the transmission direction of the light emitting signal is turned toward the upper space 924, so that the output direction of the light emitting signal is toward the optical waveguide substrate 900a, and thus the light emitting signal is finally transmitted into the optical waveguide substrate 900 a. In some embodiments, the displacement prism 407 is provided to turn the transmission direction of the light emission signal toward the upper space 924, so that the output direction of the light emission signal is transmitted into the optical waveguide substrate 900a, and the light emission signal is guided into the optical waveguide substrate 900 a.

In some embodiments, the displacement prism 407 is disposed within the embedded portion 926, and illustratively, the displacement prism 407 is disposed within the mount 408, and then the mount 408 is embedded within the embedded portion 926, thereby embedding the displacement prism 407 within the embedded portion 926, thereby fixing the displacement prism 407.

In some embodiments, the fixing frame 408 is a frame having an opening, such as a frame including a top surface, a bottom surface, and a side surface connecting the top surface and the bottom surface, the displacement prism 407 is disposed between the top surface and the bottom surface, the displacement prism 407 is clamped up and down by the top surface and the bottom surface, and the displacement prism 407 is fixed by the side surface.

In some embodiments, the width of the fixing frame 408 is relatively greater than the width of the third sidewall 921, and thus, it is necessary to form a relief groove 9114 through the middle of the first sidewall 9112 of the cover case 910 to relieve the fixing frame 408. Illustratively, one side of mount 408 is coupled to relief slot 9114.

In some embodiments, the second side wall 9113 of the cover 910 is disposed between the fourth side wall 922 of the base 920 and the optical waveguide substrate 900 a; the first side wall 9112 is connected to the third side wall 921.

Fig. 18 is an exploded view of an assembly of a cover and a base according to some embodiments. As shown in fig. 18, an avoidance groove 9114 is formed in the middle of the first side wall 9112 so as to avoid the fixing frame 408. Illustratively, one side of mount 408 is coupled to relief slot 9114. An engaging portion 926 is cut into the third side wall 921 to engage the holder 408.

FIG. 19 is a second schematic view in section illustrating the assembly of a cover and a base according to some embodiments; fig. 20 is an exploded view of a cover and base assembly according to some embodiments. As shown in fig. 19 and 20, the first side wall 9112 has a recess 9114 formed in the middle thereof, a boss 9115 formed on one side of the first side wall 9112, the boss 9115 being connected to a portion of the third support portion 9246, and a portion of the surface of the third support portion 9246 being used for supporting the boss 9115.

The cover case is formed with a receiving cavity 919 to receive the optical waveguide substrate 900a.

Fig. 21 is a schematic structural view of an optical waveguide substrate according to some embodiments. As shown in fig. 21, in some embodiments, a first input optical port 901a and a second output optical port 904a are formed on a side of the optical waveguide substrate 900a close to the optical fiber plug 800b, respectively, a first output optical port 902a is formed on a side opposite to the first input optical port 901a, and a second input optical port 903a is formed on a side adjacent to the second output optical port 904 a.

The first input optical port 901a is communicated with the first output optical port 902a, and multiple optical channels are arranged between the first input optical port 901a and the first output optical port 902a, so that transmission of multiple optical signals is realized, and the optical channels between the first input optical port 901a and the first output optical port 902a are used for transmitting external optical signals, namely optical receiving signals, to an optical receiving end.

The second input optical port 903a is communicated with the second output optical port 904a, and multiple optical channels are also arranged between the second input optical port 903a and the second output optical port 904a, so that transmission of multiple optical signals is realized, and the optical channels between the second input optical port 903a and the second output optical port 904a are used for transmitting the optical signals generated by the optical transmitting end, namely optical transmitting signals, to the outside of the optical module.

A first input optical port 901a and a first output optical port 902a disposed on opposite sides for transmitting an optical reception signal; the second input optical port 903a and the second output optical port 904a disposed on adjacent sides are used for transmitting optical emission signals.

The first input optical port 901a and the first output optical port 902a are located on opposite sides, the light receiving chip 503 is located on one side of the first output optical port 902a, and then the light entering direction of the light receiving chip 503 is consistent with the light signal outputting direction of the optical waveguide substrate 900a, and then the output optical path direction of the optical waveguide substrate 900a is consistent with the input optical path direction of the light receiving chip 503, and illustratively, both the output optical paths are directed to the optical port end of the optical module, so that the light signal output by the optical waveguide substrate 900a can be directly received by the light receiving chip 503, thereby reducing the light loss and being beneficial to guaranteeing the light receiving power.

The second input optical port 903a and the second output optical port 904a are located at two adjacent sides, and the light emitting direction of the laser chip at the light emitting end is inconsistent with the input direction of the optical waveguide substrate 900a, so that the direction of the input optical path of the optical waveguide substrate 900a is inconsistent with the direction of the light emitting optical path of the laser chip, and the direction of the light emitting optical path of the laser chip is illustratively the light emitting optical path of the laser chip faces the optical port, and the input optical path of the optical waveguide substrate 900a faces the side, so that the light emitting signal generated by the laser chip at the light emitting end needs to be turned and guided in the transmission direction so as to transmit the light emitting signal into the optical waveguide substrate 900 a.

The first input optical port 901a and the second output optical port 904a are located on the same side, and, illustratively, the first input optical port 901a and the second output optical port 904a are located on the side close to the optical fiber plug 800b, so that the received light of the light receiving end and the emitted light of the light emitting end are concentrated on one side, the received light of the light receiving end is on the side of the optical waveguide substrate 900a, and the emitted light of the light emitting end is output from the optical waveguide substrate 900a on the side.

The first light output port 902a and the second light input port 903a are located at different sides, and illustratively, the first light output port 902a and the second light input port 903a are located at two adjacent sides, in the optical waveguide substrate 900a, the transmission start point of the received light and the transmission end point of the emitted light are located at the same side, then the received light is transmitted along the transmission start point to the opposite side of the transmission start point, and the transmission start point of the emitted light is located at a different side from the transmission end point of the emitted light.

In the application, the transmission direction of the light receiving signal is consistent with the direction of the light port of the light module, and the transmission direction of the light emitting signal is guided to the side edge of the light waveguide substrate through the reflecting mirror and the displacement prism.

In the application, the input of the light receiving signal and the output of the light emitting signal are converged at one side, and the output of the light receiving signal and the input of the light emitting signal are dispersed on different transmission paths, so that the transmission paths of the light receiving signal and the light emitting signal are reasonably distributed. In the application, the space on the surfaces of the cover shell and the base is fully utilized, the relative relation among the optical waveguide substrate, the receiving light path and the transmitting light path is reasonably distributed, and the receiving and transmitting of the optical signals are realized.

The second surface 9242 and the third surface 9243 are both located at one side of the first light output port 902a of the optical waveguide substrate 900a, so that the optical signals output by the first light output port 902a are sequentially transmitted into the turning prism 502 disposed on the surfaces of the first lens 501 and the third surface 9243 disposed on the surface of the second surface 9242.

The fourth surface 929 is located at one side of the second input optical port 903a of the optical waveguide substrate 900a, so that an optical signal output from an optical element disposed on the surface of the fourth surface 929 is transmitted to the second input optical port 903a and then output through the second output optical port 904 a.

The embedded portion 926 is also located on one side of the second input optical port 903a of the optical waveguide substrate 900a, so that an optical signal output from an optical element mounted in the embedded portion 926 is transmitted to the second input optical port 903a, and then output through the second output optical port 904 a.

Illustratively, when the optical module is an 800G optical module, the first input optical port 901a communicates with the first output optical port 902a, and there are 8 optical channels therebetween, and the 8 optical channels are 8 optical receiving channels; the second input optical port 903a is communicated with the second output optical port 904a, and there are also 8 optical channels between the two, and the 8 optical channels are 8 optical emission channels. By reasonably arranging the positions of the light ports, reasonable arrangement between the 8 paths of light receiving channels and the 8 paths of light emitting channels can be realized, and mutual interference among the channels is avoided.

