CN220856497U - Rubber disc device - Google Patents

Rubber disc device Download PDF

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Publication number
CN220856497U
CN220856497U CN202322184772.2U CN202322184772U CN220856497U CN 220856497 U CN220856497 U CN 220856497U CN 202322184772 U CN202322184772 U CN 202322184772U CN 220856497 U CN220856497 U CN 220856497U
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CN
China
Prior art keywords
glue
scraping
storage groove
bulge
rubber
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Active
Application number
CN202322184772.2U
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Chinese (zh)
Inventor
张凯
胡莹璐
罗成双
张晓廓
杨思更
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Hisense Broadband Multimedia Technology Co Ltd
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Hisense Broadband Multimedia Technology Co Ltd
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Priority to CN202322184772.2U priority Critical patent/CN220856497U/en
Application granted granted Critical
Publication of CN220856497U publication Critical patent/CN220856497U/en
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Abstract

The application discloses a rubber disc device which comprises a rubber disc, a rubber scraping mechanism, a first power mechanism and a second power mechanism, wherein the rubber scraping mechanism is used for scraping rubber, and the first power mechanism is used for providing power and the second power mechanism is used for providing power. The rubber plate is provided with a storage groove for storing rubber. The scraping mechanism comprises a scraping part, two ends of the scraping part are respectively in contact connection with two structural parts which enclose an object placing groove, and the middle of the scraping part is in contact connection with the surface of the glue. The difference between the height of the two structural members surrounding the object placing groove and the preset thickness of the glue is in a preset range, so that the difference between the depth of the object placing groove and the preset thickness of the glue is in the preset range, and the thickness of the glue reaches the preset thickness. According to the application, only two ends of the scraping piece of the scraping mechanism are respectively connected with two structural members surrounding the storage groove in a contact manner, and the preset thickness of the glue can be accurately controlled without adjusting the height of the scraping piece for multiple times.

Description

Rubber disc device
Technical Field
The application relates to the technical field of die bonders for LED patch packaging, in particular to a plastic tray device.
Background
The flip chip is to make the chip function area face downwards and back to the substrate in a reverse buckling mode to weld with the substrate through the solder bump. And the soldering bumps of the chip are dipped with soldering flux in the adhesive disc device and then are welded with the substrate. To reduce the solder failure rate, each solder bump is required to be dipped with a uniform amount of flux, which is typically required to be dipped at 2/3 the height of the bump.
The traditional rubber disc device comprises a first power mechanism, a second power mechanism, a rubber scraping mechanism and a rubber disc, wherein the first power mechanism provides power for the rubber scraping mechanism so as to enable the rubber scraping mechanism to move up and down; the second power mechanism provides power for the rubber disc so as to enable the rubber disc to rotate; the glue tray is internally provided with a glue placing groove, soldering flux is placed in the glue placing groove, a glue scraping piece of the glue scraping mechanism is positioned in the glue tray, and the glue scraping piece is tightly contacted with a glue scraping plane in the object placing groove so as to scrape the soldering flux in the object placing groove.
Because the distance between the scraping part and the bottom surface of the storage groove is not fixed, the scraping mechanism is only moved up and down by a preset height, and the thickness of the soldering flux does not necessarily reach the preset height. Therefore, the thickness of the soldering flux of the traditional adhesive disc device can only be roughly adjusted by continuously adjusting the height of the adhesive scraping piece, and the thickness of the soldering flux cannot be accurately controlled.
Disclosure of utility model
The application provides a glue tray device which can accurately control the thickness of soldering flux so as to enable the thickness of the soldering flux to reach a preset thickness.
A glue tray apparatus comprising:
The rubber plate is provided with a storage groove; the storage groove is used for storing glue;
One end of the scraping mechanism is arranged in the rubber disc and comprises a scraping piece for scraping the rubber so as to ensure that the heights of the surfaces of the rubber are consistent; the two ends of the scraping piece are respectively in contact connection with two structural parts surrounding the storage groove, the middle of the scraping piece is in contact connection with the surface of the glue, and the difference value between the height of the two structural parts surrounding the storage groove and the preset thickness of the glue is in a preset range, so that the difference value between the depth of the storage groove and the preset thickness of the glue is in the preset range, and the thickness of the glue reaches the preset thickness;
one end of the first power mechanism is connected with the other end of the glue scraping mechanism and used for providing power so as to enable the glue scraping mechanism to move up and down, and the other end of the first power mechanism is connected with the glue tray and used for fixing the glue tray;
The second power mechanism is connected with the rubber disc through the first power mechanism and is used for providing power so as to enable the rubber disc to rotate.
