CN220858263U

CN220858263U - Shading type photosensitive assembly and camera module

Info

Publication number: CN220858263U
Application number: CN202322643614.9U
Authority: CN
Inventors: 丁志
Original assignee: Zhejiang Sunyu Zhiling Technology Co ltd
Current assignee: Zhejiang Sunyu Zhiling Technology Co ltd
Priority date: 2023-09-27
Filing date: 2023-09-27
Publication date: 2024-04-26
Anticipated expiration: 2033-09-27

Abstract

The utility model relates to a shading type photosensitive assembly and a camera module, which can solve the problem of stray light caused by gold wire reflection and are beneficial to improving the image quality of the module. The shading type photosensitive assembly comprises: a circuit board; the photosensitive chip is attached to the circuit board and is provided with an imaging area and a non-imaging area positioned around the imaging area; one end of the connecting wire is connected with the non-imaging area of the photosensitive chip, and the other end of the connecting wire is connected with the circuit board; the light shielding frame comprises an annular frame body, a light shielding cover body and a plurality of light shielding grids, wherein the annular frame body is convexly arranged on the circuit board so as to surround the photosensitive chip and the connecting wire, and the light shielding cover body obliquely extends from the annular frame body towards a dividing line between the imaging area and the non-imaging area so as to cover the connecting wire; the light blocking grids are arranged on the light shielding cover body at intervals.

Description

Shading type photosensitive assembly and camera module

Technical Field

The utility model relates to the technical field of camera modules, in particular to a shading type photosensitive assembly and a camera module.

Background

The camera module is used as one of the indispensable core components in intelligent electronic equipment, and is widely applied to the fields of smart phones, cameras, computer equipment, wearable equipment, automobiles and the like. Along with the continuous development and popularization of various intelligent devices, the requirements on the camera module are higher and higher, and the imaging quality of the camera module directly influences the performance of the whole product.

In order to improve the imaging quality of the camera module, the camera module adopts a plurality of advanced technologies and materials, wherein gold wires are important components for connecting the photosensitive chip and the circuit board so as to play a key role in signal transmission. However, in the conventional COB package structure, the gold wire is usually exposed, and a portion of the light entering from the outside through the optical lens irradiates onto the gold wire, and after being reflected on the surface of the gold wire, the light enters the imaging area of the photosensitive chip again, so that poor stray light reflected by the gold wire occurs, and the imaging quality of the camera module is seriously affected.

Disclosure of utility model

One advantage of the present utility model is to provide a light-shielding type photosensitive assembly and an image capturing module, which can solve the problem of stray light caused by gold wire reflection, and is helpful for improving the image quality of the module.

Another advantage of the present utility model is to provide a light-shielding type photosensitive assembly and an image capturing module, wherein in one embodiment of the present utility model, the light-shielding type photosensitive assembly can effectively block external stray light from being irradiated onto a gold wire, so as to solve the problem of stray light caused by connection wire reflection.

Another advantage of the present utility model is to provide a light-shielding type photosensitive assembly and an image capturing module, wherein in one embodiment of the present utility model, the light-shielding type photosensitive assembly is capable of absorbing unwanted light, and only allows the useful light to enter an imaging area, thereby effectively eliminating the influence of stray light.

Another advantage of the present utility model is to provide a light-shielding type photosensitive assembly and a camera module, in which, in one embodiment of the present utility model, the light-shielding type photosensitive assembly can effectively solve the problem of poor imaging caused by the entry of impurities such as external dust and water vapor into the camera module, and improve the overall protection capability of the camera module.

Another advantage of the present utility model is to provide a light-shielding type photosensitive assembly and an image pickup module in which expensive materials or complex structures are not required in the present utility model in order to achieve the above-described objects. Therefore, the utility model successfully and effectively provides a solution, which not only provides a simple shading type photosensitive assembly and a camera module, but also increases the practicability and reliability of the shading type photosensitive assembly and the camera module.

To achieve at least one of the above or other advantages and objects of the utility model, there is provided a light shielding type photosensitive assembly comprising:

a circuit board;

the photosensitive chip is attached to the circuit board and is provided with an imaging area and a non-imaging area positioned around the imaging area;

one end of the connecting wire is connected to the non-imaging area of the photosensitive chip, and the other end of the connecting wire is connected to the circuit board; and

The light shielding frame comprises an annular frame body, a light shielding cover body and a plurality of light shielding grids, wherein the annular frame body is convexly arranged on the circuit board so as to surround the photosensitive chip and the connecting wire, and the light shielding cover body obliquely extends from the annular frame body towards the dividing line between the imaging area and the non-imaging area so as to cover the connecting wire; the light blocking grids are arranged on the light shield body at intervals.