In the present application, the optical waveguide substrate 900a is used for transmitting the optical receiving signal and the optical transmitting signal at the same time, and the optical device at the optical receiving end and the optical device at the optical transmitting end are located in different layers of space, so that if the optical receiving signal and the optical transmitting signal are transmitted through the optical fiber ribbon, the situation of fiber winding or fiber coiling occurs, and the optical power loss is caused by the fiber winding or fiber coiling, thereby reducing the optical power.

Fig. 22 is a schematic diagram of an optical path for an optical waveguide substrate to transmit an optical signal according to some embodiments. As shown in fig. 22, in some embodiments, the light receiving end includes a first lens 501, a turning prism 502, and a light receiving chip 503, and illustratively, a light receiving signal enters the optical waveguide substrate 900a from the first input optical port 901a via an internal optical fiber, and then is transmitted via an optical channel in the optical waveguide substrate 900a, and is output from the first output optical port 902a, where the first lens 501 is disposed on the side of the first output optical port 902a to receive the light receiving signal output from the first output optical port 902 a.

In some embodiments, the light emitting end includes a laser chip 402, a reflecting mirror 405, and the like, and is opposite to the light receiving chip 503, where the laser chip 402 is not disposed on the surface of the circuit board 300, and the laser chip 402 is disposed on the other surface of the spacer 923, and the laser chip 402 is disposed in the lower space 925, and illustratively, a light emitting signal emitted by the laser chip 402 is reflected by the reflecting mirror 405 into the displacement prism 407, and the displacement prism 407 turns and guides the light emitting signal output by the reflecting mirror 405 toward the second input optical port 903a of the optical waveguide substrate 900a, so that the light emitting signal is transmitted into the optical waveguide substrate 900 a. Illustratively, the light emitting side of the displacement prism 407 is located at one side of the second input optical port 903a, and the light emission signal output from the displacement prism 407 enters the optical waveguide substrate 900a from the second input optical port 903a, and then is transmitted to the second output optical port 904a through the optical channel in the optical waveguide substrate 900a, and the light emission signal is output from the second output optical port 904a, enters the internal optical fiber, and then is transmitted to the outside of the optical module through the external optical fiber coupled to the internal optical fiber.

Fig. 23 is a cross-sectional view of an internal structure of an optical module according to some embodiments. As shown in fig. 23, an opening 927 is formed at one end of the baffle 923, one end of the circuit board 300 extends into the baffle 923 from the opening 927, the surface length of the upper space 924 is relatively greater than the length of the cover shell 910, the surface of the upper space 924 is exposed relative to the cover shell 910, the first lens 501 and the turning prism 502 are respectively disposed on the exposed surface, the light receiving chips 503 and TIA504 are disposed on one surface of the circuit board 300, and the light receiving chips 503 and TIA504 are disposed on the front surface of the circuit board 300. The first lens 501 and the turning prism 502 are disposed towards the front surface of the circuit board 300, and the light emitting surface of the turning prism 502 faces the front surface of the circuit board 300, for example, the light emitting surface of the turning prism 502 faces the light receiving chip 503 disposed on the front surface of the circuit board 300.

The lower space 925 is used for setting the laser chip 402 and the reflecting mirror 405, and one end of the circuit board 300 extends into the baffle 923 from the opening 927, for example, the circuit board 300 extends into one side of the laser chip 402, and the laser chip 402 is electrically connected with the other surface of the circuit board 300 by wire bonding, and illustratively, the laser chip 402 is connected with the opposite surface of the circuit board 300 by discovery. Meanwhile, in order to ensure the transmission performance of the high-frequency signal, the other surface of the circuit board 300 is flush with the surface of the laser chip 402, and illustratively, the opposite surface of the circuit board 300 is flush with the surface of the laser chip 402, so that the wire bonding length between the circuit board 300 and the laser chip 402 is advantageously shortened, thereby ensuring the transmission performance of the high-frequency signal.

The circuit board 300 extends into the spacer 923 from the opening 927, and at this time, one surface, such as the front surface, of the circuit board 300 is used for arranging the light receiving chips 503 and TIA504, and the other surface, such as the back surface, of the circuit board 300 is flush with the surface of the laser chip 402, and the back surface of the circuit board 300 is wire-bonded to the laser chip 402.

The first lens 501 is located on the first output optical port 902a side of the optical waveguide substrate 900a to receive the optical reception signal output from the optical waveguide substrate 900 a; the light emergent surface of the first lens 501 faces the turning prism 502; the turning prism 502 is configured to reflect the optical signal toward the light receiving chip 503, so as to transmit the optical receiving signal into the light receiving chip 503, and illustratively, the light emitting surface of the turning prism 502 faces the front surface of the circuit board 300, for example, the light emitting surface of the turning prism 502 faces the light receiving chip 503; the light receiving chip 503 is configured to convert a light receiving signal into an electrical signal and transmit the electrical signal into the TIA504, and the TIA504 is configured to convert the electrical signal into a voltage signal and amplify the voltage signal.

In some embodiments, when packaging the optical waveguide substrate 900a, the light receiving chip 503, the laser chip 402, etc., it is generally necessary to fix the optical waveguide substrate 900a by the cover 910, so after the optical waveguide substrate 900a is mounted, the cover 910 needs to be mounted to fix the optical waveguide substrate 900a; then packaging optical elements of the light emitting end such as the laser chip 402 and the like to ensure the light emitting power; then, the optical element of the light receiving end such as the light receiving chip 503 is packaged again, in order to facilitate packaging of the optical element of the light receiving end such as the light receiving chip 503, the length of the cover case 910 is relatively smaller than the surface length of the upper space 924 to leave a certain space on the top surface of the base 920 for disposing the optical element of the light receiving end such as the light receiving chip 503, and illustratively, the optical element of the light receiving end such as the light receiving chip 503 is packaged on the surface of the base 920 exposed with respect to the cover case 910, and therefore, the optical element of the light receiving end such as the light receiving chip 503 is exposed with respect to the cover case 910 to facilitate packaging of the optical element of the light receiving end such as the light receiving chip 503.

Since the optical element at the light receiving end of the light receiving chip 503 or the like is exposed to the outside with respect to the cover case 910, a protective cover 930 is provided to protect the light receiving chip 503 or the like, and the protective cover 930 covers the surface of the light receiving chip 503, for example.

In some embodiments, the protective cover 930 covers the surface of the light receiving chip 503; in some embodiments, the protection cover 930 covers the surfaces of the first lens 501, the turning prism 502, the light receiving chip 503 and the TIA504, at this time, one end of the protection cover 930 is connected to the cover shell 910, and the bottom end of the protection cover 930 is disposed on the front surface of the circuit board 300, and illustratively, the side wall where the bottom end of the protection cover 930 is located is overlapped on the front surface of the circuit board 300, so as to cover the surfaces of the first lens 501, the turning prism 502, the light receiving chip 503 and the TIA 504.

Fig. 24 is a schematic structural view of a protective cover according to some embodiments. As shown in fig. 24, the protective cover 930 includes a cover plate 933, a side plate 934 connected to the cover plate 933, a side plate 935, and a side plate 936. A cover plate 933 is used to cover the light receiving element, a side plate 934 is used to connect to the base 920, a side plate 935 is used to connect to the base 920, and a side plate 936 is used to connect to the circuit board 300. One side of the protection cover 930 is connected to the cover case 910.

The surface of the protective cover 930 is formed with a first notch 931 and a second notch 932, respectively. The first notch 931 is used for connecting with the base 920; the second notch 932 is configured to receive the fourth side wall 922. The first notch 931 is connected to the surface of the base 920 in a lap joint manner, the second notch 932 is connected to the fourth side wall 922 in a splice manner, so as to fix the protection cover 930, and in some embodiments, the first notch 931 may be connected to the surface of the baffle 923 in a lap joint manner, and the second notch 932 may be connected to the fourth side wall 922 in a splice manner.