The beneficial effects are that: the application provides a rubber disc device which comprises a rubber disc, a rubber scraping mechanism, a first power mechanism and a second power mechanism, wherein one end of the rubber scraping mechanism is arranged in the rubber disc, the other end of the rubber scraping mechanism is connected with one end of the first power mechanism, the other end of the first power mechanism is connected with the rubber disc, and the second power mechanism is connected with the rubber disc through the first power mechanism. The first power mechanism is used for providing power to enable the scraping mechanism to move up and down, the first power mechanism is also used for fixing the glue tray, and the second power mechanism is used for providing power to enable the glue tray to rotate. The rubber plate is provided with a storage groove for storing rubber. The scraping mechanism comprises a scraping part, two ends of the scraping part are respectively in contact connection with two structural parts which enclose an object placing groove, and the middle of the scraping part is in contact connection with the surface of the adhesive, so that the thickness of the adhesive in the object placing groove is equal to the depth of the object placing groove. The difference between the height of the two structural members surrounding the object placing groove and the preset thickness of the glue is in a preset range, so that the difference between the depth of the object placing groove and the preset thickness of the glue is in the preset range, and the thickness of the glue reaches the preset thickness. After glue is placed in the glue tray, the glue scraping part of the glue scraping mechanism moves under the action of the first power mechanism until the two ends of the glue scraping part are respectively in contact connection with the two structural parts which enclose the storage groove, and the glue scraping mechanism stops moving. After the scraping mechanism stops moving, the rubber disc rotates under the action of the second power mechanism until the scraping piece scrapes the rubber in the storage groove. Because the difference between the depth of the storage groove and the preset thickness of the glue is in the preset range, the thickness of the glue can be controlled to be the preset thickness by contacting and connecting the two ends of the glue scraping piece with two structural members which enclose the storage groove respectively and contacting and connecting the middle of the glue scraping piece with the glue. According to the application, only two ends of the scraping piece of the scraping mechanism are respectively connected with two structural members surrounding the storage groove in a contact manner, and the preset thickness of the glue can be accurately controlled without adjusting the height of the scraping piece for multiple times.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a partial architectural diagram of an optical communication system provided in accordance with some embodiments;
FIG. 2 is a partial block diagram of a host computer according to some embodiments;
FIG. 3 is a block diagram of an optical module provided in accordance with some embodiments;
FIG. 4 is an exploded view of an optical module provided in accordance with some embodiments;
FIG. 5 is a block diagram of an optical module with a housing removed and unlocking components provided in accordance with some embodiments;
FIG. 6 is a block diagram of a glue tray apparatus provided in accordance with some embodiments;
FIG. 7 is a cross-sectional view of a glue tray apparatus provided according to some embodiments;
FIG. 8 is an exploded view of a glue tray device provided according to some embodiments;
FIG. 9 is a block diagram of a first power mechanism provided in accordance with some embodiments;
FIG. 10 is a block diagram of a doctor blade mechanism provided in accordance with some embodiments;
FIG. 11 is a block diagram of a glue tray apparatus according to some embodiments at another view angle;
FIG. 12 is a block diagram of a first adhesive disc provided in accordance with some embodiments;
FIG. 13 is a block diagram of a second adhesive disc provided in accordance with some embodiments;
FIG. 14 is a block diagram of a third adhesive disc provided in accordance with some embodiments;
FIG. 15 is an exploded view of a third glue tray provided in accordance with some embodiments;
Fig. 16 is a cross-sectional view of a third glue tray provided according to some embodiments.
Detailed Description
The optical communication technology establishes information transfer between information processing apparatuses, and the optical communication technology loads information onto light, and uses propagation of light to realize information transfer, and the light loaded with information is an optical signal. The optical signal propagates in the information transmission device, so that the loss of optical power can be reduced, and the high-speed, long-distance and low-cost information transmission can be realized. Information that can be processed by the information processing device exists in the form of an electrical signal, and an optical network terminal/gateway, a router, a switch, a mobile phone, a computer, a server, a tablet computer and a television are common information processing devices, and an optical fiber and an optical waveguide are common information transmission devices.
The mutual conversion of optical signals and electric signals between the information processing equipment and the information transmission equipment is realized through an optical module. For example, an optical fiber is connected to an optical signal input end and/or an optical signal output end of the optical module, and an optical network terminal is connected to an electrical signal input end and/or an electrical signal output end of the optical module; the optical module converts the first optical signal into a first electric signal, and the optical module transmits the first electric signal into an optical network terminal; the second electrical signal from the optical network terminal is transmitted into the optical module, the optical module converts the second electrical signal into a second optical signal, and the optical module transmits the second optical signal into the optical fiber. Because the information processing devices can be connected with each other through an electrical signal network, at least one type of information processing device is required to be directly connected with the optical module, and not all types of information processing devices are required to be directly connected with the optical module, and the information processing device directly connected with the optical module is called an upper computer of the optical module.
Fig. 1 is a partial architectural diagram of an optical communication system provided in accordance with some embodiments. As shown in fig. 1, a part of the optical communication system is represented as a remote information processing apparatus 1000, a local information processing apparatus 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.
One end of the optical fiber 101 extends toward the remote information processing apparatus 1000, and the other end is connected to the optical interface of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, the propagation of the optical signal in the total reflection direction can almost maintain the original optical power, the optical signal can be totally reflected in the optical fiber 101 for a plurality of times, the optical signal from the direction of the far-end information processing device 1000 is transmitted into the optical module 200, or the light from the optical module 200 is propagated towards the direction of the far-end information processing device 1000, so that the information transmission with long distance and low power consumption is realized.
The number of the optical fibers 101 may be one or plural (two or more); the optical fiber 101 and the optical module 200 are movably connected in a pluggable mode, and can also be fixedly connected.
The upper computer 100 is provided with an optical module interface 102, and the optical module interface 102 is configured to be connected with the optical module 200, so that the upper computer 100 and the optical module 200 are connected by unidirectional/bidirectional electric signals; the upper computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor and control the working state of the optical module 200.
The host computer 100 has an external electrical interface, such as a universal serial bus interface (Universal Serial Bus, USB), a network cable interface 104, and the external electrical interface can access an electrical signal network. Illustratively, the network cable interface 104 is configured to access the network cable 103, thereby enabling the host computer 100 to establish a unidirectional/bidirectional electrical signal connection with the network cable 103.
Optical network terminals (ONU, optical Network Unit), optical line terminals (OLT, optical LINE TERMINAL), optical network units (ONT, optical Network Terminal), and data center servers are common upper computers.