According to one embodiment of the application, the light shield body has a extinction bevel facing away from the light-sensing chip.

According to one embodiment of the application, each of the light-blocking gratings is tapered to protrude from the extinction slope.

According to one embodiment of the application, the light shield body is integrally connected with the light blocking grating, and the light shield body and the light blocking grating are provided with black matte surfaces.

According to one embodiment of the application, the light shield body is a black plastic part or a surface-treated metal part.

According to one embodiment of the present application, the light shielding type photosensitive assembly further includes a filter element, and the filter element is mounted on the light shielding frame and located on the photosensitive path of the photosensitive chip.

According to one embodiment of the application, the annular frame body comprises an annular base part which is fixedly adhered to the circuit board and a bearing part which extends inwards integrally from the inner peripheral wall of the annular base part, the light shield body is integrally connected with the free end of the bearing part, and the light filtering element is fixedly adhered to the bearing part to form an inner-layer closed space for accommodating the photosensitive chip.

According to another aspect of the present application, there is further provided an image capturing module including:

The shading type photosensitive assembly; and

The lens assembly is correspondingly arranged on the photosensitive path of the shading type photosensitive assembly.

According to one embodiment of the application, the lens assembly is adhered and fixed to the circuit board around the light shielding frame, so that a middle-layer enclosed space for accommodating the photosensitive chip is formed between the lens assembly and the circuit board.

According to one embodiment of the present application, the camera module further includes a housing assembly, the light-shielding type photosensitive assembly is encapsulated within the housing assembly, and the lens assembly is correspondingly mounted to the housing assembly, so as to form an outer enclosed space between the lens assembly and the housing assembly for accommodating the photosensitive chip.

Drawings

Fig. 1 is a schematic structural diagram of an image capturing module according to an embodiment of the present utility model;

FIG. 2 is a schematic view showing a structure of the camera module according to the above embodiment of the present utility model with a housing assembly removed;

Fig. 3 is a schematic structural view of a light-shielding photosensitive assembly in an image capturing module according to the above embodiment of the present utility model.

Description of main reference numerals: 1. a camera module; 10. a shading type photosensitive component; 11. a circuit board; 12. a photosensitive chip; 121. an imaging region; 122. a non-imaging region; 13. a connecting wire; 14. a shading frame; 141. an annular frame body; 1411. an annular base; 1412. a bearing part; 142. a light shield body; 1420. extinction inclined plane; 143. a light blocking grille; 15. a filter element; 20. a lens assembly; 30. a housing assembly; 31. an upper housing; 32. and a lower housing.

The foregoing general description of the utility model will be described in further detail with reference to the drawings and detailed description.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It is noted that when an element is referred to as being "mounted to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "secured to" another element, it can be directly secured to the other element or intervening elements may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "or/and" as used herein includes any and all combinations of one or more of the associated listed items.

Considering that the gold wire is usually naked in the current COB packaging structure, the light entering from the outside through the optical lens can be partly irradiated on the gold wire, and can reenter the imaging area of the photosensitive chip after the reflection occurs on the surface of the gold wire, the stray light bad of the reflection of the gold wire appears, and therefore the imaging quality of the camera module can be seriously influenced. The application provides a shading type photosensitive assembly and a camera module, which can solve the problem of stray light caused by gold wire reflection and are beneficial to improving the image quality of the module.

Specifically, referring to fig. 1 and 2, an embodiment of the present utility model provides an image capturing module 1, which may include a light shielding type photosensitive element 10 and a lens element 20, wherein the lens element 20 is correspondingly disposed on a photosensitive path of the light shielding type photosensitive element 10, so that external light is modulated by the lens element 20 before being received by the light shielding type photosensitive element 10 for imaging.

More specifically, as shown in fig. 2 and 3, the light shielding type photosensitive assembly 10 may include a circuit board 11, a photosensitive chip 12 attached to the circuit board 11, a plurality of connection wires 13, and a light shielding frame 14. The photosensitive chip 12 has an imaging region 121 and a non-imaging region 122 located around the imaging region 121. One end of the connecting wire 13 is connected to the non-imaging region 122 of the photosensitive chip 12, and the other end of the connecting wire 13 is connected to the circuit board 11. The light shielding frame 14 includes an annular frame body 141 and a light shielding cover body 142, and the annular frame body 141 is convexly arranged on the circuit board 11 so as to surround the photosensitive chip 12 and the connecting wire 13; the light shielding body 142 extends obliquely from the annular frame 141 toward the boundary between the imaging region 121 and the non-imaging region 122 to cover the connection line 13.