FIG. 25 is a schematic illustration of an assembled cross-section of a protective cover according to some embodiments; FIG. 26 is a second schematic illustration of an assembled cross-section of a protective cover according to some embodiments; fig. 27 is an exploded view of an assembly of a protective cover according to some embodiments. As shown in fig. 25-27, in some embodiments, to facilitate assembly of the protective cover 930 and removal of the protective cover 930 when disassembly of the protective cover 930 is required, a gap is provided between a side wall of the protective cover 930 and the third side wall 921, the gap providing an operating space for gripping the protective cover 930 to facilitate removal of the protective cover 930, and illustratively, gripping the protective cover 930 between the gap and an outward facing side of the second notch 932 to remove the protective cover 930, disassembly of the protective cover 930, and so on.

The first notch 931 is connected to a surface of the barrier 923, and illustratively, the first notch 931 is connected to a surface of the third support portion 9246, and the first notch 931 overlaps the surface of the third support portion 9246; the second notch 932 is connected to the fourth side wall 922, and illustratively, the second notch 932 is connected to the fourth side wall 922 in a splice connection; one side of the protection cover 930 is connected with the side wall of the cover case 910, the bottom surface of the protection cover 930 is disposed on the surface of the circuit board 300, and the protection cover 930 is supported by the circuit board 300, and then the protection cover 930 is respectively connected with the cover case 910, the base 920 and the circuit board 300, so that the protection cover 930 is fixed, and the first lens 501, the turning prism 502, the light receiving chip 503 and the TIA504 are protected by the protection cover 930.

Fig. 28 is a schematic view of a transmission optical path of a light receiving member according to some embodiments; FIG. 29 is a schematic diagram showing a relative positional relationship among a circuit board, a light emitting device, and a light receiving device according to some embodiments; fig. 30 is a schematic diagram showing a relative positional relationship among a circuit board, a light emitting component, and a light receiving component according to some embodiments. As shown in fig. 28-30, the optical waveguide substrate 900a is disposed between the cover shell 910 and the base 920, and illustratively, the optical waveguide substrate 900a is disposed between the cover shell 910 and the upper space 924, the upper space 924 is further used for disposing the first lens 501 and the turning prism 502, and the lower space 925 is used for disposing optical elements such as the laser chip 402, where the optical waveguide substrate 900a, the first lens 501 and the turning prism 502 are disposed on the same layer, and the optical waveguide substrate 900a and the laser chip 402 are disposed on different layers, so that the light receiving signal output by the optical waveguide substrate 900a is transmitted to the light receiving chip 503 through primary reflection, and the light emitting signal generated by the laser chip 402 needs to be guided by the guiding light path, so that the generated light emitting signal is guided to the optical waveguide substrate 900 a.

The light receiving signal output from the optical waveguide substrate 900a is transmitted to the first lens 501, and the turning prism 502 is used to reflect the light receiving signal downward, so as to turn the transmission direction of the light receiving signal to the surface of the light receiving chip 503. Illustratively, the first lens 501 and the turning prism 502 are located at one side of the first output optical port 902a to receive the optical receiving signal output by the first output optical port 902 a.

In some embodiments, the optical waveguide substrate 900a is optically interfaced with an internal optical fiber at an optical port, thereby transmitting an optical receive signal and an optical transmit signal. The extension plate 912 of the cover 910 is embedded into the support groove 928 of the base 920, thereby connecting the cover 910 and the base 920. The cover case 910 has a receiving cavity to receive and fix the optical waveguide substrate 900a.

In some embodiments, the top surface of the base 920 is formed with a first surface 9241, a second surface 9242, and a third surface 9243, respectively, wherein the surface of the first surface 9241 is used for disposing the optical waveguide substrate 900a. The surfaces of the second surface 9242 and the third surface 9243 are used for disposing the first lens 501 and the turning prism 502, respectively. The length of the top surface of the base 920 is relatively greater than that of the cover 910, and the first lens 501 and the turning prism 502 are disposed on the surface with the greater number of top surfaces, and at this time, the first lens 501 and the turning prism 502 are exposed relative to the cover 910, so as to facilitate mounting of the first lens 501 and the turning prism 502.

The optical axes of the first lens 501 and the turning prism 502 are on the same axis, the turning prism 502 is arranged on the output light path of the first lens 501, the light receiving chip 503 is positioned below the turning prism 502, and the TIA504 is positioned at one side of the light receiving chip 503. Illustratively, the first lens 501 is a converging lens, the turning prism 502 is used for reflecting the light receiving signal transmitted by the first lens 501 and reflecting the light receiving signal to the surface of the light receiving chip 503, the light receiving chip 503 is used for converting the received light receiving signal into a photocurrent signal and transmitting the electric signal to the TIA504, and the TIA504 is used for converting the photocurrent signal into a voltage signal and amplifying the voltage signal. When the optical module is for multiple channels, the first lens 501 is arranged in an array, and accordingly, the turning prism 502, the light receiving chip 503, and the TIA504 are all arranged in an array.

The first lens 501 is located on the surface of the second surface 9242, the light incident surface of the first lens 501 faces the optical waveguide substrate 900a, and illustratively, the light incident surface of the first lens 501 faces the first output optical port 902a of the optical waveguide substrate 900a to receive the light receiving signal output from the first output optical port 902 a; the light emitting surface of the first lens 501 faces the turning prism 502 to transmit the light receiving signal transmitted by the first lens 501 to the inside of the turning prism 502.

The turning prism 502 is located on the surface of the third surface 9243, the light incident surface of the turning prism 502 faces the first lens 501, the light emergent surface faces the light receiving chip 503 disposed on the front surface of the circuit board 300, and the turning prism 502 is used for reflecting the received light receiving signal towards the surface of the light receiving chip 503 disposed on the front surface of the circuit board 300. Illustratively, the turning prism 502 has a slope through which a light receiving signal incident on its surface may be reflected, and the slope angle of the slope may be a preset slope angle, so as to achieve a total reflection effect, and to totally reflect the light signal incident on its surface. Illustratively, the light incident surface of the turning prism 502 faces the first lens 501 to receive the light signal transmitted by the first lens 501 and reflect the light signal, so as to turn the light path thereof, illustratively, the transmission light path of the light signal is turned downwards to reflect the light signal into the light receiving chip 503 below the turning prism 502; the light emitting surface of the turning prism 502 faces the light receiving chip 503 to transmit the reflected light signal into the light receiving chip 503.

The light receiving chip 503 is located on a surface of the circuit board 300, and illustratively, the light receiving chip 503 is located on a front surface of the circuit board 300, the light receiving chip 503 is wire-connected with the TIA504, and a light incident surface of the light receiving chip 503 faces a light emergent surface of the turning prism 502 to receive a light receiving signal reflected by the turning prism 502.

The TIA504 is located on a surface of the circuit board 300, and illustratively, the TIA504 is located on a front surface of the circuit board 300 and on one side of the light receiving chip 503, and the TIA504 is wire-bonded to the circuit board 300.

In some embodiments, after entering the optical module, the light receiving signal enters the optical waveguide substrate 900a along the internal optical fiber from the first input optical port 901a of the optical waveguide substrate 900a, is output from the first output optical port 902a along the internal optical channel, is transmitted into the first lens 501, is continuously transmitted to the turning prism 502 after being converged by the first lens 501, is reflected by the inclined surface of the turning prism 502, and the light path is turned downwards, and is turned to the surface of the light receiving chip 503 on the circuit board 300, and the light receiving chip 503 converts the received light receiving signal into a photocurrent signal, then converts the photocurrent signal into a voltage signal by the TIA504, and amplifies the voltage signal.