One end of the network cable 103 is connected to the local information processing device 2000, the other end is connected to the host computer 100, and the network cable 103 establishes an electrical signal connection between the local information processing device 2000 and the host computer 100.
Illustratively, the third electrical signal sent by the local information processing apparatus 2000 is transmitted to the host computer 100 through the network cable 103, the host computer 100 generates a second electrical signal based on the third electrical signal, the second electrical signal from the host computer 100 is transmitted to the optical module 200, the optical module 200 converts the second electrical signal into a second optical signal, the optical module 200 transmits the second optical signal to the optical fiber 101, and the second optical signal is transmitted to the remote information processing apparatus 1000 in the optical fiber 101.
Illustratively, the first optical signal from the direction of the remote information processing apparatus 1000 propagates through the optical fiber 101, the first optical signal from the optical fiber 101 is transmitted into the optical module 200, the optical module 200 converts the first optical signal into a first electrical signal, the optical module 200 transmits the first electrical signal into the host computer 100, the host computer 100 generates a fourth electrical signal based on the first electrical signal, and the host computer 100 transmits the fourth electrical signal into the local information processing apparatus 2000.
The optical module is a tool for realizing the mutual conversion of the optical signal and the electric signal, and the information is not changed in the conversion process of the optical signal and the electric signal, and the encoding and decoding modes of the information can be changed.
Fig. 2 is a partial block diagram of a host computer according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, fig. 2 only shows the structure of the host computer 100 and the optical module 200. As shown in fig. 2, the upper computer 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on a surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector (not shown in the drawing) disposed inside the cage 106, wherein the heat sink 107 has a convex structure for increasing a heat dissipation area, and the fin-like structure is a common convex structure.
The optical module 200 is inserted into the cage 106 of the host computer 100, the optical module 200 is fixed by the cage 106, and heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical interface of the optical module 200 is connected with an electrical connector inside the cage 106.
Fig. 3 is a block diagram of an optical module provided in accordance with some embodiments. Fig. 4 is an exploded view of an optical module provided in accordance with some embodiments. As shown in fig. 3 and 4, the optical module 200 includes a housing (shell), a circuit board 300 disposed within the housing, a light emitting part 400, and a light receiving part 500. The present disclosure is not limited thereto and in some embodiments, the optical module 200 includes one of the light emitting part 400 and the light receiving part 500.
The housing includes an upper housing 201 and a lower housing 202, the upper housing 201 being capped on the lower housing 202 to form the above-described housing having two openings 204 and 205; the outer contour of the housing generally presents a square shape.
In some embodiments, the lower housing 202 includes a bottom plate 2021 and two lower side plates 2022 disposed on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper housing 201 includes a cover 2011, and the cover 2011 is covered on two lower side plates 2022 of the lower housing 202 to form the housing.
In some embodiments, the lower housing 202 includes a bottom plate 2021 and two lower side plates 2022 disposed on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper housing 201 includes a cover 2011, and two upper side plates disposed on two sides of the cover 2011 and perpendicular to the cover 2011, and the two upper side plates are combined with two lower side plates 2022 to cover the upper housing 201 on the lower housing 202.
The direction of the connection line of the two openings 204 and 205 may be identical to the length direction of the optical module 200 or not identical to the length direction of the optical module 200. For example, opening 204 is located at the end of light module 200 (right end of fig. 3) and opening 205 is also located at the end of light module 200 (left end of fig. 3). Or opening 204 is located at the end of light module 200 and opening 205 is located at the side of light module 200. The opening 204 is an electrical interface, and the golden finger of the circuit board 300 extends out of the electrical interface and is inserted into the electrical connector of the test host; the opening 205 is an optical port configured to access the optical fiber 101 such that the optical fiber 101 connects to the light emitting component 400 and/or the light receiving component 500 in the optical module 200.
The assembly mode of combining the upper shell 201 and the lower shell 202 is adopted, so that the circuit board 300, the light emitting component 400, the light receiving component 500 and other components can be conveniently installed in the shells, and the shapes of the components can be packaged and protected by the upper shell 201 and the lower shell 202. In addition, when the circuit board 300, the light emitting part 400, the light receiving part 500, and the like are assembled, the positioning part, the heat dissipating part, and the electromagnetic shielding part of these devices are easily disposed, which is advantageous for automating the production.
In some embodiments, the upper housing 201 and the lower housing 202 are made of metal materials, which is beneficial to electromagnetic shielding and heat dissipation.
In some embodiments, the light module 200 further includes an unlocking member 600 located outside its housing. The unlocking part 600 is configured to achieve a fixed connection between the optical module 200 and the test host, or to release the fixed connection between the optical module 200 and the test host.
For example, the unlocking member 600 is located outside of the two lower side plates 2022 of the lower housing 202, and includes a snap-fit member that mates with the cage 106 of the test master. When the optical module 200 is inserted into the cage 106, the optical module 200 is fixed in the cage 106 by the engaging member of the unlocking member 600; when the unlocking member 600 is pulled, the engaging member of the unlocking member 600 moves along with the unlocking member, so as to change the connection relationship between the engaging member and the test host, so as to release the engagement and fixed connection between the optical module 200 and the test host, and thus the optical module 200 can be pulled out from the cage 106.