It is to be understood that the circuit board 11 according to the present application may be implemented as, but not limited to, a hard board, a soft and hard combined board, a ceramic substrate, etc., which is not limited thereto; the connection wire mentioned in the present application may be implemented as, but not limited to, a gold wire to be electrically connected to the light sensing chip 12 and the wiring board 11 by way of a gold wire bonding or a reverse gold wire bonding. Further, the ring shape mentioned in the present application is not limited to a circular ring shape, but may include various types of ring structures such as a rectangular ring; in the present application, the annular frame 141 is also generally of a rectangular annular structure, limited to the rectangular shape of the photosensitive chip 12.

It should be noted that, since the light-shielding body 142 extends obliquely from the annular frame 141 toward the boundary between the imaging region 121 and the non-imaging region 122, so that the connecting line 13 and the non-imaging region 122 are covered by the light-shielding body 142, and the imaging region 121 of the photosensitive chip 12 is uncovered and exposed, the light-shielding body 142 can block external light from irradiating the connecting line 13 while ensuring that external light can directly irradiate the imaging region 121 for imaging, thereby eliminating stray light influence caused by reflection of the connecting line 13 (such as gold wires), and contributing to improving the imaging quality of the camera module.

Meanwhile, since the light shielding body 142 extends obliquely toward the boundary between the imaging region 121 and the non-imaging region 122, the light shielding body 142 has a funnel-shaped structure, so that the imaging region 121 of the photosensitive chip 12 can receive light rays with a large angle, and interference to the field angle of the camera module 1 is avoided. In addition, the light shielding body 142 has an inclined surface instead of a vertical surface, so that even if the light shielding body 142 is capable of reflecting a part of light, most of the light is not reflected to the imaging region 121 of the light sensing chip 12, which is advantageous in reducing the stray light interference.

In addition, in order to further improve the light shielding performance of the light shielding frame 14, as shown in fig. 3, the light shielding frame 14 may further include a plurality of light shielding grids 143 spaced apart from the light shielding cover body 142, so as to block the reflected light multiple times, thereby achieving a better extinction effect.

Optionally, as shown in fig. 3, the light-shielding cover 142 has a extinction slope 1420 facing away from the photosensitive chip 12, so as to weaken the reflection of light irradiated to the surface of the light-shielding cover 142, and reduce the interference of stray light on the camera module 1. For example, the extinction slope 1420 may be implemented, but is not limited to, a black matte surface to attenuate reflection of light by absorbing light.

Alternatively, the light-shielding body 142 of the present application may be, but not limited to, made of black plastic or metal subjected to surface treatment (such as anodic oxidation, etc.), i.e., the light-shielding body 142 may be, but not limited to, a black plastic or a surface-treated metal, as long as the light-reflecting rate of the light-shielding body 142 can be reduced, which is not described in detail herein.

Optionally, as shown in fig. 3, the light shielding cover 142 is integrally connected with the light shielding grille 143, that is, the light shielding cover 142 and the light shielding grille 143 may be integrally formed with the same material, so that no special treatment is required, and the cost is low, so that most of the useless light can be eliminated, and the useless light is prevented from being reflected to the imaging area 121 to affect the imaging quality. In other words, the light shielding cover 142 and the light blocking grating 143 have black matte surfaces to reduce light reflectivity and improve light absorption capability.

Illustratively, as shown in fig. 3, each light blocking grating 143 is tapered to protrude from the extinction slope 1420 to form a trumpet-shaped space between two adjacent light blocking gratings 143, so that unwanted light better enters the space between the light blocking gratings 143, thereby facilitating better capturing of reflected light, avoiding the generation of stray light, and further improving imaging quality.

According to the above embodiment of the present application, as shown in fig. 2 and 3, the light-shielding type photosensitive assembly 10 may further include a light-filtering element 15, where the light-filtering element 15 is mounted on the light-shielding frame 14 and located on the photosensitive path of the photosensitive chip 12, so that the external light received by the lens assembly 20 is filtered by the light-filtering element 15 and then received by the imaging area 121 of the photosensitive chip 12, which is helpful for obtaining higher imaging quality. It is understood that the filter element 15 according to the present application may be, but not limited to, implemented as a filter, such as an infrared filter, for transmitting light of a set wavelength, so as to filter out stray light in the external environment, and only allow light of a specific wavelength in the external environment, such as infrared light, to enter.