The first lens 501 is located on the surface of the second surface 9242, the light receiving chip 503 is located on the surface of the circuit board 300, the second surface 9242 is higher than the circuit board 300, and certain dislocation exists between the first lens 501 and the light receiving chip 503, so that a turning prism 502 is disposed on the output light path of the first lens 501, and the light path of the light signal transmitted by the first lens 501 is turned downwards to the surface of the light receiving chip 503 through the turning prism 502.

The first lens 501 is disposed opposite to the turning prism 502, so that the optical signal transmitted from the first lens 501 is incident into the turning prism 502, and the focal length of the first lens 501 is required to be enough to enable the optical signal transmitted from the first lens 501 to be focused on the surface of the light receiving chip 503 after being reflected by the turning prism 502, so that the size of the light spot is reduced, and the light receiving signal falls within the light receiving range of the light receiving chip 503.

In some embodiments, the first surface 9241 where the optical waveguide substrate 900a is located, the second surface 9242 where the first lens 501 is located, and the third surface 9243 where the turning prism 502 is located are arranged in a step manner, so that the optical axes of the optical waveguide substrate 900a, the first lens 501, and the turning prism 502 are all on the same axis.

In some embodiments, one end of the circuit board 300 extends into the opening 927, and the light receiving chip 503 and the TIA504 are respectively disposed on the exposed surface of the circuit board 300 opposite to the cover 910. The optical signal output from the turning prism 502 is transmitted to the surface of the light receiving chip 503, and then subjected to processing such as conversion of the optical signal.

Illustratively, a portion of turning prism 502 is disposed on third surface 9243; a part of the light signal reflected by the turning prism 502 is transmitted out of the light emitting surface of the suspending part and is transmitted into the light receiving chip 503.

Illustratively, since the thickness of the optical waveguide substrate 900a is small relative to the height of the first lens 501, the height of the first surface 9241 of the optical waveguide substrate 900a is higher than the height of the second surface 9242 of the first lens 501.

In the present application, the light receiving chip 503 and the optical waveguide substrate 900a are in the same layer, the transmission of the light receiving signal is the same layer transmission, the optical path switching and guiding on the upper and lower heights are not required, the light receiving signal transmission path is relatively simple, and the number of optical devices on the transmission path is relatively small, so that the loss of the optical power is reduced, and more light receiving signals are transmitted to the surface of the light receiving chip 503.

In some embodiments of the present application, as the optical module rate increases, the photosurface of the light receiving chip 503 is smaller and smaller, for example, the photosurface decreases from 30um to 16um or even 12um, however, the smaller photosurface affects the optical coupling efficiency, and the first lens 501 focuses the received light receiving signal once, so that in order to increase the optical coupling efficiency, a secondary focusing may be performed before the light receiving signal is transmitted to the surface of the light receiving chip 503, so as to increase the optical coupling efficiency and increase the coupling tolerance.

In some embodiments, a spherical lens is disposed between the turning prism 502 and the light receiving chip 503, and the first lens 501 focuses the received light signal once, and the spherical lens focuses the light signal output by the turning prism 502 twice, so as to improve the optical coupling efficiency. Most of the light spots output by the spherical lens are light spots with uneven energy distribution, and when the light spots with uneven energy distribution are coupled to the photosensitive surface, the energy in a certain range of the photosensitive surface is concentrated too much, so that a photocurrent overshoot phenomenon occurs. Meanwhile, the focal length of the spherical lens is difficult to regulate and control, thereby affecting the optical coupling efficiency. In addition, for spherical lenses, poor uniformity of the center of the lens results in poor uniformity of the optical path due to the manufacturing process, which also reduces coupling efficiency.

In some embodiments, an aspheric lens, such as a superlens, is disposed between the turning prism 502 and the light receiving chip 503, and the first lens 501 focuses the received light signal once, and the aspheric lens focuses the light signal output by the turning prism 502 twice, thereby improving the light coupling efficiency. The aspheric lens has strong flexibility and freedom degree, and can output uniform light spots so as to avoid the phenomenon of photocurrent overshoot. The aspheric lens comprises a substrate and a plurality of medium units arranged on the surface of the substrate, and can output light spots with uniform energy distribution by changing the size or arrangement of the medium units, so that the phenomenon of photocurrent overshoot is avoided. Meanwhile, the focal length of the aspheric lens is easy to control, and the optical coupling efficiency is improved by adjusting the focal length of the aspheric lens by changing the size or arrangement of the medium units. In addition, the aspheric lens and the light receiving chip are integrated together in a single-chip or wafer mode, so that tolerance introduced in the process of pasting is reduced, and coupling efficiency is improved.

Fig. 31 is a block diagram of a light receiving chip according to some embodiments; FIG. 32 is an exploded view of a light receiving chip according to some embodiments; fig. 33 is an exploded view of a light receiving chip according to some embodiments. As shown in fig. 31-33, in some embodiments, an aspheric lens 505 is disposed on the surface of the light receiving chip 503, and the first lens 501, the second lens 403 and the third lens 409 are spherical lenses, and the aspheric lens 505 and the photosensitive surface of the light receiving chip 503 are disposed concentrically, so that the first lens 501 focuses the light receiving signal once, and enters the turning prism 502, and the aspheric lens 505 focuses the light signal reflected from the turning prism 502 twice, so as to reduce the size of the light spot, focus the light spot on a smaller photosensitive surface, and improve the optical coupling efficiency.

The aspheric lens 505 outputs a light spot with uniform energy distribution to avoid photocurrent overshoot. Meanwhile, the focal length of the aspherical lens 505 is easily controlled, so that a light spot is focused on the photosensitive surface of the light receiving chip 503, thereby improving the optical coupling efficiency.

In some embodiments, the light receiving chip 503 includes a top surface 5033, the surface of the top surface 5033 has a photosurface 5031, a G-S-G pad 5032 is disposed around the surface of the photosurface 5031, and the G-S-G pad 5032 is a ground-signal-ground pad. As the channel transfer rate increases, the area of the photosurface 5031 decreases, and therefore, the light spot coupled to the light reception signal in the light receiving chip 503 should be reduced in size so that the light spot falls within the photosurface 5031.

In some embodiments, the aspheric lens 505 may be mounted on the surface of the light receiving chip 503, and the relative position of the aspheric lens 505 and the center of the photosensitive surface of the light receiving chip 503 needs to be identified when the aspheric lens 505 is mounted, so that the accuracy requirement is very high, and compatibility between the channels needs to be considered when the array is coupled.

In some embodiments, the aspheric lens 505 is combined with the light receiving chip 503 through a MEMS process to achieve optical expansion of the photosensitive surface of the front-lit light receiving chip 503, thereby improving optical coupling efficiency. Illustratively, the MEMS process includes photolithography, epitaxy, thin film deposition, oxidation, diffusion, implantation, sputtering, evaporation, etching, dicing, and packaging.

In the present application, on the one hand, since the spherical lens cannot output a uniform light spot to the light receiving chip, and on the other hand, the surface of the substrate 5051 faces the turning prism 502, at this time, if the spherical lens is disposed on the surface of the substrate 5051, the spherical lens achieves the focusing effect by refraction, and the curved surface is far from the light sensitive surface of the light receiving chip 503, the focusing of the spherical lens output light spot above the light sensitive surface is likely to occur, so that the lens structure disposed between the turning prism 502 and the light receiving chip 503 in the present application is an aspherical lens.

In some embodiments, when an aspheric dielectric element is etched on the surface of the substrate 5051 to obtain the aspheric lens 505, for example, when the aspheric lens 505 is a superlens, the focal length may be adjusted by adjusting parameters such as the size or arrangement of the dielectric element, so that the output light spot falls on the photosurface. A superlens, also known as a supersurface lens, is a two-dimensional aspheric lens structure that focuses light through a supersurface, such as a planar two-dimensional metamaterial having a sub-wavelength thickness. Compared with the traditional lens, the super lens has the advantages of thinner volume, lighter weight, lower cost, better imaging and easier integration, provides a potential solution for a compact integrated optical system, and can realize the regulation and control of the properties of polarization, phase, amplitude and the like of light by adjusting the shape, rotation direction, height and other parameters of the structure.