The circuit board 300 includes circuit traces, electronic components, chips, etc., and the electronic components and the chips are connected together according to a circuit design through the circuit traces to realize functions of power supply, electric signal transmission, grounding, etc. The electronic components may include, for example, capacitors, resistors, transistors, metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET). The chips may include, for example, a micro control unit (Microcontroller Unit, MCU), a laser driving chip, a transimpedance amplifier (TRANSIMPEDANCE AMPLIFIER, TIA), a limiting amplifier (LIMITING AMPLIFIER), a clock data recovery chip (Clock and Data Recovery, CDR), a power management chip, a Digital Signal Processing (DSP) chip.
The circuit board 300 is generally a hard circuit board, and the hard circuit board can also realize a bearing function due to the relatively hard material, for example, the hard circuit board can stably bear the electronic components and chips; the rigid circuit board also facilitates insertion into an electrical connector in the cage of the test host.
The circuit board 300 further includes a gold finger formed on an end surface thereof, the gold finger being composed of a plurality of independent leads. The circuit board 300 is inserted into the cage 106 and is electrically connected to the electrical connectors within the cage 106 by the gold fingers. The gold fingers may be disposed on only one surface (e.g., the upper surface shown in fig. 4) of the circuit board 300, or may be disposed on both upper and lower surfaces of the circuit board 300, so as to provide more pins. The golden finger is configured to establish electrical connection with the test host to enable power, ground, I2C signaling, data signaling, and the like.
Of course, a flexible circuit board is also used in some optical modules, and the flexible circuit board is generally used in cooperation with a hard circuit board to supplement the hard circuit board.
The light emitting part 400 and/or the light receiving part 500 are located at a side of the circuit board 300 away from the gold finger; in some embodiments, the light emitting part 400 and the light receiving part 500 are physically separated from the circuit board 300, respectively, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors, respectively; in some embodiments, the light emitting and/or light receiving components may be disposed directly on the circuit board 300, may be disposed on a surface of the circuit board, or may be disposed on a side of the circuit board.
Fig. 5 is a block diagram of an optical module with a housing removed and unlocking components provided in accordance with some embodiments. As shown in fig. 5, the upper surface of the circuit board 300 is provided with a DSP chip 301, and the DSP chip 301 is connected not only to the light emitting part 400 but also to the light receiving part 500.
In some embodiments, DSP chip 301 is a flip chip, i.e., DSP chip 301 is connected to circuit board 300 via solder balls. Illustratively, the lower surface of the DSP chip 301 is provided with a solder ball layer, which includes a plurality of solder balls, one of which is a first solder ball of the TIA chip, and the upper surface of the circuit board 300 is provided with a second solder pad, which is connected to other solder balls in the solder ball layer except the first solder ball.
The flip chip is to make the chip function area face downwards and back to the substrate in a reverse buckling mode to weld with the substrate through the solder bump. And the soldering bumps of the chip are dipped with soldering flux in the adhesive disc device and then are welded with the substrate. To reduce the solder failure rate, each solder bump is required to be dipped with a uniform amount of flux, which is typically required to be dipped at 2/3 the height of the bump.
Fig. 6 is a block diagram of a glue tray device provided according to some embodiments. Fig. 7 is a cross-sectional view of a glue tray apparatus provided in accordance with some embodiments. Fig. 8 is an exploded view of a glue tray device provided in accordance with some embodiments. As shown in fig. 6, 7 and 8, in some embodiments, the adhesive disc apparatus 900 includes a first power mechanism 910, a second power mechanism 920, an adhesive scraping mechanism 930, and an adhesive disc 940, one end of the adhesive scraping mechanism 930 is disposed in the adhesive disc 940, the other end of the adhesive scraping mechanism 930 is connected to one end of the first power mechanism 910, the other end of the first power mechanism 910 is connected to the adhesive disc 940, the second power mechanism 920 is connected to the adhesive disc 940 through the first power mechanism 910, the adhesive scraping mechanism 930 is used for scraping adhesive, and the first power mechanism 910 is used for providing power to move the adhesive scraping mechanism 930 up and down; the first power mechanism 910 is also used for fixing the glue tray 940, and the second power mechanism 920 provides power to rotate the glue tray 940. After the glue is placed in the glue tray 940, the glue scraping mechanism 930 moves under the action of the first power mechanism 910 until the glue scraping mechanism 930 stops moving when one end of the glue scraping mechanism 930 is in contact connection with the surface of the glue. After the scraping mechanism 930 stops moving, the glue tray 940 rotates under the action of the second power mechanism 920 until one end of the scraping mechanism 930 scrapes the glue in the glue tray 940.
Fig. 9 is a block diagram of a first power mechanism provided in accordance with some embodiments. As shown in fig. 9, in some embodiments, the first power mechanism 910 includes a measuring member 911, a first fixing member 912, a second fixing member 917, and a third fixing member 918, the first fixing member 912 is connected to a first face of the second fixing member 917, a second face of the second fixing member 917 is connected to a first end of the third fixing member 918, the first fixing member 912 is connected to the measuring member 911, and the measuring member 911 is used to push the doctor mechanism 930 to move up and down.
The first fixing member 912 is provided with a first accommodating through hole 913, and the measuring member 911 is disposed in the first accommodating through hole 913, and the measuring member 911 is rotated to push the doctor mechanism 930 to move up and down. The first fixing member 912 is further provided with a limiting protrusion 9121, where the limiting protrusion 9121 is disposed opposite to the first accommodating through hole 913, so as to define a position of the doctor mechanism 930.
In some embodiments, the measurement member 911 is a micrometer screw that rotates the micrometer screw to push the doctor mechanism 930 up and down.