Alternatively, as shown in fig. 3, the annular frame 141 may include an annular base 1411 adhesively fixed to the circuit board 11 and a bearing 1412 integrally extending inward from an inner peripheral wall of the annular base 1411, the light-shielding cover 142 is integrally connected to a free end of the bearing 1412, and the light-filtering element 15 is adhesively fixed to the bearing 1412 to form an inner-layer enclosed space for accommodating the photosensitive chip 12, so that dust, moisture and other impurities outside the module can be effectively prevented from contacting the imaging area 121 of the photosensitive chip 12, and a higher imaging quality of the module is ensured. It will be appreciated that the bonding referred to in the present application may be, but is not limited to, bonding by an adhesive such as glue.

Optionally, as shown in fig. 1 and fig. 2, the lens assembly 20 is adhered and fixed to the circuit board 11 around the light shielding frame 14, so that a middle-layer enclosed space containing the photosensitive chip 12 is formed between the lens assembly 20 and the circuit board 11, so that the camera module 1 forms a two-layer sealing structure, and the overall protection capability of the module is improved. It will be appreciated that the lens assembly 20 of the present application is preferably implemented as an integral lens, which is advantageous in preventing dust, moisture, etc. from entering the interior of the module.

According to the above embodiment of the present application, as shown in fig. 1, the camera module 1 may further include a housing assembly 30, the light-shielding type photosensitive assembly 10 is encapsulated in the housing assembly 30, the lens assembly 20 is correspondingly mounted on the housing assembly 30, so as to form an outer enclosed space between the lens assembly 20 and the housing assembly 30 for accommodating the photosensitive chip 12, so that the camera module 1 forms a three-layer molding structure, and the overall protection capability of the module is further improved.

Illustratively, as shown in FIG. 1, the housing assembly 30 may include an upper housing 31 having an opening and a lower housing 32 sealingly connected to the upper housing 31; the light shielding type photosensitive assembly 10 is installed between the upper case 31 and the lower case 32, the lens assembly 20 protrudes from the light shielding type photosensitive assembly 10 through the opening of the upper case 31, and the lens assembly 20 is adhered to the upper case 31 so as to form an outer closed space. It is understood that the upper case 31 and the lower case 32 mentioned in the present application are respectively located above and below the light-shielding type photosensitive assembly 10, and the opening of the upper case 31 is located in the photosensitive path of the light-shielding type photosensitive assembly 10; for simplicity, unless otherwise specified, the direction along the optical axis of the lens assembly 20 toward the external object is referred to herein as the upper direction, and the opposite direction is referred to herein as the lower direction.

Alternatively, as shown in fig. 1, the upper case 31 and the lower case 32 may be coupled by bonding or welding or the like in order to sealingly assemble the light-shielding type photosensitive assembly 10 in a closed space between the upper case 31 and the lower case 32. It is understood that in other examples of the present application, the upper housing 31 may be integrally connected to the lower housing 32, or may be formed by splicing three or more housings, which will not be described in detail herein.

The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The foregoing examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model.

Claims

1. Shading formula sensitization subassembly, its characterized in that includes:

a circuit board;

2. The light-shielding photosensitive assembly of claim 1, wherein the light shield body has a extinction bevel facing away from the photosensitive chip.

3. The light-shielding photosensitive assembly of claim 2, wherein each light-shielding grille is tapered to project from the extinction ramp.

4. The light-shielding photosensitive assembly of claim 1, wherein the light shield body is integrally connected to the light blocking grille, both the light shield body and the light blocking grille having black matte surfaces.

5. The light-shielding photosensitive assembly of claim 1, wherein the light-shielding cover body is a black plastic or a surface-treated metal.

6. The light-shielding photosensitive assembly of any of claims 1-5, further comprising a filter element mounted to the light shielding frame and positioned in a photosensitive path of the photosensitive chip.

7. The light-shielding type photosensitive assembly of claim 6, wherein the annular frame body comprises an annular base portion adhered and fixed to the circuit board and a bearing portion integrally extending inward from an inner peripheral wall of the annular base portion, the light-shielding cover body is integrally connected to a free end of the bearing portion, and the light-filtering element is adhered and fixed to the bearing portion to form an inner-layer closed space for accommodating the photosensitive chip.

8. The module of making a video recording, its characterized in that includes:

a light-shielding photosensitive assembly according to any one of claims 1 to 7; and

9. The camera module of claim 8, wherein the lens assembly is adhesively secured to the circuit board around the light shielding frame to form a middle enclosure between the lens assembly and the circuit board that accommodates the light sensing chip.

10. The camera module of claim 8, further comprising a housing assembly within which the light-shielding photosensitive assembly is enclosed, the lens assembly being correspondingly mounted to the housing assembly to form an outer enclosure between the lens assembly and the housing assembly that accommodates the photosensitive chip.