In some embodiments, the aspherical lens 505 is disposed on the surface of the light receiving chip 503 through a CMOS process. Illustratively, a substrate 5051 is grown on the top surface 5033 of the aspherical lens 505 along the G-S-G pad 5032, and then a number of dielectric elements 5052 are etched on the exposed surface, i.e., the top surface, of the substrate 5051. Since the G-S-G pad 5032 has a certain thickness, the bottom surface 5054 of the substrate 5051 is formed with grooves, the grooves are just embedded in the surface of the G-S-G pad 5032, the bottom surface of the substrate 5051 is required to be embedded in the surface of the G-S-G pad 5032, the bottom surface of the substrate 5051 is formed with grooves, and the top surface of the substrate 5051 is required to ensure flatness so as to facilitate etching to form the dielectric unit 5052. Illustratively, the center of the media unit 5052 is concentric with the center of the photosurface 5031 to improve optical coupling efficiency.

The materials of the substrate 5051 and the dielectric unit 5052 are light-transmitting materials, such as SiO ₂, and the specific materials of the substrate 5051 and the dielectric unit 5052 can be flexibly selected according to the wavelength, transmittance, CTE matching with the substrate material, and the like of the light receiving signal.

In some embodiments, the dielectric units are in the form of dielectric columns, each of the dielectric columns is arranged in the form of an array, the array may be a rectangular array, or the center of the substrate 5051 is used as the center, and etching is sequentially performed outwards to arrange each of the dielectric units, for example, a certain number of dielectric columns are wound into a circle, and then the array circles of the dielectric columns with different diameters are obtained.

Illustratively, the dielectric pillars are silicon pillars or silicon oxide pillars. By adjusting the size of the medium column or the arrangement mode of each medium unit array, such as arrangement intervals, continuous phase adjustment is realized, the initial phases of incident lights entering different positions are regulated and controlled, so that interference between different incident lights occurs, the energy of the incident lights is gradually concentrated towards the same direction, and the focusing effect is achieved.

According to the application, the properties of the light spots, such as the light spot energy distribution, can be adjusted by adjusting the size of the medium column or the arrangement mode of each medium unit array, such as arrangement interval, so as to output the light spots with even energy distribution, thereby avoiding the phenomenon of photocurrent overshoot.

In the present application, since the substrate is formed by film growth, the growth of the substrate cannot be too thick in order to avoid stress, that is, the size of the substrate 5051 is relatively thin, and at this time, the focal length of the lens on the surface of the substrate is required to be relatively small, so that the light spot is focused on the photosensitive surface; in some embodiments, if a spherical lens is disposed on the surface of the substrate, the focusing effect of the spherical lens is affected by the radius of curvature and the refractive index, and it is difficult to adjust the radius of curvature or the refractive index to make the spherical lens have a small focal length, and at this time, the focal length of the spherical lens makes the light spot focus under the photosensitive surface, thereby reducing the optical coupling efficiency.

Because the thickness of the substrate is very thin, the corresponding focal length is very small, and even if the radius of curvature and the refractive index of the spherical lens are adjusted to the limit, the spherical lens still cannot reach the small focal length, and the aspheric lens can adjust the focal length by adjusting the size of the medium column or the arrangement mode of each medium unit array, such as arrangement interval and the like, so that the aspheric lens has a smaller focal length, is suitable for the thinner substrate, and focuses light spots on a photosensitive surface. Illustratively, the preset focal length of the aspherical lens 505 may be obtained according to the thickness of the substrate, that is, the preset focal length of the aspherical lens 505 has a preset relationship with the thickness of the substrate, and when the substrate is thin, the preset focal length of the preset lens is smaller, and the preset focal length of the aspherical lens 505 may be matched with the thickness of the substrate, so that the light spot is finally focused on the surface of the light receiving chip 503.

In some embodiments, when mounting the light receiving chip 503, the mounting alignment is generally performed through the center of the photosurface, and since the photosurface surface is covered by the aspherical lens 505 in the present application, the identification position 5053 is formed on the surface of the aspherical lens 505, and the mounting of the light receiving chip 503 is performed through the relative positional relationship between the identification position 5053 and the center of the photosurface 5031, so as to ensure the mounting accuracy.

Fig. 34 is a block diagram of another light receiving chip according to some embodiments. As shown in fig. 34, in some embodiments, an aspheric lens 506 is mounted on the surface of the light receiving chip 503, a certain distance is provided between the substrate of the aspheric lens 506 and the surface of the light receiving chip 503, and the aspheric lens 506 is concentrically disposed with the photosensitive surface of the light receiving chip 503, so that the first lens 501 focuses the optical signal once, enters the turning prism 502, and the aspheric lens 506 focuses the optical signal reflected from the turning prism 502 twice, thereby reducing the size of the light spot, so that the light spot is focused on a smaller photosensitive surface, and improving the optical coupling efficiency.

The aspheric lens 506 outputs a light spot with uniform energy distribution to avoid photocurrent overshoot. Meanwhile, the focal length of the aspheric lens 506 is easy to regulate, so that the light spot is focused on the photosensitive surface of the light receiving chip 503, thereby improving the light coupling efficiency.

In some embodiments, the aspheric lens 506 may be attached to the surface of the light receiving chip 503 by an optical adhesive; in some embodiments, the aspheric lens 506 may also be combined with the light receiving chip 503 through a MEMS process.

FIG. 35 is an exploded view of another light receiving chip according to some embodiments; FIG. 36 is an exploded view of a second light receiving chip according to another embodiment; fig. 37 is a schematic partial structure of another light receiving chip according to some embodiments. As shown in fig. 35-37, in some embodiments, the aspheric lens 505 is a superlens. When the aspherical lens 506 is a superlens and the light receiving chip 503 are bonded together by a CMOS process, the surface of the light receiving chip 503 is formed with a connection pad 5034 in addition to the photosurface 5031, G-S-G pad 5032, and the connection pad 5034 is used for connecting the light receiving chip 503 and the superlens, for example.

In some embodiments, when the aspherical lens 506 is a superlens, the aspherical lens 5056 includes a substrate 5061, a dielectric unit 5062 etched from a top surface of the substrate 5061, and a protrusion 5063 electroplated from a bottom surface of the substrate 5061. Illustratively, the substrate 5061 is a silicon-based wafer, and the dielectric unit 5062 is etched on the surface of the silicon-based wafer; illustratively, the protrusions 5063 are in the form of posts, which may be in the form of metal posts, such as copper posts. The convex portion 5063 and the connection pad 5034 are connected by solder metal, so that the light receiving chip 503 and the superlens are connected.

Similarly, the dielectric units are in the form of dielectric columns, each dielectric column is arranged in the form of an array, the array mode can be rectangular array, or the center of the substrate 5051 is used as the center of the circle, etching is sequentially performed outwards to arrange each dielectric unit, for example, a certain number of dielectric columns are wound into a circle, and then the array circles of the dielectric columns with different diameters are obtained.

Illustratively, the dielectric pillars are silicon pillars or silicon oxide pillars. By adjusting the size of the medium column or the arrangement mode of each medium unit array, such as arrangement intervals, the properties of the light spots, such as light spot energy distribution, can be adjusted to output light spots with even energy distribution, so that the phenomenon of photocurrent overshoot is avoided.

In some embodiments, an aspheric lens, such as a superlens, is disposed on the surface of the substrate, so that the focal length can be adjusted by adjusting the size of the dielectric pillars or the arrangement mode, such as arrangement intervals, of the dielectric unit arrays, so that the aspheric lens has a smaller focal length, and is suitable for a thinner substrate, so that the light spot is focused on the photosensitive surface.