In some embodiments, the measuring member 911 is a linear motor, and the linear motor rotates to push the scraping mechanism 930 to move up and down after receiving a control signal sent by the controller. The controller sends a control signal to the linear motor when receiving a pressure signal sent by a pressure sensor in the rubber disc.
The first surface of the second fixing member 917 is provided with a sliding rail 914, and the sliding rail 914 is connected with the scraping mechanism 930, so that the scraping mechanism 930 can move up and down along the sliding rail 914.
When the rotating measuring member 911 pushes the scraping mechanism 930 to move upward, the scraping mechanism 930 is brought into close contact with the measuring member 911. However, when the rotating measuring member 911 pushes the scraping mechanism 930 downward, the scraping mechanism 930 may not be in close contact with the measuring member 911. To avoid this problem, in some embodiments, the first surface of the second fixing member 917 is further provided with a first connecting member 916, the slide 914 and the first connecting member 916 are not connected, the first connecting member 916 and the doctor mechanism 930 are connected by a third elastic member 915, and the third elastic member 915 is used to ensure that the doctor mechanism 930 is always in close contact with the measuring member 911.
The second surface of the second fixing member 917 is connected to the third fixing member 918, the second power mechanism 920 is disposed under the third fixing member 918, the third fixing member 918 is provided with a rotating member 919, the rotating member 919 can rotate on the third fixing member 918, the rotating member 919 is provided with a glue tray 940, and the rotating member 919 and the third fixing member 918 are provided with second through holes for placing the transmission shafts 921 of the second power mechanism 920, so that the second power mechanism 920 is connected to the glue tray 940 through the first power mechanism 910. The drive shaft 921 integrally connects the second power mechanism 920, the rotary member 919 and the adhesive disc 940 such that both the adhesive disc 940 and the rotary member 919 rotate with the drive shaft 921 of the second power mechanism 920.
Fig. 10 is a block diagram of a doctor blade mechanism provided in accordance with some embodiments. Fig. 11 is a block diagram of a glue tray device according to some embodiments in another view. As shown in fig. 10 and 11, in some embodiments, the scraping mechanism 930 includes a fourth fixing member 931, and a chute 933 is disposed on a first surface of the fourth fixing member 931, and the chute 933 moves up and down along the slide rail 914. The measuring member 911 is rotated to push the fourth fixing member 931 coupled to the measuring member 911 to move up and down along the slide rail 914, so that the doctor mechanism 930 moves up and down. The end of the fourth fixing member 931, which is close to the measuring member 911, is recessed inwards to form a limiting block 9311, a first surface of the limiting block 9311 is in contact with the measuring member 911, a second surface of the limiting block 9311 can be in contact with the limiting protrusion 9121, and the tail end of the limiting block 9311 is located in a projection area of the limiting protrusion 9121, so that the limiting block 9311 is limited in the limiting protrusion 9121.
The fourth fixing member 931 has a second connection member 934, and the second connection member 934 is connected to the first connection member 916 through a third elastic member.
The second face of the fourth fixing member 931 is provided with a scraping bracket 932, and the scraping bracket 932 is provided with a scraping member 935, and the scraping member 935 is used for scraping the glue in the glue tray 940.
In some embodiments, a clamping groove 945 is disposed at the bottom of the glue tray 940, and the clamping groove 945 is used for placing the transmission shaft 921 of the second power mechanism 920, so that the glue tray 940 can rotate along with the transmission shaft 921. The transmission shaft 921 of the second power mechanism 920 is connected with the clamping groove 945 of the rubber disc 940 through the second object placing through hole, the second power mechanism 920 rotates, the rotating member 919 of the first power mechanism 910 rotates, and the rubber disc 940 rotates.
In some embodiments, the glue tray 940 has a storage slot, glue is disposed in the storage slot, two ends of the glue scraping piece 935 are respectively in contact connection with two structural members surrounding the storage slot, the middle of the glue scraping piece 935 is in contact connection with the surface of the glue, and the difference between the height of the two structural members surrounding the storage slot and the preset thickness of the glue is located in a preset range, so that the difference between the depth of the storage slot and the preset thickness of the glue is located in the preset range, and the thickness of the glue reaches the preset thickness. Because the difference between the depth of the storage groove and the preset thickness of the glue is in the preset range, the thickness of the glue can be controlled to the preset thickness only by respectively connecting the two ends of the glue scraping piece 935 with two structural members surrounding the storage groove in a contact manner and connecting the middle of the glue scraping piece 935 with the glue.
In some embodiments, the glue tray 940 has a storage groove, glue is disposed in the storage groove, two ends of the glue scraping piece 935 are respectively in contact connection with two structural members surrounding the storage groove, the middle of the glue scraping piece 935 is in contact connection with the surface of the glue, and the heights of the two structural members surrounding the storage groove are equal to the preset thickness of the glue, so that the depth of the storage groove is equal to the preset thickness of the glue, and the thickness of the glue reaches the preset thickness. Because the depth of the storage groove is equal to the preset thickness of the glue, the thickness of the glue can be controlled to the preset thickness only by contacting and connecting the two ends of the glue scraping piece 935 with the two structural members surrounding the storage groove respectively and contacting and connecting the middle of the glue scraping piece 935 with the glue.
In some embodiments, the heights of the two structural members surrounding the storage groove are equal to the preset thickness of the glue, so that the depth of the storage groove is equal to the preset thickness of the glue, and the thickness of the glue reaches the preset thickness.
Each time the thickness of the glue needs to be adjusted to a preset thickness, the glue tray with a proper size storage groove is reselected without considering the last glue tray adjustment, after the glue is placed in the glue tray 940, the glue scraping piece 935 of the glue scraping mechanism 930 moves under the action of the first power mechanism 910 until the two ends of the glue scraping piece 935 are respectively contacted and connected with the two structural members surrounding the storage groove, and the glue scraping mechanism 930 stops moving. After the scraping mechanism 930 stops moving, the glue tray 940 rotates under the action of the second power mechanism 920 until the glue scraping piece 935 scrapes the glue in the storage tank, and at this time, the thickness of the glue in the storage tank reaches the preset thickness.
Each time the thickness of the glue needs to be adjusted to a preset thickness, the selected glue tray is adjusted according to the last time, and when the preset thickness reached by the current adjustment is larger than the preset thickness reached by the last time, after the glue is placed in the glue tray 940, only the measuring piece 911 is rotated upwards by a certain thickness difference, and whether two ends of the glue scraping piece 935 are respectively contacted and connected with two structural members surrounding the storage groove is not considered, and the glue scraping mechanism 930 stops moving. After the scraping mechanism 930 stops moving, the glue tray 940 rotates under the action of the second power mechanism 920 until the glue scraping piece 935 scrapes the glue in the storage tank, and at this time, the thickness of the glue in the storage tank reaches the preset thickness. The thickness difference is the difference between the preset thickness reached by the current adjustment and the preset thickness reached by the last adjustment.
In some embodiments, the predetermined range is-10 μm to 10 μm. Illustratively, the preset range is-10 μm to 0 μm and the preset range is 0 μm to 10 μm.
The glue tray 940 may be any one of the following three types of glue trays.
Fig. 12 is a block diagram of a first adhesive disc provided in accordance with some embodiments. As shown in fig. 12, in some embodiments, the tray 940a includes a tray base 941, the tray base 941 having a first protrusion 9413 and a second protrusion 9412, the first protrusion 9413 and the second protrusion 9412 enclosing a placement slot 944, and the placement slot 944 is filled with glue. The two ends of the scraping member 935 are in contact with the first and second protrusions 9413 and 9412, respectively, and the middle of the scraping member 935 is in contact with the surface of the adhesive in the receiving groove 944, so that the depth of the receiving groove 944 is equal to the thickness of the adhesive. The difference between the heights of the first protrusions 9413 and the second protrusions 9412 and the preset thickness of the adhesive is within a preset range, so that the difference between the depth of the storage groove 944 and the preset thickness is within a preset range, and the thickness of the adhesive reaches the preset thickness.
For the glue tray 940a, the height of the first protrusion is based on the bottom of the storage tank 944, and the height of the second protrusion is also based on the bottom of the storage tank 944.
In some embodiments, the heights of the first protrusions 9413 and the second protrusions 9412 are equal to equalize the depths of the storage slots 944.
In some embodiments, the glue tray 940a also has a third protrusion 9411, the third protrusion 9411 being connected to the second protrusion 9412, the second protrusion 9412 surrounding the third protrusion 9411, the third protrusion 9411 having a height greater than the height of the second protrusion 9412 to block glue from flowing from one side of the third protrusion 9411 to the other side of the third protrusion 9411.
In some embodiments, the tray 940a further has a fence 9414, where the fence 9414 is located at an edge of the tray base 941, where the fence 9414 is connected to the first protrusion 9413, where the fence 9414 is not connected to the storage slot 944, and where the height of the fence 9414 is greater than the height of the first protrusion 9413 to block the glue from flowing out of the tray 940.
For the tray 940a, the depth of the storage groove 944 is determined by the heights of the first protrusion 9413 and the second protrusion 9412, and if the depth of the storage groove 944 needs to be replaced, the tray needs to be replaced.
Fig. 13 is a block diagram of a second glue tray provided in accordance with some embodiments. As shown in fig. 13, in some embodiments, the tray 940b includes a tray base 941, a resilient member 942, and a press member 943, the press member 943 pressing the resilient member 942 against a surface of the tray base 941. The press member 943 includes a first press member 9431 and a second press member 9432, the elastic member 942 includes a first elastic member 9421 and a second elastic member 9422, the first press member 9431 presses the first elastic member 9421 against the surface of the tray base 941, the second press member 9432 presses the second elastic member 9422 against the surface of the tray base 941, the first elastic member 9421 is located at an edge of the tray base 941, and the second elastic member 9422 is located in the middle of the tray base 941. The first elastic member 9421 and the second elastic member 9422 enclose a storage tank 944, glue is placed in the storage tank 944, two ends of the scraping member 935 are respectively in contact connection with the first elastic member 9421 and the second elastic member 9422, and the middle of the scraping member 935 is in contact connection with the surface of the glue in the storage tank 944, so that the depth of the storage tank 944 is equal to the thickness of the glue. The difference between the heights of the first elastic member 9421 and the second elastic member 9422 and the preset thickness of the glue is within a preset range, so that the difference between the depth of the storage groove 944 and the preset thickness is within a preset range, and the thickness of the glue reaches the preset thickness.
In some embodiments, the thickness dimension of the first resilient member 9421 and the second resilient member 9422 are equal to equalize the depth of the storage slot 944.
For the tray 940b, the depth of the storage groove 944 is determined by the thickness dimensions of the first elastic member 9421 and the second elastic member 9422, and if the depth of the storage groove 944 needs to be replaced, only the thickness dimensions of the first elastic member 9421 and the second elastic member 9422 need to be adjusted.