Since the protrusion 5063 exists between the substrate 5061 and the photosensitive surface of the light receiving chip 503, both the upper and lower surfaces of the substrate 5061 can be etched to form a dielectric unit.

The protrusion 5063 has a predetermined height to match the focal length of the aspherical lens 506, so that the output light spot is focused on the photosensitive surface of the light receiving chip 503.

In some embodiments, the marking location 5064 is formed on the surface of the aspheric lens 506, and the light receiving chip 503 is mounted by the relative positional relationship between the marking location 5064 and the center of the photosensitive surface 5031, so as to ensure the mounting accuracy.

Fig. 38 is a cross-sectional view of another optical module internal structure according to some embodiments. As shown in fig. 38, in some embodiments, an aspheric lens 507 is disposed on the light-emitting surface of the turning prism 502, and the aspheric lens 507 is adhered to the light-emitting surface of the turning prism 502 through an optical adhesive.

The optical signal output by the turning prism 502 is converged by the aspheric lens 507 and then is incident on the surface of the light receiving chip 503, so that the size of the optical signal light spot is further reduced by secondary focusing, the light spot falls on the photosensitive surface of the light receiving chip 503, and the optical coupling efficiency is improved.

In some embodiments, the aspherical lens 507 also includes a substrate, where the surface of the substrate is etched to form a dielectric unit, and the focal length of the dielectric unit is adjusted by changing the size or arrangement of the dielectric unit, so that the light spot is focused on the photosensitive surface, and the output light spot is a light spot with uniform energy distribution.

In some embodiments, the substrate of the aspherical lens 507 is connected to the light-emitting surface of the turning prism 502, and the dielectric unit is etched on the surface of the substrate facing the light-receiving chip.

In some embodiments of the present application, the light-emitting surface of the turning prism 502 is used as a substrate, and the dielectric unit is formed thereon, and since the light-emitting surface of the turning prism 502 is made of glass, it is difficult to form the dielectric unit by an etching process, for example, the dielectric unit may be formed by a melt injection molding method.

Fig. 39 is a cross-sectional view of yet another optical module internal structure according to some embodiments. As shown in fig. 39, a supporting portion 508a is disposed on the surface of the circuit board 300, an aspheric lens 508 is disposed on the surface of the supporting portion 508a, the aspheric lens 508 is disposed between the turning prism 502 and the light receiving chip 503, and the aspheric lens 508 performs secondary focusing on the optical signal reflected by the turning prism 502, so as to reduce the size of the optical signal spot, and make the spot fall on the photosensitive surface of the light receiving chip 503, thereby improving the optical coupling efficiency.

In some embodiments, aspherical lens 508 also includes a substrate, the substrate surface is etched to form a dielectric element, the substrate in aspherical lens 508 is the same as the substrate in aspherical lens 506, and the dielectric element in aspherical lens 508 is the same as the dielectric element in aspherical lens 506. The substrate of the aspheric lens 508 is a silicon-based wafer, a dielectric unit is formed by etching on the surface of the silicon-based wafer, the dielectric unit in the aspheric lens 508 is also a superlens, and interference between different incident lights is caused by adjusting and controlling initial phases of the incident lights which are incident on different positions, so that the energy of the incident lights is gradually concentrated towards the same direction, and the focusing effect is achieved.

In the application, the light receiving chip 503 and the optical waveguide substrate 900a are positioned at the same layer, the transmission of the light receiving signal is the same layer transmission, and the transmission light path of the light receiving signal is simple; the laser chip 402 and the optical waveguide substrate 900a are located in different layers, the transmission of the optical emission signal is cross-layer transmission, and the transmission light path of the optical emission signal is complex. When active coupling is performed, since the light emitting end is provided with a light source, the light power loss born by the light emitting end is higher than that of the light receiving end, so that a simple light path is needed to be performed by the light receiving end relative to the light emitting end, namely, the light emitting end is more suitable to be made into a complex light path relative to the light receiving end.

Fig. 40 is an assembly schematic of a base and circuit board according to some embodiments. As shown in fig. 40, the opposite surface of the circuit board 300 is in the same orientation as the bottom surface of the base 920, and as can be seen from the above, the opposite surface of the circuit board 300 refers to the opposite surface on which the DSP chip 302 is disposed.

The bottom surface of the base 920 is further provided with a cover 940, and the cover 940 is fastened to the bottom surface of the base 920 to protect the light emitting part.

Fig. 41 is a structural view of a light emitting member according to some embodiments, and fig. 42 is a sectional view of a light emitting member according to some embodiments. As shown in fig. 41 and 42, after the cover 940 is opened from the bottom surface of the base 920, it can be seen that the bottom surface of the base 920 is recessed toward the upper space 924 to form a lower space 925, and the lower space 925 includes a first recess 9251 and a second recess 9252 with different recess degrees. Optical elements such as TEC401, laser chip 402, second lens 403, mirror, etc. of the light emitting end are respectively provided in the lower space 925. The light emitted by the laser chip 402 is divergent light; the second lens 403 is a collimating lens for collimating divergent light emitted from the laser chip 402 into parallel light; the third lens 409 is a converging lens. When the optical module is multi-channel, the laser chip 402, the second lens 403, the third lens 409, and the like are arranged in an array. The laser chip 402 and the second lens 403 are both arranged on the surface of the TEC401, the second lens 403 is arranged on the light-emitting path of the laser chip 402, and the TEC401 is used for ensuring that the laser chip 402 is in a certain working range, so that the stability of the output light power of the laser chip 402 is ensured.

The TEC401, the laser chip 402, and the second lens 403 constitute a light emitting device provided in the first recess 9251, and since the laser chip 402 is located in the lower space 925 and the optical waveguide substrate 900a is located in the upper space 924, a guiding light path is required to guide the light emission signal generated by the laser chip 402 into the optical waveguide substrate 900a, so that the light emission signal is transmitted through the optical waveguide substrate 900 a. For this purpose, a mirror is provided on the light exit path of the laser chip 402, which mirror serves to guide the light emission signal toward the side wall of the base 920, and, illustratively, toward the side wall of the barrier 923; then, on the side wall of the base 920, illustratively, a displacement prism is provided on the side wall of the barrier 923, and the reflecting mirror reflects the light emission signal toward the displacement prism, guides the light emission signal into the optical waveguide substrate 900a through the displacement prism, illustratively, guides the light emission signal into the second input optical port 903a, thereby transmitting the light emission signal into the optical waveguide substrate 900a through the second input optical port 903a, and transmitting the light emission signal through the optical waveguide substrate 900 a.

In some embodiments, a vertical surface is connected to a side of the second recess 9252, and the mirror is disposed on the vertical surface, so that the mirror is fixed. Since the TEC401 in the light emitting assembly has a certain height, the first recess 9251 is more recessed with respect to the second recess 9252 in order to ensure that the collimated light transmitted from the second lens 403 is incident into the mirror.

In some embodiments, the light-in end and the light-out end of the displacement prism are exposed with respect to the barrier 923, the light-in end of the displacement prism faces the lower space 925, the light-out end of the displacement prism faces the upper space 924, and the displacement prism is used to guide the light emission signal generated by the laser chip 402 to the second light-in port 903a located in the upper space 924, so that the light emission signal is transmitted into the optical waveguide substrate 900 a.

In some embodiments, when the optical module is an 800G optical module, the 8 laser chips 402 are included, and the 8 laser chips 402 are divided into two groups, a first laser chip array 402a and a second laser chip array 402b, respectively, and the first laser chip array 402a and the second laser chip array 402b each include 4 laser chips 402. In order to monitor the operating temperature of the laser chip 402, a thermistor is disposed between the first laser chip array 402a and the second laser chip array 402b, that is, between two adjacent laser chips in the first laser chip array 402a and the second laser chip array 402b, the first laser chip array 402a has an equal interval between the 4 laser chips 402, and the second laser chip array 402b has an equal interval between the 4 laser chips 402, however, the presence of the thermistor increases the interval between the last laser chip 402 in the first laser chip array 402a and the first laser chip 402 in the second laser chip array 402b, that is, the interval between the adjacent two laser chips in the first laser chip array 402a and the second laser chip array 402b increases, for this purpose, the mirrors include a first mirror 404 and a second mirror 405, and by way of dislocating the first mirror 404 and the second mirror 405, the interval difference between the optical channels due to the presence of the thermistor is compensated.

Correspondingly, when the number of the laser chips 402 is 8, the number of the second lenses 403 is 8, and the 8 second lenses 403 are divided into two groups, namely, a first lens array 403a and a second lens array 403b. The first lens array 403a is arranged on the output light path of the first laser chip array 402a, and corresponds to the first lens array one by one; the second lens array 403b is disposed on the output light path of the second laser chip array 402b, and corresponds to each other.

The light incident surface of the first lens array 403a is opposite to the light emergent surface of the first laser chip array 402a, and the light emergent surface is opposite to the first reflecting mirror 404, so that the light emission signal emitted by the first laser chip array 402a is incident to the surface of the first reflecting mirror 404 after passing through the first lens array 403a, and the first reflecting mirror 404 reflects and transmits the received light emission signal.

The light incident surface of the second lens array 403b is opposite to the light emergent surface of the second laser chip array 402b, and the light emergent surface is opposite to the second reflector 405, so that the light emission signal emitted by the second laser chip array 402b is incident to the surface of the second reflector 405 after passing through the second lens array 403b, and the second reflector 405 reflects and transmits the received light emission signal.

In order to set the first mirror 404 and the second mirror 405, one side of the second concave portion 9252 is connected to a first vertical surface 9253 and a second vertical surface 9254, respectively, the first vertical surface 9253 and the second vertical surface 9254 are perpendicular to the surface of the second concave portion 9252, the first vertical surface 9253 is used for setting the first mirror 404, and the second vertical surface 9254 is used for setting the second mirror 405. Illustratively, the first mirror 404 is adhered to the surface of the first vertical surface 9253, and the second mirror 405 is adhered to the surface of the second vertical surface 9254, thereby achieving fixation of the first mirror 404 and the second mirror 405.

Fig. 43 is a partial block diagram of a light emitting component according to some embodiments. As shown in fig. 43, after the divergent light output from the laser chip 402 is collimated by the second lens 403, the divergent light is converted into collimated light, and the collimated light beam transmitted from the second lens 403 is incident on the surface of the first mirror 404 or the second mirror 405, respectively.

In some embodiments, the first mirror 404 is in the form of an elongated mirror that receives the light signal transmitted from the first lens array 403a with a larger light receiving area; the second mirror 405 is also in the form of an elongated mirror, and receives the optical signal transmitted from the second lens array 403b with a larger light receiving area.

To compensate for the difference in optical channel spacing due to the thermistor position, the first mirror 404 and the second mirror 405 are offset, and the first mirror 404 is illustratively located further away from the second lens 403 than the second mirror 405.

FIG. 44 is an optical path diagram of a light emitting component according to some embodiments; FIG. 45 is a side view, cross-section one of a light emitting component according to some embodiments; fig. 46 is a side view, in section, of a light emitting component according to some embodiments. As shown in fig. 44-46, a displacement prism is disposed on a sidewall of the base 920, illustratively, on a sidewall of the barrier 923, and an optical input end of the displacement prism faces the layer where the laser chip 402 is located, and an optical output end faces an optical input end of the optical waveguide substrate 900a, illustratively, such as faces the second input optical port 903a, so as to guide the light emission signal output by the mirror toward the second input optical port 903 a.

The displacement prism includes a first displacement prism 406 and a second displacement prism 407 so as to correspond to the first mirror 404 and the second mirror 405. The first mirror 404 corresponds to a first displacement prism 406, and the second mirror 405 corresponds to a second displacement prism 407. The light emitting surface of the first reflecting mirror 404 faces the light entering surface of the first displacement prism 406, so that the optical signal output by the first reflecting mirror 404 is transmitted to the surface of the first displacement prism 406; the light emitting surface of the second reflecting mirror 405 faces the light entering surface of the second shifting prism 407, so that the optical signal output by the second reflecting mirror 405 is transmitted to the surface of the second shifting prism 407.

In some embodiments, the first displacement prism 406 and the second displacement prism 407 are both fixed in the fixing frame 408, the fixing frame 408 wraps the first displacement prism 406 and the second displacement prism 407, and then the fixing frame 408 is fixed in the embedded portion 926 on the sidewall of the base 920, so as to fix the first displacement prism 406 and the second displacement prism 407.

In order to facilitate the transmission of the optical path, the hollowed dimension of the embedded portion 926 exposes the upper and lower surfaces of the barrier 923, the light incident end of the displacement prism faces the lower surface of the barrier 923, and the light emitting end faces the upper surface of the barrier 923, so that the light incident end and the light emitting end of the displacement prism are exposed relative to the barrier 923, which is beneficial to the transmission of the light emission signals on the upper and lower surfaces of the barrier, and the light emission signals transmitted to the first displacement prism 406 and the second displacement prism 407 are transmitted on the lower surface of the barrier, and the light emission signals output from the first displacement prism 406 and the second displacement prism 407 are transmitted on the upper surface of the barrier.

The first displacement prism 406 and the second displacement prism 407 are respectively used for turning the transmission directions of the light emission signals generated by the first laser chip array 402a and the second laser chip array 402b towards the optical waveguide substrate 900a, so as to transmit the light emission signals sent by the light emitting components to the outside of the optical module through the optical waveguide substrate 900 a.

One end of the first displacement prism 406 faces the first reflecting mirror 404, the other end faces the optical waveguide substrate 900a, one end of the second displacement prism 407 faces the second reflecting mirror 405, and the other end faces the optical waveguide substrate 900a, so that the optical signals reflected by the corresponding reflecting mirrors are reflected respectively, and the optical emission signals are transmitted into the optical waveguide substrate 900 a.

In some embodiments, the first displacement prism 406 is configured to receive the optical signals sequentially output from the first laser chip array 402a, the first lens array 403a, and the first mirror 404, and change a transmission direction of the optical signals, and illustratively, the optical signals are transmitted on the bottom surface of the base 920 through two reflections and are turned to the transmission on the top surface of the base 920; likewise, the second displacement prism 407 also serves this function.

The first displacement prism 406 includes a straight surface, a first inclined surface and a second inclined surface, one end of the straight surface is connected to the first inclined surface, the other end of the straight surface is connected to the second inclined surface, the straight surface is both the light incident surface and the light emergent surface, the straight surface faces the first reflecting mirror 404 and the optical waveguide substrate 900a at the same time, a portion of the straight surface serving as the light incident surface faces the first reflecting mirror 404, and a portion of the straight surface serving as the light emergent surface faces the optical waveguide substrate 900a. The first inclined surface and the second inclined surface are disposed opposite to each other, and the inclination trend of the first inclined surface is disposed opposite to the inclination trend of the second inclined surface, and the first inclined surface faces the bottom surface of the base 920, illustratively, the first reflecting mirror 404; the second inclined surface faces the top surface of the base 920, illustratively, the direction in which the third lens 409 and the optical waveguide substrate 900a are located. The second inclined plane faces the third lens 409, the third lens 409 faces the second input optical port 903a of the optical waveguide substrate 900a, so that the light emission signal output by the laser chip 402 is turned to the second input optical port 903a of the optical waveguide substrate 900a, is transmitted to the second output optical port 904a along the optical channel in the optical waveguide substrate 900a, is output to the internal optical fiber along the second output optical port 904a, and is then transmitted to the outside of the optical module along the external optical fiber, thereby realizing the emission of the light emission signal. The same applies to the second shifting prism 407.