Fig. 14 is a block diagram of a third glue tray provided according to some embodiments. Fig. 15 is an exploded view of a third glue tray provided in accordance with some embodiments. Fig. 16 is a cross-sectional view of a third glue tray provided according to some embodiments. As shown in fig. 14, 15 and 16, in some embodiments, the tray 940c includes a tray base 941, the tray base 941 has a first protrusion 9413 and a second protrusion 9412, the first protrusion 9413 and the second protrusion 9412 enclose a storage slot 944, an elastic member 942 and a pressing member 943 are disposed in the storage slot 944, the pressing member 943 presses the elastic member 942 into the storage slot 944, and the glue is placed on the pressing member 943 in the storage slot 944. The two ends of the scraping member 935 are in contact with the first and second protrusions 9413 and 9412, respectively, and the middle of the scraping member 935 is in contact with the surface of the adhesive on the pressing member 943 so that the depth of the receiving groove 944 is equal to the thickness of the adhesive. The difference between the heights of the first protrusions 9413 and the second protrusions 9412 and the preset thickness of the adhesive is within a preset range, so that the difference between the depth of the storage groove 944 and the preset thickness is within a preset range, and the thickness of the adhesive reaches the preset thickness.
For the glue pan 940c, the height of the first protrusion is based on the fasteners 943 of the storage tank 944, and the height of the second protrusion is also based on the fasteners 943 of the storage tank 944.
In some embodiments, the resilient member 942 has a third storage through hole 9423, the third storage through hole 9423 making the resilient member 942 a ring-shaped structural member; the pressing member 943 has a fourth through hole 9433, and the fourth through hole 9433 makes the pressing member 943 an annular structural member; the third through hole 9423 and the fourth through hole 9433 are correspondingly arranged, and the second protrusion 9412 is clamped in the third through hole 9423 and the fourth through hole 9433.
In some embodiments, the glue tray 940c also has a third protrusion 9411, the third protrusion 9411 being connected to the second protrusion 9412, the second protrusion 9412 surrounding the third protrusion 9411, the third protrusion 9411 having a height greater than the height of the second protrusion 9412 to block glue from flowing from one side of the third protrusion 9411 to the other side of the third protrusion 9411.
In some embodiments, the tray 940c further has a fence 9414, where the fence 9414 is located at an edge of the tray base 941, where the fence 9414 is connected to the first protrusion 9413, where the fence 9414 is not connected to the storage slot 944, and where the height of the fence 9414 is greater than the height of the first protrusion 9413 to block the glue from flowing out of the tray 940.
In some embodiments, the number and thickness of the elastic members 942 can be changed according to actual requirements, so that the depth of the storage groove 944 of the tray 940 is changed, and the depth of the storage groove 944 meets the requirements.
For the glue tray 940c, the depth of the storage groove 944 is determined by the number and thickness dimensions of the elastic members 942, and the depth of the storage groove 944 can be changed only by changing the number and thickness dimensions of the elastic members 942, so that the accuracy is higher; the two ends of the scraping member 935 are respectively contacted and rubbed with the first and second protrusions 9413 and 9412, and the scraping member 935 is not connected with the elastic member 942, thereby extending the service life of the elastic member 942.
In some embodiments, the adhesive disk device comprises an adhesive disk, an adhesive scraping mechanism, a first power mechanism and a second power mechanism, wherein one end of the adhesive scraping mechanism is arranged in the adhesive disk, the other end of the adhesive scraping mechanism is connected with one end of the first power mechanism, the other end of the first power mechanism is connected with the adhesive disk, and the second power mechanism is connected with the adhesive disk through the first power mechanism. The first power mechanism is used for providing power to enable the scraping mechanism to move up and down, the first power mechanism is also used for fixing the glue tray, and the second power mechanism is used for providing power to enable the glue tray to rotate. The rubber plate is provided with a storage groove for storing rubber. The scraping mechanism comprises a scraping part, two ends of the scraping part are respectively in contact connection with two structural parts which enclose an object placing groove, and the middle of the scraping part is in contact connection with the surface of the adhesive, so that the thickness of the adhesive in the object placing groove is equal to the depth of the object placing groove. The difference between the height of the two structural members surrounding the object placing groove and the preset thickness of the glue is in a preset range, so that the difference between the depth of the object placing groove and the preset thickness of the glue is in the preset range, and the thickness of the glue reaches the preset thickness. After glue is placed in the glue tray, the glue scraping part of the glue scraping mechanism moves under the action of the first power mechanism until the two ends of the glue scraping part are respectively in contact connection with the two structural parts which enclose the storage groove, and the glue scraping mechanism stops moving. After the scraping mechanism stops moving, the rubber disc rotates under the action of the second power mechanism until the scraping piece scrapes the rubber in the storage groove. Because the difference between the depth of the storage groove and the preset thickness of the glue is in the preset range, the thickness of the glue can be controlled to be the preset thickness by contacting and connecting the two ends of the glue scraping piece with two structural members which enclose the storage groove respectively and contacting and connecting the middle of the glue scraping piece with the glue. In some embodiments, only two ends of the scraping piece of the scraping mechanism are respectively connected with two structural members surrounding the storage groove in a contact manner, and the preset thickness of the glue can be accurately controlled without adjusting the height of the scraping piece for multiple times.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and are not limiting; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims (10)

1. A glue tray device, comprising:
The rubber plate is provided with a storage groove; the storage groove is used for storing glue;
One end of the glue scraping mechanism is arranged in the glue tray and comprises a glue scraping piece for scraping the glue so as to ensure that the heights of the surfaces of the glue are consistent; the two ends of the scraping piece are respectively in contact connection with two structural parts surrounding the storage groove, the middle of the scraping piece is in contact connection with the surface of the glue, and the difference value between the height of the two structural parts surrounding the storage groove and the preset thickness of the glue is in a preset range, so that the difference value between the depth of the storage groove and the preset thickness of the glue is in the preset range, and the thickness of the glue reaches the preset thickness;
One end of the first power mechanism is connected with the other end of the scraping mechanism and used for providing power so as to enable the scraping mechanism to move up and down, and the other end of the first power mechanism is connected with the rubber disc and used for fixing the rubber disc;
The second power mechanism is connected with the rubber disc through the first power mechanism and is used for providing power so as to enable the rubber disc to rotate.