The first inclined plane of the first displacement prism 406 faces the first reflecting mirror 404, and is configured to receive the light emission signal reflected by the first reflecting mirror 404, and reflect the light emission signal reflected by the first reflecting mirror 404 to the second inclined plane; the second inclined plane faces the third lens 409 and the optical waveguide substrate 900a, and is configured to receive the light emission signal reflected from the first inclined plane, and reflect the light signal reflected from the first inclined plane, so that the transmission direction of the light emission signal faces the third lens 409 and further faces the optical waveguide substrate 900a.

The first displacement prism 406 and the second displacement prism 407 are vertically disposed across the bottom surface sidewall to the top surface sidewall of the base 920, such that the optical path is turned to the top surface of the base 920, and illustratively enters the optical waveguide substrate 900a on the top surface of the base 920 after being transmitted in the first displacement prism 406.

In some embodiments, the light emission signal reflected from the first reflecting mirror 404 first reaches the first inclined plane of the first displacement prism 406, the light emission signal reaches the second inclined plane after being reflected by the first inclined plane, then is output through the straight plane after being reflected by the second inclined plane, and reaches the third lens 409, where the third lens 409 faces the second input optical port 903a of the optical waveguide substrate 900a, so that the light emission signal generated by the laser chip 402 is turned to the second input optical port 903a of the optical waveguide substrate 900a, is transmitted to the second output optical port 904a along the optical channel in the optical waveguide substrate 900a, and is output along the second output optical port 904 a. Therefore, the first displacement prism 406 can perform two reflections, and two turns of the optical signal transmission direction: the first reflection is performed by the first inclined plane, the optical signal reflected from the first reflecting mirror 404 is reflected to the second inclined plane surface, and at this time, the transmission direction of the optical emission signal is turned from the direction along the output optical path of the first reflecting mirror 404 to the vertical direction, that is, to the second inclined plane surface; the second reflection is performed by the second inclined surface, and the optical signal reflected to the surface of the second inclined surface is turned from the vertical direction to the direction toward the optical waveguide substrate 900 a. Wherein, "vertical direction" refers to a direction from the upper space 924 toward the lower space 925.

In some embodiments, the third lens 409 is disposed on a surface of the fourth surface 929 in an array, and the fourth surface 929 is located on a side of the second input optical port 903a of the optical waveguide substrate 900a, so that the optical signal transmitted by the third lens 409 enters the optical waveguide substrate 900a from the second input optical port 903 a.

In some embodiments, the fourth surface 929 on which the third lens 409 is disposed is more recessed relative to the first surface 9241 on which the optical waveguide substrate 900a is disposed, in order to have the exit axis of the third lens 409 be on the same line as the entrance axis of the optical waveguide substrate 900 a.

In the embodiment of the present application, by arranging the displacement prism along the vertical direction, the first inclined plane in the displacement prism faces the bottom surface of the base 920, and the second inclined plane faces the top surface of the base 920, the displacement prism spans the side wall of the base 920 vertically, so that the optical path originally on the bottom surface of the base 920 can be turned twice, and the optical path can be turned to the bottom surface of the base 920, and illustratively, the optical waveguide substrate 900a arranged on the bottom surface of the base 920, wherein the "vertical direction" refers to the direction pointing from the upper space 924 to the lower space 925.

In the embodiment of the application, the optical waveguide substrate 900a and the optical receiving chip 503 are both located in the upper space, i.e. the top surface of the baffle 923, so that the optical receiving signal can be directly transmitted into the optical receiving chip 503 along the optical channel inside the optical waveguide substrate 900a, thereby realizing the receiving of the optical signal; since the laser chip 402 is located in the lower space, i.e. the bottom surface of the barrier 923, the light emission signal generated by the laser chip 402 is guided by the mirror and the displacement prism, so that the light emission signal is guided into the second input optical port 903a of the optical waveguide substrate 900a, and the emission of the light signal is realized.

The foregoing is merely a specific embodiment of the disclosure, but the protection scope of the disclosure is not limited thereto, and any person skilled in the art who is skilled in the art will recognize that changes or substitutions are within the technical scope of the disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims

1. An optical module, comprising:

A circuit board;

2. The light module of claim 1 wherein the cover comprises first and second oppositely disposed sidewalls, the base comprises third and fourth sidewalls, a width between the third and fourth sidewalls being greater than a width between the first and second sidewalls such that the cover is disposed between the third and fourth sidewalls;

the base comprises a baffle, an upper space positioned above the baffle and a lower space positioned below the baffle;

The optical waveguide substrate is positioned between the cover shell and the upper space, and the turning prism is positioned in the upper space;

the laser chip is positioned in the lower space;

The displacement prism is located on the side wall of the baffle, the light inlet end and the light outlet end of the displacement prism are exposed relative to the baffle, the light inlet end of the displacement prism faces the lower space, and the light outlet end of the displacement prism faces the upper space.

3. The light module of claim 2 wherein the third sidewall has an embedded portion formed thereon, the embedded portion exposing upper and lower surfaces of the barrier, the embedded portion being configured to embed the displacement prism.

4. The optical module according to claim 2, wherein a reflecting mirror is disposed on an outgoing light path of the laser chip, the reflecting mirror is disposed in the lower space, and the reflecting mirror is configured to reflect the light emission signal toward the displacement prism;

And a third lens is arranged between the displacement prism and the second input light port, the third lens is arranged in the upper space, and the third lens is used for converging the light emission signals output by the displacement prism into the optical waveguide substrate through the second input light port.

5. The light module of claim 4 wherein the base comprises a barrier, an upper space above the barrier, and a lower space below the barrier;

The lower space is sunken towards the upper space to be formed with first depressed part and second depressed part respectively, first depressed part is used for setting up laser chip, the vertical face of second depressed part is used for setting up the speculum.

6. The optical module according to claim 1, wherein a supporting groove is formed at the other end of the base, the extension plate is embedded in the supporting groove, a third clamping portion is formed by downwards sinking the surface of the supporting groove, and the third clamping portion is opposite to the second clamping portion.

7. The light module of claim 1 wherein the base comprises a third sidewall and a fourth sidewall;

the surface of the light receiving chip is covered with a protective cover;

A first notch and a second notch are formed on the surface of the protective cover respectively, the first notch is used for being connected with the base, and the second notch is used for avoiding the fourth side wall; the first notch is in lap joint connection with the surface of the base, a gap is reserved between the side wall of the first notch and the third side wall, and the second notch is in splice connection with the fourth side wall.

8. The optical module according to claim 1, wherein an aspheric lens is disposed between the turning prism and the light receiving chip, and the aspheric lens is disposed on a light emitting path of the turning prism, and comprises a substrate and a medium unit disposed on a surface of the substrate, and is configured to adjust a focal length by changing a size or arrangement of the medium unit, so as to collect an optical signal output by the turning prism into a light spot.

9. The optical module of claim 1, wherein each of the laser chips forms a first laser chip array and a second laser chip array, and a thermistor is disposed between the first laser chip array and the second laser chip array;

A reflecting mirror is arranged on a light-emitting light path of the laser chip, the reflecting mirror comprises a first reflecting mirror and a second reflecting mirror, and the first reflecting mirror and the second reflecting mirror are arranged in a staggered mode; the first reflecting mirror is arranged opposite to the first laser chip array, and the second reflecting mirror is arranged opposite to the second laser chip array;

The displacement prism comprises a first displacement prism and a second displacement prism, wherein the first displacement prism is arranged opposite to the first reflecting mirror, and the second displacement prism is arranged opposite to the second reflecting mirror.

10. An optical module, comprising:

A circuit board;

The reflecting mirror is arranged on the light emitting path of the laser chip and is used for reflecting the light emission signal;

And the displacement prism is provided with a light inlet end facing the layer where the laser chip is positioned, and a light outlet end facing the second input light port, so that the light emission signal output by the reflecting mirror is guided into the second input light port.