2. The glue tray device of claim 1, wherein the glue tray comprises a glue tray base;
The rubber plate base is provided with a storage groove, a first bulge and a second bulge, the first bulge and the second bulge enclose the storage groove, two ends of the rubber scraping piece are respectively in contact connection with the first bulge and the second bulge, an elastic piece and a pressing piece are arranged in the storage groove, the pressing piece presses the elastic piece into the storage groove, and the difference value between the heights of the first bulge and the second bulge and the preset thickness of the rubber is in a preset range, so that the difference value between the depth of the storage groove and the preset thickness is in the preset range; the heights of the first bulge and the second bulge refer to the height taking the press firmware in the storage groove as a reference.
3. The glue tray device of claim 1, wherein the glue tray comprises a glue tray base;
The rubber plate base is provided with a storage groove, a first bulge and a second bulge, the first bulge and the second bulge enclose the storage groove, two ends of the rubber scraping piece are respectively in contact connection with the first bulge and the second bulge, and the difference values between the heights of the first bulge and the second bulge and the preset thickness of the rubber are respectively in a preset range, so that the difference value between the depth of the storage groove and the preset thickness is in the preset range; the heights of the first bulge and the second bulge refer to the height taking the storage groove as a reference.
4. The glue tray device of claim 1, wherein the glue tray comprises a glue tray base, an elastic member, and a press-fit member;
The pressing piece is used for pressing and fixing the elastic piece on the surface of the rubber disc base, the elastic piece comprises a first elastic piece and a second elastic piece, the first elastic piece and the second elastic piece enclose a storage groove, two ends of the scraping piece are respectively connected with the first elastic piece and the second elastic piece in a contact mode, and the difference value of the preset thickness of the first elastic piece and the second elastic piece and the preset thickness of the rubber is located in a preset range, so that the depth of the storage groove and the difference value of the preset thickness are located in the preset range.
5. The glue tray device according to claim 1, wherein the preset range is-10 μm to 0 μm and 0 μm to 10 μm.
6. A glue tray device according to claim 2 or 3, further comprising a third protrusion, said third protrusion being connected to said second protrusion, the height of said third protrusion being greater than the height of said second protrusion.
7. A glue tray device according to claim 2 or 3, wherein the glue tray further comprises a fence located at an edge of the glue tray, the fence being connected to the first protrusion, the fence having a height greater than a height of the first protrusion.
8. The adhesive tape device according to claim 1, wherein the first power mechanism comprises a first fixing member, a second fixing member and a third fixing member, the first fixing member and the third fixing member are respectively connected with the second fixing member, the first fixing member is connected with a measuring member, the measuring member is used for pushing the adhesive scraping mechanism to move up and down, a first face of the second fixing member is provided with a sliding rail and a first connecting member, the sliding rail is not connected with the first connecting member, the other face of the second fixing member is provided with the third fixing member, a rotating member is arranged on the third fixing member, the adhesive tape is placed on the rotating member, the second power mechanism is placed below the third fixing member, and the second power mechanism is connected with the adhesive tape through the first fixing member.
9. The glue tray device according to claim 8, wherein the glue scraping mechanism comprises a fourth fixing member, a first surface of the fourth fixing member is provided with a chute, the chute moves up and down along the sliding rail, a second surface of the fourth fixing member is provided with a glue scraping support, the glue scraping support is provided with the glue scraping member, the fourth fixing member is further provided with a second connecting member, the second connecting member is connected with the first connecting member through a third elastic member, and the third elastic member is used for ensuring contact connection between the fourth fixing member and the measuring member.
10. A glue tray device, comprising:
The rubber plate is provided with a storage groove; the storage groove is used for storing glue;
One end of the glue scraping mechanism is arranged in the glue tray and comprises a glue scraping piece for scraping the glue so as to ensure that the heights of the surfaces of the glue are consistent; the two ends of the scraping piece are respectively in contact connection with two structural parts surrounding the storage groove, the middle of the scraping piece is in contact connection with the surface of the glue, the heights of the two structural parts surrounding the storage groove are equal to the preset thickness of the glue, so that the depth of the storage groove is equal to the preset thickness of the glue, and the thickness of the glue reaches the preset thickness;
One end of the first power mechanism is connected with the other end of the scraping mechanism and used for providing power so as to enable the scraping mechanism to move up and down, and the other end of the first power mechanism is connected with the rubber disc and used for fixing the rubber disc;
The second power mechanism is connected with the rubber disc through the first power mechanism and is used for providing power so as to enable the rubber disc to rotate.
CN202322184772.2U 2023-08-15 2023-08-15 Rubber disc device Active CN220856497U (en)

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CN202322184772.2U CN220856497U (en) 2023-08-15 2023-08-15 Rubber disc device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202322184772.2U CN220856497U (en) 2023-08-15 2023-08-15 Rubber disc device

Publications (1)

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CN220856497U true CN220856497U (en) 2024-04-26

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Family Applications (1)

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